CL2018002017A1 - Método de fabricación de un módulo de tarjeta inteligente y una tarjeta inteligente - Google Patents

Método de fabricación de un módulo de tarjeta inteligente y una tarjeta inteligente

Info

Publication number
CL2018002017A1
CL2018002017A1 CL2018002017A CL2018002017A CL2018002017A1 CL 2018002017 A1 CL2018002017 A1 CL 2018002017A1 CL 2018002017 A CL2018002017 A CL 2018002017A CL 2018002017 A CL2018002017 A CL 2018002017A CL 2018002017 A1 CL2018002017 A1 CL 2018002017A1
Authority
CL
Chile
Prior art keywords
smart card
module
manufacturing
produced
card
Prior art date
Application number
CL2018002017A
Other languages
English (en)
Inventor
Eric Eymard
Original Assignee
Linxens Holding
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=56117830&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=CL2018002017(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Linxens Holding filed Critical Linxens Holding
Publication of CL2018002017A1 publication Critical patent/CL2018002017A1/es

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07752—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna using an interposer
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07754—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being galvanic
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G06K19/07775—Antenna details the antenna being on-chip
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/699—Insulating or insulated package substrates; Interposers; Redistribution layers for flat cards, e.g. credit cards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

MÉTODO PARA FABRICACIÓN DE UN MÓDULO (2) DE TARJETA INTELIGENTE: SE PRODUCE UN MÓDULO (2) CON UN SUSTRATO (13) QUE TIENE CONTACTOS Y UN MICROCHIP (17), CUYO MICROCHIP ESTÁ CONECTADO A AL MENOS ALGUNO DE LOS CONTACTOS; SE PRODUCE UNA ANTENA EN UN SOPORTE; SE PRODUCE UNA CAVIDAD EN AL MENOS UNA CAPA DE LA TARJETA QUE CUBRE EL SOPORTE AL MENOS EN PARTE, CON EL FIN DE COLOCAR EL MÓDULO (2) EN LA MISMA Y HACER QUE LAS ÁREAS DE CONEXIÓN DE LA ANTENA SEAN VISIBLES; MÓDULO; TARJETA.
CL2018002017A 2016-01-26 2018-07-25 Método de fabricación de un módulo de tarjeta inteligente y una tarjeta inteligente CL2018002017A1 (es)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR1650587A FR3047101B1 (fr) 2016-01-26 2016-01-26 Procede de fabrication d’un module de carte a puce et d’une carte a puce

Publications (1)

Publication Number Publication Date
CL2018002017A1 true CL2018002017A1 (es) 2019-03-08

Family

ID=56117830

Family Applications (1)

Application Number Title Priority Date Filing Date
CL2018002017A CL2018002017A1 (es) 2016-01-26 2018-07-25 Método de fabricación de un módulo de tarjeta inteligente y una tarjeta inteligente

Country Status (13)

Country Link
US (1) US10706346B2 (es)
EP (1) EP3408799B1 (es)
JP (1) JP6901207B2 (es)
CN (1) CN108496187B (es)
BR (1) BR112018014282A2 (es)
CL (1) CL2018002017A1 (es)
ES (1) ES2817578T3 (es)
FR (1) FR3047101B1 (es)
MX (1) MX391324B (es)
MY (1) MY197068A (es)
SG (2) SG10201913048XA (es)
TW (1) TWI662480B (es)
WO (1) WO2017129904A1 (es)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3063555B1 (fr) * 2017-03-03 2021-07-09 Linxens Holding Carte a puce et procede de fabrication d’une carte a puce
WO2019138260A1 (en) * 2018-01-12 2019-07-18 Linxens Holding Method for manufacturing a sim card and sim card
FR3086098B1 (fr) * 2018-09-18 2020-12-04 Smart Packaging Solutions Procede de fabrication d'un module electronique pour objet portatif
WO2020196862A1 (ja) * 2019-03-28 2020-10-01 株式会社 東芝 情報処理装置、情報処理システム、情報処理方法、記憶媒体およびプログラム
CN111626395A (zh) * 2020-05-29 2020-09-04 东信和平科技股份有限公司 一种双界面安全芯片卡及制作方法

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US5080279A (en) 1990-06-27 1992-01-14 At&T Bell Laboratories Method for tape automated bonding
FR2716281B1 (fr) 1994-02-14 1996-05-03 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
JPH08282167A (ja) * 1995-04-13 1996-10-29 Rohm Co Ltd Ｉｃカード
TW280897B (es) * 1994-10-27 1996-07-11 Ibm
US5671525A (en) * 1995-02-13 1997-09-30 Gemplus Card International Method of manufacturing a hybrid chip card
JP4153056B2 (ja) * 1997-01-27 2008-09-17 大日本印刷株式会社 Ｉｃモジュールの製造方法
US6046504A (en) * 1997-02-17 2000-04-04 Nippon Steel Corporation Resin-encapsulated LOC semiconductor device having a thin inner lead
JPH11144017A (ja) * 1997-11-11 1999-05-28 Toppan Printing Co Ltd 複合ｉｃカード
IL122250A (en) 1997-11-19 2003-07-31 On Track Innovations Ltd Smart card amenable to assembly using two manufacturing stages and a method of manufacture thereof
FR2847365B1 (fr) 2002-11-15 2005-03-11 Gemplus Card Int Connexion/raccordement simultane par un percage d'adhesif d'encartage
DE10257111B4 (de) 2002-12-05 2005-12-22 Mühlbauer Ag Chipkarte und Verfahren zur Herstellung einer Chipkarte
JP4128460B2 (ja) * 2003-01-23 2008-07-30 トッパン・フォームズ株式会社 Ｉｃカードおよびその製造方法
WO2004107263A1 (ja) * 2003-05-30 2004-12-09 Renesas Technology Corp. 半導体装置およびその製造方法
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
FR2922342B1 (fr) 2007-10-11 2010-07-30 Ask Sa Support de dispositif d'identification radiofrequence renforce et son procede de fabrication
JP2010072930A (ja) 2008-09-18 2010-04-02 Toshiba Corp Ｉｃモジュール、及びこれを用いたｉｃカード
EP2782050B1 (en) * 2011-11-17 2016-06-29 Toppan Printing Co., Ltd. Composite ic card
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Also Published As

Publication number Publication date
MX391324B (es) 2025-03-21
US10706346B2 (en) 2020-07-07
TWI662480B (zh) 2019-06-11
MX2018009123A (es) 2018-11-09
SG11201806384RA (en) 2018-08-30
CN108496187A (zh) 2018-09-04
TW201732688A (zh) 2017-09-16
CN108496187B (zh) 2021-12-28
JP2019504431A (ja) 2019-02-14
EP3408799A1 (fr) 2018-12-05
US20190026621A1 (en) 2019-01-24
JP6901207B2 (ja) 2021-07-14
FR3047101A1 (fr) 2017-07-28
MY197068A (en) 2023-05-24
WO2017129904A1 (fr) 2017-08-03
BR112018014282A2 (pt) 2018-12-18
EP3408799B1 (fr) 2020-07-08
SG10201913048XA (en) 2020-02-27
ES2817578T3 (es) 2021-04-07
FR3047101B1 (fr) 2022-04-01

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