CN101455132A - 用于相互连接携带大电流的电缆与金属薄膜的互连装置和方法 - Google Patents

用于相互连接携带大电流的电缆与金属薄膜的互连装置和方法 Download PDF

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Publication number
CN101455132A
CN101455132A CN200780018946.9A CN200780018946A CN101455132A CN 101455132 A CN101455132 A CN 101455132A CN 200780018946 A CN200780018946 A CN 200780018946A CN 101455132 A CN101455132 A CN 101455132A
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CN
China
Prior art keywords
cable
weld joint
flat cable
interconnecting
metallic film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200780018946.9A
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English (en)
Chinese (zh)
Inventor
C·W·A·弗詹斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN101455132A publication Critical patent/CN101455132A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
    • H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0108—Transparent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by welding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Multi-Conductor Connections (AREA)
CN200780018946.9A 2006-05-22 2007-05-11 用于相互连接携带大电流的电缆与金属薄膜的互连装置和方法 Pending CN101455132A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP06114318.6 2006-05-22
EP06114318 2006-05-22

Publications (1)

Publication Number Publication Date
CN101455132A true CN101455132A (zh) 2009-06-10

Family

ID=38596171

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200780018946.9A Pending CN101455132A (zh) 2006-05-22 2007-05-11 用于相互连接携带大电流的电缆与金属薄膜的互连装置和方法

Country Status (5)

Country Link
US (1) US7994709B2 (fr)
EP (1) EP2027760A2 (fr)
JP (1) JP2009538498A (fr)
CN (1) CN101455132A (fr)
WO (1) WO2007135604A2 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
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CN105098404A (zh) * 2014-05-06 2015-11-25 上海空间电源研究所 空间用太阳电池阵电缆的连接方法
CN107462610A (zh) * 2016-06-06 2017-12-12 通用汽车环球科技运作有限责任公司 用于评估超声焊接接头的方法和设备
CN107470730A (zh) * 2016-06-07 2017-12-15 程国中 一种led面光源与线路板的焊接方法

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WO2010029460A1 (fr) 2008-09-09 2010-03-18 Philips Intellectual Property & Standards Gmbh Mise en contact d’un dispositif avec un conducteur
US8343783B2 (en) * 2010-09-10 2013-01-01 Long Jing International Technology Enterprise Co., Ltd. LED module and packing method of the same
US20120256813A1 (en) * 2011-04-11 2012-10-11 General Electric Company Low temperature contact structure for flexible solid state device
DE102011077687B4 (de) 2011-06-17 2021-05-12 Pictiva Displays International Limited Organische leuchtdiode, verfahren zur herstellung einer organischen leuchtdiode und modul mit mindestens zwei organischen leuchtdioden
JP6102741B2 (ja) * 2011-09-21 2017-03-29 コニカミノルタ株式会社 有機エレクトロルミネッセンスパネル及び有機エレクトロルミネッセンスパネルの製造方法
TWI465965B (zh) * 2012-12-19 2014-12-21 Primax Electronics Ltd 發光觸控鍵盤
JP2015079737A (ja) 2013-09-11 2015-04-23 パナソニックＩｐマネジメント株式会社 発光モジュール
JP6118474B1 (ja) 2014-03-27 2017-04-19 フィリップス ライティング ホールディング ビー ヴィ 効率的な基板対基板接続
DE102015005240A1 (de) * 2015-04-26 2016-10-27 Tilman Röder Verfahren zur Installation eines Stromverteilungssystems im Bereich von Kleinspannung unter 25 Volt AC oder 60 Volt DC, bei dem mindestens ein Netzteil für die Versorgung von zwei oder mehr möglichen Stromverbrauchern verwendetwird und ein entsprechendes Stromverteilungssystem sowie zugehörige Vorrichtung
DE102019200659A1 (de) 2019-01-18 2020-07-23 Te Connectivity Germany Gmbh Elektrische Verbindungsanordnung mit zwei verschweißten Leitern und einer Schicht Cyanacrylat-Klebstoff zwischen den Leitern sowie Verfahren hierzu
JP2021106136A (ja) * 2019-12-27 2021-07-26 コニカミノルタ株式会社 発光モジュール

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105098404A (zh) * 2014-05-06 2015-11-25 上海空间电源研究所 空间用太阳电池阵电缆的连接方法
CN107462610A (zh) * 2016-06-06 2017-12-12 通用汽车环球科技运作有限责任公司 用于评估超声焊接接头的方法和设备
CN107462610B (zh) * 2016-06-06 2020-02-28 通用汽车环球科技运作有限责任公司 用于评估超声焊接接头的方法和设备
US10759006B2 (en) 2016-06-06 2020-09-01 GM Global Technology Operations LLC Method and apparatus for evaluating an ultrasonic weld junction
CN107470730A (zh) * 2016-06-07 2017-12-15 程国中 一种led面光源与线路板的焊接方法

Also Published As

Publication number Publication date
WO2007135604A2 (fr) 2007-11-29
JP2009538498A (ja) 2009-11-05
EP2027760A2 (fr) 2009-02-25
US20090160321A1 (en) 2009-06-25
WO2007135604A3 (fr) 2008-05-15
US7994709B2 (en) 2011-08-09

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Application publication date: 20090610