CN105377500B - 用于借助于激光辐射剥除脆硬材料的方法 - Google Patents

用于借助于激光辐射剥除脆硬材料的方法 Download PDF

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Publication number
CN105377500B
CN105377500B CN201480030334.1A CN201480030334A CN105377500B CN 105377500 B CN105377500 B CN 105377500B CN 201480030334 A CN201480030334 A CN 201480030334A CN 105377500 B CN105377500 B CN 105377500B
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CN
China
Prior art keywords
laser emission
stripping
recess
laser
wavelength
Prior art date
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Application number
CN201480030334.1A
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English (en)
Chinese (zh)
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CN105377500A (zh
Inventor
W.舒尔茨
U.埃佩尔特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rheinisch Westlische Technische Hochschuke RWTH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Rheinisch Westlische Technische Hochschuke RWTH
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
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Publication of CN105377500A publication Critical patent/CN105377500A/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0613—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams having a common axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laser Beam Processing (AREA)
CN201480030334.1A 2013-03-26 2014-03-21 用于借助于激光辐射剥除脆硬材料的方法 Active CN105377500B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102013005136.3 2013-03-26
DE102013005136.3A DE102013005136A1 (de) 2013-03-26 2013-03-26 Verfahren zurn Abtragen von sprödhartem Material mittels Laserstrahlung
PCT/EP2014/000778 WO2014154341A2 (de) 2013-03-26 2014-03-21 Verfahren zum abtragen von sprödhartem material mittels laserstrahlung

Publications (2)

Publication Number Publication Date
CN105377500A CN105377500A (zh) 2016-03-02
CN105377500B true CN105377500B (zh) 2019-01-04

Family

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CN201480030334.1A Active CN105377500B (zh) 2013-03-26 2014-03-21 用于借助于激光辐射剥除脆硬材料的方法

Country Status (6)

Country Link
US (1) US20160052082A1 (de)
EP (1) EP2978557A2 (de)
KR (1) KR102193056B1 (de)
CN (1) CN105377500B (de)
DE (1) DE102013005136A1 (de)
WO (1) WO2014154341A2 (de)

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EP3221727B1 (de) 2014-11-19 2021-03-17 Trumpf Laser- und Systemtechnik GmbH System zur asymmetrischen optischen strahlformung
DE102014116958B9 (de) 2014-11-19 2017-10-05 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung eines Laserstrahls, Laserbearbeitungsanlage, Verfahren zur Materialbearbeitung und Verwenden einer gemeinsamen langgezogenen Fokuszone zur Lasermaterialbearbeitung
DE102014116957A1 (de) 2014-11-19 2016-05-19 Trumpf Laser- Und Systemtechnik Gmbh Optisches System zur Strahlformung
IT202000000787A1 (it) * 2020-01-17 2021-07-17 Sacmi Imola Sc Procedimento per la produzione e il riempimento di contenitori destinati a contenere alimenti.
EP4000792B1 (de) * 2020-11-18 2026-03-18 United Machining Mill SA Laserablationsverfahren zum gravieren eines werkstücks mit einer oberflächenstruktur

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US20060091126A1 (en) 2001-01-31 2006-05-04 Baird Brian W Ultraviolet laser ablative patterning of microstructures in semiconductors
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Also Published As

Publication number Publication date
WO2014154341A3 (de) 2015-03-05
WO2014154341A2 (de) 2014-10-02
KR102193056B1 (ko) 2020-12-18
KR20150135383A (ko) 2015-12-02
US20160052082A1 (en) 2016-02-25
EP2978557A2 (de) 2016-02-03
DE102013005136A1 (de) 2014-10-02
CN105377500A (zh) 2016-03-02

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