CN107532926B - 封装电气装置及其制造方法 - Google Patents

封装电气装置及其制造方法 Download PDF

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Publication number
CN107532926B
CN107532926B CN201580078408.3A CN201580078408A CN107532926B CN 107532926 B CN107532926 B CN 107532926B CN 201580078408 A CN201580078408 A CN 201580078408A CN 107532926 B CN107532926 B CN 107532926B
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CN
China
Prior art keywords
housing
coefficient
thermal expansion
electrical
shell
Prior art date
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Active
Application number
CN201580078408.3A
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English (en)
Chinese (zh)
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CN107532926A (zh
Inventor
吕海涛
褚贵庭
潘尚春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Littelfuse OVS Ltd
Original Assignee
Hamlin Electronics Suzhou Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamlin Electronics Suzhou Co Ltd filed Critical Hamlin Electronics Suzhou Co Ltd
Publication of CN107532926A publication Critical patent/CN107532926A/zh
Application granted granted Critical
Publication of CN107532926B publication Critical patent/CN107532926B/zh
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0034—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having an overmolded housing covering the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/068—Thermal details wherein the coefficient of thermal expansion is important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1316—Moulded encapsulation of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1322—Encapsulation comprising more than one layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201580078408.3A 2015-04-10 2015-04-10 封装电气装置及其制造方法 Active CN107532926B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2015/076260 WO2016161617A1 (fr) 2015-04-10 2015-04-10 Dispositif électrique encapsulé et procédé de fabrication

Publications (2)

Publication Number Publication Date
CN107532926A CN107532926A (zh) 2018-01-02
CN107532926B true CN107532926B (zh) 2021-03-30

Family

ID=57073026

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201580078408.3A Active CN107532926B (zh) 2015-04-10 2015-04-10 封装电气装置及其制造方法

Country Status (6)

Country Link
US (1) US10362692B2 (fr)
EP (1) EP3280979A4 (fr)
JP (1) JP6533594B2 (fr)
KR (1) KR102076961B1 (fr)
CN (1) CN107532926B (fr)
WO (1) WO2016161617A1 (fr)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11395414B1 (en) * 2020-04-09 2022-07-19 General Atomics Method to manufacture potted electronic assemblies for extreme mechanical and thermal environments
JP2025018383A (ja) * 2023-07-26 2025-02-06 株式会社レゾナック 構造体の製造方法及び電子部品装置の製造方法

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WO2008039504A1 (fr) * 2006-09-27 2008-04-03 Tk Holdings Inc. Capteur de véhicule
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JP4518127B2 (ja) * 2007-10-01 2010-08-04 株式会社デンソー 電子回路装置の製造方法および電子回路装置
US7739791B2 (en) * 2007-10-26 2010-06-22 Delphi Technologies, Inc. Method of producing an overmolded electronic module with a flexible circuit pigtail
CN201149495Y (zh) * 2008-01-04 2008-11-12 潘劲松 一种测量相对温湿度的传感装置
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Also Published As

Publication number Publication date
KR20170135852A (ko) 2017-12-08
CN107532926A (zh) 2018-01-02
JP6533594B2 (ja) 2019-06-19
US20180084657A1 (en) 2018-03-22
EP3280979A4 (fr) 2018-12-05
JP2018512592A (ja) 2018-05-17
KR102076961B1 (ko) 2020-02-13
US10362692B2 (en) 2019-07-23
EP3280979A1 (fr) 2018-02-14
WO2016161617A1 (fr) 2016-10-13

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TR01 Transfer of patent right

Effective date of registration: 20210812

Address after: 215021 No.6 Xinghai street, Suzhou Industrial Park, Suzhou City, Jiangsu Province

Patentee after: SUZHOU LITTELFUSE OVS Ltd.

Address before: 215121 Suzhou City, Jiangsu Province No. 6 Xinghai street, Suzhou Industrial Park, Jiangsu Province

Patentee before: HAMLIN ELECTRONICS (SUZHOU) Co.,Ltd.

TR01 Transfer of patent right