CH510327A - Kühlelement für eine Halbleitervorrichtung - Google Patents

Kühlelement für eine Halbleitervorrichtung

Info

Publication number
CH510327A
CH510327A CH996270A CH996270A CH510327A CH 510327 A CH510327 A CH 510327A CH 996270 A CH996270 A CH 996270A CH 996270 A CH996270 A CH 996270A CH 510327 A CH510327 A CH 510327A
Authority
CH
Switzerland
Prior art keywords
semiconductor device
cooling element
cooling
semiconductor
Prior art date
Application number
CH996270A
Other languages
English (en)
Inventor
Hopkins Frank
Original Assignee
Redpoint Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Redpoint Ltd filed Critical Redpoint Ltd
Publication of CH510327A publication Critical patent/CH510327A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/641—Snap-on arrangements, e.g. clips
CH996270A 1968-11-29 1970-07-01 Kühlelement für eine Halbleitervorrichtung CH510327A (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US78015768A 1968-11-29 1968-11-29
GB3327969 1969-07-01

Publications (1)

Publication Number Publication Date
CH510327A true CH510327A (de) 1971-07-15

Family

ID=26261796

Family Applications (1)

Application Number Title Priority Date Filing Date
CH996270A CH510327A (de) 1968-11-29 1970-07-01 Kühlelement für eine Halbleitervorrichtung

Country Status (4)

Country Link
US (1) US3548927A (de)
CH (1) CH510327A (de)
DE (1) DE2032402A1 (de)
GB (1) GB1316086A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3422362A1 (de) * 1983-06-16 1984-12-20 IMC Magnetics Corp., Jericho, N.Y. Strahlungskuehler fuer halbleitervorrichtungen

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1815989A1 (de) * 1968-12-20 1970-07-02 Semikron Gleichrichterbau Halbleiter-Anordnung
US3694703A (en) * 1970-09-02 1972-09-26 Staver Co Inc The Heat dissipator for encased semiconductor device having heat tab extending therefrom
US3670215A (en) * 1970-09-28 1972-06-13 Staver Co Inc The Heat dissipator for integrated circuit
FR2167271B1 (de) * 1972-01-11 1977-04-01 Staver Co
DE7206020U (de) * 1972-02-18 1972-06-08 Itw Ateco Gmbh Vorrichtung zum befestigen des gehaeuses eines halbleiterelementes an einer tragplatte
US3893161A (en) * 1974-02-04 1975-07-01 Jr Albert Pesak Frictionally engageable heat sink for solid state devices
US4041524A (en) * 1974-12-30 1977-08-09 The Staver Company, Inc. Heat dissipating device for transistor with outwardly extending heat conductive tab
US4012769A (en) * 1975-08-04 1977-03-15 Thermalloy Incorporated Heat sink with parallel flat faces
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS5266376A (en) * 1975-11-29 1977-06-01 Hitachi Ltd Device and manufacture of resin body type semiconductor
FR2368868A7 (fr) * 1976-10-21 1978-05-19 Ates Componenti Elettron Dispositif a semi conducteurs en forme de boitier
US4103737A (en) * 1976-12-16 1978-08-01 Marantz Company, Inc. Heat exchanger structure for electronic apparatus
US4199654A (en) * 1977-09-14 1980-04-22 Bunker Ramo Corporation Semiconductor mounting assembly
IT7821073V0 (it) * 1978-03-09 1978-03-09 Ates Componenti Elettron Morsetto per il fissaggio di un dispositivo a semiconduttore ad un dissipatore di calore.
US4215361A (en) * 1978-09-12 1980-07-29 Aavid Engineering, Inc. Winged self-fastened heat sinks for semiconductor devices
US4261005A (en) * 1979-02-27 1981-04-07 Aavid Engineering, Inc. Miniature heat sink
DE2936615C2 (de) * 1979-09-11 1985-03-28 Brown, Boveri & Cie Ag, 6800 Mannheim Schutzvorrichtung
USD262961S (en) 1979-09-17 1982-02-09 Aavid Engineering, Inc. Clip-on heat sink for electronic devices
FR2479563A1 (fr) * 1980-03-26 1981-10-02 Ouest Electronic Connecteurs Etrier de verrouillage pour circuit integre
US4345267A (en) * 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4408220A (en) * 1981-01-29 1983-10-04 Calabro Anthony Denis Heat dissipator for a dual in line integrated circuit package
USD272902S (en) 1981-12-09 1984-03-06 Aavid Engineering, Inc. Self-fastened heat sink
US4481525A (en) * 1982-08-12 1984-11-06 Anthony D. Calabro Heat dissipator for integrated circuit chips
USD275749S (en) 1982-09-30 1984-10-02 Aavid Engineering, Inc. Slip-on heat sink for long integrated-circuit modules
US4552206A (en) * 1983-01-17 1985-11-12 Aavid Engineering, Inc. Heat sinks for integrated circuit modules
US4508163A (en) * 1983-01-18 1985-04-02 Aavid Engineering, Inc. Heat sinks for integrated circuit modules
DE3335377A1 (de) * 1983-09-29 1985-04-11 Siemens AG, 1000 Berlin und 8000 München Einrichtung zum festhalten eines kuehlkoerpers auf einem integrierten baustein
US4537246A (en) * 1983-12-09 1985-08-27 Conver Corporation Vertical heat sink
US4575038A (en) * 1984-07-02 1986-03-11 Thermalloy Incorporated Spring clip fastener for mounting of printed circuit board components
US4683489A (en) * 1984-08-08 1987-07-28 Siemens Aktiengesellschaft Common housing for two semi-conductor bodies
JPH0135482Y2 (de) * 1985-03-26 1989-10-30
US4609040A (en) * 1985-04-01 1986-09-02 Thermalloy Incorporated Self-securing heat sink
GB2174541B (en) * 1985-05-04 1989-05-24 Stc Plc Dil package adaptor
US4720771A (en) * 1985-07-05 1988-01-19 Chrysler Motors Corporation Heat sink assembly for a circuit board mounted integrated circuit
US4729426A (en) * 1986-03-06 1988-03-08 Thermalloy Incorporated Bonded clip heat sink
US4712159A (en) * 1986-04-14 1987-12-08 Thermalloy Incorporated Heat sink clip assembly
FR2617334B1 (fr) * 1987-06-29 1990-04-13 Cit Alcatel Dissipateur thermique pour circuit integre
US5019942A (en) * 1987-11-30 1991-05-28 Thermalloy Incorporated Insulating apparatus for electronic device assemblies
US4888637A (en) * 1988-01-15 1989-12-19 Chrysler Motors Corporation Multiple semiconductor heat sink/mounting assembly
JPH03222350A (ja) * 1990-01-29 1991-10-01 Hitachi Ltd 樹脂封止形半導体装置及びその実装構造
US5068764A (en) * 1990-03-05 1991-11-26 Thermalloy Incorporated Electronic device package mounting assembly
US5201866A (en) * 1992-02-03 1993-04-13 International Business Machines Corporation Structure for dissipation of heat having slidably engaged fins for conformal disposition against a heat generating surface
US5304735A (en) * 1992-02-14 1994-04-19 Aavid Engineering, Inc. Heat sink for an electronic pin grid array
US5311395A (en) * 1992-10-29 1994-05-10 Ncr Corporation Surface mount heat sink
JP2001091174A (ja) * 1999-09-22 2001-04-06 Kel Corp 熱伝達コネクタ
JP2003523620A (ja) * 2000-02-17 2003-08-05 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 装置に押し付けられる集積部品をもつヒートシンク
US20050161195A1 (en) * 2003-07-22 2005-07-28 Hein Gerald K. System for reliably removing heat from a semiconductor junction
US7360586B2 (en) * 2003-07-31 2008-04-22 Fujitsu Limited Wrap around heat sink apparatus and method
DE10353849B4 (de) * 2003-11-18 2009-05-07 Infineon Technologies Ag Anpresselement zum Anpressen eines zu kühlenden elektrischen Beuteils an ein Kühlelement, System zum Kühlen eines elektrischen Bauteils, und Bauteilanordnung mit einem zu kühlenden elektrischen Bauteil
JP2008218840A (ja) * 2007-03-06 2008-09-18 Funai Electric Co Ltd Ｉｃ固定構造
US20100186933A1 (en) * 2009-01-28 2010-07-29 Kun-Jung Chang Heat dispersing module
US20120012284A1 (en) * 2010-07-13 2012-01-19 Alcatel-Lucent Usa Inc. heat sink with staggered heat exchange elements
ITMI20111217A1 (it) * 2011-06-30 2012-12-31 St Microelectronics Srl Sistema contenitore/dissipatore per componente elettronico
ITMI20111214A1 (it) 2011-06-30 2012-12-31 St Microelectronics Srl Dispositivo di potenza a spessore ridotto
USD758327S1 (en) 2014-09-30 2016-06-07 Valeo Vision Heat sink for a lighting device module for a vehicle

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3422362A1 (de) * 1983-06-16 1984-12-20 IMC Magnetics Corp., Jericho, N.Y. Strahlungskuehler fuer halbleitervorrichtungen

Also Published As

Publication number Publication date
GB1316086A (en) 1973-05-09
DE2032402A1 (de) 1971-01-21
US3548927A (en) 1970-12-22

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Legal Events

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PL Patent ceased