CN104040026B - 不含甲醛的化学镀镀铜溶液 - Google Patents

不含甲醛的化学镀镀铜溶液 Download PDF

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Publication number
CN104040026B
CN104040026B CN201280049015.6A CN201280049015A CN104040026B CN 104040026 B CN104040026 B CN 104040026B CN 201280049015 A CN201280049015 A CN 201280049015A CN 104040026 B CN104040026 B CN 104040026B
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China
Prior art keywords
acid
copper
electroless copper
aqueous solution
solution
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CN201280049015.6A
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English (en)
Chinese (zh)
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CN104040026A (zh
Inventor
E·施泰因豪泽
S·勒泽勒
S·维泽
T·C·L·阮
L·施坦普
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Atotech Deutschland GmbH and Co KG
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Atotech Deutschland GmbH and Co KG
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

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  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
CN201280049015.6A 2011-10-05 2012-10-01 不含甲醛的化学镀镀铜溶液 Active CN104040026B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP11183991 2011-10-05
EP11183991.6 2011-10-05
PCT/EP2012/069388 WO2013050332A2 (fr) 2011-10-05 2012-10-01 Solution pour cuivrage autocatalytique exempte de formaldéhyde

Publications (2)

Publication Number Publication Date
CN104040026A CN104040026A (zh) 2014-09-10
CN104040026B true CN104040026B (zh) 2019-01-01

Family

ID=46963736

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280049015.6A Active CN104040026B (zh) 2011-10-05 2012-10-01 不含甲醛的化学镀镀铜溶液

Country Status (7)

Country Link
US (1) US20140242264A1 (fr)
EP (1) EP2764135A2 (fr)
JP (1) JP6180419B2 (fr)
KR (1) KR101953940B1 (fr)
CN (1) CN104040026B (fr)
TW (1) TWI557271B (fr)
WO (1) WO2013050332A2 (fr)

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ES2684353T3 (es) * 2013-09-25 2018-10-02 Atotech Deutschland Gmbh Método para depositar una capa de siembra de cobre sobre una capa de barrera y baño de cobreado
KR101799347B1 (ko) * 2014-01-27 2017-11-20 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 도전성 피막 형성 욕
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
EP3035122B1 (fr) 2014-12-16 2019-03-20 ATOTECH Deutschland GmbH Procédé de fabrication de lignes fines
EP3035375B1 (fr) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Module de traitement d'un appareil pour traiter chimiquement et horizontalement des substrats de grande taille
CN109072438B (zh) 2016-05-04 2021-08-13 德国艾托特克公司 沉积金属或金属合金到衬底表面及包括衬底表面活化的方法
KR102428755B1 (ko) * 2017-11-24 2022-08-02 엘지디스플레이 주식회사 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛
EP3578683B1 (fr) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Bain de placage de cuivre ou d'alliage de cuivre autocatalytique et procédé de galvanoplastie
EP3670698B1 (fr) 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Solution de prétraitement alcalin aqueux à utiliser avant le dépôt d'une couche d'activation de palladium, son procédé et son utilisation
TWI764121B (zh) 2019-04-04 2022-05-11 德商德國艾托特克公司 活化用於金屬化之非傳導或含碳纖維之基材表面的方法
EP3839092A1 (fr) 2019-12-20 2021-06-23 ATOTECH Deutschland GmbH Procédé d'activation d'au moins une surface, composition d'activation et utilisation de la composition d'activation pour activer une surface de dépôt autocatalytique
JP2023539602A (ja) 2020-08-27 2023-09-15 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法
JP7735686B2 (ja) * 2021-05-24 2025-09-09 三菱瓦斯化学株式会社 無電解銅めっき用組成物および無電解銅めっき方法
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN115679305B (zh) * 2023-01-03 2023-03-10 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺
TW202517833A (zh) 2023-09-07 2025-05-01 德商德國艾托特克有限兩合公司 活化用於金屬化之非導電或含碳纖維基材之表面的方法

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US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US5846925A (en) * 1995-08-30 1998-12-08 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US6660071B2 (en) * 2000-06-19 2003-12-09 Murata Manufacturing Co., Ltd. Electroless copper plating bath, electroless copper plating method and electronic part
CN1867697A (zh) * 2003-10-17 2006-11-22 株式会社日矿材料 无电镀铜溶液和无电镀铜方法
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
CN101104929A (zh) * 2006-07-07 2008-01-16 罗门哈斯电子材料有限公司 环境友好的无电镀铜组合物
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法

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BR9610178A (pt) * 1995-08-30 1998-08-11 Dow Chemical Co Composição de detergente para lavanderia composição para lava-louças automático método para lavar tecidos processo para remover nox de um fluido método para deposição não elétrica de cobre e composição para quelar um mental
US20020064592A1 (en) 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법
WO2005048674A1 (fr) * 2003-11-14 2005-05-26 Bridgestone Corporation Materiau de fenetre electromagnetiquement blindant et phototransmetteur, et procede de production
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KR20080083790A (ko) * 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US5846925A (en) * 1995-08-30 1998-12-08 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US6660071B2 (en) * 2000-06-19 2003-12-09 Murata Manufacturing Co., Ltd. Electroless copper plating bath, electroless copper plating method and electronic part
CN1867697A (zh) * 2003-10-17 2006-11-22 株式会社日矿材料 无电镀铜溶液和无电镀铜方法
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
CN101104929A (zh) * 2006-07-07 2008-01-16 罗门哈斯电子材料有限公司 环境友好的无电镀铜组合物
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法

Also Published As

Publication number Publication date
TWI557271B (zh) 2016-11-11
JP2014528517A (ja) 2014-10-27
US20140242264A1 (en) 2014-08-28
KR20140090145A (ko) 2014-07-16
WO2013050332A2 (fr) 2013-04-11
TW201323654A (zh) 2013-06-16
KR101953940B1 (ko) 2019-03-04
WO2013050332A8 (fr) 2013-07-11
WO2013050332A3 (fr) 2014-03-13
JP6180419B2 (ja) 2017-08-16
EP2764135A2 (fr) 2014-08-13
CN104040026A (zh) 2014-09-10

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