CH476048A - Process for increasing the molecular weight of polyamides - Google Patents
Process for increasing the molecular weight of polyamidesInfo
- Publication number
- CH476048A CH476048A CH317669A CH317669A CH476048A CH 476048 A CH476048 A CH 476048A CH 317669 A CH317669 A CH 317669A CH 317669 A CH317669 A CH 317669A CH 476048 A CH476048 A CH 476048A
- Authority
- CH
- Switzerland
- Prior art keywords
- acid
- polyamide
- molecular weight
- polyamides
- diamine
- Prior art date
Links
- 239000004952 Polyamide Substances 0.000 title claims description 28
- 229920002647 polyamide Polymers 0.000 title claims description 28
- 238000000034 method Methods 0.000 title claims description 15
- -1 diamine salt Chemical class 0.000 claims description 21
- 150000004985 diamines Chemical class 0.000 claims description 14
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 11
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 claims description 10
- 239000000203 mixture Substances 0.000 claims description 9
- 229920002302 Nylon 6,6 Polymers 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 2
- 239000012760 heat stabilizer Substances 0.000 claims description 2
- 239000004611 light stabiliser Substances 0.000 claims description 2
- 239000006224 matting agent Substances 0.000 claims description 2
- 230000001419 dependent effect Effects 0.000 claims 1
- 150000003839 salts Chemical class 0.000 description 12
- 125000004432 carbon atom Chemical group C* 0.000 description 11
- 150000003254 radicals Chemical class 0.000 description 11
- 125000000217 alkyl group Chemical group 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- VHRGRCVQAFMJIZ-UHFFFAOYSA-N cadaverine Chemical group NCCCCCN VHRGRCVQAFMJIZ-UHFFFAOYSA-N 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical group NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 4
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical group NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 4
- 125000003277 amino group Chemical group 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 150000005840 aryl radicals Chemical class 0.000 description 3
- FBSFTJQYCLLGKH-UHFFFAOYSA-N cyclohexylphosphonic acid Chemical compound OP(O)(=O)C1CCCCC1 FBSFTJQYCLLGKH-UHFFFAOYSA-N 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 230000000379 polymerizing effect Effects 0.000 description 3
- VHYFNPMBLIVWCW-UHFFFAOYSA-N 4-Dimethylaminopyridine Chemical compound CN(C)C1=CC=NC=C1 VHYFNPMBLIVWCW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 125000002843 carboxylic acid group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 150000003951 lactams Chemical class 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 2
- 150000003009 phosphonic acids Chemical class 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- LWBHHRRTOZQPDM-UHFFFAOYSA-N undecanedioic acid Chemical compound OC(=O)CCCCCCCCCC(O)=O LWBHHRRTOZQPDM-UHFFFAOYSA-N 0.000 description 2
- MVCIBABYNNIPFI-UHFFFAOYSA-N (4-chlorophenyl)phosphonic acid Chemical compound OP(O)(=O)C1=CC=C(Cl)C=C1 MVCIBABYNNIPFI-UHFFFAOYSA-N 0.000 description 1
- LYNDWSARZJHIKU-UHFFFAOYSA-N (4-methylphenyl)phosphonic acid Chemical compound CC1=CC=C(P(O)(O)=O)C=C1 LYNDWSARZJHIKU-UHFFFAOYSA-N 0.000 description 1
- SHANIADRGZPYSO-UHFFFAOYSA-N (4-phosphonocyclohexyl)phosphonic acid Chemical compound OP(O)(=O)C1CCC(CC1)P(O)(O)=O SHANIADRGZPYSO-UHFFFAOYSA-N 0.000 description 1
- KZKRRZFCAYOXQE-UHFFFAOYSA-N 1$l^{2}-azinane Chemical compound C1CC[N]CC1 KZKRRZFCAYOXQE-UHFFFAOYSA-N 0.000 description 1
- 125000004958 1,4-naphthylene group Chemical group 0.000 description 1
- 125000001140 1,4-phenylene group Chemical group [H]C1=C([H])C([*:2])=C([H])C([H])=C1[*:1] 0.000 description 1
- PWGJDPKCLMLPJW-UHFFFAOYSA-N 1,8-diaminooctane Chemical compound NCCCCCCCCN PWGJDPKCLMLPJW-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 1
- RZYTYVKNOREROS-UHFFFAOYSA-N 10,13-dicyclohexyl-9,11,12,14-tetraoxa-1,8-diaza-10lambda5,13lambda5-diphosphabicyclo[6.3.3]tetradecane 10,13-dioxide Chemical compound O1P(=O)(C2CCCCC2)ON(O2)CCCCCCN1OP2(=O)C1CCCCC1 RZYTYVKNOREROS-UHFFFAOYSA-N 0.000 description 1
- GUOSQNAUYHMCRU-UHFFFAOYSA-N 11-Aminoundecanoic acid Chemical compound NCCCCCCCCCCC(O)=O GUOSQNAUYHMCRU-UHFFFAOYSA-N 0.000 description 1
- QNTADTGUHSAVOZ-UHFFFAOYSA-N 17-aminoheptadecanoic acid Chemical compound NCCCCCCCCCCCCCCCCC(O)=O QNTADTGUHSAVOZ-UHFFFAOYSA-N 0.000 description 1
- 125000001622 2-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C([H])=C(*)C([H])=C([H])C2=C1[H] 0.000 description 1
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- QRKINCQKOGXVEO-UHFFFAOYSA-N 5-phosphonopentylphosphonic acid Chemical compound OP(O)(=O)CCCCCP(O)(O)=O QRKINCQKOGXVEO-UHFFFAOYSA-N 0.000 description 1
- VWPQCOZMXULHDM-UHFFFAOYSA-N 9-aminononanoic acid Chemical compound NCCCCCCCCC(O)=O VWPQCOZMXULHDM-UHFFFAOYSA-N 0.000 description 1
- LRQKBLKVPFOOQJ-RXMQYKEDSA-N D-norleucine Chemical compound CCCC[C@@H](N)C(O)=O LRQKBLKVPFOOQJ-RXMQYKEDSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 1
- SLRYSQGQIWULKN-UHFFFAOYSA-N OP(C1=CC2=CC(P(O)(O)=O)=CC(P(O)(O)=O)=C2C=C1)(O)=O Chemical compound OP(C1=CC2=CC(P(O)(O)=O)=CC(P(O)(O)=O)=C2C=C1)(O)=O SLRYSQGQIWULKN-UHFFFAOYSA-N 0.000 description 1
- SJEYSFABYSGQBG-UHFFFAOYSA-M Patent blue Chemical compound [Na+].C1=CC(N(CC)CC)=CC=C1C(C=1C(=CC(=CC=1)S([O-])(=O)=O)S([O-])(=O)=O)=C1C=CC(=[N+](CC)CC)C=C1 SJEYSFABYSGQBG-UHFFFAOYSA-M 0.000 description 1
- QLZHNIAADXEJJP-UHFFFAOYSA-N Phenylphosphonic acid Chemical compound OP(O)(=O)C1=CC=CC=C1 QLZHNIAADXEJJP-UHFFFAOYSA-N 0.000 description 1
- ZURHBENZJDSCRG-UHFFFAOYSA-N [4-(phosphonomethyl)phenyl]methylphosphonic acid Chemical compound OP(O)(=O)CC1=CC=C(CP(O)(O)=O)C=C1 ZURHBENZJDSCRG-UHFFFAOYSA-N 0.000 description 1
- 239000000980 acid dye Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- CJYXCQLOZNIMFP-UHFFFAOYSA-N azocan-2-one Chemical compound O=C1CCCCCCN1 CJYXCQLOZNIMFP-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 125000001309 chloro group Chemical group Cl* 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- GATNOFPXSDHULC-UHFFFAOYSA-N ethylphosphonic acid Chemical compound CCP(O)(O)=O GATNOFPXSDHULC-UHFFFAOYSA-N 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000004694 iodide salts Chemical class 0.000 description 1
- 150000002696 manganese Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002074 melt spinning Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- YACKEPLHDIMKIO-UHFFFAOYSA-N methylphosphonic acid Chemical compound CP(O)(O)=O YACKEPLHDIMKIO-UHFFFAOYSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- ODKLEQPZOCJQMT-UHFFFAOYSA-N n,n-diethylpyridin-4-amine Chemical compound CCN(CC)C1=CC=NC=C1 ODKLEQPZOCJQMT-UHFFFAOYSA-N 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 125000004437 phosphorous atom Chemical group 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NSETWVJZUWGCKE-UHFFFAOYSA-N propylphosphonic acid Chemical compound CCCP(O)(O)=O NSETWVJZUWGCKE-UHFFFAOYSA-N 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000001302 tertiary amino group Chemical group 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
- C08G69/28—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08B—POLYSACCHARIDES; DERIVATIVES THEREOF
- C08B3/00—Preparation of cellulose esters of organic acids
- C08B3/22—Post-esterification treatments, including purification
- C08B3/30—Stabilising
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/04—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
- C08G69/14—Lactams
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/08—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from amino-carboxylic acids
- C08G69/14—Lactams
- C08G69/16—Preparatory processes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
- C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
- C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Biochemistry (AREA)
- Materials Engineering (AREA)
- Polyamides (AREA)
Description
Verfahren zur Erhöhung des Molekulargewichtes von Polyamiden
Die vorliegende Erfindung betrifft ein Verfahren zur Erhöhung des Molekulargewichtes von Polyamiden, insbesondere von Polyhexamethylenadipamid.
Das Verfahren gemäss der Erfindung zur Erhöhung des Molekulargewichtes von vorgebildeten Polyamiden ist dadurch gekennzeichnet dass man ein Gemisch aus dem Polyamid und einem organischen Diaminsalz einer Phosphonsäure der Formel:
EMI1.1
worin n eine ganze Zahl von 1 bis 3 und R' je nach dem Wert von n einen einwertigen, zweiwertigen oder dreiwertigen organischen Rest bedeutet, auf eine Temperatur oberhalb des Schmelzpunktes des Gemisches erhitzt, bis die erforderliche Zunahme des Molekulargewichtes des Polyamides erzielt worden ist.
Dieses Verfahren kann zweckmässig ausgeführt werden, indem man das Gemisch aus dem Polyamid und dem genannten Salz auf eine Temperatur oberhalb des Schmelzpunktes des Gemisches erhitzt, vorzugsweise in Abwesenheit von Luft, z.B. unter einer inerten Gasatmosphäre, wie beispielsweise unter Stickstoff, oder in einem Vakuum, bis die erforderliche Zunahme des Molekulargewichtes des als Ausgangsmaterial verwendeten Polyamides erzielt worden ist. Vorteilhafterweise wird das Verfahren in einem Extruder für das Schmelzspinnen, der bei verminderten Drücken arbeitet, ausgeführt.
Anstelle eines Gemisches aus dem vorgebildeten Polyamid und dem genannten Salz kann man ein Polyamid verwenden, welches bereits das genannte Salz enthält, welches während der Bildung des Polyamides aus den polyamidbildenden Komponenten durch Polymerisation eingebaut worden ist.
Die durch R' dargestellten organischen Reste, die über eines ihrer Kohlenstoffatome an das Phosphoratom gebunden sind, sind vorzugsweise 1-, 2- oder 3wertige aliphatische, cycloaliphatische, Aryl-, Aralkyloder Aralkenylreste oder derartige Reste, in welchen ein Kohlenstoffatom durch ein Heteroatom, insbesondere das Stickstoffatom, ersetzt ist. Die genannten aliphatischen Reste sind vorzugsweise einwertige, zweiwertige oder dreiwertige Alkan- oder Alkenreste mit bis zu 12 Kohlenstoffatomen, wie beispielsweise Vinyl-, Methyl-, athyl-, Propyl-, Butyl-, Hexyl-, Octyl-, Decyl-, Dodecyl-, Äthylen-, Trimethylen-, Propylen-, Tetramethylen-, Hexamethylen- und 1,3.5-Pentylreste. Die genannten cycloaliphatischen Reste sind vorzugsweise einwertige Cyclohexyl- und C-Methylcyclohexylreste.
Die genannten Aralkyl- oder Aralkenylreste sind vorzugsweise einwertige, durch monocyclische Arylreste substituierte niedere Alkyl- oder Alkenylreste, wie beispielsweise Benzyl-, p- Phenyläthyl- und p-Phenylvinylreste. Die genannten Arylreste sind vorzugsweise einwertige, zweiwertige oder dreiwertige Benzol- oder Naphthalinreste, wie beispielsweise Phenyl-, Tolyl-, 1- oder 2-Naphthyl-, 1,4-Naph- thylen-, 1,3- oder 1,4-Phenylen- und 1,5,8-Naphthylen- reste. Solche Arylreste können ausserdem andere Substituenten, wie beispielsweise Chloratome, enthalten.
Als Beispiele für die genannten Reste, in welches eines der Kohlenstoffatome durch ein Stickstoffatom ersetzt ist, seien Reste von 5- und 6gliedrigen stickstoffhaltigen heterocyclischen Ringen, wie beispielsweise der Piperidinorest, und Alkanreste, in denen eines der Kohlenstoffatome durch ein Stickstoffatom ersetzt ist, wie beispielsweise Alkyl-NH-alkylenreste, z. B. der 3-(Äthyl- amino)-äthylrest, genannt.
Als spezifische Beispiele von Phosphonsäuren, die in Form von Salzen mit den organischen Diaminen verwendet werden können, seien genannt: Methylphosphonsäure, Äthylphosphonsäure, n-Propylphosphonsäure, Cyclohexylphosphonsäure, Phenylphosphonsäure, p-Phenyl- äthylphosphonsäure, p-Tolylphosphonsäure, p-Chlorphenylphosphonsäure, 1,4-Butandiphosphonsäure, 1,5-Pen- tandiphosphonsäure, 1,4-Cyclohexandiphosphonsäure, p Benzoldiphosponsäure, p-Xyloldiphosphonsäure, 1,3,5 Pentantriphosphonsäure und Naphthalin-3,6,8- triphosphonsäure.
Es wird jedoch bevorzugt, dass die Phosphonsäure der Formel:
EMI2.1
entspricht, worin R einen einwertigen organischen Rest, vorzugsweise einen Alkyl-, Cycloalkyl-, Aralkyl- oder Arylrest und vor allem einen niederen Alkyl-, Cyclohexyl-, durch monocyclisches Aryl substituierten niederen Alkyl- oder einen monocyclischen Arylrest bedeutet.
Als niedere Alkylgruppen kommen Alkylreste mit 1 bis 4 Kohlenstoffatomen in Betracht.
Die organischen Diamine, die in Form von Salzen mit den Phosphonsäuren verwendet werden, können beliebige organische Verbindungen sein, die zwei primäre, sekundäre oder tertiäre Aminogruppen oder eine Kombination derartiger Gruppen enthalten, wie beispielswei. se Piperazin, 1 ,4-Diazabicyclo-(2,2,2)-octan, 4-Dimethyl- aminopyridin und 4-Diäthylaminopyridin, aber insbesondere aliphatische Diamine, speziell aliphatische Diamine mit mindestens 2 und vorzugsweise nicht mehr als 18 Kohlenstoffatomen zwischen den Aminogruppen, wie beispielsweise Trimethylendiamin, Tetramethylendiamin, Pentamethylendiamin und Hexamethylendiamin.
Wenn das als Ausgangsmaterial im vorliegenden Verfahren verwendete Polyamid durch Polymerisation von praktisch äquimolaren Mengen eines Diamins und einer Dicarbonsäure oder einem Salz aus Diamin und Dicarbonsäure erhalten worden ist, wird es bevorzugt, dass das organische Diamin, das in Form des Salzes mit der Phosphonsäure vorliegt, gleich ist wie das Diamin, das mit der Dicarbonsäure polymerisiert worden ist. Wenn daher beispielsweise Polyhexamethylenadipamid im Verfahren gemäss der Erfindung verwendet wird, verwendet man vorzugsweise auch ein Salz der Phosphonsäure mit Hexamethylendiamin.
Das Salz der Phosphonsäure mit dem organischen Diamin kann entweder die halbe äquimolare Menge oder eine äquimolare Menge des organischen Diamins pro in der Phosphonsäure vorhandener Gruppe der Formel:
EMI2.2
enthalten. Wenn daher n den Wert 1 hat, kann es sich entweder um ein Salz aus 2 Mol Phosphonsäure und 1 Mol des Diamins oder um ein Salz aus 1 Mol der Phosphonsäure und 1 Mol des Diamins handeln.
Im Verfahren gemäss der Erfindung sind diejenigen Polyamide verwendbar, die durch Polymerisation einer Monoaminocarbonsäure oder eines Lactams derselben mit mindestens 2 Kohlenstoffatomen zwischen der Aminogruppe und der Carbonsäuregruppe erhalten wurden, vorzugsweise aber diejenigen Polyamide, die durch Polymerisation praktisch äquimolarer Mengen eines Diamins, welches mindestens 2 Kohlenstoffatome zwischen den Aminogruppen enthält, und einer Dicarbonsäure, welche mindestens 2 Kohlenstoffatome zwischen den Carbonsäuregruppen enthält, erhalten wurden.
Als Beispiele für die genannten polymerisierbaren Monoaminocarbonsäuren oder deren Lactame seien genannt: r-Aminocapronsäure, Caprolactam, 9-Aminononansäure, 11 -Aminoundecansäure, 17-Aminoheptadecansäure. Dodecanolactam, Capryllactam, Önantholactam und Pyrrolidon.
Als Beispiele für die genannte Diamine seien Diamine der Formel H2N(CHn),NH- genannt, worin m eine ganze Zahl von 2 bis 12 bedeutet, wie beispielsweise Trimethylendiamin, Tetramethylendiamin, Pentamethylendiamin, Octamethylendiamin und vor allem Hexamethylendiamin.
Als Beispiele für die genannten Dicarbonsäuren seien Terephthalsäure und Isophthalsäure, vorzugsweise aber Dicarbonsäuren der Formel HOOC-Y-COOH, worin Y einen zweiwertigen aliphatischen Rest mit mindestens 2 Kohlenstoffatomen bedeutet, erwähnt; Beispiele solcher Säuren sind Sebacinsäure, Octadecandisäure, Suberinsäure, Azelainsäure, Undecandisäure. Glutarsäure, Pimelinsäure und vor allem Adipinsäure.
Gewünschtenfalls können dem Polyamid andere Bestandteile zugesetzt werden, die gewöhnlich bei der Herstellung von Polyamiden verwendet werden, z. B. Mattierungsmittel, wie Titandioxyd, Füllstoffe, wie gepulvertes Glas, Asbest oder Glimmer, Lichtstabilisierungsmittel, wie Mangansalze, oder Wärmestabilisierungsmittel, wie Kupfersalze und Jodide, oder diese Bestandteile können bereits in dem vorgebildeten Polyamid enthalten sein.
Das Verfahren gemäss der Erfindung führt zur Bildung von Polyamiden mit viel höherem Molekulargewicht als ein Polyamid haben würde, das in Abwesenheit des organischen Diaminsalzes einer Phosphonsäure auf eine Temperatur oberhalb seines Schmelzpunktes erhitzt würde; dies ist von besonderer Bedeutung, da zwar Polyamide mit ähnlich hohem Molekulargewicht bekannt sind, diese aber bisher nur durch Verlängerung des Polymerisationsprozesses, was zu erhöhtem Abbau der Polymere führen kann, oder durch Anwendung spezieller Apparaturen oder durch anschliessende Nachpolymerisation in fester Phase erhalten werden konnten.
Die Erfindung wird erläutert, aber nicht beschränkt durch die folgenden Beispiele, in welchen Teile und Prozentsätze gewichtsmässig angegeben sind:
Beispiel 1
70 Teile Polyhexamethylenadipamid mit der relativen Viskosität 36,9 werden unter einer Stickstoffatmosphäre geschmolzen. 1,2 Teile Hexamethylendiamin-di-(cyclohexylphosphonat) werden zugesetzt, und das Gemisch wird während 10 Minuten bei 2950 C gerührt. Das Gemisch wird dann abgekühlt. Das resultierende Polymer, das eine verbesserte Affinität für Säurefarbstoffe hat, besitzt eine relative Viskosität von 53,2, während die relative Viskosität des ursprünglichen Polymers nach dem Erhitzen während 10 Minuten auf 2950 C in Abwesenheit des genannten Aminsalzes nur auf 40,9 gestiegen ist.
Beispiel 2
Polyhexamethylenadipamid, das 1 Mol.-% Cyclohexylphosphonsäure enthält (die in Form eines Salzes mit Hexamethylendiamin in den für die Polymerisation verwandten Autoklaven gegeben wurde), wird durch einen 50,8 mm-Extruder geführt, der bei einer Ablufttemperatur von 2500 C und einer Schneckengeschwindigkeit von 60 Umdrehungen pro Minute unter einem Vakuum von 711 mm Quecksilbersäule arbeitet; der Durchsatz des Polyamides wird durch Verwendung einer vibrierenden Förderschnecke für das Polyamid variiert. Die folgende Tabelle enthält die Verweilzeit des Polyamides in dem Extruder und die logarithmischen Viskositätszahlen der resultierenden Produkte.
Verweilzeit (Minuten) Logarithmische Viskositäts des Polyamides in der zahl (0,5%ige Lösung in
Schnecke des Extruders 90%iger Ameisensäure)
0 0,93
2 1,0
3 1,2
4 1,3
5 1,4
Die logarithmische Viskositätszahl eines Polyhexamethylenadipamides, das keinerlei Cyclohexylphosphonsäure enthielt, nahm nicht zu, wenn es in ähnlicher Weise durch die Schnecke des Extruders geführt wurde.
Process for increasing the molecular weight of polyamides
The present invention relates to a method for increasing the molecular weight of polyamides, in particular of polyhexamethylene adipamide.
The method according to the invention for increasing the molecular weight of preformed polyamides is characterized in that a mixture of the polyamide and an organic diamine salt of a phosphonic acid of the formula:
EMI1.1
where n is an integer from 1 to 3 and R ', depending on the value of n, is a monovalent, divalent or trivalent organic radical, heated to a temperature above the melting point of the mixture until the required increase in the molecular weight of the polyamide has been achieved.
This process can conveniently be carried out by heating the mixture of the polyamide and said salt to a temperature above the melting point of the mixture, preferably in the absence of air, e.g. under an inert gas atmosphere, such as under nitrogen, or in a vacuum until the required increase in the molecular weight of the polyamide used as the starting material has been achieved. Advantageously, the process is carried out in an extruder for melt spinning which operates at reduced pressures.
Instead of a mixture of the preformed polyamide and the salt mentioned, a polyamide can be used which already contains the salt mentioned, which was incorporated by polymerization during the formation of the polyamide from the polyamide-forming components.
The organic radicals represented by R 'which are bonded to the phosphorus atom via one of their carbon atoms are preferably 1-, 2- or 3-valent aliphatic, cycloaliphatic, aryl, aralkyl or aralkenyl radicals or such radicals in which a carbon atom is replaced by a heteroatom, in particular the nitrogen atom is replaced. The aliphatic radicals mentioned are preferably monovalent, divalent or trivalent alkane or alkene radicals with up to 12 carbon atoms, such as vinyl, methyl, ethyl, propyl, butyl, hexyl, octyl, decyl, dodecyl, Ethylene, trimethylene, propylene, tetramethylene, hexamethylene and 1,3,5-pentyl radicals. The cycloaliphatic radicals mentioned are preferably monovalent cyclohexyl and C-methylcyclohexyl radicals.
The aralkyl or aralkenyl radicals mentioned are preferably monovalent, lower alkyl or alkenyl radicals substituted by monocyclic aryl radicals, such as benzyl, p-phenylethyl and p-phenylvinyl radicals. The aryl radicals mentioned are preferably monovalent, bivalent or trivalent benzene or naphthalene radicals, such as, for example, phenyl, tolyl, 1- or 2-naphthyl, 1,4-naphthylene, 1,3- or 1,4-phenylene - and 1,5,8-naphthylene residues. Such aryl radicals can also contain other substituents such as chlorine atoms.
Examples of the radicals mentioned, in which one of the carbon atoms has been replaced by a nitrogen atom, are radicals of 5- and 6-membered nitrogen-containing heterocyclic rings, such as the piperidino radical, and alkane radicals in which one of the carbon atoms is replaced by a nitrogen atom, such as Alkyl-NH-alkylene radicals, e.g. B. the 3- (ethyl-amino) -ethyl radical called.
Specific examples of phosphonic acids that can be used in the form of salts with the organic diamines are: methylphosphonic acid, ethylphosphonic acid, n-propylphosphonic acid, cyclohexylphosphonic acid, phenylphosphonic acid, p-phenylethylphosphonic acid, p-tolylphosphonic acid, p-chlorophenylphosphonic acid, 4-butanediphosphonic acid, 1,5-pentanediphosphonic acid, 1,4-cyclohexanediphosphonic acid, p-benzene diphosphonic acid, p-xylene diphosphonic acid, 1,3,5 pentane triphosphonic acid and naphthalene-3,6,8-triphosphonic acid.
However, it is preferred that the phosphonic acid of the formula:
EMI2.1
where R is a monovalent organic radical, preferably an alkyl, cycloalkyl, aralkyl or aryl radical and above all a lower alkyl, cyclohexyl, lower alkyl substituted by monocyclic aryl or a monocyclic aryl radical.
The lower alkyl groups are alkyl radicals having 1 to 4 carbon atoms.
The organic diamines which are used in the form of salts with the phosphonic acids can be any organic compounds containing two primary, secondary or tertiary amino groups, or a combination of such groups, such as, for example. se piperazine, 1,4-diazabicyclo- (2,2,2) -octane, 4-dimethylaminopyridine and 4-diethylaminopyridine, but especially aliphatic diamines, especially aliphatic diamines with at least 2 and preferably not more than 18 carbon atoms between the amino groups such as trimethylene diamine, tetramethylene diamine, pentamethylene diamine and hexamethylene diamine.
If the polyamide used as the starting material in the present process has been obtained by polymerizing practically equimolar amounts of a diamine and a dicarboxylic acid or a salt of diamine and dicarboxylic acid, it is preferred that the organic diamine, which is in the form of the salt with the phosphonic acid, is the same as the diamine that has been polymerized with the dicarboxylic acid. If, for example, polyhexamethylene adipamide is used in the process according to the invention, a salt of phosphonic acid with hexamethylene diamine is preferably also used.
The salt of the phosphonic acid with the organic diamine can be either half the equimolar amount or an equimolar amount of the organic diamine per group of the formula present in the phosphonic acid:
EMI2.2
contain. Therefore, when n is 1, it can be either a salt of 2 moles of phosphonic acid and 1 mole of the diamine or a salt of 1 mole of the phosphonic acid and 1 mole of the diamine.
In the process according to the invention, those polyamides can be used which have been obtained by polymerizing a monoaminocarboxylic acid or a lactam thereof having at least 2 carbon atoms between the amino group and the carboxylic acid group, but preferably those polyamides obtained by polymerizing practically equimolar amounts of a diamine containing at least 2 carbon atoms contains between the amino groups, and a dicarboxylic acid containing at least 2 carbon atoms between the carboxylic acid groups.
Examples of the polymerizable monoaminocarboxylic acids mentioned or their lactams are: r-aminocaproic acid, caprolactam, 9-aminononanoic acid, 11-aminoundecanoic acid, 17-aminoheptadecanoic acid. Dodecanolactam, caprylic lactam, enantholactam and pyrrolidone.
Examples of the diamines mentioned are diamines of the formula H2N (CHn), NH-, where m is an integer from 2 to 12, such as trimethylene diamine, tetramethylene diamine, pentamethylene diamine, octamethylene diamine and, above all, hexamethylene diamine.
Examples of the dicarboxylic acids mentioned include terephthalic acid and isophthalic acid, but preferably dicarboxylic acids of the formula HOOC-Y-COOH, where Y is a divalent aliphatic radical having at least 2 carbon atoms; Examples of such acids are sebacic acid, octadecanedioic acid, suberic acid, azelaic acid, undecanedioic acid. Glutaric acid, pimelic acid and especially adipic acid.
If desired, other ingredients commonly used in the manufacture of polyamides can be added to the polyamide, e.g. B. matting agents such as titanium dioxide, fillers such as powdered glass, asbestos or mica, light stabilizers such as manganese salts, or heat stabilizers such as copper salts and iodides, or these components can already be contained in the preformed polyamide.
The process according to the invention leads to the formation of polyamides of much higher molecular weight than would have a polyamide which, in the absence of the organic diamine salt of a phosphonic acid, would be heated to a temperature above its melting point; This is of particular importance since polyamides with a similarly high molecular weight are known, but so far these could only be obtained by lengthening the polymerization process, which can lead to increased degradation of the polymers, or by using special equipment or by subsequent post-polymerization in the solid phase.
The invention is illustrated but not limited by the following examples, in which parts and percentages are given by weight:
example 1
70 parts of polyhexamethylene adipamide with a relative viscosity of 36.9 are melted under a nitrogen atmosphere. 1.2 parts of hexamethylenediamine di (cyclohexylphosphonate) are added and the mixture is stirred at 2950 ° C. for 10 minutes. The mixture is then cooled. The resulting polymer, which has an improved affinity for acid dyes, has a relative viscosity of 53.2, while the relative viscosity of the original polymer after heating for 10 minutes at 2950 ° C. in the absence of said amine salt only increased to 40.9.
Example 2
Polyhexamethylene adipamide, which contains 1 mol% cyclohexylphosphonic acid (which was added in the form of a salt with hexamethylenediamine to the autoclave used for the polymerization), is passed through a 50.8 mm extruder, which has an exhaust air temperature of 2500 C and a screw speed operates at 60 revolutions per minute under a vacuum of 711 mm of mercury; the throughput of the polyamide is varied by using a vibrating screw conveyor for the polyamide. The following table contains the residence time of the polyamide in the extruder and the inherent viscosity numbers of the resulting products.
Dwell time (minutes) Logarithmic viscosity of the polyamide in number (0.5% solution in
Screw of the extruder 90% formic acid)
0 0.93
2 1.0
3 1.2
4 1.3
5 1.4
The inherent viscosity of a polyhexamethylene adipamide which did not contain any cyclohexylphosphonic acid did not increase when similarly fed through the screw of the extruder.
Claims (1)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB22036/66A GB1092845A (en) | 1965-06-23 | 1965-06-23 | Polyamides |
| GB2659665 | 1965-06-23 | ||
| GB613066 | 1966-02-11 | ||
| GB1640866 | 1966-04-14 | ||
| GB1791766 | 1966-04-25 | ||
| CH901866A CH471181A (en) | 1965-06-23 | 1966-06-22 | Process for the production of polyamides |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH476048A true CH476048A (en) | 1969-07-31 |
Family
ID=27543825
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH317669A CH476048A (en) | 1965-06-23 | 1966-06-22 | Process for increasing the molecular weight of polyamides |
Country Status (1)
| Country | Link |
|---|---|
| CH (1) | CH476048A (en) |
-
1966
- 1966-06-22 CH CH317669A patent/CH476048A/en not_active IP Right Cessation
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