JPS52104882A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS52104882A
JPS52104882A JP2141876A JP2141876A JPS52104882A JP S52104882 A JPS52104882 A JP S52104882A JP 2141876 A JP2141876 A JP 2141876A JP 2141876 A JP2141876 A JP 2141876A JP S52104882 A JPS52104882 A JP S52104882A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
staderize
lsi
much
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2141876A
Other languages
Japanese (ja)
Other versions
JPS5858809B2 (en
Inventor
Hideho Masuzawa
Takamitsu Tsuchimoto
Makoto Mukai
Katsuyuki Hamada
Takao Uehara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP51021418A priority Critical patent/JPS5858809B2/en
Priority to CA268,155A priority patent/CA1091360A/en
Priority to DE2659246A priority patent/DE2659246C2/en
Priority to ES454684A priority patent/ES454684A1/en
Publication of JPS52104882A publication Critical patent/JPS52104882A/en
Priority to US05/925,788 priority patent/US4197555A/en
Publication of JPS5858809B2 publication Critical patent/JPS5858809B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)

Abstract

PURPOSE:To staderize as much as possible, wiring patterns in multilayer structure on a semiconductor element and to obtain a desired connecting manner of a circuit at manufacturing of LSI.
JP51021418A 1975-12-29 1976-02-28 Manufacturing method of semiconductor device Expired JPS5858809B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP51021418A JPS5858809B2 (en) 1976-02-28 1976-02-28 Manufacturing method of semiconductor device
CA268,155A CA1091360A (en) 1975-12-29 1976-12-17 Normalized interconnection patterns
DE2659246A DE2659246C2 (en) 1975-12-29 1976-12-28 Semiconductor device
ES454684A ES454684A1 (en) 1975-12-29 1976-12-29 A SEMICONDUCTOR DEVICE.
US05/925,788 US4197555A (en) 1975-12-29 1978-07-18 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP51021418A JPS5858809B2 (en) 1976-02-28 1976-02-28 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS52104882A true JPS52104882A (en) 1977-09-02
JPS5858809B2 JPS5858809B2 (en) 1983-12-27

Family

ID=12054449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51021418A Expired JPS5858809B2 (en) 1975-12-29 1976-02-28 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5858809B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589434A (en) * 1981-06-22 1983-01-19 Yokogawa Hewlett Packard Ltd Programable logic array
JPH02239652A (en) * 1989-03-14 1990-09-21 Toshiba Corp Semiconductor device
JPH08162535A (en) * 1990-08-01 1996-06-21 Actel Corp User configurable circuit array architecture

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS589434A (en) * 1981-06-22 1983-01-19 Yokogawa Hewlett Packard Ltd Programable logic array
JPH02239652A (en) * 1989-03-14 1990-09-21 Toshiba Corp Semiconductor device
US5521417A (en) * 1989-03-14 1996-05-28 Kabushiki Kaisha Toshiba Semiconductor device comprising a non-volatile memory formed on a data processor
JPH08162535A (en) * 1990-08-01 1996-06-21 Actel Corp User configurable circuit array architecture

Also Published As

Publication number Publication date
JPS5858809B2 (en) 1983-12-27

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