CH551840A - Hartlotverbindung bei halbleiterbauelementen und verfahren zu ihrer herstellung. - Google Patents

Hartlotverbindung bei halbleiterbauelementen und verfahren zu ihrer herstellung.

Info

Publication number
CH551840A
CH551840A CH1036170A CH1036170A CH551840A CH 551840 A CH551840 A CH 551840A CH 1036170 A CH1036170 A CH 1036170A CH 1036170 A CH1036170 A CH 1036170A CH 551840 A CH551840 A CH 551840A
Authority
CH
Switzerland
Prior art keywords
semi
production
solder connection
hard solder
conductor components
Prior art date
Application number
CH1036170A
Other languages
English (en)
Original Assignee
Semikron Gleichrichterbau
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau
Publication of CH551840A publication Critical patent/CH551840A/de

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
    • B23K35/286—Al as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B23K35/3006—Ag as the principal constituent
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12674—Ge- or Si-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CH1036170A 1969-07-11 1970-07-08 Hartlotverbindung bei halbleiterbauelementen und verfahren zu ihrer herstellung. CH551840A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1935143A DE1935143C3 (de) 1969-07-11 1969-07-11 Hartlotverbindung bei Halbleiter-Bauelementen und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number Publication Date
CH551840A true CH551840A (de) 1974-07-31

Family

ID=5739467

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1036170A CH551840A (de) 1969-07-11 1970-07-08 Hartlotverbindung bei halbleiterbauelementen und verfahren zu ihrer herstellung.

Country Status (7)

Country Link
US (1) US3755882A (de)
CH (1) CH551840A (de)
DE (1) DE1935143C3 (de)
ES (1) ES382117A1 (de)
FR (1) FR2054035A5 (de)
GB (1) GB1314044A (de)
SE (1) SE348668B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4036602A (en) * 1975-11-26 1977-07-19 Chromalloy American Corporation Diffusion coating of magnesium in metal substrates
JP5548167B2 (ja) * 2011-07-11 2014-07-16 日本発條株式会社 積層体及び積層体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA683210A (en) * 1964-03-31 P. Skinner Ransom Brazing dissimilar metal members
BE577086A (de) * 1958-04-03 1900-01-01
NL268834A (de) * 1960-09-02
DE1172378B (de) * 1961-07-14 1964-06-18 Siemens Ag Verfahren zur Herstellung einer elektrisch unsymmetrisch leitenden Halbleiteranordnung
US3337947A (en) * 1964-06-29 1967-08-29 Aluminum Co Of America Method of joining electrical contacts to aluminum parts
US3375143A (en) * 1964-09-29 1968-03-26 Melpar Inc Method of making tunnel diode
CH423997A (de) * 1965-06-24 1966-11-15 Bbc Brown Boveri & Cie Halbleiteranordnung
US3447236A (en) * 1966-02-11 1969-06-03 Western Electric Co Method of bonding an electrical part to an electrical contact
US3478416A (en) * 1967-02-15 1969-11-18 North American Rockwell Bonding of beryllium members
US3409974A (en) * 1967-07-07 1968-11-12 Alloys Unltd Inc Process of making tungsten-based composite materials

Also Published As

Publication number Publication date
ES382117A1 (es) 1972-11-01
DE1935143B2 (de) 1974-08-15
DE1935143A1 (de) 1971-04-22
DE1935143C3 (de) 1975-04-17
FR2054035A5 (de) 1971-04-16
SE348668B (de) 1972-09-11
US3755882A (en) 1973-09-04
GB1314044A (en) 1973-04-18

Similar Documents

Publication Publication Date Title
CH555377A (de) Poroese formstoffe und verfahren zu ihrer herstellung.
CH552047A (de) Klebstoff zum beschleunigten verbinden nichtporoeser flaechen miteinander und verfahren zu seiner herstellung.
CH550122A (de) Pulverfoermiger synthetischer (beta)-wollastonit und verfahren zu dessen herstellung.
CH549637A (de) Reinigungsmittel und verfahren zu seiner herstellung.
DE1695853B2 (de) 4-azadibenzocycloheptenderivate und verfahren zu ihrer herstellung
AT299561B (de) Hilfsmetallhaltige Sinterhartstofflegierung und Verfahren zu ihrer Herstellung
CH526370A (de) Trennscheibe und Verfahren zu ihrer Herstellung
CH504100A (de) Halbleiterbauelement und Verfahren zu dessen Herstellung
ES157851Y (es) Aparato antropometrico perfeccionado.
CH557882A (de) Gesinterte stahlgebundene hartstofflegierung und verfahren zu ihrer herstellung.
CH434507A (de) Zusammengesetzte Halbleiteranordnung und Verfahren zu ihrer Herstellung
CH532933A (de) Zahnpasta und Verfahren zu deren Herstellung
CH499877A (de) Halbleiterbauelement und Verfahren zu dessen Herstellung
CH552066A (de) Nichtmagnetische, elastische mangan-kupfer-legierung sowie verfahren zu deren herstellung.
CH474156A (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
CH528819A (de) Halbleiterbauelement und Verfahren zu seiner Herstellung
AT279009B (de) Stueckfoermiges reinigungsmittel und verfahren zu dessen herstellung
CH549010A (de) Verfahren zur herstellung von novenamin.
CH474157A (de) Halbleitervorrichtung und Verfahren zu ihrer Herstellung
CH499189A (de) Induktives Bauelement und Verfahren zu dessen Herstellung
ZA707273B (en) Improvements in or relating to d.c.converter circuits
CH555402A (de) Wasch- und reinigungsmittel und verfahren zur herstellung desselben.
CH551840A (de) Hartlotverbindung bei halbleiterbauelementen und verfahren zu ihrer herstellung.
CH550166A (de) Verfahren zur herstellung von indolderivaten.
AT295042B (de) Haftmittel für Zahnprothesen und Verfahren zu seiner Herstellung

Legal Events

Date Code Title Description
PL Patent ceased