CN108307635B - 工件加工用胶粘带 - Google Patents

工件加工用胶粘带 Download PDF

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Publication number
CN108307635B
CN108307635B CN201680023562.5A CN201680023562A CN108307635B CN 108307635 B CN108307635 B CN 108307635B CN 201680023562 A CN201680023562 A CN 201680023562A CN 108307635 B CN108307635 B CN 108307635B
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CN
China
Prior art keywords
meth
urethane
adhesive tape
acrylate
compound
Prior art date
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Active
Application number
CN201680023562.5A
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English (en)
Chinese (zh)
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CN108307635A (zh
Inventor
小升雄一朗
藤本泰史
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Lintec Corp
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Lintec Corp
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Publication of CN108307635A publication Critical patent/CN108307635A/zh
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Publication of CN108307635B publication Critical patent/CN108307635B/zh
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
CN201680023562.5A 2015-04-30 2016-04-21 工件加工用胶粘带 Active CN108307635B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015-093141 2015-04-30
JP2015093141 2015-04-30
PCT/JP2016/062581 WO2016175112A1 (ja) 2015-04-30 2016-04-21 ワーク加工用粘着テープ

Publications (2)

Publication Number Publication Date
CN108307635A CN108307635A (zh) 2018-07-20
CN108307635B true CN108307635B (zh) 2021-04-02

Family

ID=57198397

Family Applications (1)

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CN201680023562.5A Active CN108307635B (zh) 2015-04-30 2016-04-21 工件加工用胶粘带

Country Status (6)

Country Link
JP (1) JP6541775B2 (ko)
KR (1) KR102528633B1 (ko)
CN (1) CN108307635B (ko)
SG (1) SG11201708797YA (ko)
TW (1) TWI778939B (ko)
WO (1) WO2016175112A1 (ko)

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JP7064857B2 (ja) * 2017-12-14 2022-05-11 三星エスディアイ株式会社 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム
WO2019130741A1 (ja) * 2017-12-26 2019-07-04 日東電工株式会社 光学部材用表面保護シート
JP2019116609A (ja) * 2017-12-26 2019-07-18 日東電工株式会社 光学部材用表面保護シート
KR20190078510A (ko) * 2017-12-26 2019-07-04 닛토덴코 가부시키가이샤 광학 부재용 표면 보호 시트
JP7761993B2 (ja) 2018-03-29 2025-10-29 リンテック株式会社 粘着性組成物および粘着テープ
KR102104714B1 (ko) * 2018-05-02 2020-04-24 (재)한국건설생활환경시험연구원 3ｄ 프린터 빌드 시트용 점착제 조성물
KR102210259B1 (ko) * 2018-07-11 2021-02-01 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
JP7191586B2 (ja) * 2018-08-17 2022-12-19 株式会社ディスコ ウエーハの一体化方法
KR102306588B1 (ko) * 2018-10-02 2021-09-29 삼성에스디아이 주식회사 점착성 보호 필름 및 이를 포함하는 광학 부재
JP7285072B2 (ja) * 2018-12-28 2023-06-01 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7241538B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7241537B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 熱硬化型粘着剤組成物、熱硬化物および表面保護フィルム
KR102581044B1 (ko) * 2019-01-25 2023-09-20 주식회사 엘지화학 표면 보호 필름 및 유기 발광 전자 장치 제조 방법
JP6769503B2 (ja) * 2019-02-22 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着剤、および粘着シートとその使用方法
CN113613896A (zh) * 2019-03-29 2021-11-05 琳得科株式会社 半导体加工用保护片以及半导体装置的制造方法
CN113993663B (zh) * 2019-09-05 2024-05-31 株式会社力森诺科 背面研磨带
WO2021125152A1 (ja) * 2019-12-17 2021-06-24 昭和電工株式会社 半導体加工用テープ
GB2593754B (en) * 2020-04-01 2022-12-28 Henkel Ag & Co Kgaa Redox curable compositions and methods of manufacture thereof
JP6769574B1 (ja) * 2020-06-01 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着シート、粘着シート付き被着体、および粘着シートの使用方法
KR20250099396A (ko) * 2022-11-18 2025-07-01 닛토덴코 가부시키가이샤 점착 시트
KR20250105666A (ko) * 2022-11-18 2025-07-08 닛토덴코 가부시키가이샤 점착 시트
KR20250099395A (ko) * 2022-11-18 2025-07-01 닛토덴코 가부시키가이샤 점착 시트
CN121925987A (zh) * 2023-09-21 2026-04-24 琳得科株式会社 粘合片材和物体的处理方法
WO2025154655A1 (ja) * 2024-01-15 2025-07-24 日東電工株式会社 表面保護フィルム

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Also Published As

Publication number Publication date
SG11201708797YA (en) 2017-11-29
TWI778939B (zh) 2022-10-01
JP6541775B2 (ja) 2019-07-10
KR102528633B1 (ko) 2023-05-03
TW201710428A (zh) 2017-03-16
KR20170140221A (ko) 2017-12-20
JPWO2016175112A1 (ja) 2018-02-22
WO2016175112A1 (ja) 2016-11-03
CN108307635A (zh) 2018-07-20

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