CN105321865A - 带扩张装置 - Google Patents

带扩张装置 Download PDF

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Publication number
CN105321865A
CN105321865A CN201510308985.9A CN201510308985A CN105321865A CN 105321865 A CN105321865 A CN 105321865A CN 201510308985 A CN201510308985 A CN 201510308985A CN 105321865 A CN105321865 A CN 105321865A
Authority
CN
China
Prior art keywords
expansion
wafer
tape
adhesive
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510308985.9A
Other languages
English (en)
Chinese (zh)
Inventor
服部笃
武藤荣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN105321865A publication Critical patent/CN105321865A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201510308985.9A 2014-06-13 2015-06-08 带扩张装置 Pending CN105321865A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-122699 2014-06-13
JP2014122699A JP2016004832A (ja) 2014-06-13 2014-06-13 テープ拡張装置

Publications (1)

Publication Number Publication Date
CN105321865A true CN105321865A (zh) 2016-02-10

Family

ID=55082506

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510308985.9A Pending CN105321865A (zh) 2014-06-13 2015-06-08 带扩张装置

Country Status (4)

Country Link
JP (1) JP2016004832A (ja)
KR (1) KR20150143319A (ja)
CN (1) CN105321865A (ja)
TW (1) TW201604943A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108630592A (zh) * 2017-03-24 2018-10-09 株式会社迪思科 片材扩展装置
TWI884088B (zh) * 2024-09-30 2025-05-11 翌實實業股份有限公司 晶圓冷擴設備

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6785162B2 (ja) 2017-01-12 2020-11-18 株式会社ディスコ 分割装置
JP6846205B2 (ja) * 2017-01-12 2021-03-24 株式会社ディスコ 分割装置及び分割方法
US11508606B2 (en) 2019-11-05 2022-11-22 Nxp B.V. Technique for handling diced wafers of integrated circuits
US11658056B2 (en) 2019-11-05 2023-05-23 Nxp B.V. Technique for handling diced wafers of integrated circuits
JP7775321B2 (ja) * 2021-09-14 2025-11-25 ヤマハ発動機株式会社 エキスパンド装置
DE112022006550T5 (de) * 2022-04-27 2025-01-02 Yamaha Hatsudoki Kabushiki Kaisha Ausdehnungsvorrichtung, Verfahren zur Herstellung von Halbleiterchips, sowie Halbleiterchip
JP7624075B2 (ja) * 2022-04-27 2025-01-29 ヤマハ発動機株式会社 エキスパンド装置、半導体チップの製造方法および半導体チップ
JP7820064B2 (ja) * 2022-05-20 2026-02-25 株式会社ディスコ エキスパンド装置、及び、エキスパンド方法
KR102542890B1 (ko) * 2023-04-03 2023-06-13 남진우 웨이퍼 신장 장치
WO2025258033A1 (ja) * 2024-06-13 2025-12-18 ヤマハ発動機株式会社 エキスパンド装置
WO2025258041A1 (ja) * 2024-06-13 2025-12-18 ヤマハ発動機株式会社 エキスパンド装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071794A (ja) * 2002-08-06 2004-03-04 Hitachi Kokusai Electric Inc 基板処理装置
CN1986140A (zh) * 2005-12-21 2007-06-27 詹诺普蒂克自动化技术有限公司 用于分割由脆性材料制成的盘片尤其是晶片的方法和装置
CN101577217A (zh) * 2008-05-09 2009-11-11 株式会社迪思科 膜状粘接剂的断裂装置和断裂方法
JP2009277837A (ja) * 2008-05-14 2009-11-26 Disco Abrasive Syst Ltd 破断装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4744957B2 (ja) 2005-07-13 2011-08-10 株式会社ディスコ ウエーハに装着された接着フィルムの破断装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004071794A (ja) * 2002-08-06 2004-03-04 Hitachi Kokusai Electric Inc 基板処理装置
CN1986140A (zh) * 2005-12-21 2007-06-27 詹诺普蒂克自动化技术有限公司 用于分割由脆性材料制成的盘片尤其是晶片的方法和装置
CN101577217A (zh) * 2008-05-09 2009-11-11 株式会社迪思科 膜状粘接剂的断裂装置和断裂方法
JP2009277837A (ja) * 2008-05-14 2009-11-26 Disco Abrasive Syst Ltd 破断装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108630592A (zh) * 2017-03-24 2018-10-09 株式会社迪思科 片材扩展装置
CN108630592B (zh) * 2017-03-24 2023-07-07 株式会社迪思科 片材扩展装置
TWI884088B (zh) * 2024-09-30 2025-05-11 翌實實業股份有限公司 晶圓冷擴設備

Also Published As

Publication number Publication date
TW201604943A (zh) 2016-02-01
KR20150143319A (ko) 2015-12-23
JP2016004832A (ja) 2016-01-12

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Application publication date: 20160210