CH552648A - Procede de preparation d'une resine dispersable dans l'eau. - Google Patents

Procede de preparation d'une resine dispersable dans l'eau.

Info

Publication number
CH552648A
CH552648A CH1867271A CH1867271A CH552648A CH 552648 A CH552648 A CH 552648A CH 1867271 A CH1867271 A CH 1867271A CH 1867271 A CH1867271 A CH 1867271A CH 552648 A CH552648 A CH 552648A
Authority
CH
Switzerland
Prior art keywords
dispersable
preparing
resin
water
resin dispersable
Prior art date
Application number
CH1867271A
Other languages
English (en)
Original Assignee
Ppg Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US05/167,470 external-priority patent/US4001101A/en
Application filed by Ppg Industries Inc filed Critical Ppg Industries Inc
Publication of CH552648A publication Critical patent/CH552648A/fr

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4078Curing agents not provided for by the groups C08G59/42 - C08G59/66 boron containing compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/56Amines together with other curing agents
    • C08G59/58Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/44Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications
    • C09D5/4419Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for electrophoretic applications with polymers obtained otherwise than by polymerisation reactions only involving carbon-to-carbon unsaturated bonds
    • C09D5/443Polyepoxides
    • C09D5/4434Polyepoxides characterised by the nature of the epoxy binder

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Molecular Biology (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
CH1867271A 1970-12-22 1971-12-21 Procede de preparation d'une resine dispersable dans l'eau. CH552648A (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10082570A 1970-12-22 1970-12-22
US10083470A 1970-12-22 1970-12-22
US12926771A 1971-03-29 1971-03-29
US05/167,470 US4001101A (en) 1969-07-10 1971-07-29 Electrodeposition of epoxy compositions

Publications (1)

Publication Number Publication Date
CH552648A true CH552648A (fr) 1974-08-15

Family

ID=27493157

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1867271A CH552648A (fr) 1970-12-22 1971-12-21 Procede de preparation d'une resine dispersable dans l'eau.

Country Status (7)

Country Link
JP (1) JPS5115860B1 (fr)
BE (1) BE777034A (fr)
CA (1) CA981848A (fr)
CH (1) CH552648A (fr)
DE (1) DE2163143C3 (fr)
IT (1) IT945823B (fr)
NL (1) NL162420C (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1065523A (fr) * 1972-08-04 1979-10-30 Joseph F. Bosso Composes d'electrodeposition
JPS5853675B2 (ja) * 1976-04-06 1983-11-30 関西ペイント株式会社 カチオン性電着塗料組成物
US4139396A (en) * 1976-07-29 1979-02-13 Nippon Oil Company, Ltd. Water-soluble coating composition for cathode-precipitating electrodeposition and process for its preparation
DE2914085A1 (de) 1979-04-07 1980-10-16 Basf Ag Additionsprodukt und seine verwendung
DE10109483A1 (de) * 2001-02-28 2002-09-05 Clariant Gmbh Oxalkylierungsprodukte hergestellt aus Epoxiden und Aminen und deren Verwendung in Pigmentpräparationen
US20230042975A1 (en) 2021-08-03 2023-02-09 Eci Technology, Inc. Methods of boric acid analysis and process control of metallization solutions

Also Published As

Publication number Publication date
NL162420C (nl) 1980-05-16
DE2163143A1 (de) 1972-08-03
NL7117646A (fr) 1972-06-26
DE2163143B2 (de) 1976-06-16
JPS5115860B1 (fr) 1976-05-20
CA981848A (en) 1976-01-13
BE777034A (fr) 1972-06-21
NL162420B (nl) 1979-12-17
DE2163143C3 (de) 1980-10-02
IT945823B (it) 1973-05-10

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Legal Events

Date Code Title Description
PL Patent ceased