CN1118868C - 半导体器件及其制造方法 - Google Patents

半导体器件及其制造方法 Download PDF

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Publication number: CN1118868C
Authority: CN; China
Prior art keywords: film; oxide film; field; electrode; oxidation
Prior art date: 1997-06-27
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

CN98105764A

Other languages

English (en)

Chinese (zh)

Other versions

CN1204146A (zh

Inventor

前田茂伸

岩松俊明

前川繁登

一法师隆志

山口泰男

平野有一

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Mitsubishi Electric Corp

Original Assignee

Mitsubishi Electric Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1997-06-27

Filing date

1998-03-23

Publication date

2003-08-20

1998-03-23 Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp

1999-01-06 Publication of CN1204146A publication Critical patent/CN1204146A/zh

2003-08-20 Application granted granted Critical

2003-08-20 Publication of CN1118868C publication Critical patent/CN1118868C/zh

2018-03-23 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/01—Manufacture or treatment
- H10W10/051—Manufacture or treatment of isolation region based on field-effect
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W10/00—Isolation regions in semiconductor bodies between components of integrated devices
- H10W10/50—Isolation regions based on field-effect

Landscapes

Element Separation (AREA)
Thin Film Transistor (AREA)
Insulated Gate Type Field-Effect Transistor (AREA)

CN98105764A 1997-06-27 1998-03-23 半导体器件及其制造方法 Expired - Fee Related CN1118868C (zh)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP171773/1997		1997-06-27
JP9171773A JPH1117000A (ja)	1997-06-27	1997-06-27	半導体装置およびその製造方法
JP171773/97		1997-06-27

Publications (2)

Publication Number	Publication Date
CN1204146A CN1204146A (zh)	1999-01-06
CN1118868C true CN1118868C (zh)	2003-08-20

Family

ID=15929421

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
CN98105764A Expired - Fee Related CN1118868C (zh)	1997-06-27	1998-03-23	半导体器件及其制造方法

Country Status (7)

Country	Link
US (1)	US6191450B1 (2)
JP (1)	JPH1117000A (2)
KR (1)	KR100257594B1 (2)
CN (1)	CN1118868C (2)
DE (1)	DE19805692C2 (2)
FR (2)	FR2765396B1 (2)
TW (1)	TW357433B (2)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP3594779B2 (ja)	1997-06-24	2004-12-02	株式会社ルネサステクノロジ	半導体装置の製造方法
US7163851B2 (en) *	2002-08-26	2007-01-16	International Business Machines Corporation	Concurrent Fin-FET and thick-body device fabrication
US7638841B2 (en)	2003-05-20	2009-12-29	Fairchild Semiconductor Corporation	Power semiconductor devices and methods of manufacture
CN103199017B (zh) *	2003-12-30	2016-08-03	飞兆半导体公司	形成掩埋导电层方法、材料厚度控制法、形成晶体管方法
JP2007220755A (ja) *	2006-02-14	2007-08-30	Toshiba Corp	半導体装置及びその製造方法
JP5499455B2 (ja) *	2007-10-22	2014-05-21	株式会社デンソー	ＳＯＩ（Ｓｉｌｉｃｏｎｏｎｉｎｓｕｌａｔｏｒ）構造の半導体装置およびその製造方法
DE102009023420B3 (de) *	2009-05-29	2011-01-20	Texas Instruments Deutschland Gmbh	Verfahren zur Herstellung einer Halbleitervorrichtung und Halbleitervorrichtung (z.B. Doppelgate-Transistor)
AU2010226940C1 (en) *	2010-10-02	2011-07-14	Bui, Dac Thong Mr	Auto switch MOS-FET
CN103545194B (zh) *	2013-10-11	2018-03-02	中国电子科技集团公司第十三研究所	射频功率vdmosfet屏蔽栅结构的制作方法

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4686000A (en) *	1985-04-02	1987-08-11	Heath Barbara A	Self-aligned contact process
JP2505736B2 (ja) *	1985-06-18	1996-06-12	キヤノン株式会社	半導体装置の製造方法
US4843023A (en) *	1985-09-25	1989-06-27	Hewlett-Packard Company	Process for forming lightly-doped-drain (LDD) without extra masking steps
US4818715A (en) *	1987-07-09	1989-04-04	Industrial Technology Research Institute	Method of fabricating a LDDFET with self-aligned silicide
US4786609A (en) *	1987-10-05	1988-11-22	North American Philips Corporation, Signetics Division	Method of fabricating field-effect transistor utilizing improved gate sidewall spacers
US4922311A (en) *	1987-12-04	1990-05-01	American Telephone And Telegraph Company	Folded extended window field effect transistor
US5304829A (en) *	1989-01-17	1994-04-19	Kabushiki Kaisha Toshiba	Nonvolatile semiconductor device
US5814869A (en) *	1992-01-28	1998-09-29	Thunderbird Technologies, Inc.	Short channel fermi-threshold field effect transistors
US5367186A (en) *	1992-01-28	1994-11-22	Thunderbird Technologies, Inc.	Bounded tub fermi threshold field effect transistor
JPH06302779A (ja)	1993-04-09	1994-10-28	Nippon Steel Corp	半導体装置及びその製造方法
JPH07201967A (ja)	1993-12-28	1995-08-04	Nippon Steel Corp	半導体装置の製造方法
JPH07283300A (ja)	1994-04-01	1995-10-27	Nippon Steel Corp	半導体装置及びその製造方法
US5641989A (en)	1994-06-03	1997-06-24	Nippon Steel Corporation	Semiconductor device having field-shield isolation structures and a method of making the same
JPH0831928A (ja)	1994-07-12	1996-02-02	Nippon Steel Corp	半導体装置の製造方法
US5640032A (en)	1994-09-09	1997-06-17	Nippon Steel Corporation	Non-volatile semiconductor memory device with improved rewrite speed
JPH08162523A (ja)	1994-12-06	1996-06-21	Nippon Steel Corp	半導体装置及びその製造方法
EP0718881B1 (en)	1994-12-20	2003-07-16	STMicroelectronics, Inc.	Isolation by active transistors with grounded gates
JPH0927600A (ja)	1995-07-07	1997-01-28	Nippon Steel Corp	半導体装置およびその製造方法
US5783469A (en) *	1996-12-10	1998-07-21	Advanced Micro Devices, Inc.	Method for making nitrogenated gate structure for improved transistor performance

1997
- 1997-06-27 JP JP9171773A patent/JPH1117000A/ja active Pending
- 1997-10-27 TW TW086115830A patent/TW357433B/zh active
- 1997-12-08 KR KR1019970066589A patent/KR100257594B1/ko not_active Expired - Fee Related
- 1997-12-15 US US08/990,285 patent/US6191450B1/en not_active Expired - Fee Related
1998
- 1998-01-21 FR FR9800606A patent/FR2765396B1/fr not_active Expired - Fee Related
- 1998-02-12 DE DE19805692A patent/DE19805692C2/de not_active Expired - Fee Related
- 1998-03-23 CN CN98105764A patent/CN1118868C/zh not_active Expired - Fee Related
2001
- 2001-01-31 FR FR0101304A patent/FR2803095B1/fr not_active Expired - Fee Related

Also Published As

Publication number	Publication date
JPH1117000A (ja)	1999-01-22
FR2803095A1 (fr)	2001-06-29
DE19805692C2 (de)	2001-04-26
DE19805692A1 (de)	1999-01-07
FR2765396B1 (fr)	2001-06-22
FR2803095B1 (fr)	2004-12-10
CN1204146A (zh)	1999-01-06
US6191450B1 (en)	2001-02-20
FR2765396A1 (fr)	1998-12-31
TW357433B (en)	1999-05-01
KR100257594B1 (ko)	2000-06-01
KR19990006291A (ko)	1999-01-25

Legal Events

Date	Code	Title	Description
1998-09-16	C10	Entry into substantive examination
1998-09-16	SE01	Entry into force of request for substantive examination
1999-01-06	C06	Publication
1999-01-06	PB01	Publication
2003-08-20	C14	Grant of patent or utility model
2003-08-20	GR01	Patent grant
2010-08-04	C17	Cessation of patent right
2010-08-04	CF01	Termination of patent right due to non-payment of annual fee	Granted publication date: 20030820

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