ZA726623B - Low pressure moulding composition for converting electronic components - Google Patents

Low pressure moulding composition for converting electronic components

Info

Publication number
ZA726623B
ZA726623B ZA726623A ZA726623A ZA726623B ZA 726623 B ZA726623 B ZA 726623B ZA 726623 A ZA726623 A ZA 726623A ZA 726623 A ZA726623 A ZA 726623A ZA 726623 B ZA726623 B ZA 726623B
Authority
ZA
South Africa
Prior art keywords
low pressure
electronic components
moulding composition
pressure moulding
converting electronic
Prior art date
Application number
ZA726623A
Other languages
English (en)
Inventor
H Lindner
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19712148690 external-priority patent/DE2148690C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ZA726623B publication Critical patent/ZA726623B/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/441—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from alkenes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Insulating Materials (AREA)
  • Casings For Electric Apparatus (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
ZA726623A 1971-09-29 1972-09-27 Low pressure moulding composition for converting electronic components ZA726623B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19712148690 DE2148690C3 (de) 1971-09-29 Niederdruck-PreBmasse zum Umhüllen von elektronischen Bauelementen

Publications (1)

Publication Number Publication Date
ZA726623B true ZA726623B (en) 1973-06-27

Family

ID=5820967

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA726623A ZA726623B (en) 1971-09-29 1972-09-27 Low pressure moulding composition for converting electronic components

Country Status (5)

Country Link
JP (1) JPS5426720B2 (de)
CH (1) CH552891A (de)
IT (1) IT967911B (de)
NL (1) NL7211450A (de)
ZA (1) ZA726623B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5994442A (ja) * 1982-11-22 1984-05-31 Hitachi Ltd 樹脂封止型半導体装置

Also Published As

Publication number Publication date
IT967911B (it) 1974-03-11
CH552891A (de) 1974-08-15
NL7211450A (de) 1973-04-02
DE2148690A1 (de) 1973-04-05
DE2148690B2 (de) 1976-04-08
JPS5426720B2 (de) 1979-09-05
JPS4842399A (de) 1973-06-20

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