CH536882A - Appareil pour le revêtement sous vide d'un substrat par une couche épaisse et fortement adhérente - Google Patents
Appareil pour le revêtement sous vide d'un substrat par une couche épaisse et fortement adhérenteInfo
- Publication number
- CH536882A CH536882A CH285471A CH285471A CH536882A CH 536882 A CH536882 A CH 536882A CH 285471 A CH285471 A CH 285471A CH 285471 A CH285471 A CH 285471A CH 536882 A CH536882 A CH 536882A
- Authority
- CH
- Switzerland
- Prior art keywords
- thick
- substrate
- vacuum coating
- adherent layer
- strongly adherent
- Prior art date
Links
- 230000001464 adherent effect Effects 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
- 238000001771 vacuum deposition Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/02—Pretreatment of the material to be coated
- C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/46—Sputtering by ion beam produced by an external ion source
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR7008177A FR2082217A5 (en) | 1970-03-06 | 1970-03-06 | Substrate coating by cathodic sputtering andevaporation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CH536882A true CH536882A (fr) | 1973-05-15 |
Family
ID=9051857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CH285471A CH536882A (fr) | 1970-03-06 | 1971-02-25 | Appareil pour le revêtement sous vide d'un substrat par une couche épaisse et fortement adhérente |
Country Status (3)
| Country | Link |
|---|---|
| CH (1) | CH536882A (fr) |
| DE (1) | DE2110668A1 (fr) |
| FR (1) | FR2082217A5 (fr) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2194105A1 (en) * | 1972-07-31 | 1974-02-22 | Cit Alcatel | Plasma generator for thin film deposition - in which anode and cathode bodies are fixed rigidly together and magnet is fixed to anode |
| FR2403645A2 (fr) * | 1977-09-14 | 1979-04-13 | Vide & Traitement Sa | Four pour le traitement thermochimique, en continu, de pieces metalliques, par bombardement ionique |
| DE2800852C2 (de) * | 1978-01-10 | 1983-07-14 | Jurij Akimovič Moskva Dmitriev | Einrichtung zum Ionenplasma-Beschichten |
| US4175029A (en) * | 1978-03-16 | 1979-11-20 | Dmitriev Jury A | Apparatus for ion plasma coating of articles |
| GB9225270D0 (en) * | 1992-12-03 | 1993-01-27 | Gec Ferranti Defence Syst | Depositing different materials on a substrate |
| US6238533B1 (en) | 1995-08-07 | 2001-05-29 | Applied Materials, Inc. | Integrated PVD system for aluminum hole filling using ionized metal adhesion layer |
| US5962923A (en) * | 1995-08-07 | 1999-10-05 | Applied Materials, Inc. | Semiconductor device having a low thermal budget metal filling and planarization of contacts, vias and trenches |
| JP4947834B2 (ja) | 1997-11-26 | 2012-06-06 | アプライド マテリアルズ インコーポレイテッド | ダメージフリー被覆刻設堆積法 |
| US7253109B2 (en) | 1997-11-26 | 2007-08-07 | Applied Materials, Inc. | Method of depositing a tantalum nitride/tantalum diffusion barrier layer system |
| US20180269044A1 (en) * | 2017-03-20 | 2018-09-20 | International Business Machines Corporation | Pvd tool to deposit highly reactive materials |
-
1970
- 1970-03-06 FR FR7008177A patent/FR2082217A5/fr not_active Expired
-
1971
- 1971-02-25 CH CH285471A patent/CH536882A/fr not_active IP Right Cessation
- 1971-03-05 DE DE19712110668 patent/DE2110668A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE2110668A1 (de) | 1971-09-23 |
| FR2082217A5 (en) | 1971-12-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PL | Patent ceased |