EP3213022A4 - Mikrgefertigte thermische massefläche auf polymerbasis - Google Patents

Mikrgefertigte thermische massefläche auf polymerbasis Download PDF

Info

Publication number
EP3213022A4
EP3213022A4 EP15878262.3A EP15878262A EP3213022A4 EP 3213022 A4 EP3213022 A4 EP 3213022A4 EP 15878262 A EP15878262 A EP 15878262A EP 3213022 A4 EP3213022 A4 EP 3213022A4
Authority
EP
European Patent Office
Prior art keywords
polymer
ground plane
thermal ground
microfabricated thermal
based microfabricated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP15878262.3A
Other languages
English (en)
French (fr)
Other versions
EP3213022A2 (de
Inventor
Ryan John Lewis
Yung-Cheng Lee
Li-Anne Liew
Yunda WANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kelvin Thermal Technologies Inc
Original Assignee
Kelvin Thermal Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kelvin Thermal Technologies Inc filed Critical Kelvin Thermal Technologies Inc
Publication of EP3213022A2 publication Critical patent/EP3213022A2/de
Publication of EP3213022A4 publication Critical patent/EP3213022A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Micromachines (AREA)
  • Multiple-Way Valves (AREA)
  • Road Signs Or Road Markings (AREA)
EP15878262.3A 2014-10-28 2015-10-28 Mikrgefertigte thermische massefläche auf polymerbasis Withdrawn EP3213022A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201462069564P 2014-10-28 2014-10-28
PCT/US2015/057885 WO2016114840A2 (en) 2014-10-28 2015-10-28 Polymer-based microfabricated thermal ground plane

Publications (2)

Publication Number Publication Date
EP3213022A2 EP3213022A2 (de) 2017-09-06
EP3213022A4 true EP3213022A4 (de) 2018-06-13

Family

ID=56406553

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15878262.3A Withdrawn EP3213022A4 (de) 2014-10-28 2015-10-28 Mikrgefertigte thermische massefläche auf polymerbasis

Country Status (3)

Country Link
EP (1) EP3213022A4 (de)
CN (2) CN107003076B (de)
WO (1) WO2016114840A2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110006282B (zh) * 2018-01-05 2020-12-15 开文热工科技公司 热接地平面
US12464679B2 (en) * 2020-06-19 2025-11-04 Kelvin Thermal Technologies, Inc. Folding thermal ground plane
JP7593793B2 (ja) * 2020-11-26 2024-12-03 古河電気工業株式会社 ベーパーチャンバおよびベーパーチャンバの製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100093160A1 (en) * 2008-10-09 2010-04-15 Sungkyunkwan University Foundation For Corporate Collaboration Methods of forming nano-devices using nanostructures having self-assembly characteristics
US20110017431A1 (en) * 2009-03-06 2011-01-27 Y.C. Lee Flexible thermal ground plane and manufacturing the same
US20110198059A1 (en) * 2008-08-01 2011-08-18 Commissariat A L'energie Atomique Et Aux Ene Alt Heat exchange structure and cooling device comprising such a structure
US20130244439A1 (en) * 2012-03-13 2013-09-19 Massachusetts Institute Of Technology Removable templates for directed self assembly

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6896039B2 (en) * 1999-05-12 2005-05-24 Thermal Corp. Integrated circuit heat pipe heat spreader with through mounting holes
KR100633922B1 (ko) * 2003-11-27 2006-10-16 엘에스전선 주식회사 판형 열전달 장치
CN2715467Y (zh) * 2004-06-24 2005-08-03 嘉联益科技股份有限公司 具有消除应力设计的覆盖板
CN100420912C (zh) * 2005-06-08 2008-09-24 财团法人工业技术研究院 热传组件的复合式毛细结构
DE202007007568U1 (de) * 2007-05-25 2007-09-20 Boston Cool Tec Corporation, Wilmington Eine flache Heatpipe (Wärmeleitrohr) und Kühlkörper welche diese verwenden
US8807203B2 (en) * 2008-07-21 2014-08-19 The Regents Of The University Of California Titanium-based thermal ground plane
CN101754656B (zh) * 2008-12-10 2013-02-20 富准精密工业(深圳)有限公司 均温板
US8579018B1 (en) * 2009-03-23 2013-11-12 Hrl Laboratories, Llc Lightweight sandwich panel heat pipe
JP2013148289A (ja) * 2012-01-20 2013-08-01 Toyota Motor Corp 平板型ヒートパイプ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110198059A1 (en) * 2008-08-01 2011-08-18 Commissariat A L'energie Atomique Et Aux Ene Alt Heat exchange structure and cooling device comprising such a structure
US20100093160A1 (en) * 2008-10-09 2010-04-15 Sungkyunkwan University Foundation For Corporate Collaboration Methods of forming nano-devices using nanostructures having self-assembly characteristics
US20110017431A1 (en) * 2009-03-06 2011-01-27 Y.C. Lee Flexible thermal ground plane and manufacturing the same
US20130244439A1 (en) * 2012-03-13 2013-09-19 Massachusetts Institute Of Technology Removable templates for directed self assembly

Also Published As

Publication number Publication date
WO2016114840A2 (en) 2016-07-21
EP3213022A2 (de) 2017-09-06
WO2016114840A3 (en) 2016-09-22
CN107003076B (zh) 2019-07-26
CN110470160A (zh) 2019-11-19
CN107003076A (zh) 2017-08-01

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