CN102414535B - 具有叠片组的热交换设备及其制造方法 - Google Patents

具有叠片组的热交换设备及其制造方法 Download PDF

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Publication number
CN102414535B
CN102414535B CN201080019004.4A CN201080019004A CN102414535B CN 102414535 B CN102414535 B CN 102414535B CN 201080019004 A CN201080019004 A CN 201080019004A CN 102414535 B CN102414535 B CN 102414535B
Authority
CN
China
Prior art keywords
plates
plate
pattern
panels
stack
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201080019004.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN102414535A (zh
Inventor
N.休伯
M.梅纳特
A.拉斯托吉
K.雷肯伯格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of CN102414535A publication Critical patent/CN102414535A/zh
Application granted granted Critical
Publication of CN102414535B publication Critical patent/CN102414535B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
CN201080019004.4A 2009-04-29 2010-04-15 具有叠片组的热交换设备及其制造方法 Expired - Fee Related CN102414535B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
DE102009019356 2009-04-29
DE102009019356.1 2009-04-29
DE102009052489.4 2009-11-09
DE102009052489A DE102009052489A1 (de) 2009-04-29 2009-11-09 Vorrichtung zum Austausch von Wärme mit einem Plattenpaket und Verfahren zu deren Herstellung
PCT/EP2010/054947 WO2010124937A2 (fr) 2009-04-29 2010-04-15 Dispositif pour l'échange de chaleur comprenant un empilement de plaques et son procédé de production

Publications (2)

Publication Number Publication Date
CN102414535A CN102414535A (zh) 2012-04-11
CN102414535B true CN102414535B (zh) 2014-07-16

Family

ID=42932582

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080019004.4A Expired - Fee Related CN102414535B (zh) 2009-04-29 2010-04-15 具有叠片组的热交换设备及其制造方法

Country Status (6)

Country Link
US (1) US20120055659A1 (fr)
EP (1) EP2425196A2 (fr)
JP (1) JP5420755B2 (fr)
CN (1) CN102414535B (fr)
DE (1) DE102009052489A1 (fr)
WO (1) WO2010124937A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011007759A1 (de) 2011-04-20 2012-10-25 Siemens Aktiengesellschaft Elektrolysezelle mit einem Blechpaket übereinander gestapelter Bleche mit Ausnehmungen und Verfahren zu deren Herstellung und Betrieb
DE102011079637A1 (de) * 2011-07-22 2013-01-24 Siemens Aktiengesellschaft Verfahren zur Herstellung einer seewasserfesten Kühlplatte und Vorrichtung hergestellt mit diesem Verfahren sowie deren Verwendung
US20130058042A1 (en) * 2011-09-03 2013-03-07 Todd Richard Salamon Laminated heat sinks
EP2674715A1 (fr) * 2012-06-14 2013-12-18 Alfa Laval Corporate AB Échangeur thermique de plaque avec un trou réalisé par fluoperçage

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528116A1 (de) * 1995-08-01 1997-02-06 Behr Gmbh & Co Wärmeübertrager mit Platten-Sandwichstruktur
US5718286A (en) * 1995-08-01 1998-02-17 Behr Gmbh & Co. Heat transfer device of a plate stack construction
JP2006224253A (ja) * 2005-02-18 2006-08-31 Seiko Epson Corp マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
CN101122632A (zh) * 2006-08-07 2008-02-13 西门子公司 梯度线圈系统和磁共振层析x射线摄影机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2281754A (en) * 1937-01-27 1942-05-05 Cherry Burreil Corp Heat exchanger
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
GB8910966D0 (en) * 1989-05-12 1989-06-28 Du Pont Canada Panel heat exchangers formed from thermoplastic polymers
DE4238192C2 (de) * 1992-11-12 1994-09-29 Hoechst Ceram Tec Ag Durchlässige Struktur
DE19536115C2 (de) * 1995-09-28 2001-03-08 Behr Gmbh & Co Mehrfluid-Wärmeübertrager mit Plattenstapelaufbau
US6167952B1 (en) * 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US6892805B1 (en) * 2004-04-05 2005-05-17 Modine Manufacturing Company Fluid flow distribution device
DE102005007707A1 (de) * 2004-09-27 2006-03-30 Powerfluid Gmbh Rekuperator, Mikrokanal-Rekuperator, Folie, Verwendung einer Folie und Verfahren zum Herstellen sowie zum Betreiben eines Rekuperators

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19528116A1 (de) * 1995-08-01 1997-02-06 Behr Gmbh & Co Wärmeübertrager mit Platten-Sandwichstruktur
US5718286A (en) * 1995-08-01 1998-02-17 Behr Gmbh & Co. Heat transfer device of a plate stack construction
JP2006224253A (ja) * 2005-02-18 2006-08-31 Seiko Epson Corp マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
CN101122632A (zh) * 2006-08-07 2008-02-13 西门子公司 梯度线圈系统和磁共振层析x射线摄影机

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP特开2006-224253A 2006.08.31

Also Published As

Publication number Publication date
JP5420755B2 (ja) 2014-02-19
US20120055659A1 (en) 2012-03-08
WO2010124937A3 (fr) 2011-06-03
CN102414535A (zh) 2012-04-11
DE102009052489A1 (de) 2010-11-11
WO2010124937A2 (fr) 2010-11-04
EP2425196A2 (fr) 2012-03-07
JP2012525559A (ja) 2012-10-22

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20140716

Termination date: 20160415

CF01 Termination of patent right due to non-payment of annual fee