CH607328A5 - - Google Patents

Info

Publication number
CH607328A5
CH607328A5 CH69877A CH69877A CH607328A5 CH 607328 A5 CH607328 A5 CH 607328A5 CH 69877 A CH69877 A CH 69877A CH 69877 A CH69877 A CH 69877A CH 607328 A5 CH607328 A5 CH 607328A5
Authority
CH
Switzerland
Application number
CH69877A
Inventor
Raymond Louis Delorme
Henri Grosjean
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of CH607328A5 publication Critical patent/CH607328A5/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0465—Surface mounting by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CH69877A 1976-09-20 1977-01-20 CH607328A5 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7628170A FR2365209A1 (fr) 1976-09-20 1976-09-20 Procede pour le montage de micro-plaquettes de circuits integres sur un substrat et installation pour sa mise en oeuvre

Publications (1)

Publication Number Publication Date
CH607328A5 true CH607328A5 (fr) 1978-12-15

Family

ID=9177834

Family Applications (1)

Application Number Title Priority Date Filing Date
CH69877A CH607328A5 (fr) 1976-09-20 1977-01-20

Country Status (11)

Country Link
US (1) US4116376A (fr)
JP (1) JPS5823935B2 (fr)
BE (1) BE851574A (fr)
CA (1) CA1076711A (fr)
CH (1) CH607328A5 (fr)
DE (1) DE2704266C2 (fr)
FR (1) FR2365209A1 (fr)
GB (1) GB1570406A (fr)
IT (1) IT7720663A1 (fr)
NL (1) NL186125C (fr)
SE (1) SE412682B (fr)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2404990A1 (fr) * 1977-10-03 1979-04-27 Cii Honeywell Bull Substrat d'interconnexion de composants electroniques a circuits integres, muni d'un dispositif de reparation
DE2836924A1 (de) * 1978-08-24 1980-03-06 Blaupunkt Werke Gmbh Vorrichtung zur automatischen positionierung von elektronischen bauelementen
US4426571A (en) 1980-06-19 1984-01-17 Sperry Corporation Portable electric hot air rework tool for soldering and desoldering printed circuit assemblies
US4342090A (en) * 1980-06-27 1982-07-27 International Business Machines Corp. Batch chip placement system
DE3138296A1 (de) * 1981-09-25 1983-04-28 Siemens AG, 1000 Berlin und 8000 München Verfahren zum positionieren und fixieren von optischen bauelementen relativ zueinander
NL8201653A (nl) * 1982-04-21 1983-11-16 Philips Nv Werkwijze en inrichting voor het plaatsen van chipvormige electrische en/of electronische onderdelen op een substraat.
DE3235139A1 (de) * 1982-09-23 1984-03-29 Schwarzwälder Elektronik-Werke GmbH, 7730 Villingen-Schwenningen Verfahren zum automatischen bestuecken von leiterplatten mit halbleiterbauteilen mit integrierten schaltungen und vorrichtungen zur durchfuehrung der verfahren
JPS59161040A (ja) * 1983-03-03 1984-09-11 Shinkawa Ltd インナ−リ−ドボンダ−
US4479298A (en) * 1983-07-26 1984-10-30 Storage Technology Partners Alignment apparatus and method for mounting LSI and VLSI packages to a printed circuit board
JPS61168446A (ja) * 1985-01-21 1986-07-30 Fuji Kikai Seizo Kk プリント基板位置決め装置
EP0208916A3 (fr) * 1985-06-13 1987-08-12 Matsushita Electric Industrial Co., Ltd. Appareil pour fabriquer une connexion permanente entre conducteurs électriques
JPS6298737A (ja) * 1985-10-25 1987-05-08 Sharp Corp 半導体装置の交換方法
JPS6365891A (ja) * 1986-09-08 1988-03-24 ヤマトミシン製造株式会社 ミシンのシ−ソ−生地送り方法並びにその装置
US4768698A (en) * 1986-10-03 1988-09-06 Pace Incorporated X-Y table with θ rotation
JPH0243339Y2 (fr) * 1987-03-31 1990-11-19
US4832250A (en) * 1987-05-28 1989-05-23 Srtechnologies, Inc. Electronic circuit board rework and repair system
US4972990A (en) * 1988-02-22 1990-11-27 Pace Incorporated Apparatus for removal and installing electronic components with respect to a substrate
US4899920A (en) * 1988-02-22 1990-02-13 Pace Incorporated Apparatus for removal and installing electronic components with respect to a substrate
US4899921A (en) * 1988-10-28 1990-02-13 The American Optical Corporation Aligner bonder
USD326463S (en) 1989-04-12 1992-05-26 Eldon Industries, Inc. Surface mount rework station
US5031820A (en) * 1990-02-01 1991-07-16 Eldon Industries, Inc. PCB rework station
US5627913A (en) * 1990-08-27 1997-05-06 Sierra Research And Technology, Inc. Placement system using a split imaging system coaxially coupled to a component pickup means
US5235407A (en) * 1990-08-27 1993-08-10 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices
US5251266A (en) * 1990-08-27 1993-10-05 Sierra Research And Technology, Inc. System for placement and mounting of fine pitch integrated circuit devices using a split mirror assembly
US5144747A (en) * 1991-03-27 1992-09-08 Integrated System Assemblies Corporation Apparatus and method for positioning an integrated circuit chip within a multichip module
US5152055A (en) * 1991-04-26 1992-10-06 At&T Bell Laboratories Article alignment method
US5317803A (en) * 1991-05-30 1994-06-07 Sierra Research And Technology, Inc. Method of soldering an integrated circuit
US5547537A (en) * 1992-05-20 1996-08-20 Kulicke & Soffa, Investments, Inc. Ceramic carrier transport for die attach equipment
US5862588A (en) * 1995-08-14 1999-01-26 International Business Machines Corporation Method for restraining circuit board warp during area array rework
US5813590A (en) * 1995-12-18 1998-09-29 Micron Technology, Inc. Extended travel wire bonding machine
JP3466394B2 (ja) * 1996-10-31 2003-11-10 太陽誘電株式会社 チップ部品及びその製造方法
KR100242024B1 (ko) * 1997-03-13 2000-03-02 윤종용 집적회로 실장방법
JPH11340695A (ja) * 1998-05-25 1999-12-10 Sony Corp 組立装置
KR20030005372A (ko) * 2000-05-22 2003-01-17 토레이 엔지니어링 컴퍼니, 리미티드 칩 실장 장치 및 그 장치에 있어서의 얼라인먼트 방법
SG91870A1 (en) * 2000-05-26 2002-10-15 Casem Asia Pte Ltd Method and device for bleed out control in solder bonding
JP4616514B2 (ja) * 2001-06-07 2011-01-19 富士機械製造株式会社 電気部品装着システムおよびそれにおける位置誤差検出方法
US6667630B2 (en) * 2001-07-26 2003-12-23 Obaida A. Abdulky Universal flying probe fixture
FR2876539B1 (fr) * 2004-10-07 2007-01-12 Cybernetix Microelectronique S Procede de positionnement d'un composant electronique par rapport a plusieurs plots de connexions
WO2014098174A1 (fr) * 2012-12-21 2014-06-26 株式会社新川 Soudeuse de puces à protubérances et procédé de correction de planéité et de degré de déformation d'étage de liaison
CN118737890A (zh) * 2024-05-22 2024-10-01 上海世禹精密设备股份有限公司 一种贴片设备及方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1909480C2 (de) * 1968-03-01 1984-10-11 General Electric Co., Schenectady, N.Y. Trägeranordnung und Verfahren zur elektrischen Kontaktierung von Halbleiterchips
US3628717A (en) * 1969-11-12 1971-12-21 Ibm Apparatus for positioning and bonding
US3641648A (en) * 1970-08-20 1972-02-15 Bell Telephone Labor Inc Piece part handling apparatus
US3793710A (en) * 1971-10-12 1974-02-26 Western Electric Co Methods of bonding a beam-lead device to a substrate
FR2205800B1 (fr) * 1972-11-09 1976-08-20 Honeywell Bull Soc Ind
US3838984A (en) * 1973-04-16 1974-10-01 Sperry Rand Corp Flexible carrier and interconnect for uncased ic chips
US3946931A (en) * 1974-11-27 1976-03-30 Western Electric Company, Inc. Methods of and apparatus for bonding an article to a substrate

Also Published As

Publication number Publication date
US4116376A (en) 1978-09-26
JPS5338977A (en) 1978-04-10
DE2704266A1 (de) 1978-03-23
JPS5823935B2 (ja) 1983-05-18
FR2365209B1 (fr) 1979-01-12
FR2365209A1 (fr) 1978-04-14
IT7720663A1 (it) 1978-08-25
SE412682B (sv) 1980-03-10
NL186125C (nl) 1990-09-17
NL7705373A (nl) 1978-03-22
CA1076711A (fr) 1980-04-29
GB1570406A (en) 1980-07-02
NL186125B (nl) 1990-04-17
BE851574A (fr) 1977-06-16
DE2704266C2 (de) 1985-07-11
SE7701706L (sv) 1978-03-21

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Legal Events

Date Code Title Description
PL Patent ceased