WO2013050332A3 - Solution pour cuivrage autocatalytique exempte de formaldéhyde - Google Patents

Solution pour cuivrage autocatalytique exempte de formaldéhyde Download PDF

Info

Publication number
WO2013050332A3
WO2013050332A3 PCT/EP2012/069388 EP2012069388W WO2013050332A3 WO 2013050332 A3 WO2013050332 A3 WO 2013050332A3 EP 2012069388 W EP2012069388 W EP 2012069388W WO 2013050332 A3 WO2013050332 A3 WO 2013050332A3
Authority
WO
WIPO (PCT)
Prior art keywords
copper plating
formaldehyde
plating solution
electroless copper
acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/EP2012/069388
Other languages
English (en)
Other versions
WO2013050332A2 (fr
WO2013050332A8 (fr
Inventor
Edith STEINHÄUSER
Sandra RÖSELER
Stefanie WIESE
Tang Cam Lai NGUYEN
Lutz Stamp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Atotech Deutschland GmbH and Co KG
Original Assignee
Atotech Deutschland GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland GmbH and Co KG filed Critical Atotech Deutschland GmbH and Co KG
Priority to KR1020147008668A priority Critical patent/KR101953940B1/ko
Priority to CN201280049015.6A priority patent/CN104040026B/zh
Priority to JP2014533846A priority patent/JP6180419B2/ja
Priority to EP12766668.3A priority patent/EP2764135A2/fr
Priority to US14/350,153 priority patent/US20140242264A1/en
Publication of WO2013050332A2 publication Critical patent/WO2013050332A2/fr
Publication of WO2013050332A8 publication Critical patent/WO2013050332A8/fr
Publication of WO2013050332A3 publication Critical patent/WO2013050332A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/38—Coating with copper
    • C23C18/40—Coating with copper using reducing agents

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

La présente invention porte sur une solution aqueuse pour cuivrage autocatalytique, comprenant une source d'ions cuivre, une source d'acide glyoxylique servant d'agent réducteur et au moins un acide polyaminodisuccinique ou au moins un acide polyaminomonosuccinique, ou un mélange d'au moins un acide polyaminodisuccinique et d'au moins un acide polyaminomonosuccinique servant d'agent complexant, ainsi que sur un procédé pour le cuivrage autocatalytique utilisant ladite solution et sur l'utilisation de la solution pour le placage de substrats.
PCT/EP2012/069388 2011-10-05 2012-10-01 Solution pour cuivrage autocatalytique exempte de formaldéhyde Ceased WO2013050332A2 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020147008668A KR101953940B1 (ko) 2011-10-05 2012-10-01 무전해 구리 도금 수용액
CN201280049015.6A CN104040026B (zh) 2011-10-05 2012-10-01 不含甲醛的化学镀镀铜溶液
JP2014533846A JP6180419B2 (ja) 2011-10-05 2012-10-01 ホルムアルデヒドのない無電解銅めっき溶液
EP12766668.3A EP2764135A2 (fr) 2011-10-05 2012-10-01 Solution pour cuivrage autocatalytique exempte de formaldéhyde
US14/350,153 US20140242264A1 (en) 2011-10-05 2012-10-01 Formaldehyde-free electroless copper plating solution

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP11183991 2011-10-05
EP11183991.6 2011-10-05

Publications (3)

Publication Number Publication Date
WO2013050332A2 WO2013050332A2 (fr) 2013-04-11
WO2013050332A8 WO2013050332A8 (fr) 2013-07-11
WO2013050332A3 true WO2013050332A3 (fr) 2014-03-13

Family

ID=46963736

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2012/069388 Ceased WO2013050332A2 (fr) 2011-10-05 2012-10-01 Solution pour cuivrage autocatalytique exempte de formaldéhyde

Country Status (7)

Country Link
US (1) US20140242264A1 (fr)
EP (1) EP2764135A2 (fr)
JP (1) JP6180419B2 (fr)
KR (1) KR101953940B1 (fr)
CN (1) CN104040026B (fr)
TW (1) TWI557271B (fr)
WO (1) WO2013050332A2 (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2784181B1 (fr) * 2013-03-27 2015-12-09 ATOTECH Deutschland GmbH Solution de dépôt de cuivre chimique
ES2684353T3 (es) * 2013-09-25 2018-10-02 Atotech Deutschland Gmbh Método para depositar una capa de siembra de cobre sobre una capa de barrera y baño de cobreado
KR101799347B1 (ko) * 2014-01-27 2017-11-20 오꾸노 케미칼 인더스트리즈 컴파니,리미티드 도전성 피막 형성 욕
JP6539992B2 (ja) * 2014-11-14 2019-07-10 凸版印刷株式会社 配線回路基板、半導体装置、配線回路基板の製造方法、半導体装置の製造方法
US20160145745A1 (en) * 2014-11-24 2016-05-26 Rohm And Haas Electronic Materials Llc Formaldehyde-free electroless metal plating compositions and methods
EP3035122B1 (fr) 2014-12-16 2019-03-20 ATOTECH Deutschland GmbH Procédé de fabrication de lignes fines
EP3035375B1 (fr) * 2014-12-19 2017-05-03 ATOTECH Deutschland GmbH Module de traitement d'un appareil pour traiter chimiquement et horizontalement des substrats de grande taille
CN109072438B (zh) 2016-05-04 2021-08-13 德国艾托特克公司 沉积金属或金属合金到衬底表面及包括衬底表面活化的方法
KR102428755B1 (ko) * 2017-11-24 2022-08-02 엘지디스플레이 주식회사 파장 변환이 가능한 광섬유 및 이를 사용하는 백라이트 유닛
EP3578683B1 (fr) 2018-06-08 2021-02-24 ATOTECH Deutschland GmbH Bain de placage de cuivre ou d'alliage de cuivre autocatalytique et procédé de galvanoplastie
EP3670698B1 (fr) 2018-12-17 2021-08-11 ATOTECH Deutschland GmbH Solution de prétraitement alcalin aqueux à utiliser avant le dépôt d'une couche d'activation de palladium, son procédé et son utilisation
TWI764121B (zh) 2019-04-04 2022-05-11 德商德國艾托特克公司 活化用於金屬化之非傳導或含碳纖維之基材表面的方法
EP3839092A1 (fr) 2019-12-20 2021-06-23 ATOTECH Deutschland GmbH Procédé d'activation d'au moins une surface, composition d'activation et utilisation de la composition d'activation pour activer une surface de dépôt autocatalytique
JP2023539602A (ja) 2020-08-27 2023-09-15 アトテック ドイチェランド ゲーエムベーハー ウント コ カーゲー 非導電性基材又は炭素繊維含有基材の表面を金属化のために活性化する方法
JP7735686B2 (ja) * 2021-05-24 2025-09-09 三菱瓦斯化学株式会社 無電解銅めっき用組成物および無電解銅めっき方法
CN114507850A (zh) * 2021-12-06 2022-05-17 华东理工大学 一种喷墨打印在陶瓷基板上非甲醛化学镀铜的环保型镀液的化学配方
CN115679305B (zh) * 2023-01-03 2023-03-10 湖南源康利科技有限公司 一种印制板用铝箔表面化学镀铜处理工艺
TW202517833A (zh) 2023-09-07 2025-05-01 德商德國艾托特克有限兩合公司 活化用於金屬化之非導電或含碳纖維基材之表面的方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US5846925A (en) * 1995-08-30 1998-12-08 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
EP1876262A1 (fr) * 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Compositions de dépôt autocatalytique sans danger pour lýenvironnement

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2761874A (en) 1954-09-30 1956-09-04 Dow Chemical Co Amino derivatives of n-alkyl substituted aspartic acids and their functional derivatives
US3158635A (en) 1959-03-18 1964-11-24 Stauffer Chemical Co Bis-adduction products and methods of preparing same
US3632704A (en) * 1967-12-04 1972-01-04 Stauffer Chemical Co Method for modifying electrically nonconductive surfaces for electroless plating
US4315045A (en) * 1978-12-19 1982-02-09 Crown City Plating Co. Conditioning of polyamides for electroless plating
JPS57116031A (en) 1981-01-13 1982-07-19 Tokyo Organ Chem Ind Ltd N-substituted polyamine and its preparation
US4668532A (en) * 1984-09-04 1987-05-26 Kollmorgen Technologies Corporation System for selective metallization of electronic interconnection boards
GB9422762D0 (en) * 1994-11-11 1995-01-04 Ass Octel Use of a compound
JPH0949084A (ja) * 1995-05-31 1997-02-18 Nitto Chem Ind Co Ltd ジアミン型生分解性キレート剤を用いた無電解Ｃｕメッキ浴
BR9610178A (pt) * 1995-08-30 1998-08-11 Dow Chemical Co Composição de detergente para lavanderia composição para lava-louças automático método para lavar tecidos processo para remover nox de um fluido método para deposição não elétrica de cobre e composição para quelar um mental
JP3444276B2 (ja) * 2000-06-19 2003-09-08 株式会社村田製作所 無電解銅めっき浴、無電解銅めっき方法および電子部品
US20020064592A1 (en) 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
KR100529371B1 (ko) * 2003-07-29 2005-11-21 주식회사 엘지화학 촉매전구체 수지조성물 및 이를 이용한 투광성 전자파차폐재 제조방법
WO2005038087A1 (fr) * 2003-10-17 2005-04-28 Nikko Materials Co., Ltd. Solution de cuivrage par depot autocatalytique et procede de cuivrage par depot autocatalytique
WO2005048674A1 (fr) * 2003-11-14 2005-05-26 Bridgestone Corporation Materiau de fenetre electromagnetiquement blindant et phototransmetteur, et procede de production
US20060251801A1 (en) * 2005-03-18 2006-11-09 Weidman Timothy W In-situ silicidation metallization process
KR100702797B1 (ko) * 2005-12-09 2007-04-03 동부일렉트로닉스 주식회사 반도체소자의 구리배선막 형성방법
KR20080083790A (ko) * 2007-03-13 2008-09-19 삼성전자주식회사 무전해 구리 도금액, 그의 제조방법 및 무전해 구리도금방법
CN102191491A (zh) * 2010-03-10 2011-09-21 比亚迪股份有限公司 一种化学镀铜液及一种化学镀铜方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4617205A (en) * 1984-12-21 1986-10-14 Omi International Corporation Formaldehyde-free autocatalytic electroless copper plating
US5741555A (en) * 1995-05-22 1998-04-21 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US5846925A (en) * 1995-08-30 1998-12-08 The Dow Chemical Company Succinic acid derivative degradable chelants, uses and compositions thereof
US7220296B1 (en) * 2005-12-15 2007-05-22 Intel Corporation Electroless plating baths for high aspect features
EP1876262A1 (fr) * 2006-07-07 2008-01-09 Rohm and Haas Electronic Materials, L.L.C. Compositions de dépôt autocatalytique sans danger pour lýenvironnement

Also Published As

Publication number Publication date
TWI557271B (zh) 2016-11-11
JP2014528517A (ja) 2014-10-27
US20140242264A1 (en) 2014-08-28
KR20140090145A (ko) 2014-07-16
WO2013050332A2 (fr) 2013-04-11
TW201323654A (zh) 2013-06-16
KR101953940B1 (ko) 2019-03-04
CN104040026B (zh) 2019-01-01
WO2013050332A8 (fr) 2013-07-11
JP6180419B2 (ja) 2017-08-16
EP2764135A2 (fr) 2014-08-13
CN104040026A (zh) 2014-09-10

Similar Documents

Publication Publication Date Title
WO2013050332A3 (fr) Solution pour cuivrage autocatalytique exempte de formaldéhyde
WO2013009527A3 (fr) Inhibiteurs du facteur ixa
ATE486896T1 (de) Colöserfreie, selbstvernetzende pur-dispersionen
WO2013053518A3 (fr) Composition de bain de placage autocatalytique de palladium
PH12013502144A1 (en) Multiple myeloma treatment
WO2014015063A3 (fr) Revêtements autocatalytiques de nickel et compositions et procédés de formation desdits revêtements
MX2013013891A (es) Sistema y metodo de tratamiento de agua anti-incrustaciones.
GEP201706690B (en) Novel process for making compounds for use in treatment of cancer
MY182304A (en) Plating bath composition and method for electroless plating of palladium
GEP20166448B (en) Ophthalmic solution containing diquafosol, method for producing same, and method for preventing formation of insoluble precipitate
MX2013000009A (es) Procedimiento de preparacion de la sal de l-arginina de perindoprilo.
CL2012001300A1 (es) Proceso de preparación de un compuesto de fórmula (i) en forma de sal iónica, que comprende las etapas de i) hidrogenar un compuesto de fórmula (ii) usando un catalizador metálico con hidrógeno y ii) filtrar el catalizador seguido de tratamiento con una solución ácida o gas.
MX336369B (es) Uso de acido elagico como agentes anticaspa.
WO2012156162A3 (fr) Procédé pour placage anélectrolytique
GB201107985D0 (en) Process
WO2010021978A3 (fr) Marqueur biologique à base d'il-8
WO2013181592A3 (fr) Procédé de préparation de dihalopyridines
MX2013003581A (es) Proceso para producir granulos que comprende una o mas sales de agentes complejas.
WO2013190357A8 (fr) Procédé pour la fabrication de gabapentine
WO2010056612A3 (fr) Solutions de revêtement pour dépôt autocatalytique de ruthénium
MX354846B (es) Metodos para tratar gota en sub-poblaciones de pacientes.
WO2013072938A3 (fr) Procédé amélioré pour la préparation de roflumilast
EP2826562A3 (fr) Catalyseurs pour métallisation autocatalytique contenant de l'acide iminodiacétique et dérivés
SA112330683B1 (ar) طريقة لإزالة أيونات فلز من محلول مائي
WO2010098632A3 (fr) Procédé pour augmenter la solubilité de la méthionine par ajout de minéraux et traitement acide

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12766668

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2012766668

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20147008668

Country of ref document: KR

Kind code of ref document: A

ENP Entry into the national phase

Ref document number: 2014533846

Country of ref document: JP

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 14350153

Country of ref document: US