CN107636039B - 用于热固性环氧树脂的固化剂和制备用于电子工程的绝缘系统的方法 - Google Patents

用于热固性环氧树脂的固化剂和制备用于电子工程的绝缘系统的方法 Download PDF

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Publication number
CN107636039B
CN107636039B CN201680028631.1A CN201680028631A CN107636039B CN 107636039 B CN107636039 B CN 107636039B CN 201680028631 A CN201680028631 A CN 201680028631A CN 107636039 B CN107636039 B CN 107636039B
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China
Prior art keywords
methylthio
epoxy resin
diaminobenzene
diaminotoluene
phenyl
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Chinese (zh)
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CN107636039A (zh
Inventor
C·贝塞勒
S·克里亚德
C·舍恩恩博格
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Huntsman Advanced Materials Licensing Switzerland GmbH
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Huntsman Advanced Materials Licensing Switzerland GmbH
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/56—Amines together with other curing agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F38/00—Adaptations of transformers or inductances for specific applications or functions
    • H01F38/20—Instruments transformers
    • H01F38/22—Instruments transformers for single phase AC
    • H01F38/24—Voltage transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
    • H01H33/02—Details
    • H01H33/021—Use of solid insulating compounds resistant to the contacting fluid dielectrics and their decomposition products, e.g. to SF6

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Epoxy Resins (AREA)
  • Insulators (AREA)
CN201680028631.1A 2015-05-19 2016-05-11 用于热固性环氧树脂的固化剂和制备用于电子工程的绝缘系统的方法 Active CN107636039B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP15168065 2015-05-19
EP15168065.9 2015-05-19
PCT/EP2016/060558 WO2016184749A1 (fr) 2015-05-19 2016-05-11 Agent de durcissement pour le thermodurcissement de résines époxy, et procédé pour la préparation de systèmes d'isolation destinés eux domaines de l'électrotechnique

Publications (2)

Publication Number Publication Date
CN107636039A CN107636039A (zh) 2018-01-26
CN107636039B true CN107636039B (zh) 2020-11-24

Family

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CN201680028631.1A Active CN107636039B (zh) 2015-05-19 2016-05-11 用于热固性环氧树脂的固化剂和制备用于电子工程的绝缘系统的方法

Country Status (13)

Country Link
US (1) US10851201B2 (fr)
EP (1) EP3298061B1 (fr)
JP (1) JP6944879B2 (fr)
KR (1) KR102572379B1 (fr)
CN (1) CN107636039B (fr)
CA (1) CA2983679C (fr)
DK (1) DK3298061T3 (fr)
ES (1) ES2834894T3 (fr)
HU (1) HUE052763T2 (fr)
MX (1) MX2017014697A (fr)
PL (1) PL3298061T3 (fr)
TW (1) TWI734686B (fr)
WO (1) WO2016184749A1 (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734686B (zh) * 2015-05-19 2021-08-01 瑞士商亨斯邁先進材料授權（瑞士）有限公司 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法
JP6734287B2 (ja) * 2015-09-16 2020-08-05 日本曹達株式会社 包接化合物
MX2019008819A (es) * 2017-01-26 2019-09-26 Huntsman Adv Mat Licensing Switzerland Gmbh Composicion de resina epoxidica termofraguable para preparacion de articulos para ingenieria electrica, y tales articulos obtenidos a partir de la misma.
GB2569614B (en) * 2017-12-21 2022-04-06 Hexcel Composites Ltd A curative composition and a resin composition containing the curative composition
TWI847997B (zh) 2018-08-17 2024-07-11 德商漢高股份有限及兩合公司 液體壓縮成型或封裝組合物
TW202337995A (zh) * 2021-11-17 2023-10-01 德商漢高股份有限及兩合公司 液體模製物料及其當暴露於雷射能後變成具可鍍性的反應產物
CN115926115A (zh) * 2022-12-19 2023-04-07 湖南肆玖科技有限公司 改性环氧树脂固化剂、制备方法及其使用方法

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US6147169A (en) * 1997-03-25 2000-11-14 Kansai Paint Co., Ltd. Curable coating composition
JP2013136702A (ja) * 2011-12-28 2013-07-11 Namics Corp 液状封止材
CN103764755A (zh) * 2011-08-31 2014-04-30 亨斯迈先进材料（瑞士）有限公司 疏水性环氧树脂体系用于封装仪表变压器的用途

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US4775736A (en) 1985-12-27 1988-10-04 Ethyl Corporation Epoxy curing agent composition
JPS6460625A (en) * 1987-08-31 1989-03-07 Toshiba Corp Casting epoxy resin composition
US5364977A (en) * 1992-12-01 1994-11-15 Nippon Soda Co., Ltd. Clathrate compounds comprising tetrakisphenols as host
US7495060B2 (en) * 1996-12-27 2009-02-24 Nippon Soda Co., Ltd. Tetrakisphenol and non-clathrated curing agent for epoxy resin
EP1520867A3 (fr) * 1996-12-27 2008-04-30 Nippon Soda Co., Ltd. agents de durcissement de résine epoxy, accélérateur de durcissement, et composition de résine epoxy
JP3904311B2 (ja) * 1996-12-27 2007-04-11 日本曹達株式会社 エポキシ樹脂用硬化剤・硬化促進剤及びエポキシ樹脂組成物
JPH10324826A (ja) * 1997-03-25 1998-12-08 Kansai Paint Co Ltd 硬化型塗料組成物
WO2005062410A1 (fr) * 2003-12-18 2005-07-07 Kurita Water Industries Ltd. Combustible pour pile a combustible, pile a combustible et utilisation de celle-ci
JP5068045B2 (ja) 2005-07-06 2012-11-07 日本曹達株式会社 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂
JP2012232994A (ja) 2005-07-06 2012-11-29 Nippon Soda Co Ltd 包接化合物、硬化触媒、硬化樹脂形成用組成物及び硬化樹脂
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JP5576595B2 (ja) * 2008-03-27 2014-08-20 大阪瓦斯株式会社 フルオレン骨格を含有する化合物を用いた包接化合物
WO2010103809A1 (fr) * 2009-03-11 2010-09-16 日本曹達株式会社 Composition de résine époxy, agent de vulcanisation et accélérateur de vulcanisation
WO2010127118A1 (fr) * 2009-04-30 2010-11-04 Dow Global Technologies Inc. Compositions de résine thermodurcissables
CN102574988B (zh) * 2009-10-16 2014-05-14 日本曹达株式会社 环氧固化树脂形成用组合物及其固化物
WO2011145317A1 (fr) * 2010-05-21 2011-11-24 日本曹達株式会社 Composition de revêtement en poudre durcissable et son produit durci
JP2014185115A (ja) * 2013-03-25 2014-10-02 Nippon Soda Co Ltd 新規な包接化合物
TWI734686B (zh) * 2015-05-19 2021-08-01 瑞士商亨斯邁先進材料授權（瑞士）有限公司 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法
JP6734287B2 (ja) * 2015-09-16 2020-08-05 日本曹達株式会社 包接化合物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6147169A (en) * 1997-03-25 2000-11-14 Kansai Paint Co., Ltd. Curable coating composition
CN103764755A (zh) * 2011-08-31 2014-04-30 亨斯迈先进材料（瑞士）有限公司 疏水性环氧树脂体系用于封装仪表变压器的用途
JP2013136702A (ja) * 2011-12-28 2013-07-11 Namics Corp 液状封止材

Also Published As

Publication number Publication date
KR102572379B1 (ko) 2023-09-01
US10851201B2 (en) 2020-12-01
CA2983679A1 (fr) 2016-11-24
JP2018517018A (ja) 2018-06-28
CN107636039A (zh) 2018-01-26
US20180142058A1 (en) 2018-05-24
ES2834894T3 (es) 2021-06-21
KR20180008782A (ko) 2018-01-24
TW201700525A (zh) 2017-01-01
WO2016184749A1 (fr) 2016-11-24
EP3298061B1 (fr) 2020-09-09
TWI734686B (zh) 2021-08-01
PL3298061T3 (pl) 2021-05-31
HUE052763T2 (hu) 2021-05-28
DK3298061T3 (da) 2020-11-16
MX2017014697A (es) 2018-01-24
EP3298061A1 (fr) 2018-03-28
CA2983679C (fr) 2023-08-08
JP6944879B2 (ja) 2021-10-06

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