CH552891A - Verfahren zum umhuellen von elektronischen bauelementen mit epoxyharz-pressmassen. - Google Patents

Verfahren zum umhuellen von elektronischen bauelementen mit epoxyharz-pressmassen.

Info

Publication number
CH552891A
CH552891A CH1241072A CH1241072A CH552891A CH 552891 A CH552891 A CH 552891A CH 1241072 A CH1241072 A CH 1241072A CH 1241072 A CH1241072 A CH 1241072A CH 552891 A CH552891 A CH 552891A
Authority
CH
Switzerland
Prior art keywords
epoxy resin
electronic components
resin compounds
covering electronic
covering
Prior art date
Application number
CH1241072A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712148690 external-priority patent/DE2148690C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of CH552891A publication Critical patent/CH552891A/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Casings For Electric Apparatus (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CH1241072A 1971-09-29 1972-08-22 Verfahren zum umhuellen von elektronischen bauelementen mit epoxyharz-pressmassen. CH552891A (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712148690 DE2148690C3 (de) 1971-09-29 Niederdruck-PreBmasse zum Umhüllen von elektronischen Bauelementen

Publications (1)

Publication Number Publication Date
CH552891A true CH552891A (de) 1974-08-15

Family

ID=5820967

Family Applications (1)

Application Number Title Priority Date Filing Date
CH1241072A CH552891A (de) 1971-09-29 1972-08-22 Verfahren zum umhuellen von elektronischen bauelementen mit epoxyharz-pressmassen.

Country Status (5)

Country Link
JP (1) JPS5426720B2 (de)
CH (1) CH552891A (de)
IT (1) IT967911B (de)
NL (1) NL7211450A (de)
ZA (1) ZA726623B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994442A (ja) * 1982-11-22 1984-05-31 Hitachi Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
ZA726623B (en) 1973-06-27
IT967911B (it) 1974-03-11
NL7211450A (de) 1973-04-02
DE2148690A1 (de) 1973-04-05
DE2148690B2 (de) 1976-04-08
JPS5426720B2 (de) 1979-09-05
JPS4842399A (de) 1973-06-20

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Legal Events

Date Code Title Description
PL Patent ceased