CN102719210A - Insulating heat-conducting adhesive for ultralow temperature - Google Patents
Insulating heat-conducting adhesive for ultralow temperature Download PDFInfo
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- 239000000853 adhesive Substances 0.000 title claims abstract description 61
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 61
- 239000000203 mixture Substances 0.000 claims abstract description 55
- 239000003822 epoxy resin Substances 0.000 claims abstract description 52
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 52
- 239000000843 powder Substances 0.000 claims abstract description 49
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 45
- 238000002156 mixing Methods 0.000 claims abstract description 44
- 238000006243 chemical reaction Methods 0.000 claims abstract description 42
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 24
- 239000000945 filler Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims abstract description 11
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims description 35
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 18
- 150000004982 aromatic amines Chemical class 0.000 claims description 12
- -1 glycidyl ester Chemical class 0.000 claims description 11
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical group OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 10
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 claims description 9
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 claims description 9
- 239000009261 D 400 Substances 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 5
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims description 4
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical group Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 4
- 239000004845 glycidylamine epoxy resin Substances 0.000 claims description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 3
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical group NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 3
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 2
- PISLZQACAJMAIO-UHFFFAOYSA-N 2,4-diethyl-6-methylbenzene-1,3-diamine Chemical group CCC1=CC(C)=C(N)C(CC)=C1N PISLZQACAJMAIO-UHFFFAOYSA-N 0.000 claims description 2
- CXXSQMDHHYTRKY-UHFFFAOYSA-N 4-amino-2,3,5-tris(oxiran-2-ylmethyl)phenol Chemical compound C1=C(O)C(CC2OC2)=C(CC2OC2)C(N)=C1CC1CO1 CXXSQMDHHYTRKY-UHFFFAOYSA-N 0.000 claims description 2
- 229910052582 BN Inorganic materials 0.000 claims description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- JRPRCOLKIYRSNH-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,2-dicarboxylate Chemical compound C=1C=CC=C(C(=O)OCC2OC2)C=1C(=O)OCC1CO1 JRPRCOLKIYRSNH-UHFFFAOYSA-N 0.000 claims description 2
- ZXOATMQSUNJNNG-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) benzene-1,3-dicarboxylate Chemical compound C=1C=CC(C(=O)OCC2OC2)=CC=1C(=O)OCC1CO1 ZXOATMQSUNJNNG-UHFFFAOYSA-N 0.000 claims description 2
- KIKYOFDZBWIHTF-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohex-3-ene-1,2-dicarboxylate Chemical compound C1CC=CC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 KIKYOFDZBWIHTF-UHFFFAOYSA-N 0.000 claims description 2
- 229910052810 boron oxide Inorganic materials 0.000 claims description 2
- 238000009833 condensation Methods 0.000 claims description 2
- 230000005494 condensation Effects 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims description 2
- 230000004048 modification Effects 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 2
- 239000011787 zinc oxide Substances 0.000 claims description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract description 7
- 239000003085 diluting agent Substances 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 abstract description 2
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- 239000002245 particle Substances 0.000 description 25
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- 238000012546 transfer Methods 0.000 description 16
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
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- 239000010931 gold Substances 0.000 description 1
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- 238000000034 method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000012205 single-component adhesive Substances 0.000 description 1
- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
本发明涉及的超低温绝缘导热胶黏剂，其为由混合物组分A和固化剂混合，并进行固化反应而得到的超低温双组份绝缘导热胶黏剂；所述进行固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h；混合物组分A为由100重量份环氧树脂，6重量份硅烷偶联剂和100-1000重量份导热粉体填料通过机械方式进行均匀混和所得混合物；导热粉体填料由0-60wt％金属导热粉体与40-100wt％非金属导热粉体组成；本发明的超低温绝缘导热胶黏剂在超低温环境下具有良好的绝缘和导热性能，可克服现有导热胶不能应用于超低温环境和超低温下导热率差的缺点，而且制备过程中不含稀释剂，固化时不存在小分子挥发而造成的污染。The ultra-low temperature insulating and heat-conducting adhesive involved in the present invention is an ultra-low temperature two-component insulating and heat-conducting adhesive obtained by mixing the mixture component A with a curing agent and performing a curing reaction; the curing conditions for the curing reaction are: Heat at 25°C for 24h, then heat up to 150°C for 6h; mixture component A is obtained by mechanically mixing 100 parts by weight of epoxy resin, 6 parts by weight of silane coupling agent and 100-1000 parts by weight of thermal conductive powder filler The mixture; the heat-conducting powder filler is composed of 0-60wt% metal heat-conducting powder and 40-100wt% non-metal heat-conducting powder; the ultra-low temperature insulating heat-conducting adhesive of the present invention has good insulation and heat-conducting properties in an ultra-low temperature environment, and can overcome Existing thermally conductive adhesives cannot be used in ultra-low temperature environments and have the disadvantage of poor thermal conductivity at ultra-low temperatures, and there is no diluent in the preparation process, and there is no pollution caused by volatilization of small molecules during curing.
Description
技术领域 technical field
本发明涉及一种在超低温环境下具有绝缘和导热性能的超低温用绝缘导热胶黏剂。The invention relates to an insulating and heat-conducting adhesive for ultra-low temperature with insulating and heat-conducting properties in an ultra-low temperature environment.
背景技术 Background technique
通常情况下，超低温指液氧(-183℃)及其温度以下的温度区间。绝缘性一般是指物体电导率小于109Ω·cm。导热胶黏剂是指具有优异的热传导性能的胶黏剂。随着电子电路的密集化和微型化的程度越来越高，电子元件的散热性能的要求也越来越高。一般采用一定的散热装置来散热，但是存在散热装置与热源表面接触不良的问题，导热胶应运而生。Under normal circumstances, ultra-low temperature refers to the temperature range of liquid oxygen (-183°C) and below. Insulation generally means that the electrical conductivity of an object is less than 10 9 Ω·cm. Thermally conductive adhesives refer to adhesives with excellent thermal conductivity. With the increasing densification and miniaturization of electronic circuits, the heat dissipation performance requirements of electronic components are also getting higher and higher. Generally, a certain heat dissipation device is used to dissipate heat, but there is a problem of poor contact between the heat dissipation device and the surface of the heat source, and thermally conductive adhesives emerge as the times require.
近年来，随着航空航天、国防工业和大型低温工程的发展，对超低温应用的胶黏剂有了新的需求，要求在超低温下具有绝缘导热性能，且有一定的机械强度。In recent years, with the development of aerospace, national defense industry and large-scale low-temperature engineering, there is a new demand for adhesives for ultra-low temperature applications, which require insulation and thermal conductivity at ultra-low temperatures and certain mechanical strength.
国内外对导热胶黏剂、超低温胶黏剂已有不少的研究及应用，但是在超低温环境中应用的绝缘导热胶黏剂的研究报道仅有航空材料及工艺研究所的吴金林(吴金林，低温导热绝缘胶黏剂的研究，[J]低温工程，1998(3))，他在已有的DW-3超低温胶黏剂的基础上，通过加入硅微粉(即二氧化硅，热导率比氮化铝小)作为导热填料来增加胶黏剂的热导率，报道的热导率在77K为0.6W/(m·K)。There have been many researches and applications on thermally conductive adhesives and ultra-low temperature adhesives at home and abroad, but only Wu Jinlin from the Institute of Aeronautical Materials and Technology has reported research on insulating thermally conductive adhesives used in ultra-low temperature environments (Wu Jinlin, Low Temperature Research on thermally conductive and insulating adhesives, [J] Low Temperature Engineering, 1998 (3)). On the basis of the existing DW-3 ultra-low temperature adhesive, he added silicon micropowder (ie, silicon dioxide, thermal conductivity ratio Aluminum nitride (aluminum nitride) is used as a thermally conductive filler to increase the thermal conductivity of the adhesive. The reported thermal conductivity is 0.6W/(m·K) at 77K.
发明内容 Contents of the invention
本发明的一个目的在于克服现有导热胶不能应用于超低温环境和超低温下导热率差的缺点，而提供一种在超低温环境下具有绝缘和导热性能的超低温用绝缘导热胶黏剂。An object of the present invention is to overcome the shortcomings of the existing thermally conductive adhesives that cannot be used in ultra-low temperature environments and have poor thermal conductivity at ultra-low temperatures, and provide an insulating thermally conductive adhesive for ultra-low temperature with insulation and thermal conductivity properties in ultra-low temperature environments.
本发明的技术方案如下：Technical scheme of the present invention is as follows:
本发明提供的超低温绝缘导热胶黏剂，其为由混合物组分A和固化剂混合，并进行固化反应而得到的超低温双组份绝缘导热胶黏剂；The ultra-low temperature insulating and heat-conducting adhesive provided by the present invention is an ultra-low temperature two-component insulating and heat-conducting adhesive obtained by mixing the mixture component A with a curing agent and performing a curing reaction;
所述进行固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h；The curing conditions for the curing reaction are: heating at 25°C for 24h, then heating to 150°C for 6h;
所述的混合物组分A为由100重量份环氧树脂，6重量份硅烷偶联剂和100-1000重量份导热粉体填料通过机械方式进行均匀混和所得混合物；The mixture component A is a mixture obtained by mechanically mixing 100 parts by weight of epoxy resin, 6 parts by weight of silane coupling agent and 100-1000 parts by weight of thermal conductive powder filler;
所述的导热粉体填料由0-60wt％金属导热粉体与40-100wt％非金属导热粉体组成。The heat-conducting powder filler is composed of 0-60wt% metal heat-conducting powder and 40-100wt% non-metal heat-conducting powder.
所述的导热粉体填料中的金属导热粉体为银粉、铜粉、镍粉、锡粉、金粉或铝粉；所述的导热粉体填料中的非金属导热粉体为氮化铝、氧化铝、氧化锌、碳化硅、二氧化硅、氮化硼、氧化硼或氮化硅。The metal heat-conducting powder in the heat-conducting powder filler is silver powder, copper powder, nickel powder, tin powder, gold powder or aluminum powder; the non-metal heat-conducting powder in the heat-conducting powder filler is aluminum nitride, oxide Aluminum, zinc oxide, silicon carbide, silicon dioxide, boron nitride, boron oxide or silicon nitride.
所述金属导热粉体和非金属导热粉体的尺寸具在1nm-500μm范围之内；所述金属导热粉体和非金属导热粉体的形貌为颗粒、片状或纤维状。The size of the metal heat-conducting powder and the non-metal heat-conducting powder is in the range of 1nm-500μm; the shape of the metal heat-conducting powder and the non-metal heat-conducting powder is particle, flake or fiber.
所述的环氧树脂为缩水甘油醚环氧树脂、缩水甘油酯环氧树脂、缩水甘油胺环氧树脂或它们的任意混合物。The epoxy resin is glycidyl ether epoxy resin, glycidyl ester epoxy resin, glycidyl amine epoxy resin or any mixture thereof.
所述的缩水甘油醚环氧树脂为双酚A型或双酚F型；所述的缩水甘油酯环氧树脂为四氢领苯二甲酸二缩水甘油酯(商品名711环氧树脂)、邻苯二甲酸二缩水甘油酯(商品名731环氧树脂)或间苯二甲酸二缩水甘油酯(商品名732环氧树脂)；所述的缩水甘油胺环氧树脂为4，4’-二氨基二苯甲烷四缩水甘油胺(商品名AG-80)或三缩水甘油基对氨基苯酚(商品名AFG-90)。所述的固化剂为脂肪胺固化剂、芳香胺固化剂、聚醚胺固化剂或它们的任意混合物。Described glycidyl ether epoxy resin is bisphenol A type or bisphenol F type; Described glycidyl ester epoxy resin is diglycidyl tetrahydrophthalate (trade name 711 epoxy resin), ortho Diglycidyl phthalate (trade name 731 epoxy resin) or diglycidyl isophthalate (trade name 732 epoxy resin); the glycidylamine epoxy resin is 4,4'-diamino Diphenylmethane tetraglycidylamine (trade name AG-80) or triglycidyl p-aminophenol (trade name AFG-90). The curing agent is an aliphatic amine curing agent, an aromatic amine curing agent, a polyether amine curing agent or any mixture thereof.
所述的聚醚胺固化剂为聚醚胺D-230、聚醚胺D-400或聚醚胺D-2000；所述的脂肪胺固化剂为二乙烯三胺、三乙烯四胺或四乙烯五胺；所述的芳香胺固化剂为二乙基甲苯二胺(简称DETD)、间苯二胺、间苯二甲胺、间苯二甲胺缩合改性固化剂(商品名GY-051)、4，4’-二氨基二苯甲烷(简称DDM)或4，4’-二氨基二苯砜(简称DDS)。The polyetheramine curing agent is polyetheramine D-230, polyetheramine D-400 or polyetheramine D-2000; the fatty amine curing agent is diethylenetriamine, triethylenetetramine or tetraethylene Pentaamine; the aromatic amine curing agent is diethyltoluenediamine (DETD for short), m-phenylenediamine, m-xylylenediamine, m-xylylenediamine condensation modified curing agent (trade name GY-051) , 4,4'-diaminodiphenylmethane (abbreviated as DDM) or 4,4'-diaminodiphenylsulfone (abbreviated as DDS).
所述的机械方式进行均匀混和的设备为三辊研磨机或行星球磨机。The equipment for uniform mixing by mechanical means is a three-roll mill or a planetary ball mill.
所述的硅烷偶联剂为γ-环氧丙氧基三甲氧基硅烷(商品名KH-560)或γ-氨基丙基三乙氧基硅烷(商品名KH-550)。The silane coupling agent is γ-glycidoxytrimethoxysilane (trade name KH-560) or γ-aminopropyltriethoxysilane (trade name KH-550).
本发明提供的超低温绝缘导热胶黏剂具有下述优点：The ultra-low temperature insulating heat-conducting adhesive provided by the present invention has the following advantages:
本发明的超低温绝缘导热胶黏剂可克服现有导热胶不能应用于超低温环境的不足和现有超低温胶黏剂导热率差的缺点；通过改变填料的配比，可以得到不同粘度的胶黏剂以应用于不同的场合；本发明的超低温用绝缘导热胶黏剂为双组份胶黏剂，与单组份胶黏剂相比有较长的储存期；而且制备过程中不含稀释剂，固化时不存在小分子挥发而造成的污染；本发明的超低温用绝缘导热胶黏剂由于采用高密度的金属填料与非金属填料相混合，可提高导热填料的重量比，并通过机械混合保证均匀分散，可提高热导率；本发明的超低温用绝缘导热胶黏剂有用于使用了具有高导热率的金属粉体填料配合非金属导热粉体，在保证绝缘性能的基础上得到优良的导热率。The ultra-low temperature insulating and heat-conducting adhesive of the present invention can overcome the shortcomings of existing heat-conducting adhesives that cannot be used in ultra-low temperature environments and the shortcomings of poor thermal conductivity of existing ultra-low temperature adhesives; by changing the proportion of fillers, adhesives with different viscosities can be obtained It can be applied to different occasions; the insulating and thermally conductive adhesive for ultra-low temperature of the present invention is a two-component adhesive, which has a longer storage period compared with a single-component adhesive; and does not contain a diluent during the preparation process, There is no pollution caused by volatilization of small molecules during curing; the insulating and heat-conducting adhesive for ultra-low temperature of the present invention is mixed with high-density metal fillers and non-metal fillers, which can increase the weight ratio of heat-conducting fillers, and ensure uniformity through mechanical mixing. Dispersion can improve thermal conductivity; the ultra-low temperature insulating heat-conducting adhesive of the present invention is useful for using metal powder fillers with high thermal conductivity combined with non-metallic heat-conducting powders to obtain excellent thermal conductivity on the basis of ensuring insulation performance .
具体实施方式 Detailed ways
实施例1Example 1
称取100.0g缩水甘油醚型环氧树脂WSR 615(双酚A)，6.0g硅烷偶联剂KH-560以及330.5g微米级AlN粉末，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入28.3g聚醚胺固化剂D-400及7.4g脂肪胺固化剂三乙烯四胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ether type epoxy resin WSR 615 (bisphenol A), 6.0g of silane coupling agent KH-560 and 330.5g of micron-sized AlN powder, stir and mix with a glass rod, and then transfer the mixture to three rollers Grinder for mixing, after mixing evenly, add 28.3g of polyetheramine curing agent D-400 and 7.4g of aliphatic amine curing agent triethylenetetramine for curing reaction, to obtain the ultra-low temperature insulating heat-conducting adhesive of this embodiment; the carried out The curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.
实施例2Example 2
称取100.0g缩水甘油醚型环氧树脂WSR 615，6.0g硅烷偶联剂KH-560，294.0g微米级AlN颗粒粉末及22.615g微米级Ag片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入28.3g聚醚胺固化剂D-400及7.4g脂肪胺固化剂三乙烯四胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ether type epoxy resin WSR 615, 6.0g of silane coupling agent KH-560, 294.0g of micron-sized AlN particle powder and 22.615g of micron-sized Ag flakes, stir and mix with a glass rod, and then transfer the mixture Mix in a three-roll mill, and after mixing evenly, add 28.3g of polyetheramine curing agent D-400 and 7.4g of aliphatic amine curing agent triethylenetetramine for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; The curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.
实施例3Example 3
称取100.0g缩水甘油醚型环氧树脂WSR 615，6.0g硅烷偶联剂KH-560，226.2g微米级AlN颗粒粉末及90.5g微米级Ag片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入28.3g聚醚胺固化剂D-400及7.4g脂肪胺固化剂三乙烯四胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ether type epoxy resin WSR 615, 6.0g of silane coupling agent KH-560, 226.2g of micron-sized AlN particle powder and 90.5g of micron-sized Ag flakes, stir and mix with a glass rod, and then transfer the mixture Mix in a three-roll mill, and after mixing evenly, add 28.3g of polyetheramine curing agent D-400 and 7.4g of aliphatic amine curing agent triethylenetetramine for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; The curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.
实施例4Example 4
称取100.0g缩水甘油醚型环氧树脂WSR 615，6.0g硅烷偶联剂KH-560，141.7g微米级AlN颗粒粉末及188.9g微米级Ag片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入28.3g聚醚胺固化剂D-400及7.4g脂肪胺固化剂三乙烯四胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ether type epoxy resin WSR 615, 6.0g of silane coupling agent KH-560, 141.7g of micron-sized AlN particle powder and 188.9g of micron-sized Ag flakes, stir and mix with a glass rod, and then transfer the mixture Mix in a three-roll mill, and after mixing evenly, add 28.3g of polyetheramine curing agent D-400 and 7.4g of aliphatic amine curing agent triethylenetetramine for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; The curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.
对以上具体实施例所得超低温绝缘导热胶黏剂进行了热导率及绝缘性能测试；其具体测试结果见表1The thermal conductivity and insulation properties of the ultra-low temperature insulating heat-conducting adhesive obtained in the above specific examples were tested; the specific test results are shown in Table 1
表1绝缘导热胶黏剂性能Table 1 Properties of insulating and thermally conductive adhesives
实施例5Example 5
称取100.0g缩水甘油醚型环氧树脂WSR615，6.0g硅烷偶联剂KH-560，159g微米级AlN颗粒粉末及212.0g微米级Ag片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入53.0g聚醚胺固化剂D-400进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ether type epoxy resin WSR615, 6.0g of silane coupling agent KH-560, 159g of micron-sized AlN particle powder and 212.0g of micron-sized Ag flakes, stir and mix with a glass rod, and then transfer the mixture to three Roll mill for mixing, after mixing evenly, add 53.0g of polyetheramine curing agent D-400 for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; the curing condition for the curing reaction is: heating at 25°C 24h, and then heated to 150 ° C for 6h.
实施例6Example 6
称取100.0g缩水甘油醚型环氧树脂DER354(双酚F)，6.0g硅烷偶联剂KH-550，233.4g微米级AlN颗粒粉末及93.4g微米级Cu颗粒，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入34.0g聚醚胺固化剂D-230进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ether type epoxy resin DER354 (bisphenol F), 6.0g of silane coupling agent KH-550, 233.4g of micron-sized AlN particle powder and 93.4g of micron-sized Cu particle, first stir and mix with a glass rod, Then transfer the mixture to a three-roll mill for mixing. After mixing evenly, add 34.0g of polyetheramine curing agent D-230 for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; The conditions are: heating at 25°C for 24h, then raising the temperature to 150°C for 6h.
实施例7Example 7
称取100.0g缩水甘油酯型环氧树脂711环氧树脂，6.0g硅烷偶联剂KH-560，485.3g微米级SiN颗粒粉末及485.3g纳米级Ag纤维，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入310.0g聚醚胺固化剂D-2000进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ester type epoxy resin 711 epoxy resin, 6.0g of silane coupling agent KH-560, 485.3g of micron-sized SiN particle powder and 485.3g of nano-sized Ag fiber, stir and mix with a glass rod first, and then The mixture was transferred to a three-roll mill for mixing. After mixing evenly, 310.0 g of polyetheramine curing agent D-2000 was added for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; the curing conditions for the curing reaction were : Heating at 25°C for 24h, then raising the temperature to 150°C for 6h.
实施例8Example 8
称取100.0g缩水甘油酯型环氧树脂731环氧树脂，6.0g硅烷偶联剂KH-550，238.0g微米级BN颗粒粉末及39.7g微米级Ni颗粒，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入13.0g脂肪胺固化剂二乙烯三胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidyl ester type epoxy resin 731 epoxy resin, 6.0g of silane coupling agent KH-550, 238.0g of micron-sized BN particle powder and 39.7g of micron-sized Ni particle, stir and mix with a glass rod first, and then The mixture was transferred to a three-roll mill for mixing. After mixing evenly, 13.0 g of aliphatic amine curing agent diethylenetriamine was added for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; the curing conditions for the curing reaction were : Heating at 25°C for 24h, then raising the temperature to 150°C for 6h.
实施例9Example 9
称取100g缩水甘油酯型环氧树脂732环氧树脂，6.0g硅烷偶联剂KH-560，181.7g微米级SiC颗粒粉末及100.9g纳米级Au纤维，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入15.1g脂肪胺固化剂三乙烯四胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100g of glycidyl ester type epoxy resin 732 epoxy resin, 6.0g of silane coupling agent KH-560, 181.7g of micron-sized SiC particle powder and 100.9g of nano-sized Au fiber, stir and mix with a glass rod, and then mix the mixture Transfer to a three-roll mill for mixing. After mixing evenly, add 15.1 g of aliphatic amine curing agent triethylenetetramine for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; the curing conditions for the curing reaction are: Heating at 25°C for 24h, then heating to 150°C for 6h.
实施例10Example 10
称取100.0g缩水甘油胺型环氧树脂AG-80，6.0g硅烷偶联剂KH-550，170.3g微米级BeO颗粒粉末及127.7g微米级Al片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入21.7g脂肪胺固化剂四乙烯五胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidylamine type epoxy resin AG-80, 6.0g of silane coupling agent KH-550, 170.3g of micron-sized BeO particle powder and 127.7g of micron-sized Al flakes, stir and mix with a glass rod, and then mix the mixture Transfer to a three-roll mill for mixing. After mixing evenly, add 21.7g of aliphatic amine curing agent tetraethylenepentamine for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; the curing conditions for the curing reaction are: Heating at 25°C for 24h, then heating to 150°C for 6h.
实施例11Example 11
称取100.0g缩水甘油胺型环氧树脂AFG-90，6.0g硅烷偶联剂KH-560，143.7g微米级氧化铝颗粒粉末及191.6g微米级Ag片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入37.7g芳香胺固化剂DETD进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 100.0g of glycidylamine type epoxy resin AFG-90, 6.0g of silane coupling agent KH-560, 143.7g of micron-sized alumina particle powder and 191.6g of micron-sized Ag flakes, stir and mix with a glass rod, and then Transfer the mixture to a three-roll mill for mixing. After mixing evenly, add 37.7g of aromatic amine curing agent DETD for curing reaction to obtain the ultra-low temperature insulating and heat-conducting adhesive of this example; the curing condition for the curing reaction is: 25°C Heated for 24h, then heated to 150°C for 6h.
实施例12Example 12
称取50.0g缩水甘油醚型环氧树脂WSR 615和50.0g缩水甘油酯型环氧树脂711环氧树脂，6.0g硅烷偶联剂KH-550，142.0g纳米级SiO2颗粒粉末及142.0g微米级Cu片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入15.7g芳香胺固化剂间苯二胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 50.0g glycidyl ether type epoxy resin WSR 615 and 50.0g glycidyl ester type epoxy resin 711 epoxy resin, 6.0g silane coupling agent KH-550, 142.0g nanoscale SiO2 particle powder and 142.0g micron grade Cu flakes, first use a glass rod to stir and mix, then transfer the mixture to a three-roll mill for mixing, after mixing evenly, add 15.7g of aromatic amine curing agent m-phenylenediamine for curing reaction, and obtain the ultra-low temperature insulation and heat conduction Adhesive; the curing conditions for the curing reaction are: heating at 25°C for 24h, and then heating to 150°C for 6h.
实施例13Example 13
称取50.0g缩水甘油醚型环氧树脂DER354和50.0g缩水甘油酯型环氧树脂731环氧树脂，6.0g硅烷偶联剂KH-560，211.3g微米级AlN颗粒粉末及84.5g纳米级Sn颗粒，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入20.8g芳香胺固化剂间苯二甲胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 50.0g glycidyl ether type epoxy resin DER354 and 50.0g glycidyl ester type epoxy resin 731 epoxy resin, 6.0g silane coupling agent KH-560, 211.3g micron-sized AlN particle powder and 84.5g nano-sized Sn Particles, first stir and mix with a glass rod, then transfer the mixture to a three-roll mill for mixing, after mixing evenly, add 20.8g of aromatic amine curing agent m-xylylenediamine for curing reaction, and obtain the ultra-low temperature insulating heat-conducting adhesive of this embodiment Adhesive; the curing conditions for the curing reaction are: heating at 25°C for 24h, and then heating at 150°C for 6h.
实施例14Example 14
称取50.0g缩水甘油醚型环氧树脂WSR 615和50.0g缩水甘油胺型环氧树脂AG-80，6.0g硅烷偶联剂KH-550，210.3g微米级氧化铝颗粒粉末及116.8g纳米级Ni颗粒，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入34.2g芳香缩胺固化剂GY-051进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 50.0g of glycidyl ether type epoxy resin WSR 615 and 50.0g of glycidylamine type epoxy resin AG-80, 6.0g of silane coupling agent KH-550, 210.3g of micron-sized alumina particle powder and 116.8g of nano-sized For Ni particles, stir and mix with a glass rod first, then transfer the mixture to a three-roller mill for mixing, after mixing evenly, add 34.2g of aromatic amine curing agent GY-051 for curing reaction, and obtain the ultra-low temperature insulating heat-conducting adhesive of this embodiment Adhesive; the curing conditions for the curing reaction are: heating at 25°C for 24h, and then heating at 150°C for 6h.
实施例15Example 15
称取50.0g缩水甘油醚型环氧树脂DER354和50.0g缩水甘油胺型环氧树脂AFG-90，6.0g硅烷偶联剂KH-560，113.4g微米级AlN颗粒粉末及170.0g纳米级Ag纤维，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入35.7g芳香胺固化剂DDM进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 50.0g glycidyl ether type epoxy resin DER354 and 50.0g glycidylamine type epoxy resin AFG-90, 6.0g silane coupling agent KH-560, 113.4g micron-sized AlN particle powder and 170.0g nano-sized Ag fiber , first stir and mix with a glass rod, then transfer the mixture to a three-roll mill for mixing, after mixing evenly, add 35.7g of aromatic amine curing agent DDM for curing reaction, and obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; The curing conditions of the curing reaction are: heating at 25°C for 24h, then raising the temperature to 150°C for 6h.
实施例16Example 16
称取50.0g缩水甘油酯型环氧树脂711环氧树脂和50.0g缩水甘油胺型环氧树脂AG-80，6.0g硅烷偶联剂KH-550，150.1g微米级SiC颗粒粉末及200.1g微米级Al颗粒，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入44.1g芳香胺固化剂DDS进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 50.0g glycidyl ester type epoxy resin 711 epoxy resin and 50.0g glycidylamine type epoxy resin AG-80, 6.0g silane coupling agent KH-550, 150.1g micron SiC particle powder and 200.1g micron Grade Al particles, first stir and mix with a glass rod, then transfer the mixture to a three-roll mill for mixing, after mixing evenly, add 44.1g of aromatic amine curing agent DDS for curing reaction, and obtain the ultra-low temperature insulating heat-conducting adhesive of this embodiment ; The curing conditions for the curing reaction are: heating at 25° C. for 24 hours, then raising the temperature to 150° C. and heating for 6 hours.
实施例17Example 17
称取33.4g缩水甘油醚型环氧树脂WSR 615和33.3g缩水甘油酯型环氧树脂711和33.3g缩水甘油胺型环氧树脂AG-80，6.0g硅烷偶联剂KH-560，196.5g微米级SiC颗粒粉末及147.4g纳米Ag纤维，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入33.1g聚醚胺固化剂D-230及8.3g脂肪胺固化剂三乙烯四胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 33.4g glycidyl ether type epoxy resin WSR 615 and 33.3g glycidyl ester type epoxy resin 711 and 33.3g glycidylamine type epoxy resin AG-80, 6.0g silane coupling agent KH-560, 196.5g Micron-sized SiC particle powder and 147.4g nano-Ag fiber, first stirred and mixed with a glass rod, then transferred the mixture to a three-roll mill for mixing, after mixing evenly, added 33.1g of polyetheramine curing agent D-230 and 8.3g of fat The amine curing agent triethylenetetramine was cured to obtain the ultra-low temperature insulating and heat-conducting adhesive of this embodiment; the curing conditions of the curing reaction were: heating at 25°C for 24 hours, and then heating at 150°C for 6 hours.
实施例18Example 18
称取50.0g缩水甘油酯型环氧树脂731环氧树脂和50.0g缩水甘油胺型环氧树脂AG-80，6.0g硅烷偶联剂KH-550，197.3g微米级氧化铝颗粒粉末及197.3g微米级Cu片，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入50.5g聚醚胺固化剂D-400及12.6g芳香胺固化剂DETD进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 50.0g glycidyl ester type epoxy resin 731 epoxy resin and 50.0g glycidylamine type epoxy resin AG-80, 6.0g silane coupling agent KH-550, 197.3g micron alumina particle powder and 197.3g Micron-sized Cu flakes, first stir and mix with a glass rod, then transfer the mixture to a three-roll mill for mixing, after mixing evenly, add 50.5g of polyetheramine curing agent D-400 and 12.6g of aromatic amine curing agent DETD for curing reaction , to obtain the ultra-low temperature insulating heat-conducting adhesive of this embodiment; the curing conditions of the curing reaction are: heating at 25° C. for 24 hours, and then raising the temperature to 150° C. and heating for 6 hours.
实施例19Example 19
称取50.0g缩水甘油醚型环氧树脂DER354和50.0g缩水甘油胺型环氧树脂AG-80，6.0g硅烷偶联剂KH-560，137.0g微米级SiC颗粒粉末及182.7g纳米Sn颗粒，先用玻璃棒搅拌混合，然后将混合物转移到三辊研磨机进行混合，混合均匀后，加入24.8g芳香胺固化剂DDM及6.2g脂肪胺固化剂三乙烯四胺进行固化反应，得本实施例的超低温绝缘导热胶黏剂；所进行的固化反应的固化条件为：25℃加热24h，然后升温到150℃加热6h。Weigh 50.0g of glycidyl ether type epoxy resin DER354 and 50.0g of glycidylamine type epoxy resin AG-80, 6.0g of silane coupling agent KH-560, 137.0g of micron SiC particle powder and 182.7g of nanometer Sn particles, Stir and mix with a glass rod first, then transfer the mixture to a three-roll mill for mixing, after mixing evenly, add 24.8g of aromatic amine curing agent DDM and 6.2g of aliphatic amine curing agent triethylenetetramine for curing reaction, and obtain this embodiment The ultra-low temperature insulating and heat-conducting adhesive; the curing conditions of the curing reaction are: heating at 25°C for 24h, and then heating to 150°C for 6h.
虽然已经参照技术内容和实施例对本发明进行了详细的描述，但该描述仅处于说明的目的，对于本领域的技术人员来说，在不背离本发明范围的情况下对本发明进行各种变化和改动都是显而易见的，不能把本发明限定为说明书所描述的内容。Although the present invention has been described in detail with reference to the technical contents and examples, the description is only for the purpose of illustration. For those skilled in the art, various changes and changes can be made to the present invention without departing from the scope of the present invention. Modifications are obvious, and the present invention cannot be limited to the content described in the specification.
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| CN103074020A (en) * | 2013-02-01 | 2013-05-01 | 中国工程物理研究院化工材料研究所 | Room-temperature cured, low-viscosity and low temperature-resistant adhesive |
| CN103289175A (en) * | 2013-06-24 | 2013-09-11 | 地球卫士（天津）环保新材料有限公司 | A polyolefin-based insulating composite material of high thermal conductivity and a preparation method thereof |
| CN103351836A (en) * | 2013-07-04 | 2013-10-16 | 张立强 | COB (Chip on Board) heat conduction adhesive |
| CN104031598A (en) * | 2014-06-30 | 2014-09-10 | 江苏华程光电科技有限公司 | High-thermal-conductivity LED sealant |
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| CN104327782A (en) * | 2014-11-24 | 2015-02-04 | 桂林理工大学 | Preparation method of epoxy resin adhesive |
| CN104449510A (en) * | 2014-12-08 | 2015-03-25 | 成都锦汇科技有限公司 | Flexible heat-conduction epoxy resin adhesive and preparation method thereof |
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| CN106366995A (en) * | 2016-08-30 | 2017-02-01 | 张为凤 | High-elasticity high-heat-dissipation adhesive |
| CN106833464A (en) * | 2016-12-27 | 2017-06-13 | 四川依索电工科技股份有限公司 | A kind of epoxy adhesive and its glass fiber reinforced plastics product being used under 196 DEG C of environment |
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| CN110689993A (en) * | 2019-09-03 | 2020-01-14 | 北京氦舶科技有限责任公司 | Low-temperature curing conductive silver paste for electronic packaging and preparation method thereof |
| CN111253897A (en) * | 2020-04-14 | 2020-06-09 | 常熟市斯泰普新材料有限公司 | Thermosetting insulating flame-retardant film and preparation process thereof |
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