CN1092558A - 一种击穿电压高的薄有源层半导体器件 - Google Patents
一种击穿电压高的薄有源层半导体器件 Download PDFInfo
- Publication number
- CN1092558A CN1092558A CN94100698.0A CN94100698A CN1092558A CN 1092558 A CN1092558 A CN 1092558A CN 94100698 A CN94100698 A CN 94100698A CN 1092558 A CN1092558 A CN 1092558A
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- China
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- transistor
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- semiconductor
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- 239000004065 semiconductor Substances 0.000 title claims description 49
- 230000015556 catabolic process Effects 0.000 title description 8
- 230000005684 electric field Effects 0.000 claims abstract description 25
- 230000005669 field effect Effects 0.000 claims abstract description 12
- 238000002955 isolation Methods 0.000 claims description 28
- 102100021971 Bcl-2-interacting killer Human genes 0.000 claims description 23
- 101000970576 Homo sapiens Bcl-2-interacting killer Proteins 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 20
- 101150031017 BIP2 gene Proteins 0.000 claims description 18
- 239000002019 doping agent Substances 0.000 claims description 11
- 238000009429 electrical wiring Methods 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims 1
- 230000003313 weakening effect Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 18
- 239000000969 carrier Substances 0.000 abstract description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 12
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 6
- 239000000377 silicon dioxide Substances 0.000 abstract description 6
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 74
- 235000012431 wafers Nutrition 0.000 description 17
- 238000000926 separation method Methods 0.000 description 12
- 230000000875 corresponding effect Effects 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000002441 reversible effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 4
- 125000006850 spacer group Chemical group 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 244000028477 Annona glabra Species 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000013178 mathematical model Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000002459 sustained effect Effects 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
- H10D84/403—Combinations of FETs or IGBTs with BJTs and with one or more of diodes, resistors or capacitors
- H10D84/406—Combinations of FETs or IGBTs with vertical BJTs and with one or more of diodes, resistors or capacitors
Landscapes
- Bipolar Transistors (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
- Bipolar Integrated Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE9300210 | 1993-01-25 | ||
| SE9300210A SE500814C2 (sv) | 1993-01-25 | 1993-01-25 | Halvledaranordning i ett tunt aktivt skikt med hög genombrottsspänning |
| US08/669,848 US5659190A (en) | 1993-01-25 | 1996-06-26 | Semiconductor device in a thin active layer with high breakdown voltage |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1092558A true CN1092558A (zh) | 1994-09-21 |
Family
ID=26661632
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN94100698.0A Pending CN1092558A (zh) | 1993-01-25 | 1994-01-25 | 一种击穿电压高的薄有源层半导体器件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5659190A (fr) |
| EP (1) | EP0623951B1 (fr) |
| JP (1) | JPH06349849A (fr) |
| CN (1) | CN1092558A (fr) |
| SE (1) | SE500814C2 (fr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101467261B (zh) * | 2006-06-12 | 2011-01-26 | 苏沃塔公司 | 用于小线宽和下降的线宽的jfet的可扩展工艺和结构 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07283414A (ja) * | 1994-04-05 | 1995-10-27 | Toshiba Corp | Mos型半導体装置 |
| DE4418206C2 (de) * | 1994-05-25 | 1999-01-14 | Siemens Ag | CMOS-kompatibler Bipolartransistor und Herstellungsverfahren desselben |
| SE513512C2 (sv) * | 1994-10-31 | 2000-09-25 | Ericsson Telefon Ab L M | Halvledaranordning med ett flytande kollektorområde |
| US6043555A (en) * | 1995-04-13 | 2000-03-28 | Telefonaktiebolget Lm Ericsson | Bipolar silicon-on-insulator transistor with increased breakdown voltage |
| US5852559A (en) * | 1996-09-24 | 1998-12-22 | Allen Bradley Company, Llc | Power application circuits utilizing bidirectional insulated gate bipolar transistor |
| US5977569A (en) * | 1996-09-24 | 1999-11-02 | Allen-Bradley Company, Llc | Bidirectional lateral insulated gate bipolar transistor having increased voltage blocking capability |
| SE512661C2 (sv) * | 1996-11-13 | 2000-04-17 | Ericsson Telefon Ab L M | Lateral bipolär hybridtransistor med fälteffektmod och förfarande vid densamma |
| JP3709668B2 (ja) * | 1997-09-02 | 2005-10-26 | ソニー株式会社 | 半導体装置とその製造方法 |
| DE19800715A1 (de) * | 1998-01-12 | 1999-07-15 | Bremicker Auto Elektrik | Elektrisches Halbleiterelement sowie Verfahren zur Herstellung eines Halbleiterelementes |
| US6313482B1 (en) | 1999-05-17 | 2001-11-06 | North Carolina State University | Silicon carbide power devices having trench-based silicon carbide charge coupling regions therein |
| US6291304B1 (en) | 1999-09-15 | 2001-09-18 | Taiwan Semiconductor Manufacturing Company | Method of fabricating a high voltage transistor using P+ buried layer |
| US6245609B1 (en) | 1999-09-27 | 2001-06-12 | Taiwan Semiconductor Manufacturing Company | High voltage transistor using P+ buried layer |
| EP2058854B1 (fr) * | 2007-11-07 | 2014-12-03 | Acreo Swedish ICT AB | Dispositif semi-conducteur |
| JP6459416B2 (ja) * | 2014-11-12 | 2019-01-30 | 富士電機株式会社 | 半導体装置 |
| US9935628B2 (en) | 2015-11-10 | 2018-04-03 | Analog Devices Global | FET—bipolar transistor combination, and a switch comprising such a FET—bipolar transistor combination |
| GB201604796D0 (en) | 2015-11-10 | 2016-05-04 | Analog Devices Global | A combined isolator and power switch |
| US9698594B2 (en) | 2015-11-10 | 2017-07-04 | Analog Devices Global | Overvoltage protection device, and a galvanic isolator in combination with an overvoltage protection device |
| US9653455B1 (en) * | 2015-11-10 | 2017-05-16 | Analog Devices Global | FET—bipolar transistor combination |
| TWI747235B (zh) * | 2020-04-16 | 2021-11-21 | 世界先進積體電路股份有限公司 | 高壓半導體裝置 |
| US11121212B1 (en) | 2020-05-28 | 2021-09-14 | Vanguard International Semiconductor Corporation | High-voltage semiconductor device |
| CN113823678A (zh) * | 2021-09-03 | 2021-12-21 | 无锡市晶源微电子有限公司 | 一种高压npn器件 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3404295A (en) * | 1964-11-30 | 1968-10-01 | Motorola Inc | High frequency and voltage transistor with added region for punch-through protection |
| CA1131801A (fr) * | 1978-01-18 | 1982-09-14 | Johannes A. Appels | Semiconducteur |
| US4608590A (en) * | 1978-12-20 | 1986-08-26 | At&T Bell Laboratories | High voltage dielectrically isolated solid-state switch |
| US4587545A (en) * | 1978-12-20 | 1986-05-06 | At&T Bell Laboratories | High voltage dielectrically isolated remote gate solid-state switch |
| US4587656A (en) * | 1979-12-28 | 1986-05-06 | At&T Bell Laboratories | High voltage solid-state switch |
| NL186665C (nl) * | 1980-03-10 | 1992-01-16 | Philips Nv | Halfgeleiderinrichting. |
| US4868624A (en) * | 1980-05-09 | 1989-09-19 | Regents Of The University Of Minnesota | Channel collector transistor |
| US4300150A (en) * | 1980-06-16 | 1981-11-10 | North American Philips Corporation | Lateral double-diffused MOS transistor device |
| NL187415C (nl) * | 1980-09-08 | 1991-09-16 | Philips Nv | Halfgeleiderinrichting met gereduceerde oppervlakteveldsterkte. |
| US4485392A (en) * | 1981-12-28 | 1984-11-27 | North American Philips Corporation | Lateral junction field effect transistor device |
| NL8200464A (nl) * | 1982-02-08 | 1983-09-01 | Philips Nv | Halfgeleiderinrichting met gereduceerde oppervlakteveldsterkte. |
| US4639761A (en) * | 1983-12-16 | 1987-01-27 | North American Philips Corporation | Combined bipolar-field effect transistor resurf devices |
| US4605948A (en) * | 1984-08-02 | 1986-08-12 | Rca Corporation | Semiconductor structure for electric field distribution |
| US5001075A (en) * | 1989-04-03 | 1991-03-19 | Motorola | Fabrication of dielectrically isolated semiconductor device |
| JP2825322B2 (ja) * | 1989-09-13 | 1998-11-18 | 株式会社東芝 | 誘電体分離構造を有する半導体基板の製造方法 |
| JP2654268B2 (ja) * | 1991-05-13 | 1997-09-17 | 株式会社東芝 | 半導体装置の使用方法 |
-
1993
- 1993-01-25 SE SE9300210A patent/SE500814C2/sv not_active IP Right Cessation
-
1994
- 1994-01-12 EP EP94850004A patent/EP0623951B1/fr not_active Expired - Lifetime
- 1994-01-24 JP JP6005896A patent/JPH06349849A/ja active Pending
- 1994-01-25 CN CN94100698.0A patent/CN1092558A/zh active Pending
-
1996
- 1996-06-26 US US08/669,848 patent/US5659190A/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101467261B (zh) * | 2006-06-12 | 2011-01-26 | 苏沃塔公司 | 用于小线宽和下降的线宽的jfet的可扩展工艺和结构 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP0623951B1 (fr) | 1998-07-08 |
| EP0623951A1 (fr) | 1994-11-09 |
| SE500814C2 (sv) | 1994-09-12 |
| US5659190A (en) | 1997-08-19 |
| SE9300210L (sv) | 1994-07-26 |
| JPH06349849A (ja) | 1994-12-22 |
| SE9300210D0 (sv) | 1993-01-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C01 | Deemed withdrawal of patent application (patent law 1993) | ||
| WD01 | Invention patent application deemed withdrawn after publication |