CN100347321C - Copper alloy material having high heat conductivity - Google Patents
Copper alloy material having high heat conductivity Download PDFInfo
- Publication number
- CN100347321C CN100347321C CNB2003101109094A CN200310110909A CN100347321C CN 100347321 C CN100347321 C CN 100347321C CN B2003101109094 A CNB2003101109094 A CN B2003101109094A CN 200310110909 A CN200310110909 A CN 200310110909A CN 100347321 C CN100347321 C CN 100347321C
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- China
- Prior art keywords
- alloy material
- pure
- heat conductivity
- alloy
- high heat
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- 239000000956 alloy Substances 0.000 title claims abstract description 26
- 229910000881 Cu alloy Inorganic materials 0.000 title claims abstract description 13
- 229910052714 tellurium Inorganic materials 0.000 claims abstract description 5
- 229910052744 lithium Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 8
- 239000002994 raw material Substances 0.000 abstract description 2
- 238000003723 Smelting Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 description 12
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 239000010946 fine silver Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 229910011687 LiCu Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
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- Conductive Materials (AREA)
Abstract
The present invention relates to a copper alloy material with high heat conductivity, which is prepared from the following components: 0.0010 to 0.0050 wt% of Li, 0.10 to 0.20 wt% of Te and Cu as the rest. Pure Cu, pure Li and pure Te are used as raw materials to make the alloy material by vacuum smelting. The heat conductivity of the present invention is 28% higher than that of pure red copper and 21% higher than that of pure silver, and the electric conductivity is not less than 100% (IACS).
Description
One, technical field
The present invention relates to alloy, particularly the Cu alloy material of high heat conductance and high conductivity is made the field.
Two, background technology
The current era electronic technology is advanced by leaps and bounds, and the electronic devices and components develop rapidly is more and more as transistor integrated on the wafer, has entered into super large-scale integration from large-scale integrated circuit.Transistor on the unit surface is many more, and power consumption is just many more, and heat radiation has just become big problem.Expectation is integrated 200,000,000 transistors on wafer in 2005, it will hotly must resemble " nuclear reactor ", doubled as if integrated transistor on the wafer by 2010, the level of high-temperature gas nozzle in the time of will hotly arriving rocket launching, by 2015 if the integrated number of transistor be doubled again, will be hot must be the same with the Solar watch surface temperature high.Therefore, the power consumption of ultra-large chip and heat radiation will become an essence restriction, and become the big problem of whole information industry of restriction and even global economy development.Communication system and for example, function is more and more, and data transmit more and more faster, and digital just more and more huger, it is more and more huger consume energy, and the heat that is produced is just very huge, and heat energy can not leave rapidly, and thermal accumlation gets up, and will burn out machine.SAM system supposes to control simultaneously originally three pieces of guided missiles for another example, now controls 6 pieces of guided missiles simultaneously, and numeral doubles at least, and power consumption is doubled at least, if heat does not leave rapidly, machine will soon hotly get and can't work, even burns out.Therefore, heat radiation becomes the formidable enemy of various high-tech, military production development.
In existing thermal conductive metallic material, the highest (λ=405～414wm of the thermal conductivity of fine silver
-1k
-1), the pure red copper (λ=388～391wm that takes second place
-1k
-1), still, existing conventional thermally conductive material is faced with the challenge of new high-tech industry, the especially electronics industry of develop rapidly, can not satisfy the requirement to highly heat-conductive material.
Three, summary of the invention
The Cu alloy material that the purpose of this invention is to provide a kind of high heat conductance, it has than pure red copper even than the better heat conductivility of fine silver.Purpose of the present invention is by being realized by following technical scheme: a kind of Cu alloy material of high heat conductance, and it is made up of following component by weight percentage: the Li of 0.0010%-0.0050%, the Te of 0.10%-0.20%, surplus is Cu.
Technological process of the present invention is as follows: according to each components contents requirement in the above-mentioned alloy, adopting fine copper, pure lithium and pure tellurium is raw material, pass through vacuum melting respectively, make LiCu alloy and TeCu alloy respectively, again with above-mentioned two alloys by vacuum melting, make content and close the LiTeCu alloy that symbol requires.
Learn that through microexamination and Analysis on Mechanism Te form with compound in copper is dissolved in the copper, is the chain parallel rows, distribute along crystal boundary and intracrystalline, Li becomes wire to distribute after playing desoxydatoin and infiltrating the Te element, produce second phase, be precipitation strength, improved the thermal conductivity and the specific conductivity of alloy greatly.The present invention detects its thermal conductivity λ=491～502wm through Institute of Analysis of Southwest Jiaotong University
-1k
-1(SI system).This material thermal conductivity is than pure red copper (λ=388～391wm
-1k
-1) high by 28%, than fine silver high by about 21% (thermal conductivity of fine silver is the highest, and pure red copper is taken second place).Detect its specific conductivity 〉=100%IACS through China Testing Technology Institute.
Four, embodiment
Example 1: according to above-mentioned technological process, the first step: vacuum melting makes LiCu and TeCu alloy, second step: the Cu alloy material that two alloy vacuum meltings is made the following weight degree:
Li 0.0020％
Te 0.12％
The Cu surplus
This alloy thermal conductivity 498wm
-1k
-1(SI), specific conductivity 102.1% (IACS).
Example 2: technological process is the same, and vacuum melting makes the Cu alloy material of following weight degree:
Li 0.0030％
Te 0.15％
The Cu surplus
This alloy thermal conductivity 502wm
-1k
-1(SI), specific conductivity 102.4% (IACS).
Example 3: technological process is the same, and vacuum melting makes the Cu alloy material of following weight degree:
Li 0.0040％
Te 0.18％
The Cu surplus
This alloy thermal conductivity 491wm
-1k
-1(SI), specific conductivity 101.5% (IACS).
Claims (4)
1, a kind of Cu alloy material is characterized in that, it is made up of following component by weight percentage:
The Li of 0.0010%-0.0050%,
The Te of 0.10%-0.20%,
Surplus is Cu.
2, Cu alloy material according to claim 1 is characterized in that it is composed of the following components:
0.0020% Li,
0.12% Te,
Surplus is Cu.
3, Cu alloy material according to claim 1 is characterized in that it is composed of the following components:
0.0030% Li,
0.15% Te,
Surplus is Cu.
4, Cu alloy material according to claim 1 is characterized in that it is composed of the following components:
0.0040% Li,
0.18% Te,
Surplus is Cu.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101109094A CN100347321C (en) | 2003-11-11 | 2003-11-11 | Copper alloy material having high heat conductivity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101109094A CN100347321C (en) | 2003-11-11 | 2003-11-11 | Copper alloy material having high heat conductivity |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1544672A CN1544672A (en) | 2004-11-10 |
| CN100347321C true CN100347321C (en) | 2007-11-07 |
Family
ID=34335808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101109094A Expired - Fee Related CN100347321C (en) | 2003-11-11 | 2003-11-11 | Copper alloy material having high heat conductivity |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100347321C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101768682B (en) * | 2010-02-08 | 2011-10-05 | 四川鑫炬矿业资源开发股份有限公司 | A high-conductivity free-cutting copper-selenium-lithium alloy material |
| CN105112714A (en) * | 2015-09-08 | 2015-12-02 | 周欢 | High-conductivity copper alloy material |
| CN105112721A (en) * | 2015-09-08 | 2015-12-02 | 周欢 | Copper-rare earth alloy material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4347413A (en) * | 1978-07-28 | 1982-08-31 | Hitachi, Ltd. | Electrodes of vacuum circuit breaker |
| US4499009A (en) * | 1981-12-21 | 1985-02-12 | Mitsubishi Denki Kabushiki Kaisha | Electrode composition for vacuum switch |
| US4717436A (en) * | 1985-03-27 | 1988-01-05 | Mitsubishi Kinzoku Kabushiki Kaisha | Wire for bonding a semiconductor device |
| CN1410569A (en) * | 2002-09-18 | 2003-04-16 | 四川鑫炬矿业资源开发股份有限公司 | Copper alloy material for contact net wire |
-
2003
- 2003-11-11 CN CNB2003101109094A patent/CN100347321C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4347413A (en) * | 1978-07-28 | 1982-08-31 | Hitachi, Ltd. | Electrodes of vacuum circuit breaker |
| US4499009A (en) * | 1981-12-21 | 1985-02-12 | Mitsubishi Denki Kabushiki Kaisha | Electrode composition for vacuum switch |
| US4717436A (en) * | 1985-03-27 | 1988-01-05 | Mitsubishi Kinzoku Kabushiki Kaisha | Wire for bonding a semiconductor device |
| CN1410569A (en) * | 2002-09-18 | 2003-04-16 | 四川鑫炬矿业资源开发股份有限公司 | Copper alloy material for contact net wire |
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| Publication number | Publication date |
|---|---|
| CN1544672A (en) | 2004-11-10 |
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