CH618316GA3 - Method for manufacturing a miniaturised electronic device and device obtained by this method - Google Patents

Method for manufacturing a miniaturised electronic device and device obtained by this method Download PDF

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Publication number
CH618316GA3
CH618316GA3 CH166077A CH166077A CH618316GA3 CH 618316G A3 CH618316G A3 CH 618316GA3 CH 166077 A CH166077 A CH 166077A CH 166077 A CH166077 A CH 166077A CH 618316G A3 CH618316G A3 CH 618316GA3
Authority
CH
Switzerland
Prior art keywords
supports
manufacturing
flexible
miniaturised
electronic device
Prior art date
Application number
CH166077A
Other versions
CH618316B (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Publication of CH618316B publication Critical patent/CH618316B/en
Application filed filed Critical
Publication of CH618316GA3 publication Critical patent/CH618316GA3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/08—Housings
    • G04G17/083—Watches distributed over several housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Electric Clocks (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Multi-Conductor Connections (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Thermistors And Varistors (AREA)

Abstract

According to this method, the components of the circuit are distributed over supports (A, B, C), which are joined together by flexible links (AB, BC), the connections between components belonging to two different supports are made by adhesively bonding insulated flexible leads (wires) (6, 7) onto the flexible link and the various supports are folded one on top of another. The miniaturised electronic devices obtained by this method can be used especially for producing electronic watches, mini-calculators or implanted circuits for medical applications. <IMAGE>
CH166077A 1976-03-09 1977-02-11 Method for manufacturing a miniaturised electronic device and device obtained by this method CH618316GA3 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7606726A FR2344203A1 (en) 1976-03-09 1976-03-09 Miniature electronic circuit module - has circuit elements mounted on separate supports intercoupled by flexible links

Publications (2)

Publication Number Publication Date
CH618316B CH618316B (en)
CH618316GA3 true CH618316GA3 (en) 1980-07-31

Family

ID=9170174

Family Applications (1)

Application Number Title Priority Date Filing Date
CH166077A CH618316GA3 (en) 1976-03-09 1977-02-11 Method for manufacturing a miniaturised electronic device and device obtained by this method

Country Status (3)

Country Link
JP (1) JPS52109165A (en)
CH (1) CH618316GA3 (en)
FR (1) FR2344203A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3137864A1 (en) * 1981-09-23 1983-04-14 Siemens AG, 1000 Berlin und 8000 München FASTENING AND CONTACTING ARRANGEMENT FOR AN LCD DISPLAY UNIT OF AN ELECTRONIC DEVICE HOUSED IN A HOUSING
US4533787A (en) * 1981-11-26 1985-08-06 Autophon Ag. Printed circuit assembly
FR2576430B1 (en) * 1985-01-21 1987-02-27 Bequet Claude ANALOG LINEAR WATCH
WO1990013989A1 (en) * 1989-04-28 1990-11-15 Motorola, Inc. Printed circuit board having multiple form factors
US5117282A (en) * 1990-10-29 1992-05-26 Harris Corporation Stacked configuration for integrated circuit devices
EP0489995A1 (en) * 1990-12-12 1992-06-17 International Business Machines Corporation Flexible printed circuit package and flexible printed circuit for incorporation into such a package
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
DE19960250A1 (en) * 1999-12-14 2001-06-21 Honsberg & Co Kg Flexible i.e. foldable circuit board for equipping with electronic components, uses separate equipping boards which fold over one another via flexible hinge areas

Also Published As

Publication number Publication date
FR2344203A1 (en) 1977-10-07
CH618316B (en)
JPS52109165A (en) 1977-09-13
FR2344203B1 (en) 1981-09-25

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Legal Events

Date Code Title Description
PL Patent ceased