CH615082GA3 - - Google Patents

Download PDF

Info

Publication number
CH615082GA3
CH615082GA3 CH579976A CH579976A CH615082GA3 CH 615082G A3 CH615082G A3 CH 615082GA3 CH 579976 A CH579976 A CH 579976A CH 579976 A CH579976 A CH 579976A CH 615082G A3 CH615082G A3 CH 615082GA3
Authority
CH
Switzerland
Prior art keywords
chip
lead frame
wire
base plate
bonding
Prior art date
Application number
CH579976A
Other versions
CH615082B (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH615082B publication Critical patent/CH615082B/en
Application filed filed Critical
Publication of CH615082GA3 publication Critical patent/CH615082GA3/xx

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49579—Watch or clock making

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Electronic Switches (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electromechanical Clocks (AREA)

Abstract

A method of manufacturing a circuit assembly for an electronic watch without use of a printed circuit board comprises bonding an IC chip to the surface of a lead frame and then wire-bonding the IC chip terminal pads to respective bonding conductors. The lead frame is superposed on a thermoplastic resin base plate and preselected parts of the base plate are melted so as to fix and connect together the lead frame and base plate as the melted parts harden. The IC chip and wire-bond connections are then potted with synthetic resin to form the completed circuit assembly. A thermoplastic resin cover plate may be disposed atop the lead frame except for the region of the IC chip and wire-bond connection and fixed to the head frame during the melting step.
CH579976A 1975-05-08 1976-05-07 METHOD OF ASSEMBLING THE COMPONENTS OF AN ELECTRONIC WATCH. CH615082B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP50055762A JPS51130866A (en) 1975-05-08 1975-05-08 Method of mounting electronic timekeeper circuits

Publications (2)

Publication Number Publication Date
CH615082B CH615082B (en)
CH615082GA3 true CH615082GA3 (en) 1980-01-15

Family

ID=13007848

Family Applications (1)

Application Number Title Priority Date Filing Date
CH579976A CH615082B (en) 1975-05-08 1976-05-07 METHOD OF ASSEMBLING THE COMPONENTS OF AN ELECTRONIC WATCH.

Country Status (6)

Country Link
US (1) US4086696A (en)
JP (1) JPS51130866A (en)
CH (1) CH615082B (en)
DE (1) DE2619833A1 (en)
FR (1) FR2310588A1 (en)
GB (1) GB1503098A (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5351958U (en) * 1976-10-06 1978-05-02
JPS53103659U (en) * 1977-01-25 1978-08-21
US4254448A (en) * 1979-05-14 1981-03-03 Western Electric Company, Inc. Techniques for assembling electrical components with printed circuit boards
DE3029667A1 (en) * 1980-08-05 1982-03-11 GAO Gesellschaft für Automation und Organisation mbH, 8000 München CARRIER ELEMENT FOR AN IC COMPONENT
DE3235650A1 (en) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg INFORMATION CARD AND METHOD FOR THEIR PRODUCTION
DE3427908C2 (en) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Method for producing the circuit carrier of an electromechanical clockwork and circuit carrier that can be produced by such a method
JPS60100461A (en) * 1984-10-01 1985-06-04 Hitachi Ltd Manufacture of electronic device
US4656384A (en) * 1984-10-25 1987-04-07 Siemens Aktiengesellschaft Ultrasonic detection sensor in hybrid structure with appertaining electronic circuit
JPS62108607A (en) * 1985-11-06 1987-05-19 Murata Mfg Co Ltd Piezoelectric parts
US4796239A (en) * 1986-05-08 1989-01-03 Seikosha Co., Ltd. Circuit unit for timepiece and process for fabricating the same
DE3623419A1 (en) * 1986-07-11 1988-01-21 Junghans Uhren Gmbh METHOD FOR EQUIPPING A CABINET NETWORK FOR THE CIRCUIT HOLDER OF AN ELECTROMECHANICAL CLOCKWORK AND PARTLY ASSEMBLED CABINET NETWORK OF A CLOCKWORK CIRCUIT BRACKET
DE3809005A1 (en) * 1988-03-17 1989-09-28 Hitachi Semiconductor Europ Gm Chip module and its production and use
US5271953A (en) * 1991-02-25 1993-12-21 Delco Electronics Corporation System for performing work on workpieces
US5240746A (en) * 1991-02-25 1993-08-31 Delco Electronics Corporation System for performing related operations on workpieces
US5368899A (en) * 1992-02-28 1994-11-29 Delco Electronics Corp. Automatic vertical dip coater with simultaneous ultraviolet cure
TW272311B (en) * 1994-01-12 1996-03-11 At & T Corp
TW382079B (en) * 1998-08-28 2000-02-11 Via Tech Inc Integrated real time clock integrated circuit device and manufacturing method thereof
JP2000114918A (en) * 1998-10-05 2000-04-21 Mitsubishi Electric Corp Surface acoustic wave device and method of manufacturing the same
JP3908512B2 (en) * 2001-11-16 2007-04-25 セイコーインスツル株式会社 Piezoelectric transducer and pulse wave detector
JP2008124097A (en) * 2006-11-09 2008-05-29 Shinko Electric Ind Co Ltd Package for semiconductor device and method for manufacturing the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3791025A (en) * 1972-04-06 1974-02-12 Teledyne Inc Method of manufacturing an electronic assembly
JPS5028662A (en) * 1973-07-17 1975-03-24
US3981138A (en) * 1973-05-31 1976-09-21 Uranus Electronics, Inc. Digital display timepiece
US3863436A (en) * 1974-04-18 1975-02-04 Timex Corp Solid state quartz watch
US3999285A (en) * 1975-06-30 1976-12-28 Burroughs Corporation Semiconductor device package

Also Published As

Publication number Publication date
CH615082B (en)
FR2310588A1 (en) 1976-12-03
DE2619833A1 (en) 1976-11-18
JPS51130866A (en) 1976-11-13
FR2310588B1 (en) 1981-07-31
US4086696A (en) 1978-05-02
GB1503098A (en) 1978-03-08

Similar Documents

Publication Publication Date Title
FR2310588B1 (en)
US6329220B1 (en) Packages for semiconductor die
US5717252A (en) Solder-ball connected semiconductor device with a recessed chip mounting area
KR100190981B1 (en) Method of manufacturing one side resin sealing type semiconductor devices
KR100214555B1 (en) Manufacturing method of semiconductor package
GB1383297A (en) Electrical integrated circuit package
JPH04302457A (en) Fabrication of hybrid ic board
JP2803211B2 (en) Semiconductor device bonding method and bonding apparatus
JPH03160751A (en) Semiconductor device
JPS5718348A (en) Integrated circuit device
MY106858A (en) Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin.
KR960005683Y1 (en) Chip board using shoulder ball
JPH0313754Y2 (en)
KR100214553B1 (en) Method of making buttom lead package
JPH04159765A (en) Hybrid integrated circuit device
JPS6314475Y2 (en)
JPS59224147A (en) Semiconductor device
JPH0758245A (en) Semiconductor device and manufacturing method thereof
JPS58204545A (en) Sealing method for ic
JPS60227492A (en) Electronic circuit block
JPS6421935A (en) Tape carrier
JPS61102297A (en) Integrated circuit card
JPS56155556A (en) Semiconductor device
JPS6398678U (en)
JPS5740945A (en) Integrated circuit device

Legal Events

Date Code Title Description
PL Patent ceased