CH493647A - Wässriges Metallisierbad - Google Patents

Wässriges Metallisierbad

Info

Publication number: CH493647A
Authority: CH; Switzerland
Prior art keywords: ions; solution; metal; volume; parts
Prior art date: 1966-05-07

Application number

CH641967A

Other languages

German (de)

English (en)

Inventor

Gerbrecht De Ruig Willem

Molenaar Arian

Jonker Hendrik

Original Assignee

Philips Nv

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1966-05-07

Filing date

1967-05-05

Publication date

1970-07-15

1967-05-05 Application filed by Philips Nv filed Critical Philips Nv

1970-07-15 Publication of CH493647A publication Critical patent/CH493647A/de

Links

229910052751 metal Inorganic materials 0.000 claims description 36
239000002184 metal Substances 0.000 claims description 36
PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 34
150000002500 ions Chemical class 0.000 claims description 24
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
229910052802 copper Inorganic materials 0.000 claims description 16
239000010949 copper Substances 0.000 claims description 16
229910052759 nickel Inorganic materials 0.000 claims description 15
239000010941 cobalt Substances 0.000 claims description 14
GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 14
239000000203 mixture Substances 0.000 claims description 14
QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 13
229910052753 mercury Inorganic materials 0.000 claims description 13
229910017052 cobalt Inorganic materials 0.000 claims description 12
ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
229910052718 tin Inorganic materials 0.000 claims description 10
238000000151 deposition Methods 0.000 claims description 8
229910021645 metal ion Inorganic materials 0.000 claims description 7
238000007254 oxidation reaction Methods 0.000 claims description 7
230000009467 reduction Effects 0.000 claims description 7
230000002441 reversible effect Effects 0.000 claims description 6
229910052738 indium Inorganic materials 0.000 claims description 4
APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 4
239000000126 substance Substances 0.000 claims description 4
229910052793 cadmium Inorganic materials 0.000 claims description 3
BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 3
230000003647 oxidation Effects 0.000 claims description 3
239000011133 lead Substances 0.000 claims description 2
238000001465 metallisation Methods 0.000 claims description 2
229910001429 cobalt ion Inorganic materials 0.000 claims 2
229910001449 indium ion Inorganic materials 0.000 claims 2
229910001453 nickel ion Inorganic materials 0.000 claims 2
230000001419 dependent effect Effects 0.000 claims 1
239000003381 stabilizer Substances 0.000 claims 1
229910001432 tin ion Inorganic materials 0.000 claims 1
239000000243 solution Substances 0.000 description 65
239000007864 aqueous solution Substances 0.000 description 32
XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 26
229910052709 silver Inorganic materials 0.000 description 16
239000004332 silver Substances 0.000 description 16
BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 14
239000011651 chromium Substances 0.000 description 13
239000010410 layer Substances 0.000 description 13
229910000497 Amalgam Inorganic materials 0.000 description 12
238000002156 mixing Methods 0.000 description 11
238000011282 treatment Methods 0.000 description 11
QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 10
239000012299 nitrogen atmosphere Substances 0.000 description 10
WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 9
HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
239000003638 chemical reducing agent Substances 0.000 description 9
230000006911 nucleation Effects 0.000 description 9
238000010899 nucleation Methods 0.000 description 9
150000003839 salts Chemical class 0.000 description 9
IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
150000002739 metals Chemical class 0.000 description 7
238000006722 reduction reaction Methods 0.000 description 7
VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 6
150000001875 compounds Chemical class 0.000 description 6
239000012153 distilled water Substances 0.000 description 6
JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 6
229910000510 noble metal Inorganic materials 0.000 description 6
HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 5
229910000365 copper sulfate Inorganic materials 0.000 description 5
ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 5
230000008021 deposition Effects 0.000 description 5
238000000034 method Methods 0.000 description 5
230000002787 reinforcement Effects 0.000 description 5
-1 silver ions Chemical class 0.000 description 5
KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
239000002253 acid Substances 0.000 description 4
230000015572 biosynthetic process Effects 0.000 description 4
238000006073 displacement reaction Methods 0.000 description 4
230000000694 effects Effects 0.000 description 4
BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 4
229910052757 nitrogen Inorganic materials 0.000 description 4
BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical compound [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 description 4
238000001179 sorption measurement Methods 0.000 description 4
229910052725 zinc Inorganic materials 0.000 description 4
239000011701 zinc Substances 0.000 description 4
ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 3
MKJXYGKVIBWPFZ-UHFFFAOYSA-L calcium lactate Chemical compound [Ca+2].CC(O)C([O-])=O.CC(O)C([O-])=O MKJXYGKVIBWPFZ-UHFFFAOYSA-L 0.000 description 3
239000008139 complexing agent Substances 0.000 description 3
239000004922 lacquer Substances 0.000 description 3
239000004310 lactic acid Substances 0.000 description 3
235000014655 lactic acid Nutrition 0.000 description 3
238000007747 plating Methods 0.000 description 3
239000002244 precipitate Substances 0.000 description 3
RPACBEVZENYWOL-XFULWGLBSA-M sodium;(2r)-2-[6-(4-chlorophenoxy)hexyl]oxirane-2-carboxylate Chemical compound [Na+].C=1C=C(Cl)C=CC=1OCCCCCC[C@]1(C(=O)[O-])CO1 RPACBEVZENYWOL-XFULWGLBSA-M 0.000 description 3
239000004094 surface-active agent Substances 0.000 description 3
IWYVYUZADLIDEY-UHFFFAOYSA-N 4-methoxybenzenesulfonic acid Chemical compound COC1=CC=C(S(O)(=O)=O)C=C1 IWYVYUZADLIDEY-UHFFFAOYSA-N 0.000 description 2
CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
KIKDPIYHXZFGGH-UHFFFAOYSA-N B(F)(F)F.[Sn] Chemical compound B(F)(F)F.[Sn] KIKDPIYHXZFGGH-UHFFFAOYSA-N 0.000 description 2
ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
229920002284 Cellulose triacetate Polymers 0.000 description 2
QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
JVTAAEKCZFNVCJ-UHFFFAOYSA-M Lactate Chemical compound CC(O)C([O-])=O JVTAAEKCZFNVCJ-UHFFFAOYSA-M 0.000 description 2
229910021586 Nickel(II) chloride Inorganic materials 0.000 description 2
GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 2
OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
239000013543 active substance Substances 0.000 description 2
239000012790 adhesive layer Substances 0.000 description 2
239000012670 alkaline solution Substances 0.000 description 2
230000003321 amplification Effects 0.000 description 2
TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
229910052796 boron Inorganic materials 0.000 description 2
239000007795 chemical reaction product Substances 0.000 description 2
RCTYPNKXASFOBE-UHFFFAOYSA-M chloromercury Chemical compound [Hg]Cl RCTYPNKXASFOBE-UHFFFAOYSA-M 0.000 description 2
238000001035 drying Methods 0.000 description 2
239000004744 fabric Substances 0.000 description 2
239000011790 ferrous sulphate Substances 0.000 description 2
235000003891 ferrous sulphate Nutrition 0.000 description 2
229910000359 iron(II) sulfate Inorganic materials 0.000 description 2
229940046892 lead acetate Drugs 0.000 description 2
238000004519 manufacturing process Methods 0.000 description 2
QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 2
229910017604 nitric acid Inorganic materials 0.000 description 2
238000003199 nucleic acid amplification method Methods 0.000 description 2
229910052763 palladium Inorganic materials 0.000 description 2
ACVYVLVWPXVTIT-UHFFFAOYSA-M phosphinate Chemical compound [O-][PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-M 0.000 description 2
239000011574 phosphorus Substances 0.000 description 2
229910052698 phosphorus Inorganic materials 0.000 description 2
229910052697 platinum Inorganic materials 0.000 description 2
KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 2
230000003014 reinforcing effect Effects 0.000 description 2
229910001961 silver nitrate Inorganic materials 0.000 description 2
230000002269 spontaneous effect Effects 0.000 description 2
UUUGYDOQQLOJQA-UHFFFAOYSA-L vanadyl sulfate Chemical compound [V+2]=O.[O-]S([O-])(=O)=O UUUGYDOQQLOJQA-UHFFFAOYSA-L 0.000 description 2
229940041260 vanadyl sulfate Drugs 0.000 description 2
229910000352 vanadyl sulfate Inorganic materials 0.000 description 2
CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
FQBAMYDJEQUGNV-UHFFFAOYSA-N 2-methoxybenzenesulfonic acid Chemical compound COC1=CC=CC=C1S(O)(=O)=O FQBAMYDJEQUGNV-UHFFFAOYSA-N 0.000 description 1
QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
ZFIQGRISGKSVAG-UHFFFAOYSA-N 4-methylaminophenol Chemical compound CNC1=CC=C(O)C=C1 ZFIQGRISGKSVAG-UHFFFAOYSA-N 0.000 description 1
BHPQYMZQTOCNFJ-UHFFFAOYSA-N Calcium cation Chemical compound [Ca+2] BHPQYMZQTOCNFJ-UHFFFAOYSA-N 0.000 description 1
229910021555 Chromium Chloride Inorganic materials 0.000 description 1
KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 1
229920013646 Hycar Polymers 0.000 description 1
NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
229910002651 NO3 Inorganic materials 0.000 description 1
NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
229920000459 Nitrile rubber Polymers 0.000 description 1
ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
206010070834 Sensitisation Diseases 0.000 description 1
QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 1
229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
230000009471 action Effects 0.000 description 1
230000003213 activating effect Effects 0.000 description 1
230000004913 activation Effects 0.000 description 1
239000000654 additive Substances 0.000 description 1
230000000996 additive effect Effects 0.000 description 1
230000002411 adverse Effects 0.000 description 1
229910021529 ammonia Inorganic materials 0.000 description 1
VBIXEXWLHSRNKB-UHFFFAOYSA-N ammonium oxalate Chemical compound [NH4+].[NH4+].[O-]C(=O)C([O-])=O VBIXEXWLHSRNKB-UHFFFAOYSA-N 0.000 description 1
239000012298 atmosphere Substances 0.000 description 1
JBANFLSTOJPTFW-UHFFFAOYSA-N azane;boron Chemical compound [B].N JBANFLSTOJPTFW-UHFFFAOYSA-N 0.000 description 1
244000052616 bacterial pathogen Species 0.000 description 1
ITHZDDVSAWDQPZ-UHFFFAOYSA-L barium acetate Chemical compound [Ba+2].CC([O-])=O.CC([O-])=O ITHZDDVSAWDQPZ-UHFFFAOYSA-L 0.000 description 1
230000005587 bubbling Effects 0.000 description 1
NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
UHYPYGJEEGLRJD-UHFFFAOYSA-N cadmium(2+);selenium(2-) Chemical compound [Se-2].[Cd+2] UHYPYGJEEGLRJD-UHFFFAOYSA-N 0.000 description 1
239000011575 calcium Substances 0.000 description 1
229910001424 calcium ion Inorganic materials 0.000 description 1
229920002678 cellulose Polymers 0.000 description 1
239000001913 cellulose Substances 0.000 description 1
239000000460 chlorine Substances 0.000 description 1
229910052801 chlorine Inorganic materials 0.000 description 1
QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
238000004140 cleaning Methods 0.000 description 1
GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
230000000536 complexating effect Effects 0.000 description 1
238000001816 cooling Methods 0.000 description 1
229930003836 cresol Natural products 0.000 description 1
238000010790 dilution Methods 0.000 description 1
239000012895 dilution Substances 0.000 description 1
238000007598 dipping method Methods 0.000 description 1
HBRNMIYLJIXXEE-UHFFFAOYSA-N dodecylazanium;acetate Chemical compound CC(O)=O.CCCCCCCCCCCCN HBRNMIYLJIXXEE-UHFFFAOYSA-N 0.000 description 1
238000004870 electrical engineering Methods 0.000 description 1
229910001448 ferrous ion Inorganic materials 0.000 description 1
238000001914 filtration Methods 0.000 description 1
229910052732 germanium Inorganic materials 0.000 description 1
GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
238000010438 heat treatment Methods 0.000 description 1
229910000337 indium(III) sulfate Inorganic materials 0.000 description 1
XGCKLPDYTQRDTR-UHFFFAOYSA-H indium(iii) sulfate Chemical compound [In+3].[In+3].[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O.[O-]S([O-])(=O)=O XGCKLPDYTQRDTR-UHFFFAOYSA-H 0.000 description 1
239000000463 material Substances 0.000 description 1
239000011259 mixed solution Substances 0.000 description 1
229910052750 molybdenum Inorganic materials 0.000 description 1
239000011733 molybdenum Substances 0.000 description 1
230000007935 neutral effect Effects 0.000 description 1
230000003287 optical effect Effects 0.000 description 1
230000001590 oxidative effect Effects 0.000 description 1
150000002940 palladium Chemical class 0.000 description 1
PIBWKRNGBLPSSY-UHFFFAOYSA-L palladium(II) chloride Chemical compound Cl[Pd]Cl PIBWKRNGBLPSSY-UHFFFAOYSA-L 0.000 description 1
150000002989 phenols Chemical class 0.000 description 1
229920006267 polyester film Polymers 0.000 description 1
239000011591 potassium Substances 0.000 description 1
229910052700 potassium Inorganic materials 0.000 description 1
239000001103 potassium chloride Substances 0.000 description 1
235000011164 potassium chloride Nutrition 0.000 description 1
238000001556 precipitation Methods 0.000 description 1
230000008569 process Effects 0.000 description 1
230000000135 prohibitive effect Effects 0.000 description 1
239000011347 resin Substances 0.000 description 1
229920005989 resin Polymers 0.000 description 1
230000008313 sensitization Effects 0.000 description 1
150000003378 silver Chemical class 0.000 description 1
229940100890 silver compound Drugs 0.000 description 1
150000003379 silver compounds Chemical class 0.000 description 1
238000002791 soaking Methods 0.000 description 1
230000000087 stabilizing effect Effects 0.000 description 1
235000011150 stannous chloride Nutrition 0.000 description 1
238000005728 strengthening Methods 0.000 description 1
UEUXEKPTXMALOB-UHFFFAOYSA-J tetrasodium;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate Chemical compound [Na+].[Na+].[Na+].[Na+].[O-]C(=O)CN(CC([O-])=O)CCN(CC([O-])=O)CC([O-])=O UEUXEKPTXMALOB-UHFFFAOYSA-J 0.000 description 1
229910052716 thallium Inorganic materials 0.000 description 1
BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
239000011135 tin Substances 0.000 description 1
AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
229910000349 titanium oxysulfate Inorganic materials 0.000 description 1
230000007704 transition Effects 0.000 description 1
238000009827 uniform distribution Methods 0.000 description 1

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C1/00—Photosensitive materials
- G03C1/52—Compositions containing diazo compounds as photosensitive substances
- G03C1/62—Metal compounds reducible to metal
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03C—PHOTOSENSITIVE MATERIALS FOR PHOTOGRAPHIC PURPOSES; PHOTOGRAPHIC PROCESSES, e.g. CINE, X-RAY, COLOUR, STEREO-PHOTOGRAPHIC PROCESSES; AUXILIARY PROCESSES IN PHOTOGRAPHY
- G03C5/00—Photographic processes or agents therefor; Regeneration of such processing agents
- G03C5/58—Processes for obtaining metallic images by vapour deposition or physical development

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Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
General Physics & Mathematics (AREA)
Physics & Mathematics (AREA)
Chemically Coating (AREA)
Laminated Bodies (AREA)
Manufacturing Of Printed Wiring (AREA)
Electroplating And Plating Baths Therefor (AREA)

CH641967A 1966-05-07 1967-05-05 Wässriges Metallisierbad CH493647A (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
NL6606262A NL155055B (nl)	1966-05-07	1966-05-07	Werkwijze voor het metalliseren van kiembeelden op elektrisch niet-geleidende dragers en dragers voorzien van aldus verkregen metaalbeelden.

Publications (1)

Publication Number	Publication Date
CH493647A true CH493647A (de)	1970-07-15

Family

ID=19796529

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CH641967A CH493647A (de)	1966-05-07	1967-05-05	Wässriges Metallisierbad

Country Status (6)

Country	Link
AT (1)	AT274511B (th)
BE (1)	BE698159A (th)
CH (1)	CH493647A (th)
GB (1)	GB1187861A (th)
NL (1)	NL155055B (th)
SE (1)	SE326891B (th)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2505437A1 (de) *	1974-02-22	1975-08-28	Philips Nv	Universelle verkupferungsloesung

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
NL7402422A (nl)	1974-02-22	1975-08-26	Philips Nv	Universele verkoperingsoplossing.

1966
- 1966-05-07 NL NL6606262A patent/NL155055B/xx not_active IP Right Cessation
1967
- 1967-05-03 SE SE632667A patent/SE326891B/xx unknown
- 1967-05-04 GB GB2071567A patent/GB1187861A/en not_active Expired
- 1967-05-05 AT AT423267A patent/AT274511B/de active
- 1967-05-05 CH CH641967A patent/CH493647A/de not_active IP Right Cessation
- 1967-05-08 BE BE698159D patent/BE698159A/xx unknown

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE2505437A1 (de) *	1974-02-22	1975-08-28	Philips Nv	Universelle verkupferungsloesung

Also Published As

Publication number	Publication date
DE1621299B2 (de)	1975-11-27
SE326891B (th)	1970-08-03
BE698159A (th)	1967-11-08
NL6606262A (th)	1967-11-08
NL155055B (nl)	1977-11-15
GB1187861A (en)	1970-04-15
AT274511B (de)	1969-09-25
DE1621299A1 (de)	1971-04-29

Legal Events

Date	Code	Title	Description
1974-12-13	PL	Patent ceased

Publication	Publication Date	Title
DE2457829A1 (de)	1975-06-12	Verfahren und loesungen fuer die stromlose metallauftragung
DE1917474B2 (de)	1975-01-02	Verfahren zum Herstellen metallischer Muster auf einer Unterlage
DE1446699B2 (de)	1971-12-02	Verfahren zur herstellung von elektrisch nichtleitenden makromolekularen traegern
DE2238002B2 (de)	1978-03-30	Verfahren zur additiven Herstellung von aus Metallabscheidungen bestehenden Mustern
DE2505958C3 (de)	1982-04-22	Verkupferungslösung
DE2049061B2 (de)	1980-07-24	Alkalisches wäßriges Bad und dessen Verwendung zur stromlosen Verkupferung
DE2335497C3 (de)	1978-08-24	Verfahren zum katalytischen Sensibilisieren von Oberflächen von Kunststoffen und Lösung zur Durchführung des Verfahrens
DE2559059C3 (de)	1978-05-11	Stabilisiertes Bad für die stromlose Metallabscheidung
DE2627941C2 (de)	1985-04-18	Aktivierungslösung zum stromlosen Verkupfern auf der Basis eines Silbersalzes
DE2137179A1 (de)	1972-02-03	Verfahren zum stromlosen Metalhsie ren einer Oberflache
DE1572226A1 (de)	1970-01-08	Verfahren zur photographischen Herstellung von Metallbildern
CH493647A (de)	1970-07-15	Wässriges Metallisierbad
DE1269481B (de)	1968-05-30	Verfahren zur Herstellung von Metallbildern auf photographischem Wege
DE2453786C2 (de)	1981-12-24	Verfahren zur Herstellung eines äußeren elektrisch leitenden Metallmusters
DE1621299C3 (de)	1976-07-01	Metallisierungsbad
DE2454536A1 (de)	1975-06-05	Verfahren zur herstellung von lichtempfindlichem material
DE3852681T2 (de)	1995-07-20	Verfahren zum selektiven Metallplattieren auf der Oberfläche eines Substrats.
DE2530614C2 (de)	1983-12-29	Verfahren zum Vorbereiten von Trägermaterialien für die Herstellung von Metallmustern
DE2328378C3 (de)	1980-12-11	Bad zum stromlosen Abscheiden von Silber
DE4412463A1 (de)	1995-10-12	Palladiumkolloid-Lösung und deren Verwendung
DE2530415A1 (de)	1976-01-29	Verfahren zum herstellen von mustern, insbesondere leitermustern gedruckter schaltungen nach dem sogenannten aufbauverfahren
AT369941B (de)	1983-02-10	Verfahren zum herstellen von insbesondere als leitermuster fuer gedruckte schaltungen dienenden mustern auf unterlagen
DE2323507A1 (de)	1973-11-29	Verfahren zur herstellung metallischer muster
DE2548832C3 (de)	1980-01-31	Verfahren zum katalytischen Bekeimen von Oberflächen, insbesondere Isolierstoffoberflächen und Lösung zur Durchführung des Verfahrens
DE1797223C3 (de)	1977-03-17	Verfahren zur Herstellung von elektrisch leitenden Metallschichten auf Kunststoffen

CH493647A - Wässriges Metallisierbad - Google Patents

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Applications Claiming Priority (1)

Publications (1)

Family

ID=19796529

Family Applications (1)

Country Status (6)

Cited By (1)

Families Citing this family (1)

Cited By (1)

Also Published As

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