CN107003076B - 基于聚合物的、微制造的热接地平面 - Google Patents

基于聚合物的、微制造的热接地平面 Download PDF

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Publication number
CN107003076B
CN107003076B CN201580059333.4A CN201580059333A CN107003076B CN 107003076 B CN107003076 B CN 107003076B CN 201580059333 A CN201580059333 A CN 201580059333A CN 107003076 B CN107003076 B CN 107003076B
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China
Prior art keywords
layer
polymer
sacrificial
gas phase
pillars
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CN201580059333.4A
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English (en)
Chinese (zh)
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CN107003076A (zh
Inventor
瑞恩·约翰·路易斯
李永正
刘·丽·安妮
王云达
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University of Colorado Denver
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University of Colorado Denver
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Priority to CN201910754250.7A priority Critical patent/CN110470160A/zh
Publication of CN107003076A publication Critical patent/CN107003076A/zh
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Publication of CN107003076B publication Critical patent/CN107003076B/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Micromachines (AREA)
  • Multiple-Way Valves (AREA)
  • Road Signs Or Road Markings (AREA)
CN201580059333.4A 2014-10-28 2015-10-28 基于聚合物的、微制造的热接地平面 Active CN107003076B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910754250.7A CN110470160A (zh) 2014-10-28 2015-10-28 基于聚合物的、微制造的热接地平面

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201462069564P 2014-10-28 2014-10-28
US62/069,564 2014-10-28
PCT/US2015/057885 WO2016114840A2 (en) 2014-10-28 2015-10-28 Polymer-based microfabricated thermal ground plane

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201910754250.7A Division CN110470160A (zh) 2014-10-28 2015-10-28 基于聚合物的、微制造的热接地平面

Publications (2)

Publication Number Publication Date
CN107003076A CN107003076A (zh) 2017-08-01
CN107003076B true CN107003076B (zh) 2019-07-26

Family

ID=56406553

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201580059333.4A Active CN107003076B (zh) 2014-10-28 2015-10-28 基于聚合物的、微制造的热接地平面
CN201910754250.7A Pending CN110470160A (zh) 2014-10-28 2015-10-28 基于聚合物的、微制造的热接地平面

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201910754250.7A Pending CN110470160A (zh) 2014-10-28 2015-10-28 基于聚合物的、微制造的热接地平面

Country Status (3)

Country Link
EP (1) EP3213022A4 (de)
CN (2) CN107003076B (de)
WO (1) WO2016114840A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110006282B (zh) * 2018-01-05 2020-12-15 开文热工科技公司 热接地平面
US12464679B2 (en) * 2020-06-19 2025-11-04 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
JP7593793B2 (ja) * 2020-11-26 2024-12-03 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1957221A (zh) * 2004-05-07 2007-05-02 热力公司 具有贯通安装孔的集成电路热管传热片
CN100508708C (zh) * 2003-11-27 2009-07-01 Ls电线有限公司 平板传热装置
WO2010036442A1 (en) * 2008-07-21 2010-04-01 The Regents Of The University Of California Titanium-based thermal ground plane
US8579018B1 (en) * 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2715467Y (zh) * 2004-06-24 2005-08-03 嘉联益科技股份有限公司 具有消除应力设计的覆盖板
CN100420912C (zh) * 2005-06-08 2008-09-24 财团法人工业技术研究院 热传组件的复合式毛细结构
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden
FR2934709B1 (fr) * 2008-08-01 2010-09-10 Commissariat Energie Atomique Structure d'echange thermique et dispositif de refroidissement comportant une telle structure.
KR101062416B1 (ko) * 2008-10-09 2011-09-06 성균관대학교산학협력단 나노 소자의 형성방법
CN101754656B (zh) * 2008-12-10 2013-02-20 富准精密工业(深圳)有限公司 均温板
US9163883B2 (en) * 2009-03-06 2015-10-20 Kevlin Thermal Technologies, Inc. Flexible thermal ground plane and manufacturing the same
JP2013148289A (ja) * 2012-01-20 2013-08-01 Toyota Motor Corp 平板型ヒートパイプ
US9478429B2 (en) * 2012-03-13 2016-10-25 Massachusetts Institute Of Technology Removable templates for directed self assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100508708C (zh) * 2003-11-27 2009-07-01 Ls电线有限公司 平板传热装置
CN1957221A (zh) * 2004-05-07 2007-05-02 热力公司 具有贯通安装孔的集成电路热管传热片
WO2010036442A1 (en) * 2008-07-21 2010-04-01 The Regents Of The University Of California Titanium-based thermal ground plane
US8579018B1 (en) * 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe

Also Published As

Publication number Publication date
WO2016114840A2 (en) 2016-07-21
EP3213022A2 (de) 2017-09-06
WO2016114840A3 (en) 2016-09-22
CN110470160A (zh) 2019-11-19
CN107003076A (zh) 2017-08-01
EP3213022A4 (de) 2018-06-13

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