TWI778939B - 工件加工用黏著膠帶 - Google Patents

工件加工用黏著膠帶 Download PDF

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Publication number
TWI778939B
TWI778939B TW105112954A TW105112954A TWI778939B TW I778939 B TWI778939 B TW I778939B TW 105112954 A TW105112954 A TW 105112954A TW 105112954 A TW105112954 A TW 105112954A TW I778939 B TWI778939 B TW I778939B
Authority
TW
Taiwan
Prior art keywords
aforementioned
urethane
compound
meth
energy ray
Prior art date
Application number
TW105112954A
Other languages
English (en)
Chinese (zh)
Other versions
TW201710428A (zh
Inventor
小升雄一朗
藤本泰史
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201710428A publication Critical patent/TW201710428A/zh
Application granted granted Critical
Publication of TWI778939B publication Critical patent/TWI778939B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C09J175/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C09J175/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
TW105112954A 2015-04-30 2016-04-26 工件加工用黏著膠帶 TWI778939B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-093141 2015-04-30
JP2015093141 2015-04-30

Publications (2)

Publication Number Publication Date
TW201710428A TW201710428A (zh) 2017-03-16
TWI778939B true TWI778939B (zh) 2022-10-01

Family

ID=57198397

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105112954A TWI778939B (zh) 2015-04-30 2016-04-26 工件加工用黏著膠帶

Country Status (6)

Country Link
JP (1) JP6541775B2 (ko)
KR (1) KR102528633B1 (ko)
CN (1) CN108307635B (ko)
SG (1) SG11201708797YA (ko)
TW (1) TWI778939B (ko)
WO (1) WO2016175112A1 (ko)

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JP6618038B2 (ja) * 2016-06-29 2019-12-11 荒川化学工業株式会社 粘着剤組成物
KR102126046B1 (ko) * 2017-08-31 2020-06-24 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
JP7064857B2 (ja) * 2017-12-14 2022-05-11 三星エスディアイ株式会社 粘着剤組成物、その溶液、粘着剤層および表面保護フィルム
WO2019130741A1 (ja) * 2017-12-26 2019-07-04 日東電工株式会社 光学部材用表面保護シート
JP2019116609A (ja) * 2017-12-26 2019-07-18 日東電工株式会社 光学部材用表面保護シート
KR20190078510A (ko) * 2017-12-26 2019-07-04 닛토덴코 가부시키가이샤 광학 부재용 표면 보호 시트
JP7761993B2 (ja) 2018-03-29 2025-10-29 リンテック株式会社 粘着性組成物および粘着テープ
KR102104714B1 (ko) * 2018-05-02 2020-04-24 (재)한국건설생활환경시험연구원 3ｄ 프린터 빌드 시트용 점착제 조성물
KR102210259B1 (ko) * 2018-07-11 2021-02-01 삼성에스디아이 주식회사 점착 필름, 이를 위한 점착제 조성물 및 이를 포함하는 디스플레이 부재
JP7191586B2 (ja) * 2018-08-17 2022-12-19 株式会社ディスコ ウエーハの一体化方法
KR102306588B1 (ko) * 2018-10-02 2021-09-29 삼성에스디아이 주식회사 점착성 보호 필름 및 이를 포함하는 광학 부재
JP7285072B2 (ja) * 2018-12-28 2023-06-01 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7241538B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 粘着剤組成物、硬化物および表面保護フィルム
JP7241537B2 (ja) * 2018-12-28 2023-03-17 三星エスディアイ株式会社 熱硬化型粘着剤組成物、熱硬化物および表面保護フィルム
KR102581044B1 (ko) * 2019-01-25 2023-09-20 주식회사 엘지화학 표면 보호 필름 및 유기 발광 전자 장치 제조 방법
JP6769503B2 (ja) * 2019-02-22 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着剤、および粘着シートとその使用方法
CN113613896A (zh) * 2019-03-29 2021-11-05 琳得科株式会社 半导体加工用保护片以及半导体装置的制造方法
CN113993663B (zh) * 2019-09-05 2024-05-31 株式会社力森诺科 背面研磨带
WO2021125152A1 (ja) * 2019-12-17 2021-06-24 昭和電工株式会社 半導体加工用テープ
GB2593754B (en) * 2020-04-01 2022-12-28 Henkel Ag & Co Kgaa Redox curable compositions and methods of manufacture thereof
JP6769574B1 (ja) * 2020-06-01 2020-10-14 東洋インキＳｃホールディングス株式会社 粘着シート、粘着シート付き被着体、および粘着シートの使用方法
KR20250099396A (ko) * 2022-11-18 2025-07-01 닛토덴코 가부시키가이샤 점착 시트
KR20250105666A (ko) * 2022-11-18 2025-07-08 닛토덴코 가부시키가이샤 점착 시트
KR20250099395A (ko) * 2022-11-18 2025-07-01 닛토덴코 가부시키가이샤 점착 시트
CN121925987A (zh) * 2023-09-21 2026-04-24 琳得科株式会社 粘合片材和物体的处理方法
WO2025154655A1 (ja) * 2024-01-15 2025-07-24 日東電工株式会社 表面保護フィルム

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JP2005015544A (ja) * 2003-06-24 2005-01-20 Denki Kagaku Kogyo Kk 半導体ウエハ裏面研削用粘着シート
TW201004452A (en) * 2008-03-13 2010-01-16 Qualcomm Inc Methods and apparatus for using connection identifiers having different priorities at different times
CN102754200A (zh) * 2009-12-22 2012-10-24 古河电气工业株式会社 半导体晶片表面保护用胶带
JP2014022476A (ja) * 2012-07-13 2014-02-03 Lintec Corp ダイシングシート
CN104040696A (zh) * 2011-12-26 2014-09-10 琳得科株式会社 带有保护膜形成层的切割片及芯片的制造方法
TW201441327A (zh) * 2013-03-29 2014-11-01 Toyo Ink Sc Holdings Co Ltd 黏著劑及黏著片

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JPH10310748A (ja) * 1997-05-12 1998-11-24 Sumitomo Bakelite Co Ltd 半導体ウエハ加工用粘着シート
JP4828009B2 (ja) * 1998-11-20 2011-11-30 リンテック株式会社 粘着シートおよびその使用方法
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JP3764133B2 (ja) * 2002-08-22 2006-04-05 電気化学工業株式会社 電子部材用粘着テープ
JP4367769B2 (ja) 2004-04-13 2009-11-18 日東電工株式会社 半導体ウエハ保持保護用粘着シートおよび半導体ウエハの裏面研削方法
KR100970313B1 (ko) 2005-02-18 2010-07-15 미쓰이 가가쿠 가부시키가이샤 반도체 웨이퍼 표면 보호시트 및 그 보호시트를 이용한 반도체 웨이퍼의 보호 방법
JP5244603B2 (ja) * 2006-10-03 2013-07-24 株式会社イーテック 粘着剤組成物及び粘着シート
JP5101111B2 (ja) * 2007-01-05 2012-12-19 日東電工株式会社 半導体基板加工用粘着シート
JP5501060B2 (ja) * 2009-04-02 2014-05-21 日東電工株式会社 半導体ウエハ保護用粘着シートの貼り合わせ方法、及びこの貼り合わせ方法に用いる半導体ウエハ保護用粘着シート
JP5859193B2 (ja) * 2010-07-14 2016-02-10 デンカ株式会社 多層粘着シート及び電子部品の製造方法
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JP2005015544A (ja) * 2003-06-24 2005-01-20 Denki Kagaku Kogyo Kk 半導体ウエハ裏面研削用粘着シート
TW201004452A (en) * 2008-03-13 2010-01-16 Qualcomm Inc Methods and apparatus for using connection identifiers having different priorities at different times
CN102754200A (zh) * 2009-12-22 2012-10-24 古河电气工业株式会社 半导体晶片表面保护用胶带
CN104040696A (zh) * 2011-12-26 2014-09-10 琳得科株式会社 带有保护膜形成层的切割片及芯片的制造方法
JP2014022476A (ja) * 2012-07-13 2014-02-03 Lintec Corp ダイシングシート
TW201441327A (zh) * 2013-03-29 2014-11-01 Toyo Ink Sc Holdings Co Ltd 黏著劑及黏著片

Also Published As

Publication number Publication date
SG11201708797YA (en) 2017-11-29
JP6541775B2 (ja) 2019-07-10
KR102528633B1 (ko) 2023-05-03
TW201710428A (zh) 2017-03-16
KR20170140221A (ko) 2017-12-20
JPWO2016175112A1 (ja) 2018-02-22
CN108307635B (zh) 2021-04-02
WO2016175112A1 (ja) 2016-11-03
CN108307635A (zh) 2018-07-20

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