CN109689541A - 用于基板的传输系统和加工系统 - Google Patents

用于基板的传输系统和加工系统 Download PDF

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Publication number
CN109689541A
CN109689541A CN201780048605.XA CN201780048605A CN109689541A CN 109689541 A CN109689541 A CN 109689541A CN 201780048605 A CN201780048605 A CN 201780048605A CN 109689541 A CN109689541 A CN 109689541A
Authority
CN
China
Prior art keywords
substrate
bearing surface
compressed
transmission system
air
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780048605.XA
Other languages
English (en)
Chinese (zh)
Inventor
弗洛里安·瓦姆斯勒
阿希姆·阿诺德
克劳斯·奥佩尔特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asys Automatisierungssysteme GmbH
Original Assignee
Asys Automatisierungssysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asys Automatisierungssysteme GmbH filed Critical Asys Automatisierungssysteme GmbH
Publication of CN109689541A publication Critical patent/CN109689541A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3208—Changing the direction of the conveying path
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3222—Loading to or unloading from a conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN201780048605.XA 2016-08-01 2017-08-01 用于基板的传输系统和加工系统 Pending CN109689541A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016214184.8A DE102016214184A1 (de) 2016-08-01 2016-08-01 Transportsystem und Bearbeitungssystem für Substrate
DE102016214184.8 2016-08-01
PCT/EP2017/069390 WO2018024707A1 (de) 2016-08-01 2017-08-01 Transportsystem und bearbeitungssystem für substrate

Publications (1)

Publication Number Publication Date
CN109689541A true CN109689541A (zh) 2019-04-26

Family

ID=59686906

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780048605.XA Pending CN109689541A (zh) 2016-08-01 2017-08-01 用于基板的传输系统和加工系统

Country Status (4)

Country Link
EP (1) EP3490916A1 (de)
CN (1) CN109689541A (de)
DE (1) DE102016214184A1 (de)
WO (1) WO2018024707A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114641854A (zh) * 2019-11-05 2022-06-17 亚席斯自动化系统有限公司 用于基板料盒的装卸装置、基板料盒系统

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102018112706B4 (de) * 2018-05-28 2021-03-04 Hennecke Systems Gmbh Waferstraße sowie Verfahren zum Fördern von Wafern
CN116713161B (zh) 2023-06-05 2024-10-11 广东科雷明斯智能科技有限公司 一种动力锂电池多面自动喷印方法

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3126200A (en) * 1960-07-30 1964-03-24 Separating device
EP0019107B1 (de) * 1979-05-17 1982-01-06 Sack-Glastechnik GmbH Glasbesäummaschine
JPS57145338A (en) * 1981-03-03 1982-09-08 Nec Corp Carrier mechanism for semiconductor wafer
GB2143193A (en) * 1983-06-14 1985-02-06 Hebenstreit Gmbh Belt conveyor systems for wafer leaves and deflectors therefor
JPS60118520A (ja) * 1983-11-30 1985-06-26 Natl House Ind Co Ltd ワ−ク取出し装置
EP0658497A3 (de) * 1993-12-15 1996-03-13 Schuler Pressen Gmbh & Co Mit Saugluft arbeitende Vorrichtung zum hängenden Transport von Blechen.
NL1020087C2 (nl) * 2002-02-28 2003-08-29 Lan Handling Systems B V Overzetinrichting, gebruik van een dergelijke overzetinrichting, alsmede samenstel van een dergelijke overzetinrichting en een toevoertransporteur.
CN100999320A (zh) * 2006-01-09 2007-07-18 塔工程有限公司 用于切断玻璃基板的装置
CN101168412A (zh) * 2006-10-25 2008-04-30 株式会社真星Techtem 吸附、传送、移送、积载多数物品的装置
CN103183235A (zh) * 2013-04-10 2013-07-03 北京中科同志科技有限公司 元件移转机
CN103449179A (zh) * 2012-06-01 2013-12-18 三星钻石工业股份有限公司 基板的垂直搬送装置
CN105151646A (zh) * 2015-09-18 2015-12-16 佛山市顺德区捷嘉机器人科技有限公司 一种高速循环式机器人
CN205328207U (zh) * 2015-11-16 2016-06-22 钟伟 一种玻璃基板的气浮运输装置
CN105752635A (zh) * 2016-05-18 2016-07-13 广州超音速自动化科技股份有限公司 电路板输送流水线

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3592329A (en) * 1966-10-27 1971-07-13 Gen Logistics Differential pressure conveyors
US4566726A (en) * 1984-06-13 1986-01-28 At&T Technologies, Inc. Method and apparatus for handling semiconductor wafers
JPH0825649B2 (ja) * 1990-05-09 1996-03-13 シャープ株式会社 シート給送装置
US20050212198A1 (en) * 2004-03-29 2005-09-29 Eastman Kodak Company Method of operating a vacuum corrugated belt feeder to improve sheet acquisition from a feed supply
DE102004019231A1 (de) * 2004-04-16 2005-11-17 PROTEC Gesellschaft für Werkstoff- und Oberflächentechnik mbH Übergabe- und Ladestation für mobile, elektrostatische Substrathalter
EP2431307A3 (de) * 2010-09-16 2012-04-04 Montech AG Vakuumtransportband und Ventil für die Vakuumregelung dieses Transportbands

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3126200A (en) * 1960-07-30 1964-03-24 Separating device
EP0019107B1 (de) * 1979-05-17 1982-01-06 Sack-Glastechnik GmbH Glasbesäummaschine
JPS57145338A (en) * 1981-03-03 1982-09-08 Nec Corp Carrier mechanism for semiconductor wafer
GB2143193A (en) * 1983-06-14 1985-02-06 Hebenstreit Gmbh Belt conveyor systems for wafer leaves and deflectors therefor
JPS60118520A (ja) * 1983-11-30 1985-06-26 Natl House Ind Co Ltd ワ−ク取出し装置
EP0658497A3 (de) * 1993-12-15 1996-03-13 Schuler Pressen Gmbh & Co Mit Saugluft arbeitende Vorrichtung zum hängenden Transport von Blechen.
NL1020087C2 (nl) * 2002-02-28 2003-08-29 Lan Handling Systems B V Overzetinrichting, gebruik van een dergelijke overzetinrichting, alsmede samenstel van een dergelijke overzetinrichting en een toevoertransporteur.
CN100999320A (zh) * 2006-01-09 2007-07-18 塔工程有限公司 用于切断玻璃基板的装置
CN101168412A (zh) * 2006-10-25 2008-04-30 株式会社真星Techtem 吸附、传送、移送、积载多数物品的装置
CN103449179A (zh) * 2012-06-01 2013-12-18 三星钻石工业股份有限公司 基板的垂直搬送装置
CN103183235A (zh) * 2013-04-10 2013-07-03 北京中科同志科技有限公司 元件移转机
CN105151646A (zh) * 2015-09-18 2015-12-16 佛山市顺德区捷嘉机器人科技有限公司 一种高速循环式机器人
CN205328207U (zh) * 2015-11-16 2016-06-22 钟伟 一种玻璃基板的气浮运输装置
CN105752635A (zh) * 2016-05-18 2016-07-13 广州超音速自动化科技股份有限公司 电路板输送流水线

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114641854A (zh) * 2019-11-05 2022-06-17 亚席斯自动化系统有限公司 用于基板料盒的装卸装置、基板料盒系统

Also Published As

Publication number Publication date
DE102016214184A1 (de) 2018-02-01
WO2018024707A1 (de) 2018-02-08
EP3490916A1 (de) 2019-06-05

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Application publication date: 20190426

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