CH519786A - Verfahren zum Umhüllen von elektronischen Bauelementen mit Epoxidharz-Pressmassen - Google Patents
Verfahren zum Umhüllen von elektronischen Bauelementen mit Epoxidharz-PressmassenInfo
- Publication number
- CH519786A CH519786A CH1211469A CH1211469A CH519786A CH 519786 A CH519786 A CH 519786A CH 1211469 A CH1211469 A CH 1211469A CH 1211469 A CH1211469 A CH 1211469A CH 519786 A CH519786 A CH 519786A
- Authority
- CH
- Switzerland
- Prior art keywords
- epoxy resin
- electronic components
- resin molding
- molding compounds
- encasing electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/12—Protection against corrosion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19681789053 DE1789053B1 (de) | 1968-09-28 | 1968-09-28 | Niederdruck-pressmasse zum umhuellen von elektronis chen bauelementen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH519786A true CH519786A (de) | 1972-02-29 |
Family
ID=5706779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH1211469A CH519786A (de) | 1968-09-28 | 1969-08-11 | Verfahren zum Umhüllen von elektronischen Bauelementen mit Epoxidharz-Pressmassen |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPS5510929B1 (de) |
| CH (1) | CH519786A (de) |
| DE (1) | DE1789053B1 (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013143727A3 (de) * | 2012-03-29 | 2014-01-09 | Siemens Aktiengesellschaft | Elektroisolationskörper für eine hochspannungsrotationsmaschine und verfahren zum herstellen des elektroisolationskörpers |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04113180A (ja) * | 1990-09-03 | 1992-04-14 | Masahiro Yamazaki | 透明着色氷の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2906932A (en) * | 1955-06-13 | 1959-09-29 | Sprague Electric Co | Silicon junction diode |
| NL219578A (de) * | 1956-08-03 | 1900-01-01 | ||
| DE1141083B (de) * | 1959-08-11 | 1962-12-13 | Paul Lechler Kunststoff Chemie | Verfahren zum Herstellen von Form- oder UEberzugsmassen |
| US3264248A (en) * | 1959-12-03 | 1966-08-02 | Gen Electric | Encapsulating compositions containing an epoxy resin, metaxylylene diamine, and tris-beta chlorethyl phosphate, and encapsulated modules |
| DE1263285B (de) * | 1960-09-13 | 1968-03-14 | Siemens Ag | Verfahren zum Umhuellen von elektrischen Bauteilen |
-
1968
- 1968-09-28 DE DE19681789053 patent/DE1789053B1/de not_active Withdrawn
-
1969
- 1969-08-11 CH CH1211469A patent/CH519786A/de not_active IP Right Cessation
- 1969-09-27 JP JP7732169A patent/JPS5510929B1/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2013143727A3 (de) * | 2012-03-29 | 2014-01-09 | Siemens Aktiengesellschaft | Elektroisolationskörper für eine hochspannungsrotationsmaschine und verfahren zum herstellen des elektroisolationskörpers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5510929B1 (de) | 1980-03-21 |
| DE1789053B1 (de) | 1972-04-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |