CH511511A - Halbleiter-Anordnung - Google Patents

Halbleiter-Anordnung

Info

Publication number
CH511511A
CH511511A CH1091369A CH1091369A CH511511A CH 511511 A CH511511 A CH 511511A CH 1091369 A CH1091369 A CH 1091369A CH 1091369 A CH1091369 A CH 1091369A CH 511511 A CH511511 A CH 511511A
Authority
CH
Switzerland
Prior art keywords
semiconductor arrangement
semiconductor
arrangement
Prior art date
Application number
CH1091369A
Other languages
English (en)
Inventor
Liboslav Dipl Chem Vladik
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of CH511511A publication Critical patent/CH511511A/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
    • Y10S257/909—Macrocell arrays, e.g. gate arrays with variable size or configuration of cells
CH1091369A 1968-12-20 1969-07-16 Halbleiter-Anordnung CH511511A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19681815989 DE1815989A1 (de) 1968-12-20 1968-12-20 Halbleiter-Anordnung

Publications (1)

Publication Number Publication Date
CH511511A true CH511511A (de) 1971-08-15

Family

ID=5716894

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1091369A CH511511A (de) 1968-12-20 1969-07-16 Halbleiter-Anordnung

Country Status (7)

Country Link
US (1) US3783347A (de)
JP (1) JPS4926267B1 (de)
CH (1) CH511511A (de)
DE (1) DE1815989A1 (de)
ES (1) ES371189A1 (de)
FR (1) FR2026610A1 (de)
GB (1) GB1279699A (de)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4011575A (en) * 1974-07-26 1977-03-08 Litton Systems, Inc. Light emitting diode array having a plurality of conductive paths for each light emitting diode
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
US4054901A (en) * 1975-10-14 1977-10-18 Thermalloy, Inc. Index mounting unitary heat sink apparatus with apertured base
JPS5273457A (en) * 1975-12-16 1977-06-20 Ishikawajima Harima Heavy Ind Co Ltd Crane for pipe transport
US4117508A (en) * 1977-03-21 1978-09-26 General Electric Company Pressurizable semiconductor pellet assembly
JPS5572064A (en) * 1978-11-25 1980-05-30 Kyocera Corp Ceramic substrate
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
US4278990A (en) * 1979-03-19 1981-07-14 General Electric Company Low thermal resistance, low stress semiconductor package
US4303934A (en) * 1979-08-30 1981-12-01 Burr-Brown Research Corp. Molded lead frame dual in line package including a hybrid circuit
US5032898A (en) * 1979-12-10 1991-07-16 Amp Incorporated Electro-optic device assembly having integral heat sink/retention means
US4530003A (en) * 1981-02-02 1985-07-16 Motorola, Inc. Low-cost power device package with quick connect terminals and electrically isolated mounting means
US4611389A (en) * 1983-11-03 1986-09-16 Motorola, Inc. Low-cost power device package with quick-connect terminals and electrically isolated mounting means
DE3505086A1 (de) * 1985-02-14 1986-08-28 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungshalbleitermodul mit einem kunststoffgehaeuse
JPH0331020Y2 (de) * 1985-06-17 1991-07-01
DE3887992D1 (de) * 1988-03-05 1994-03-31 Itt Ind Gmbh Deutsche Halbleiterbauelement mit zwei anschlüssen, dessen herstellverfahren und ausführungsvorrichtung dafür.
KR100241476B1 (ko) * 1990-09-24 2000-02-01 윌리엄 비. 켐플러 집적 회로용 절연 리드 프레임 및 그의 제조 방법
US5309320A (en) * 1991-02-06 1994-05-03 Hughes Aircraft Company Circuit card assembly conduction converter
US5402006A (en) * 1992-11-10 1995-03-28 Texas Instruments Incorporated Semiconductor device with enhanced adhesion between heat spreader and leads and plastic mold compound
US6949822B2 (en) * 2000-03-17 2005-09-27 International Rectifier Corporation Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance
US20070230185A1 (en) * 2006-03-31 2007-10-04 Shuy Geoffrey W Heat exchange enhancement
US7593229B2 (en) * 2006-03-31 2009-09-22 Hong Kong Applied Science & Technology Research Institute Co. Ltd Heat exchange enhancement
US7440280B2 (en) 2006-03-31 2008-10-21 Hong Kong Applied Science & Technology Research Institute Co., Ltd Heat exchange enhancement
DE102007033103B4 (de) * 2007-07-13 2010-05-06 Auto-Kabel Management Gmbh Verpolschutzeinrichtung für Bordnetze von Kraftfahrzeugen
US10267567B1 (en) * 2014-01-13 2019-04-23 Nutech Ventures Monolithic heat-transfer device
JP6093455B2 (ja) * 2014-01-27 2017-03-08 株式会社日立製作所 半導体モジュール
US10114183B2 (en) * 2015-07-31 2018-10-30 Finisar Corporation Screwless heat sink attachment
WO2019037867A1 (en) 2017-08-25 2019-02-28 Huawei Technologies Co., Ltd. SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
FR3104891B1 (fr) * 2019-12-11 2021-11-19 Valeo Equip Electr Moteur Ensemble électrique et convertisseur de tension

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3056898A (en) * 1959-07-09 1962-10-02 Westinghouse Electric Corp Lighting unit and method of manufacture
GB1083288A (en) * 1963-12-21 1967-09-13 Ckd Praha Improvements in or relating to vacuum-tight casings for semiconductor elements
US3463970A (en) * 1966-10-26 1969-08-26 Gen Electric Integrated semiconductor rectifier assembly
DE1614587B2 (de) * 1967-08-24 1976-05-13 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
US3469148A (en) * 1967-11-08 1969-09-23 Gen Motors Corp Protectively covered hybrid microcircuits
US3539875A (en) * 1968-09-25 1970-11-10 Philips Corp Hardware envelope with semiconductor mounting arrangements
US3548927A (en) * 1968-11-29 1970-12-22 Intern Electronic Research Co Heat dissipating retainer for electronic component
US3566958A (en) * 1968-12-18 1971-03-02 Gen Systems Inc Heat sink for electrical devices

Also Published As

Publication number Publication date
FR2026610A1 (de) 1970-09-18
US3783347A (en) 1974-01-01
ES371189A1 (es) 1972-01-16
DE1815989A1 (de) 1970-07-02
JPS4926267B1 (de) 1974-07-08
GB1279699A (en) 1972-06-28

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Legal Events

Date Code Title Description
PL Patent ceased