CN101432901A - 具有多层封装的压电执行元件及其制造方法 - Google Patents

具有多层封装的压电执行元件及其制造方法 Download PDF

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Publication number
CN101432901A
CN101432901A CNA2007800147574A CN200780014757A CN101432901A CN 101432901 A CN101432901 A CN 101432901A CN A2007800147574 A CNA2007800147574 A CN A2007800147574A CN 200780014757 A CN200780014757 A CN 200780014757A CN 101432901 A CN101432901 A CN 101432901A
Authority
CN
China
Prior art keywords
piezoelectric actuator
metal layer
layer
electrically insulating
elastic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800147574A
Other languages
English (en)
Chinese (zh)
Inventor
H·拜尔
H·弗鲁登伯格
A·冈斯特
C·哈曼
O·亨宁
J·D·詹森
G·卢格特
R·莫克
C·舒
J·扎普夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of CN101432901A publication Critical patent/CN101432901A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/80—Constructional details
    • H10N30/88—Mounts; Supports; Enclosures; Casings
    • H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/02—Forming enclosures or casings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/42—Piezoelectric device making

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Fuel-Injection Apparatus (AREA)
  • General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
CNA2007800147574A 2006-04-26 2007-04-24 具有多层封装的压电执行元件及其制造方法 Pending CN101432901A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006019489.6 2006-04-26
DE102006019489A DE102006019489B4 (de) 2006-04-26 2006-04-26 Piezoaktor mit Mehrschicht-Verkapselung und Verfahren zu seiner Herstellung

Publications (1)

Publication Number Publication Date
CN101432901A true CN101432901A (zh) 2009-05-13

Family

ID=38371002

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2007800147574A Pending CN101432901A (zh) 2006-04-26 2007-04-24 具有多层封装的压电执行元件及其制造方法

Country Status (8)

Country Link
US (1) US7851978B2 (de)
EP (1) EP2011166B1 (de)
JP (1) JP5021722B2 (de)
CN (1) CN101432901A (de)
AT (1) ATE494637T1 (de)
DE (2) DE102006019489B4 (de)
DK (1) DK2011166T3 (de)
WO (1) WO2007122227A2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9331282B2 (en) 2012-09-14 2016-05-03 Toray Industries, Inc. Conjugated polymer, and electron donating organic material, material for photovoltaic device and photovoltaic device using the conjugated polymer

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006019900A1 (de) * 2006-04-28 2007-11-08 Siemens Ag Piezoaktor mit Gradient-Verkapselungsschicht und Verfahren zu seiner Herstellung
DE102007037553A1 (de) * 2007-08-09 2009-02-12 Robert Bosch Gmbh Piezoelektrisches Aktormodul
DE102010022911B4 (de) * 2010-06-07 2017-01-19 Continental Automotive Gmbh Verfahren zum Herstellen eines Piezoaktors und Piezoaktor
US8940559B2 (en) 2011-11-04 2015-01-27 Hewlett-Packard Development Company, L.P. Method of fabricating an integrated orifice plate and cap structure
US9680445B2 (en) * 2014-10-31 2017-06-13 Avago Technologies General Ip (Singapore) Pte. Ltd. Packaged device including cavity package with elastic layer within molding compound
DE102017120210A1 (de) * 2017-09-01 2019-03-07 Technische Universität Darmstadt Verfahren zur Herstellung eines Schichtenabfolgenelements sowie Schichtenabfolgenelement für die Herstellung eines dielektrischen Elastomerwandlers
JP7083481B2 (ja) * 2017-12-22 2022-06-13 国立研究開発法人宇宙航空研究開発機構 多層断熱材、宇宙機、損傷診断装置、及び被検出物の検出方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61243166A (ja) * 1985-04-18 1986-10-29 Matsushita Electric Ind Co Ltd 硬質膜およびその製造方法
JPH0666483B2 (ja) * 1987-11-24 1994-08-24 日本電気株式会社 電歪効果素子
JPH0399902A (ja) * 1989-09-12 1991-04-25 Bridgestone Corp 浮上式車両用重荷重ラジアルタイヤ
US5372848A (en) 1992-12-24 1994-12-13 International Business Machines Corporation Process for creating organic polymeric substrate with copper
DE19753930A1 (de) * 1997-12-05 1999-06-10 Ceramtec Ag Verfahren zur Anbringung von Außenelektroden an Festkörperaktoren
WO2001048834A2 (de) * 1999-12-23 2001-07-05 Siemens Aktiengesellschaft Piezoelektrisches element
WO2005087979A2 (en) 2004-03-11 2005-09-22 Frontcoat Technologies Aps A method and a device for deposition of a metal layer on a non-conducting surface of a substrate
JP2009527118A (ja) 2006-02-14 2009-07-23 デルファイ・テクノロジーズ・インコーポレーテッド 圧電装置のバリヤ被覆
GB0604467D0 (en) 2006-03-06 2006-04-12 Delphi Tech Inc Ionic barrier coatings

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9331282B2 (en) 2012-09-14 2016-05-03 Toray Industries, Inc. Conjugated polymer, and electron donating organic material, material for photovoltaic device and photovoltaic device using the conjugated polymer

Also Published As

Publication number Publication date
JP5021722B2 (ja) 2012-09-12
US20090302713A1 (en) 2009-12-10
DE102006019489B4 (de) 2008-03-13
US7851978B2 (en) 2010-12-14
DE502007006189D1 (de) 2011-02-17
WO2007122227A3 (de) 2007-12-13
EP2011166B1 (de) 2011-01-05
DE102006019489A1 (de) 2007-10-31
ATE494637T1 (de) 2011-01-15
JP2009535010A (ja) 2009-09-24
DK2011166T3 (da) 2011-04-11
WO2007122227A2 (de) 2007-11-01
EP2011166A2 (de) 2009-01-07

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Application publication date: 20090513