CN1005943B - 在半导体圆片的边缘制造斜面的方法 - Google Patents

在半导体圆片的边缘制造斜面的方法 Download PDF

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Publication number
CN1005943B
CN1005943B CN87106903.2A CN87106903A CN1005943B CN 1005943 B CN1005943 B CN 1005943B CN 87106903 A CN87106903 A CN 87106903A CN 1005943 B CN1005943 B CN 1005943B
Authority
CN
China
Prior art keywords
semiconductor wafer
grinding
grinding wheel
wafer
edge
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CN87106903.2A
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English (en)
Chinese (zh)
Other versions
CN87106903A (zh
Inventor
吉利·德劳希
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BBC Brown Boveri AG Switzerland
Original Assignee
BBC Brown Boveri AG Switzerland
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BBC Brown Boveri AG Switzerland filed Critical BBC Brown Boveri AG Switzerland
Publication of CN87106903A publication Critical patent/CN87106903A/zh
Publication of CN1005943B publication Critical patent/CN1005943B/zh
Expired legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/12—Preparing bulk and homogeneous wafers
    • H10P90/128—Preparing bulk and homogeneous wafers by edge treatment, e.g. chamfering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Thyristors (AREA)
CN87106903.2A 1986-10-13 1987-10-13 在半导体圆片的边缘制造斜面的方法 Expired CN1005943B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH4070/86 1986-10-13
CH4070/86-0 1986-10-13
CH4070/86A CH671116A5 (2) 1986-10-13 1986-10-13

Publications (2)

Publication Number Publication Date
CN87106903A CN87106903A (zh) 1988-04-20
CN1005943B true CN1005943B (zh) 1989-11-29

Family

ID=4269257

Family Applications (1)

Application Number Title Priority Date Filing Date
CN87106903.2A Expired CN1005943B (zh) 1986-10-13 1987-10-13 在半导体圆片的边缘制造斜面的方法

Country Status (6)

Country Link
US (1) US4793102A (2)
EP (1) EP0264679B1 (2)
JP (1) JPS63102859A (2)
CN (1) CN1005943B (2)
CH (1) CH671116A5 (2)
DE (1) DE3777528D1 (2)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5128281A (en) * 1991-06-05 1992-07-07 Texas Instruments Incorporated Method for polishing semiconductor wafer edges
JPH0715897B2 (ja) * 1991-11-20 1995-02-22 株式会社エンヤシステム ウエ−ハ端面エッチング方法及び装置
KR0185234B1 (ko) * 1991-11-28 1999-04-15 가부시키 가이샤 토쿄 세이미쯔 반도체 웨이퍼의 모떼기 방법
US5595522A (en) * 1994-01-04 1997-01-21 Texas Instruments Incorporated Semiconductor wafer edge polishing system and method
US5674110A (en) * 1995-05-08 1997-10-07 Onix S.R.L. Machine and a process for sizing and squaring slabs of materials such as a glass, stone and marble, ceramic tile and the like
RU2163408C1 (ru) * 2000-02-08 2001-02-20 Воронежская государственная технологическая академия Устройство для снятия фаски при финишной обработке полупроводниковых пластин
RU2168796C1 (ru) * 2000-07-10 2001-06-10 Воронежская государственная технологическая академия Устройство для снятия фаски при финишной обработке полупроводниковых пластин
JP4852806B2 (ja) * 2000-07-27 2012-01-11 日立金属株式会社 希土類磁石の面取り方法およびその装置
CN101851488A (zh) * 2009-03-31 2010-10-06 三河市科大博德粉末有限公司 陶瓷结合剂金刚石磨块及其制造方法
CN104526493A (zh) * 2014-11-18 2015-04-22 天津中环领先材料技术有限公司 一种单晶硅晶圆片边缘抛光工艺
JP7549322B2 (ja) * 2020-04-01 2024-09-11 株式会社ノベルクリスタルテクノロジー 半導体基板及びその製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2782565A (en) * 1954-03-25 1957-02-26 Landis Tool Co Valve grinder
US3262234A (en) * 1963-10-04 1966-07-26 Int Rectifier Corp Method of forming a semiconductor rim by sandblasting
GB1048740A (en) * 1964-11-30 1966-11-16 Westinghouse Brake & Signal Semi-conductor elements
SU435926A1 (ru) * 1972-11-09 1974-07-15 Н. В. Фокин Устройство для обработки фасок линз
US4031667A (en) * 1976-03-29 1977-06-28 Macronetics, Inc. Apparatus for contouring edge of semiconductor wafers
DE2807268C3 (de) * 1978-02-21 1981-02-12 Prontor-Werk Alfred Gauthier Gmbh, 7547 Wildbad Maschine zum Zentrierschleifen von optischen Linsen
US4227347A (en) * 1978-09-14 1980-10-14 Silicon Valley Group, Inc. Two motor drive for a wafer processing machine
FR2437271A1 (fr) * 1978-09-26 1980-04-25 Crouzet Sa Dispositif pour detourer les tranches de silicium
US4344260A (en) * 1979-07-13 1982-08-17 Nagano Electronics Industrial Co., Ltd. Method for precision shaping of wafer materials
JPS5726439A (en) * 1980-07-24 1982-02-12 Nec Corp Manufacture of semiconductor device
JPS58202758A (ja) * 1982-05-21 1983-11-26 Hitachi Ltd 研削装置
US4580368A (en) * 1982-11-30 1986-04-08 Energy Adaptive Grinding, Inc. Centerless and center-type grinding systems
JPS59224250A (ja) * 1983-06-03 1984-12-17 Toshiba Corp 研削方法

Also Published As

Publication number Publication date
US4793102A (en) 1988-12-27
DE3777528D1 (de) 1992-04-23
CH671116A5 (2) 1989-07-31
EP0264679B1 (de) 1992-03-18
JPS63102859A (ja) 1988-05-07
EP0264679A1 (de) 1988-04-27
CN87106903A (zh) 1988-04-20

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