CN1109217A - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

Info

Publication number
CN1109217A
CN1109217A CN94119896A CN94119896A CN1109217A CN 1109217 A CN1109217 A CN 1109217A CN 94119896 A CN94119896 A CN 94119896A CN 94119896 A CN94119896 A CN 94119896A CN 1109217 A CN1109217 A CN 1109217A
Authority
CN
China
Prior art keywords
semiconductor chip
mentioned
lead
fixing
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN94119896A
Other languages
English (en)
Chinese (zh)
Inventor
越智岳雄
船越久士
畑田贤造
若林巍
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of CN1109217A publication Critical patent/CN1109217A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/04—Manufacture or treatment of leadframes
    • H10W70/048—Mechanical treatments, e.g. punching, cutting, deforming or cold welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/415—Leadframe inner leads serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H10W70/427—Bent parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/865—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/931—Shapes of bond pads
    • H10W72/932—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Wire Bonding (AREA)
CN94119896A 1993-12-08 1994-12-05 半导体装置及其制造方法 Pending CN1109217A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP30793293 1993-12-08
JP307932/93 1993-12-08
JP203843/94 1994-08-29
JP20384394 1994-08-29

Publications (1)

Publication Number Publication Date
CN1109217A true CN1109217A (zh) 1995-09-27

Family

ID=26514139

Family Applications (1)

Application Number Title Priority Date Filing Date
CN94119896A Pending CN1109217A (zh) 1993-12-08 1994-12-05 半导体装置及其制造方法

Country Status (6)

Country Link
US (2) US5776802A (de)
EP (1) EP0657931B1 (de)
KR (1) KR0140675B1 (de)
CN (1) CN1109217A (de)
DE (1) DE69421592T2 (de)
TW (1) TW270213B (de)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2708191B2 (ja) * 1988-09-20 1998-02-04 株式会社日立製作所 半導体装置
TW270213B (de) * 1993-12-08 1996-02-11 Matsushita Electric Industrial Co Ltd
JPH09283545A (ja) * 1996-04-10 1997-10-31 Oki Electric Ind Co Ltd 樹脂封止型半導体装置及びその製造方法
US5940686A (en) * 1996-04-12 1999-08-17 Conexant Systems, Inc. Method for manufacturing multi-chip modules utilizing direct lead attach
US5969410A (en) * 1996-05-09 1999-10-19 Oki Electric Industry Co., Ltd. Semiconductor IC device having chip support element and electrodes on the same surface
JP3012816B2 (ja) * 1996-10-22 2000-02-28 松下電子工業株式会社 樹脂封止型半導体装置およびその製造方法
US5925927A (en) * 1996-12-18 1999-07-20 Texas Instruments Incoporated Reinforced thin lead frames and leads
US5907769A (en) * 1996-12-30 1999-05-25 Micron Technology, Inc. Leads under chip in conventional IC package
US6861735B2 (en) * 1997-06-27 2005-03-01 Matsushita Electric Industrial Co., Ltd. Resin molded type semiconductor device and a method of manufacturing the same
JPH1187572A (ja) * 1997-09-10 1999-03-30 Oki Electric Ind Co Ltd 樹脂封止半導体装置およびその製造方法
KR100271657B1 (ko) * 1998-05-30 2000-11-15 김영환 칼럼 리드형 반도체 패키지 및 그 제조방법
TW468258B (en) * 1998-10-21 2001-12-11 Hitachi Ltd Semiconductor device and method of manufacturing the same
US6405429B1 (en) * 1999-08-26 2002-06-18 Honeywell Inc. Microbeam assembly and associated method for integrated circuit interconnection to substrates
US6700210B1 (en) 1999-12-06 2004-03-02 Micron Technology, Inc. Electronic assemblies containing bow resistant semiconductor packages
US6384487B1 (en) 1999-12-06 2002-05-07 Micron Technology, Inc. Bow resistant plastic semiconductor package and method of fabrication
US6229202B1 (en) * 2000-01-10 2001-05-08 Micron Technology, Inc. Semiconductor package having downset leadframe for reducing package bow
USD449271S1 (en) 2000-06-01 2001-10-16 Avansys Power Co., Ltd. Power supply unit
DE10158770B4 (de) * 2001-11-29 2006-08-03 Infineon Technologies Ag Leiterrahmen und Bauelement mit einem Leiterrahmen
TWI232560B (en) * 2002-04-23 2005-05-11 Sanyo Electric Co Semiconductor device and its manufacture
TWI229435B (en) 2002-06-18 2005-03-11 Sanyo Electric Co Manufacture of semiconductor device
TWI227550B (en) * 2002-10-30 2005-02-01 Sanyo Electric Co Semiconductor device manufacturing method
SG157957A1 (en) * 2003-01-29 2010-01-29 Interplex Qlp Inc Package for integrated circuit die
US7173951B2 (en) * 2003-03-25 2007-02-06 Sharp Kabushiki Kaisha Semiconductor laser device with light receiving element
JP4401181B2 (ja) 2003-08-06 2010-01-20 三洋電機株式会社 半導体装置及びその製造方法
WO2006022591A1 (en) * 2004-08-26 2006-03-02 Infineon Technologies Ag Packaging of integrated circuits to lead frames
US7977698B2 (en) * 2005-03-18 2011-07-12 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. System and method for surface mountable display
TWI273636B (en) * 2005-08-02 2007-02-11 Chipmos Technologies Inc Chip package having asymmetric molding
TWI324800B (en) 2005-12-28 2010-05-11 Sanyo Electric Co Method for manufacturing semiconductor device
US20110001227A1 (en) * 2009-07-01 2011-01-06 Texas Instruments Incorporated Semiconductor Chip Secured to Leadframe by Friction
US20110042137A1 (en) * 2009-08-18 2011-02-24 Honeywell International Inc. Suspended lead frame electronic package
JP6239840B2 (ja) * 2013-03-27 2017-11-29 ローム株式会社 半導体装置および半導体装置の製造方法

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4054238A (en) * 1976-03-23 1977-10-18 Western Electric Company, Inc. Method, apparatus and lead frame for assembling leads with terminals on a substrate
US4426689A (en) * 1979-03-12 1984-01-17 International Business Machines Corporation Vertical semiconductor integrated circuit chip packaging
DE3213884A1 (de) * 1982-04-15 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Anschlussvorrichtung fuer ein plattenfoermiges elektrisches geraet
JPS61117868A (ja) * 1984-11-14 1986-06-05 Toshiba Corp 半導体装置及びその製造方法
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
JPS63228657A (ja) * 1987-03-18 1988-09-22 Hitachi Ltd 混成集積回路装置およびリ−ドフレ−ム
US4782589A (en) * 1987-04-06 1988-11-08 Dennis Richard K Process of connecting lead frame to a semi-conductor device and a device to effect same
JPH0815165B2 (ja) * 1987-09-17 1996-02-14 株式会社東芝 樹脂絶縁型半導体装置の製造方法
US5260601A (en) * 1988-03-14 1993-11-09 Texas Instruments Incorporated Edge-mounted, surface-mount package for semiconductor integrated circuit devices
DE3813435A1 (de) * 1988-04-21 1989-11-02 Siemens Ag Bauelement in chip-bauweise zum befestigen auf einer schaltplatte, mit einem elektrischen oder elektronischen funktionskoerper
JPH02202046A (ja) * 1989-01-31 1990-08-10 Mitsui High Tec Inc リードフレームおよびこれを用いた半導体装置の製造方法
JPH02278857A (ja) * 1989-04-20 1990-11-15 Fujitsu Ltd 樹脂封止型半導体装置
JP2875334B2 (ja) * 1990-04-06 1999-03-31 株式会社日立製作所 半導体装置
US5202288A (en) * 1990-06-01 1993-04-13 Robert Bosch Gmbh Method of manufacturing an electronic circuit component incorporating a heat sink
US5089877A (en) * 1990-06-06 1992-02-18 Sgs-Thomson Microelectronics, Inc. Zero power ic module
JP2895920B2 (ja) * 1990-06-11 1999-05-31 株式会社日立製作所 半導体装置及びその製造方法
JP2839941B2 (ja) * 1990-07-26 1998-12-24 株式会社日立製作所 半導体装置
EP0503072B1 (de) * 1990-09-10 1997-12-17 Fujitsu Limited Halbleiteranordnung und ihr herstellungsverfahren
JPH04317363A (ja) * 1991-04-16 1992-11-09 Sony Corp ダイパッドレス樹脂封止型半導体装置とその製造方法
US5176255A (en) * 1991-06-19 1993-01-05 North American Specialties Corporation Lead frame for integrated circuits or the like and method of manufacture
US5221812A (en) * 1991-06-28 1993-06-22 Vlsi Technology, Inc. System for protecting leads to a semiconductor chip package during testing, burn-in and handling
KR940006083B1 (ko) * 1991-09-11 1994-07-06 금성일렉트론 주식회사 Loc 패키지 및 그 제조방법
JPH05144992A (ja) * 1991-11-18 1993-06-11 Mitsubishi Electric Corp 半導体装置およびその製造方法ならびにその製造に使用されるリードフレームおよびその製造方法
JPH05175405A (ja) * 1991-12-20 1993-07-13 Kawasaki Steel Corp 半導体チップのパッケージ
JP3075617B2 (ja) * 1991-12-25 2000-08-14 株式会社日立製作所 半導体集積回路装置
JP3055581B2 (ja) * 1992-02-25 2000-06-26 日立電線株式会社 半導体装置
JPH06169051A (ja) * 1992-11-27 1994-06-14 Sumitomo Special Metals Co Ltd リードフレームとその製造方法並びに半導体パッケージ
JP2809115B2 (ja) * 1993-10-13 1998-10-08 ヤマハ株式会社 半導体装置とその製造方法
TW270213B (de) * 1993-12-08 1996-02-11 Matsushita Electric Industrial Co Ltd
KR970010676B1 (ko) * 1994-03-29 1997-06-30 엘지반도체 주식회사 반도체 패키지 및 이에 사용되는 리드 프레임
JPH08264685A (ja) * 1995-03-27 1996-10-11 Toshiba Corp 樹脂封止型半導体装置及びその製造方法
JPH10163400A (ja) * 1996-11-28 1998-06-19 Nitto Denko Corp 半導体装置及びそれに用いる２層リードフレーム

Also Published As

Publication number Publication date
EP0657931B1 (de) 1999-11-10
US5998866A (en) 1999-12-07
TW270213B (de) 1996-02-11
KR0140675B1 (ko) 1998-06-01
DE69421592D1 (de) 1999-12-16
DE69421592T2 (de) 2000-04-06
EP0657931A1 (de) 1995-06-14
US5776802A (en) 1998-07-07
KR950021448A (ko) 1995-07-26

Similar Documents

Publication Publication Date Title
CN1109217A (zh) 半导体装置及其制造方法
CN1107349C (zh) 一种半导体器件引线框架及引线接合法
CN1185698C (zh) 半导体装置及其制造方法、电路板以及电子设备
CN1283004C (zh) 半导体装置及其制造方法、线路基板及电子机器
CN1047470C (zh) 半导体器件
CN1160932A (zh) 半导体器件
US6114750A (en) Surface mount TO-220 package and process for the manufacture thereof
US20140167237A1 (en) Power module package
CN86101795A (zh) 半导体器件及其生产方法，以及上述工艺所用的引线框架
CN1992362A (zh) 光半导体器件以及其制造方法
CN1471730A (zh) 电子线路装置及其制造方法
US20140110833A1 (en) Power module package
CN1848427A (zh) 电子装置及其制造方法
CN1812091A (zh) 半导体装置
CN1191629C (zh) 引线框、半导体装置及其制造方法、电路基板和电子装置
CN1574312A (zh) 树脂密封型半导体装置及其制造方法
JPS6132452A (ja) リ−ドフレ−ムとそれを用いた電子装置
JP2003037298A (ja) 面実装型ｌｅｄランプ
US10453780B2 (en) Electronic circuit, production method thereof, and electronic component
CN1790687A (zh) 树脂密封半导体器件、具有管芯垫的引线框及其制造方法
CN1121720C (zh) 塑封半导体器件及其制造方法
CN1314119C (zh) 半导体装置及其制造方法、电路板和电子仪器
CN108417394A (zh) 一种贴片式电容器
JP2677967B2 (ja) 半導体装置の製造方法
JP2904175B2 (ja) 集積回路装置の実装構造および集積回路実装用ケース

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication