CN112567523B - 显示装置及其制造方法 - Google Patents

显示装置及其制造方法 Download PDF

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Publication number
CN112567523B
CN112567523B CN201980054133.8A CN201980054133A CN112567523B CN 112567523 B CN112567523 B CN 112567523B CN 201980054133 A CN201980054133 A CN 201980054133A CN 112567523 B CN112567523 B CN 112567523B
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China
Prior art keywords
substrate
light emitting
inorganic light
encapsulation layer
viscoelastic material
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CN201980054133.8A
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English (en)
Chinese (zh)
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CN112567523A (zh
Inventor
朴元淳
李泽模
尹正勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority claimed from PCT/KR2019/010405 external-priority patent/WO2020040483A1/fr
Publication of CN112567523A publication Critical patent/CN112567523A/zh
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins

Landscapes

  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
CN201980054133.8A 2018-08-20 2019-08-16 显示装置及其制造方法 Active CN112567523B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR10-2018-0097032 2018-08-20
KR20180097032 2018-08-20
KR10-2019-0089452 2019-07-24
KR1020190089452A KR102766461B1 (ko) 2018-08-20 2019-07-24 디스플레이 장치 및 그 제조 방법
PCT/KR2019/010405 WO2020040483A1 (fr) 2018-08-20 2019-08-16 Appareil d'affichage et son procédé de fabrication

Publications (2)

Publication Number Publication Date
CN112567523A CN112567523A (zh) 2021-03-26
CN112567523B true CN112567523B (zh) 2024-12-13

Family

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Family Applications (1)

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CN201980054133.8A Active CN112567523B (zh) 2018-08-20 2019-08-16 显示装置及其制造方法

Country Status (3)

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EP (1) EP3811414A4 (fr)
KR (1) KR102766461B1 (fr)
CN (1) CN112567523B (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102717583B1 (ko) * 2020-04-24 2024-10-16 삼성전자주식회사 디스플레이 모듈 및 이를 포함하는 디스플레이 장치
KR20220017070A (ko) * 2020-08-04 2022-02-11 삼성전자주식회사 디스플레이 장치
KR20230000611A (ko) * 2021-06-25 2023-01-03 삼성전자주식회사 디스플레이 모듈을 포함하는 디스플레이 장치 및 그 제조 방법
CN115939287A (zh) * 2021-08-24 2023-04-07 成都辰显光电有限公司 发光器件的修复装置和修复方法
CN114023780B (zh) * 2021-09-24 2025-07-18 重庆康佳光电科技有限公司 显示装置的修复方法
US20230282787A1 (en) * 2022-03-06 2023-09-07 Seoul Viosys Co., Ltd. Light emitting device and display apparatus
CN116053387A (zh) * 2023-03-07 2023-05-02 惠科股份有限公司 显示面板制作方法与显示面板
KR102798156B1 (ko) * 2023-06-01 2025-04-17 주식회사 레다즈 디스플레이 장치 및 디스플레이 장치의 리워크 방법
TWI867739B (zh) * 2023-09-08 2024-12-21 友達光電股份有限公司 顯示裝置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205723618U (zh) * 2016-05-30 2016-11-23 弗洛里光电材料（苏州）有限公司 荧光胶膜及封装结构

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5805117A (en) * 1994-05-12 1998-09-08 Samsung Electronics Co., Ltd. Large area tiled modular display system
KR20100083392A (ko) * 2009-01-13 2010-07-22 삼성에스디아이 주식회사 발광 장치 및 이를 구비한 표시 장치
JP2011151268A (ja) * 2010-01-22 2011-08-04 Sharp Corp 発光装置
KR101439426B1 (ko) * 2013-01-07 2014-09-16 에스케이씨 주식회사 태양전지용 봉지재 시트 및 이를 이용한 태양전지 모듈
US9111464B2 (en) * 2013-06-18 2015-08-18 LuxVue Technology Corporation LED display with wavelength conversion layer
CN106189251A (zh) * 2015-05-29 2016-12-07 弗洛里光电材料（苏州）有限公司 应用于半导体封装的有机硅组合物及其应用
KR102396325B1 (ko) * 2015-10-12 2022-05-13 삼성전자주식회사 엘이디 디스플레이 장치의 광학 부재 및 엘이디 디스플레이 장치
JP6446507B2 (ja) * 2017-06-16 2018-12-26 株式会社ジャパンディスプレイ 表示装置の製造方法
TWI635470B (zh) 2017-07-04 2018-09-11 PlayNitride Inc. 發光模組及顯示裝置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN205723618U (zh) * 2016-05-30 2016-11-23 弗洛里光电材料（苏州）有限公司 荧光胶膜及封装结构

Also Published As

Publication number Publication date
KR20200021399A (ko) 2020-02-28
CN112567523A (zh) 2021-03-26
EP3811414A1 (fr) 2021-04-28
EP3811414A4 (fr) 2021-08-18
KR102766461B1 (ko) 2025-02-13

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