EP2425196A2 - Dispositif pour l'échange de chaleur comprenant un empilement de plaques et son procédé de production - Google Patents

Dispositif pour l'échange de chaleur comprenant un empilement de plaques et son procédé de production

Info

Publication number
EP2425196A2
EP2425196A2 EP10716315A EP10716315A EP2425196A2 EP 2425196 A2 EP2425196 A2 EP 2425196A2 EP 10716315 A EP10716315 A EP 10716315A EP 10716315 A EP10716315 A EP 10716315A EP 2425196 A2 EP2425196 A2 EP 2425196A2
Authority
EP
European Patent Office
Prior art keywords
plates
plate
recesses
adjacent
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP10716315A
Other languages
German (de)
English (en)
Inventor
Norbert Huber
Michael Meinert
Armin Rastogi
Karsten Rechenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP2425196A2 publication Critical patent/EP2425196A2/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/08—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning
    • F28F3/086—Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning having one or more openings therein forming tubular heat-exchange passages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making

Definitions

  • the present invention relates to an apparatus for exchanging heat and a method for the production thereof.
  • the device has a plate pack comprising at least a first, a second and a third plate.
  • the at least three plates are stacked on top of each other and have recesses formed throughout the entire thickness of the respective plate.
  • the recesses are arranged in a plane of the respective plate in the form of a regular pattern.
  • the cooling plates consist of a stack of plates, which is made up of at least two plates with recesses. The plates are arranged such that the recesses partially overlap and form a cooling channel. A fluid, e.g. Water flowing through the cooling channel cools the plate and removes excess heat from the device.
  • a problem with the device described is the temperature distribution within a cooling plate.
  • a strong temperature difference prevails.
  • this can negatively affect proper operation.
  • Object of the device according to the invention is to provide a cooling device in which the aforementioned problems are at least reduced.
  • it is an object to provide a device for exchanging heat, which enables a standardization of the temperature in a device.
  • the stated object is achieved with respect to the device for exchanging heat with the features of claim 1 and with respect to the method for producing the device with the features of claim 11.
  • the heat exchange device has a plate pack comprising at least a first, a second and a third plate.
  • the at least three plates are stacked on top of each other and have recesses formed throughout the entire thickness of the respective plates.
  • the recesses are arranged in a plane of the respective plate in the form of a regular pattern.
  • the first and second plates, and the second and third plates are each adjacent, stacked one over the other such that the adjacent plates each form at least one common cooling channel accessible to a fluid along a direction in the plate plane.
  • the at least two cooling channels are formed by means of partially, but not completely overlapping recesses arranged in the adjacent plates.
  • the at least one cooling channel of the first and the second plate is complete spatially separated from the at least one cooling channel of the second and the third plate.
  • a fluid By forming separate cooling channels, a fluid can be introduced from different sides of the device and e.g. in a countercurrent principle absorb heat of the device. By flowing the fluid for cooling from different sides, an equalization of the cooling effect is achieved. A temperature gradient between inlet and outlet of the fluid in the device is reduced.
  • the device is cooled more evenly in their spatial extent.
  • the device can be used as a heat exchanger between two fluids of different temperature.
  • the recesses of the plate may have a same shape, in particular a Y-shape.
  • the Y-shape can be composed of rotated by 120 degrees, equal parts.
  • the recesses may be arranged so that they overlap only in the region of the ends of the Y-shape.
  • the device can be particularly easy to produce and the recesses can be easily overlap.
  • Each end of a Y-shaped recess of a plate may be overlapped with one end of a Y-shaped recess of an adjacent plate, in particular each with one end of a Y-shaped recess of an adjacent plate.
  • the cooling channels formed have such favorable flow conditions.
  • a plate can be constructed from a plurality of identically shaped, congruently stacked sub-plates. Relating to cooling surfaces with edge lengths in the range of some
  • the thickness of the plate may be in the range of 0.5 mm - 20 mm and the channels may have a thickness in the range of 0.5 mm to 20 mm.
  • Kleinstküh- Large or very large cold plates may have correspondingly changed channel dimensions.
  • the plates may consist of a metal, in particular magnetizable iron. Furthermore, the plates may be partially or completely coated with an electrically insulating lacquer and / or be electrically insulated from one another.
  • the plate pack may be part of a generator or a motor and / or be part of a rotor or a stator.
  • the plates may consist of a metal, in particular aluminum or copper.
  • the plate pack can be used to cool electrical power components, such as for cooling electrical energy storage or power electronics components.
  • An inventive method for producing a device described above is given by the fact that at least three plates are stacked to form a plate package such that at least a first cooling channel through a first and a second plate of the
  • Plate stack arises.
  • the result is at least one second cooling channel completely separated from the at least first cooling channel, through the second and a third plate of the plate stack.
  • the cooling channels are formed along at least one direction in a plane of the plate through recesses in the at least three plates.
  • the recesses of adjacent plates are arranged partially but not completely overlapping.
  • the recesses may be punched out of the plates and / or drilled and / or milled and / or etched and / or formed by means of a laser.
  • the recesses in each of the plates may be arranged in a plane of the respective plate in the form of a regular pattern.
  • the first and third plates are formed with the same pattern rotated 90 degrees against each other.
  • the second plate arranged between the first and the third plate is formed with a pattern which results in a superposition of the pattern of the first plate with the pattern of the third plate, in particular with a displacement of the two patterns relative to one another by a half distance of the recesses of a plate to one another ,
  • All plates of the plate pack can be arranged so that recesses of adjacent plates overlap one another and are not congruently arranged.
  • the panels may be joined by gluing and / or snap connection and / or by soldering and / or by screws.
  • the cooling channels formed by the recesses can be traversed by a fluid, in particular air, water or oils, antifreeze and corrosion inhibitors.
  • the at least two cooling channels can also each be traversed by a fluid, wherein the at least two fluid streams differ in their temperature and takes place on the plates, a heat exchange between the separate fluids.
  • Fig. 1 is an oblique view of a plate pack with a cooling channel according to the prior art
  • Fig. 2 is a plan view of a plate pack with two plates according to the prior art, as shown in Fig. 1, and
  • FIG. 3 is a plan view of an inventive plate package with 3 plates, wherein two spatially separated from each other cooling channels are formed, and
  • Fig. 4 is a first plate of the plate pack, as shown in Fig. 3, and
  • Fig. 5 shows a second plate of the plate pack, as shown in Fig. 3, and
  • FIG. 6 shows a third plate of the plate pack, as shown in FIG.
  • Fig. 7 shows a plate without a pattern of recesses, which is arranged as a cover plate on or under the plate pack, and
  • Fig. 8 is a side view of the plate pack with a cover plate on and one under the plate pack and connections for the supply and removal of fluids to and from cooling channels.
  • Fig. 1 shows an oblique view of a plate package 1 with
  • Recesses 7 according to the prior art, which has a contiguous cooling channel 8 or channel for a fluid.
  • the plate pack 1 is made of two stacked th plates 4 and 5 constructed and sandwiched by an upper cover plate 2 and a lower cover plate 3 under the plate pack 1.
  • the two plates 4 and 5 of the plate pack 1 each have Y-shaped recesses 7, which are arranged at regular intervals from each other, without touching each other.
  • the recesses 7 each result in a plate 4 or 5 a regular pattern.
  • Adjacent plates 4 and 5 are arranged with their recesses 7 so that the recesses 7 overlap only in their margins.
  • Each end of a Y-shaped recess 7 of a plate 4 or 5 overlaps with one end, in particular with exactly one end, a Y-shaped recess 7 of the adjacent plate 5 and 4.
  • a Y-shaped recess 7 of the adjacent plate 5 and 4 By the overlapping recesses 7 adjacent plates 4 and 5 is a through the plate 4 and 5 completely along the plane of the plate continuous cooling channel 8 is formed.
  • the cooling channel 8 thus formed can be flowed through by the fluid, wherein the fluid can absorb and dissipate waste heat of the plate 2 and 3.
  • Cooling is given by water.
  • the cooling water flows in the channel 8 parallel to a plane of the plates 2 to 5.
  • the overlapping recesses 7 of adjacent plates 4 and 5 form a pattern which gives a large common surface between the plates 4 and 5 and the fluid.
  • effective cooling becomes possible.
  • Fig. 2 is a plan view of a plate pack shown, as shown in Fig. 1.
  • the hatched recesses 7a are formed in the first plate 4 in a top plate 4 in a first plane
  • the dotted recesses 7b are formed in the second plate 5 in the plate stack in a second plane.
  • the recesses 7a and 7b of the first and the second plate 4 and 5 all overlap, but only in the marginal area, ie at the ends of their Y-shape.
  • the pattern of the recesses 7a in the first plate 4 and the same pattern of recesses 7b in the second plate 5 displaced therefrom results in a cooling channel 8 extending continuously along the plane of the plate, which has the form of a network.
  • Fig. 3 is a plan view of an inventive plate package 1 with 3 plates 4, 5, and 6 is shown.
  • the three plates 4 to 6 are stacked on top of each other and each have a pattern of recesses 7.
  • the recesses 7 are arranged in the plates 4 to 6 such that form two spatially separated, partially superimposed cooling channels 8a and 8b.
  • the first plate 4 is shown individually, with a pattern of the recesses 7a.
  • an inflow 9 and an outflow channel 10 are shown.
  • the inflow channel 9 serves to introduce fluid into the first channel 8a.
  • the discharge channel 10 serves the fluid to leave the first channel 8a or escape. Circles indicated by dashed lines are in each case connections 11 on the inflow channel 9 and on the outflow channel 10.
  • Fig. 5 the pattern of the recesses 7b of the second plate 5 is shown.
  • the pattern of the recesses 7b of the second plate 5 results as a superposition of the pattern of the recesses 7a of the first plate 4 (see Fig. 4) with the same pattern, rotated 180 degrees and shifted from each other by half a distance of the recesses 7a.
  • Dashed lines indicated on the right and left side in the plane of the figure are respectively the Anström- 9 and the outflow channel 10 of the below the second plate 5 arranged third plate 6 (see Fig. 6).
  • Circular bores in the second plate 5 are introduced to pass through connections 11 through the first and second plates 4 and 5, fluid in the inflow passage 9 and the outflow channel 10th the third plate 6 (see dashed lines and Fig. 6) to bring or transported away.
  • Fig. 6 the third plate 6 is shown individually, with a pattern of the recesses 7c.
  • an inflow 9 and an outflow channel 10 are shown on the right and left side in the plane of the figure.
  • the inflow channel 9 serves to introduce fluid into the second channel 8b.
  • the outflow channel 10 serves the fluid in order to be able to leave or escape the second channel 8b. Circles indicated in each case are connections 11 to the inflow channel 9 and to the outflow channel 10 in FIG. 6.
  • a cover plate 2 (analogous to the cover plate 3) is shown, which has no pattern of recesses 7. With the help of the cover plate 2 and 3, the channels 8 are sealed upwards or downwards.
  • a cover plate 2 is on and a cover plate 3 is disposed under the plate package 1. The plates 4 to 6 with recesses are sandwiched between the cover plates 2 and 3.
  • the plate pack 1 is shown in Fig. 8 from the side.
  • Fig. 7 circularly indicated connections are shown in Fig. 8 connected to inlet and outlet lines 12.
  • two fluid circuits can be operated separately by means of the first and second channels 8a and 8b.
  • the two circuits can be used for more uniform cooling of the plate pack 1, since cool fluid can flow into the plate pack 1 from two different sides.
  • the plate pack 1 may be used as a heat exchanger between a fluid having a temperature Ti and a fluid having a higher temperature T2.
  • the plates 2 to 6 shown in the figures typically have a thickness in the range of 1 mm.
  • the channels 8a and 8b thus typically also have a thickness of 1 mm (2 mm at points of overlap of recesses 7) in the direction perpendicular to the plane of the plate.
  • the plates 2 to 6 and cooling channels 8a and 8b may also be other sizes, e.g. in the range of a few centimeters thick.
  • the width of the recesses 7, and thus of the channels 8a and 8b, is preferably in the range of 5 to 30 mm. But there are also channel widths in the range of centimeters possible.
  • the thickness of the plates may be in the range of 0.5 mm - 20 mm and the channels may have a thickness in the range of 0.5 mm to 20 mm.
  • Micro-coolers or very large cooling plates can have correspondingly changed channel dimensions.
  • the plates 2 to 6 are preferably made of a metal, in particular aluminum or copper. However, other pure metals or metal alloys are also suitable.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

L'invention concerne un dispositif pour l'échange de chaleur comprenant un empilement de plaques (1) constitué d'au moins une première, une deuxième et une troisième plaque (4, 5, 6). Les trois plaques (4 - 6) sont empilées les unes sur les autres et présentent des évidements (7) qui sont placés selon un motif régulier dans un plan des plaques respectives (4 - 6). La première et la deuxième plaque (4, 5) ainsi que la deuxième et la troisième plaque (5, 6) sont respectivement empilées l'une sur l'autre de sorte que les plaques voisines forment respectivement au moins un conduit de refroidissement commun (8), accessible à un fluide, le long d'une direction dans le plan de la plaque. Les deux conduits de refroidissement (8a, 8b) sont réalisés à l'aide d'évidements (7), se chevauchant partiellement mais pas complètement, dans les plaques voisines. Le conduit de refroidissement (8a) des première et deuxième plaques (4, 5) est complètement séparé dans l'espace du conduit de refroidissement (8b) des deuxième et troisième plaques (5, 6). L'invention concerne également un procédé de production de l'empilement de plaques (1) par empilage des plaques (2 - 6).
EP10716315A 2009-04-29 2010-04-15 Dispositif pour l'échange de chaleur comprenant un empilement de plaques et son procédé de production Withdrawn EP2425196A2 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009019356 2009-04-29
DE102009052489A DE102009052489A1 (de) 2009-04-29 2009-11-09 Vorrichtung zum Austausch von Wärme mit einem Plattenpaket und Verfahren zu deren Herstellung
PCT/EP2010/054947 WO2010124937A2 (fr) 2009-04-29 2010-04-15 Dispositif pour l'échange de chaleur comprenant un empilement de plaques et son procédé de production

Publications (1)

Publication Number Publication Date
EP2425196A2 true EP2425196A2 (fr) 2012-03-07

Family

ID=42932582

Family Applications (1)

Application Number Title Priority Date Filing Date
EP10716315A Withdrawn EP2425196A2 (fr) 2009-04-29 2010-04-15 Dispositif pour l'échange de chaleur comprenant un empilement de plaques et son procédé de production

Country Status (6)

Country Link
US (1) US20120055659A1 (fr)
EP (1) EP2425196A2 (fr)
JP (1) JP5420755B2 (fr)
CN (1) CN102414535B (fr)
DE (1) DE102009052489A1 (fr)
WO (1) WO2010124937A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011007759A1 (de) 2011-04-20 2012-10-25 Siemens Aktiengesellschaft Elektrolysezelle mit einem Blechpaket übereinander gestapelter Bleche mit Ausnehmungen und Verfahren zu deren Herstellung und Betrieb
DE102011079637A1 (de) * 2011-07-22 2013-01-24 Siemens Aktiengesellschaft Verfahren zur Herstellung einer seewasserfesten Kühlplatte und Vorrichtung hergestellt mit diesem Verfahren sowie deren Verwendung
US20130058042A1 (en) * 2011-09-03 2013-03-07 Todd Richard Salamon Laminated heat sinks
EP2674715A1 (fr) * 2012-06-14 2013-12-18 Alfa Laval Corporate AB Échangeur thermique de plaque avec un trou réalisé par fluoperçage

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US2281754A (en) * 1937-01-27 1942-05-05 Cherry Burreil Corp Heat exchanger
US4516632A (en) * 1982-08-31 1985-05-14 The United States Of America As Represented By The United States Deparment Of Energy Microchannel crossflow fluid heat exchanger and method for its fabrication
GB8910966D0 (en) * 1989-05-12 1989-06-28 Du Pont Canada Panel heat exchangers formed from thermoplastic polymers
DE4238192C2 (de) * 1992-11-12 1994-09-29 Hoechst Ceram Tec Ag Durchlässige Struktur
DE19528117B4 (de) * 1995-08-01 2004-04-29 Behr Gmbh & Co. Wärmeübertrager mit Plattenstapelaufbau
DE19528116B4 (de) * 1995-08-01 2007-02-15 Behr Gmbh & Co. Kg Wärmeübertrager mit Platten-Sandwichstruktur
DE19536115C2 (de) * 1995-09-28 2001-03-08 Behr Gmbh & Co Mehrfluid-Wärmeübertrager mit Plattenstapelaufbau
US6167952B1 (en) * 1998-03-03 2001-01-02 Hamilton Sundstrand Corporation Cooling apparatus and method of assembling same
US6892805B1 (en) * 2004-04-05 2005-05-17 Modine Manufacturing Company Fluid flow distribution device
DE102005007707A1 (de) * 2004-09-27 2006-03-30 Powerfluid Gmbh Rekuperator, Mikrokanal-Rekuperator, Folie, Verwendung einer Folie und Verfahren zum Herstellen sowie zum Betreiben eines Rekuperators
JP2006224253A (ja) * 2005-02-18 2006-08-31 Seiko Epson Corp マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
DE102006036833B4 (de) * 2006-08-07 2012-12-13 Siemens Ag Gradientenspulensystem und Magnetresonanztomograph

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See references of WO2010124937A2 *

Also Published As

Publication number Publication date
CN102414535B (zh) 2014-07-16
JP5420755B2 (ja) 2014-02-19
US20120055659A1 (en) 2012-03-08
WO2010124937A3 (fr) 2011-06-03
CN102414535A (zh) 2012-04-11
DE102009052489A1 (de) 2010-11-11
WO2010124937A2 (fr) 2010-11-04
JP2012525559A (ja) 2012-10-22

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