SE348668B - - Google Patents

Info

Publication number: SE348668B
Authority: SE; Sweden

Application number

SE09540/70A

Inventor

P Flohrs

H Schaefer

T Tovar

Original Assignee

Semikron Gleichrichterbau

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1969-07-11

Filing date

1970-07-09

Publication date

1972-09-11

1970-07-09 Application filed by Semikron Gleichrichterbau filed Critical Semikron Gleichrichterbau

1972-09-11 Publication of SE348668B publication Critical patent/SE348668B/xx

Links

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/28—Selection of soldering or welding materials proper with the principal constituent melting at less than 950°C
- B23K35/286—Al as the principal constituent
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
- B23K35/3006—Ag as the principal constituent
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
- H10W72/351—Materials of die-attach connectors
- H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12674—Ge- or Si-base component

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Die Bonding (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

SE09540/70A 1969-07-11 1970-07-09 SE348668B (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DE1935143A DE1935143C3 (de)	1969-07-11	1969-07-11	Hartlotverbindung bei Halbleiter-Bauelementen und Verfahren zu ihrer Herstellung

Publications (1)

Publication Number	Publication Date
SE348668B true SE348668B (de)	1972-09-11

Family

ID=5739467

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
SE09540/70A SE348668B (de)	1969-07-11	1970-07-09

Country Status (7)

Country	Link
US (1)	US3755882A (de)
CH (1)	CH551840A (de)
DE (1)	DE1935143C3 (de)
ES (1)	ES382117A1 (de)
FR (1)	FR2054035A5 (de)
GB (1)	GB1314044A (de)
SE (1)	SE348668B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4036602A (en) *	1975-11-26	1977-07-19	Chromalloy American Corporation	Diffusion coating of magnesium in metal substrates
JP5548167B2 (ja) *	2011-07-11	2014-07-16	日本発條株式会社	積層体及び積層体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA683210A (en) *		1964-03-31	P. Skinner Ransom	Brazing dissimilar metal members
BE577086A (de) *	1958-04-03	1900-01-01
NL268834A (de) *	1960-09-02
DE1172378B (de) *	1961-07-14	1964-06-18	Siemens Ag	Verfahren zur Herstellung einer elektrisch unsymmetrisch leitenden Halbleiteranordnung
US3337947A (en) *	1964-06-29	1967-08-29	Aluminum Co Of America	Method of joining electrical contacts to aluminum parts
US3375143A (en) *	1964-09-29	1968-03-26	Melpar Inc	Method of making tunnel diode
CH423997A (de) *	1965-06-24	1966-11-15	Bbc Brown Boveri & Cie	Halbleiteranordnung
US3447236A (en) *	1966-02-11	1969-06-03	Western Electric Co	Method of bonding an electrical part to an electrical contact
US3478416A (en) *	1967-02-15	1969-11-18	North American Rockwell	Bonding of beryllium members
US3409974A (en) *	1967-07-07	1968-11-12	Alloys Unltd Inc	Process of making tungsten-based composite materials

1969
- 1969-07-11 DE DE1935143A patent/DE1935143C3/de not_active Expired
1970
- 1970-07-02 FR FR7024532A patent/FR2054035A5/fr not_active Expired
- 1970-07-02 ES ES382117A patent/ES382117A1/es not_active Expired
- 1970-07-08 CH CH1036170A patent/CH551840A/de not_active IP Right Cessation
- 1970-07-09 SE SE09540/70A patent/SE348668B/xx unknown
- 1970-07-13 US US00054344A patent/US3755882A/en not_active Expired - Lifetime
- 1970-07-13 GB GB3386870A patent/GB1314044A/en not_active Expired

Also Published As

Publication number	Publication date
CH551840A (de)	1974-07-31
DE1935143B2 (de)	1974-08-15
DE1935143C3 (de)	1975-04-17
FR2054035A5 (de)	1971-04-16
GB1314044A (en)	1973-04-18
US3755882A (en)	1973-09-04
ES382117A1 (es)	1972-11-01
DE1935143A1 (de)	1971-04-22

Publication	Publication Date	Title
AU429630B2 (de)	1972-10-26
AU5461069A (de)	1970-11-12
AU442375B2 (de)	1973-11-06
AU2355770A (de)	1972-06-22
FR2054035A5 (de)	1971-04-16
AU5113869A (de)	1971-04-29
AT308690B (de)	1973-06-15
AU425297B2 (de)	1972-03-26
AU442463B2 (de)	1973-11-09
AU442535B2 (de)	1973-11-12
AU417208B2 (de)	1971-10-14
AU442357B2 (de)	1973-11-07
AU414607B2 (de)	1971-06-29
AU442322B2 (de)	1973-11-02
AU442538B2 (de)	1973-11-12
AU442285B2 (de)	1973-11-02
AU410358B2 (de)	1971-02-09
AU438128B2 (de)	1973-07-16
AU428074B2 (de)	1972-09-11
AU428129B2 (de)	1972-09-12
AU442554B2 (de)	1973-11-13
AU5228269A (de)	1970-09-24
AU5598769A (de)	1970-12-10
AR203167Q (de)	1975-08-22
BE742885A (de)	1970-05-14