CH539123A - Verzinnungsverfahren, insbesondere für Lötstellen - Google Patents

Verzinnungsverfahren, insbesondere für Lötstellen

Info

Publication number
CH539123A
CH539123A CH1392970A CH1392970A CH539123A CH 539123 A CH539123 A CH 539123A CH 1392970 A CH1392970 A CH 1392970A CH 1392970 A CH1392970 A CH 1392970A CH 539123 A CH539123 A CH 539123A
Authority
CH
Switzerland
Prior art keywords
solder joints
tinning process
tinning
solder
joints
Prior art date
Application number
CH1392970A
Other languages
English (en)
Inventor
Missel Leo
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of CH539123A publication Critical patent/CH539123A/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/001—Interlayers, transition pieces for metallurgical bonding of workpieces
    • B23K35/007—Interlayers, transition pieces for metallurgical bonding of workpieces at least one of the workpieces being of copper or another noble metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3465—Application of solder
    • H05K3/3473—Plating of solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
CH1392970A 1969-10-08 1970-09-21 Verzinnungsverfahren, insbesondere für Lötstellen CH539123A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US86486369A 1969-10-08 1969-10-08

Publications (1)

Publication Number Publication Date
CH539123A true CH539123A (de) 1973-07-15

Family

ID=25344241

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1392970A CH539123A (de) 1969-10-08 1970-09-21 Verzinnungsverfahren, insbesondere für Lötstellen

Country Status (5)

Country Link
US (1) US3639218A (de)
CH (1) CH539123A (de)
DE (1) DE2048738A1 (de)
FR (1) FR2064188B1 (de)
GB (1) GB1300304A (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4020987A (en) * 1975-09-22 1977-05-03 Norman Hascoe Solder preform for use in hermetically sealing a container
JPS53120658A (en) * 1977-03-30 1978-10-21 Seiko Epson Corp Improved brazing filler metal
USRE30348E (en) * 1979-01-10 1980-07-29 Semi-Alloys, Inc. Solder preform
US4461679A (en) * 1979-10-02 1984-07-24 Nippon Steel Corporation Method of making steel sheet plated with Pb-Sn alloy for automotive fuel tank
JPS5784135A (en) * 1980-11-14 1982-05-26 Toshiba Corp Manufacture of semiconductor element
DE3403185A1 (de) * 1984-01-31 1985-08-01 Metalon Stolberg GmbH, 5190 Stolberg Bleibleche, -baender und -platinen
EP2244285A1 (de) * 2009-04-24 2010-10-27 ATOTECH Deutschland GmbH Verfahren zur Formung von Lötablagerungen auf Substraten

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2734024A (en) * 1956-02-07 Method of making bearings
US2266330A (en) * 1935-12-23 1941-12-16 John S Nachtman Process for electroplating strip steel
US3323938A (en) * 1963-11-18 1967-06-06 Dow Chemical Co Method of coating tin over basis metals
US3445351A (en) * 1964-10-21 1969-05-20 Du Pont Process for plating metals
GB1204052A (en) * 1968-04-23 1970-09-03 Engelhard Ind Ltd Improvements in or relating to soft-solder coated wire, strip or tape

Also Published As

Publication number Publication date
FR2064188B1 (de) 1973-03-16
DE2048738A1 (de) 1971-04-15
FR2064188A1 (de) 1971-07-16
US3639218A (en) 1972-02-01
GB1300304A (en) 1972-12-20

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Legal Events

Date Code Title Description
PL Patent ceased