CN112917618A - Low-formaldehyde high-quality solid wood composite floor and processing technology - Google Patents
Low-formaldehyde high-quality solid wood composite floor and processing technology Download PDFInfo
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- CN112917618A CN112917618A CN202110115236.XA CN202110115236A CN112917618A CN 112917618 A CN112917618 A CN 112917618A CN 202110115236 A CN202110115236 A CN 202110115236A CN 112917618 A CN112917618 A CN 112917618A
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- formaldehyde
- adhesive film
- low
- film paper
- solid wood
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- 239000002023 wood Substances 0.000 title claims abstract description 48
- WSFSSNUMVMOOMR-UHFFFAOYSA-N formaldehyde Substances O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 title claims abstract description 45
- 239000002131 composite material Substances 0.000 title claims abstract description 34
- 239000007787 solid Substances 0.000 title claims abstract description 34
- 239000002313 adhesive film Substances 0.000 claims abstract description 45
- 239000003292 glue Substances 0.000 claims abstract description 43
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 24
- 238000007731 hot pressing Methods 0.000 claims description 22
- 238000003825 pressing Methods 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000001816 cooling Methods 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000010422 painting Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000004838 Heat curing adhesive Substances 0.000 claims 7
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 43
- 230000000694 effects Effects 0.000 abstract description 11
- 229920001807 Urea-formaldehyde Polymers 0.000 abstract description 8
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 abstract description 8
- 230000007613 environmental effect Effects 0.000 abstract description 5
- 238000005336 cracking Methods 0.000 abstract description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 27
- 238000010438 heat treatment Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 6
- 238000004321 preservation Methods 0.000 description 6
- 239000011148 porous material Substances 0.000 description 4
- 239000012466 permeate Substances 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D1/00—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring
- B27D1/04—Joining wood veneer with any material; Forming articles thereby; Preparatory processing of surfaces to be joined, e.g. scoring to produce plywood or articles made therefrom; Plywood sheets
- B27D1/06—Manufacture of central layers; Form of central layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27D—WORKING VENEER OR PLYWOOD
- B27D3/00—Veneer presses; Press plates; Plywood presses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
- B27M—WORKING OF WOOD NOT PROVIDED FOR IN SUBCLASSES B27B - B27L; MANUFACTURE OF SPECIFIC WOODEN ARTICLES
- B27M3/00—Manufacture or reconditioning of specific semi-finished or finished articles
- B27M3/04—Manufacture or reconditioning of specific semi-finished or finished articles of flooring elements, e.g. parqueting blocks
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
- E04F15/04—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members
- E04F15/041—Flooring or floor layers composed of a number of similar elements only of wood or with a top layer of wood, e.g. with wooden or metal connecting members with a top layer of wood in combination with a lower layer of other material
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Forests & Forestry (AREA)
- Architecture (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a low-formaldehyde high-quality solid wood composite floor and a processing technology thereof, and the solid wood composite floor comprises a substrate (1), wherein the back surface of the substrate (1) is connected with a back plate (3) through first thermosetting adhesive film paper (2), and the front surface of the substrate (1) is connected with a panel (5) through second thermosetting adhesive film paper (4); the substrate (1) comprises a core board (101), and the front surface and the back surface of the core board (101) are respectively provided with a single board (102). The invention can effectively relieve the cracking problem of the surface plate of the whole core plate when in use and reduce the formaldehyde emission of the floor; on the basis, stable gluing of MDI formaldehyde-free glue can be realized by optimizing the processing technology, compared with the existing gluing technology using urea formaldehyde glue or formaldehyde-free glue, the method can conveniently control the technology and reduce the required gluing procedures, and further has the characteristics of high structural stability, good environmental protection effect and convenient processing.
Description
Technical Field
The invention relates to a solid wood composite floor, in particular to a low-formaldehyde high-quality solid wood composite floor.
Background
Traditional solid wood composite floor divide into rib core floor and whole wood core floor, wherein rib core floor compares whole wood core floor owing to have better structural stability, is difficult to appear warping, fracture and the problem of rise layer, consequently more extensive by the user selection. However, the rib core floor has the disadvantage that the problem of rib marks is easy to appear on the surface of the floor after the floor is used for a long time, and the use requirements of users are difficult to meet. Therefore, how to improve the structural strength and stability of the whole wood core floor and enable the whole wood core floor to replace the rib core floor becomes a problem which needs to be solved urgently by floor manufacturers at present.
On the other hand, in the existing solid wood composite floor, all layers of veneers are bonded by urea-formaldehyde glue, and once the urea-formaldehyde glue is coated, formaldehyde is released, so that pollutant emission in the subsequent process and the use process of the floor is caused, and the emission standard of the floor is reduced. In order to solve the problem, although zero-emission aldehyde-free glue is developed on the market, the aldehyde-free glue has higher requirement on the control precision of process parameters in the floor gluing process, so that the adhesion stability of the aldehyde-free glue is easily reduced due to the fact that the aldehyde-free glue is not controlled in place, and the aldehyde-free glue is difficult to popularize in the composite floor processing process.
In addition, the floor is glued by urea-formaldehyde glue or formaldehyde-free glue, the floor is required to be pre-pressed and hot-pressed by a plurality of stations in the processing process, and the conventional pre-pressing time is 60-90 min in summer and 90-120 min in winter, so that the consumed time is long; thereby reducing the processing efficiency of the floor and increasing the complexity of the process.
Therefore, the existing solid wood composite floor has the problems of low structural stability, poor environmental protection effect and difficult processing.
Disclosure of Invention
The invention aims to provide a low-formaldehyde high-quality solid wood composite floor and a processing technology thereof. The novel environment-friendly plastic pipe has the characteristics of high structural stability, good environment-friendly effect and convenience in processing.
The technical scheme of the invention is as follows: a low-formaldehyde high-quality solid wood composite floor comprises a substrate, wherein the back surface of the substrate is connected with a back plate through first thermosetting adhesive film paper, and the front surface of the substrate is connected with a face plate through second thermosetting adhesive film paper; the base plate comprises a core plate, and the front surface and the back surface of the core plate are respectively provided with a single plate.
In the low-formaldehyde high-quality solid wood composite floor, the front surface and the back surface of the core plate are connected with the veneer through the MDI formaldehyde-free glue layer.
In the low-formaldehyde high-quality solid wood composite floor, the thickness of the core plate is 6-8 mm, and the thickness of the single plate is 2-3 mm.
In the low-formaldehyde high-quality solid wood composite floor, the thickness of the back plate is 0.7-1 mm, and the thickness of the panel is 1-2.5 mm.
In the low-formaldehyde high-quality solid wood composite floor, the wood grain directions of the core board, the face board and the back board are longitudinal, and the wood grain directions of the two single boards are transverse.
In the low-formaldehyde high-quality solid wood composite floor, the first thermosetting adhesive film paper and the second thermosetting adhesive film paper are both thermosetting adhesive film paper, and the thickness of the first thermosetting adhesive film paper and the thickness of the second thermosetting adhesive film paper are 0.6-0.7 mm.
The processing technology of the low-formaldehyde high-quality solid wood composite floor comprises the following steps:
a. coating MDI (diphenylmethane diisocyanate) aldehyde-free glue on the surfaces of two sides of the core plate, and gluing and prepressing the core plate and the two veneers to obtain a substrate A;
b. sequentially assembling the back plate, the first thermosetting adhesive film paper, the substrate A, the second thermosetting adhesive film paper and the panel from bottom to top, and then heating and hot-pressing the assembled components for 1-2 minutes to obtain a green board B;
c. naturally cooling the element plates B, and stacking for 3-7 days to obtain element plates C;
d. and sequentially grooving and surface painting the plain boards C to obtain the finished floor.
In the processing technology of the low-formaldehyde high-quality solid wood composite floor, the gluing prepressing temperature in the step a is normal temperature, and the gluing prepressing time is 30-60 minutes.
In the processing process of the low-formaldehyde high-quality solid wood composite floor, the specific steps of the step a are as follows:
a1. preserving the temperature of the core board at 70 ℃ for 5-10 minutes to obtain an A1 core board;
a2. heating MDI formaldehyde-free glue to 50-60 ℃, and coating the heated MDI formaldehyde-free glue on the surfaces of two sides of an A1 core plate to obtain an A2 core plate;
a3. and adhering the two veneers to the upper side and the lower side of the A2 core plate respectively, and then gluing and pre-pressing at normal temperature for 30-60 minutes to obtain the A substrate.
In the processing technology of the low-formaldehyde high-quality solid wood composite floor, in the step b, the assembled green board is placed into a hot press, the temperature of the green board is raised through the hot press for hot pressing, and when the temperature of the green board is raised to 108-116 ℃, the hot pressing is completed.
Compared with the prior art, the invention has the following characteristics:
(1) the first thermosetting adhesive film paper and the second thermosetting adhesive film paper are matched to replace the prior urea-formaldehyde glue to glue the substrate, the back plate and the panel, so that a plurality of gluing processes required by the prior floor can be reduced into two processes of assembly and hot pressing, the difficulty of the processing process of the floor is effectively reduced, the gluing efficiency is improved, and the manufacturing efficiency is improved by more than 8 times compared with the prior gluing process utilizing liquid glue; the first thermosetting adhesive film paper and the second thermosetting adhesive film paper are in solid structures in a natural state, so that formaldehyde release before and after hot pressing and during daily use of the floor can be avoided, and the environmental protection effect of the floor is improved;
(2) by adopting the gluing mode of the thermosetting adhesive film paper, the thermosetting adhesive film paper can be firstly melted to form liquid adhesive in the heating and hot pressing process, and then the liquid adhesive penetrates into pores of the wood, and is cured at the temperature of 108-; under the process, the thermosetting adhesive film paper is changed into liquid and releases formaldehyde only in the process of temperature rise and hot pressing, so that the formaldehyde is effectively and conveniently collected and treated by manufacturers, and the environmental protection effect of the invention is further improved;
(3) the board bodies of all layers can be mutually restrained when being deformed by arranging the board bodies in the criss-cross mode in the grain direction, so that the integral deformation of the floor is reduced, and the structural stability of the floor is improved; the grain directions of the core plate, the back plate and the face plate are set to be longitudinal, so that the deformation coefficients of the core plate, the back plate and the face plate are relatively kept consistent, the internal stress generated when the floor is deformed is further reduced, and the probability of cracking of the back plate and the face plate is reduced;
(4) the core plate and the single plates at the two sides are glued by MDI formaldehyde-free glue, so that the formaldehyde emission of the floor can be further reduced; on the basis, the MDI formaldehyde-free glue can be kept in a liquid state in the coating and initial prepressing processes by the heat preservation process of coating the MDI formaldehyde-free glue on the core plate, so that the MDI formaldehyde-free glue can fully permeate into wood pores, and the MDI formaldehyde-free glue can be completely cured in the prepressing process by prepressing the core plate for 30-60 minutes at normal temperature, so that the gluing stability of the core plate is effectively improved, and the application of the MDI formaldehyde-free glue in the whole core plate process is realized;
(5) by optimizing the pre-pressing process of the MDI formaldehyde-free glue, the invention can realize the gluing effect on the core plate only by the pre-pressing process, thereby effectively reducing the hot-pressing process compared with the existing urea formaldehyde glue pressing process, reducing the process complexity and the process cost of the invention and facilitating the processing of manufacturers;
(6) through the matching, the formaldehyde emission of the floor board can reach 0.029mg/m in daily use3Below, the level E1 criterion, which is much lower than the standard;
therefore, the invention has the characteristics of high structural stability, good environmental protection effect and convenient processing.
Drawings
Fig. 1 is a schematic structural view of the present invention.
The labels in the figures are: 1-substrate, 2-first thermosetting adhesive film paper, 3-back plate, 4-second thermosetting adhesive film paper, 5-face plate, 101-core plate, 102-single plate and 103-MDI formaldehyde-free adhesive layer.
Detailed Description
The invention is further illustrated by the following figures and examples, which are not to be construed as limiting the invention.
Example 1. A low-formaldehyde high-quality solid wood composite floor is composed as shown in figure 1, and comprises a substrate 1, wherein the back surface of the substrate 1 is connected with a back plate 3 through a first thermosetting adhesive film paper 2, and the front surface of the substrate 1 is connected with a face plate 5 through a second thermosetting adhesive film paper 4; the substrate 1 includes a core board 101, and both front and back surfaces of the core board 101 are provided with single boards 102.
The front surface and the back surface of the core plate 101 are connected with the veneer 102 through the MDI formaldehyde-free adhesive layer 103.
The thickness of the core board 101 is 6-8 mm, and the thickness of the veneer 102 is 2-3 mm.
The thickness of the back plate 3 is 0.7-1 mm, and the thickness of the face plate 5 is 1-2.5 mm.
The wood grain directions of the core board 101, the face board 5 and the back board 3 are longitudinal (consistent with the length direction of the floor), and the wood grain directions of the two single boards 102 are transverse.
The first thermosetting adhesive film paper 2 and the second thermosetting adhesive film paper 4 are both thermosetting adhesive film paper, and the thickness of the first thermosetting adhesive film paper 2 and the thickness of the second thermosetting adhesive film paper 4 are 0.6-0.7 mm.
The processing technology of the low-formaldehyde high-quality solid wood composite floor comprises the following steps:
a. coating MDI (diphenylmethane diisocyanate) aldehyde-free glue on the surfaces of two sides of the core plate, and gluing and prepressing the core plate and the two veneers to obtain a substrate A;
b. sequentially assembling the back plate, the first thermosetting adhesive film paper, the substrate A, the second thermosetting adhesive film paper and the panel from bottom to top, and then heating and hot-pressing the assembled components for 1-2 minutes to obtain a B plain plate;
c. naturally cooling the element plates B, and stacking for 3-7 days to obtain element plates C;
d. and sequentially grooving and surface painting the plain boards C to obtain the finished floor.
And (c) the gluing prepressing temperature in the step a is normal temperature, and the gluing prepressing time is 30-60 minutes.
And b, putting the assembled green board into a hot press, heating and hot-pressing the green board through the hot press, and finishing hot pressing after the temperature of the green board is increased to 108-116 ℃.
The working principle of the invention is as follows: according to the invention, the thermosetting adhesive film paper is used for replacing the existing urea-formaldehyde glue to glue the substrate 1, the back plate 3 and the face plate 5, so that the process steps and process time required by the composite floor during hot-pressing gluing can be effectively reduced, and the hot-pressing efficiency of the floor is further improved; meanwhile, the thermosetting adhesive film paper is in a solid state before treatment and after hot pressing, so that compared with urea-formaldehyde glue, the formaldehyde emission of the floor can be reduced, and the environment-friendly effect of the floor is improved. Through the limitation to the texture direction of each plate body, on one hand, the textures of the adjacent plate bodies can be crisscrossed, so that the plate bodies can be mutually restrained when being deformed along the texture direction, and further the integral deformation of the floor is relieved. On the other hand, because the grain directions of the core board 101, the back board 3 and the face board 5 are the same, the deformation coefficients of the inner board and the face board are similar, thereby avoiding the problem of cracking or extrusion cracking caused by the difference of the deformation of the inner layer and the outer layer when the floor board is deformed by the external environment, and further improving the structural stability of the invention.
Example 2. A low-formaldehyde high-quality solid wood composite floor is composed as shown in figure 1, and comprises a substrate 1, wherein the back surface of the substrate 1 is connected with a back plate 3 through a first thermosetting adhesive film paper 2, and the front surface of the substrate 1 is connected with a face plate 5 through a second thermosetting adhesive film paper 4; the substrate 1 comprises a core board 101, and both the front and back surfaces of the core board 101 are provided with single boards 102; the melting points of the first thermosetting adhesive film paper 2 and the second thermosetting adhesive film paper 4 are both 25-30 ℃, and the curing temperature is 108-116 ℃.
The front surface and the back surface of the core plate 101 are connected with the veneer 102 through the MDI formaldehyde-free adhesive layer 103.
The thickness of the core board 101 is 6-8 mm, and the thickness of the veneer 102 is 2-3 mm.
The thickness of the back plate 3 is 0.7-1 mm, and the thickness of the face plate 5 is 1-2.5 mm.
The wood grain directions of the core board 1, the face board 5 and the back board 3 are longitudinal (consistent with the length direction of the floor), and the wood grain directions of the two single boards 102 are transverse.
The first thermosetting adhesive film paper 2 and the second thermosetting adhesive film paper 4 are both thermosetting adhesive film paper, and the thickness of the first thermosetting adhesive film paper 2 and the thickness of the second thermosetting adhesive film paper 4 are 0.6-0.7 mm.
The processing technology of the low-formaldehyde high-quality solid wood composite floor comprises the following steps:
a. coating MDI (diphenylmethane diisocyanate) aldehyde-free glue on the surfaces of two sides of the core plate, and gluing and prepressing the core plate and the two veneers to obtain a substrate A;
b. sequentially assembling the back plate, the first thermosetting adhesive film paper, the substrate A, the second thermosetting adhesive film paper and the panel from bottom to top, and then heating and hot-pressing the assembled components for 1-2 minutes to obtain a green board B;
c. naturally cooling the element plates B, and stacking for 3-7 days to obtain element plates C;
d. and sequentially grooving and surface painting the plain boards C to obtain the finished floor.
The specific steps of the step a are as follows:
a1. preserving the temperature of the core board at 70 ℃ for 5-10 minutes to obtain an A1 core board;
a2. heating MDI formaldehyde-free glue to 50-60 ℃, and coating the heated MDI formaldehyde-free glue on the surfaces of two sides of an A1 core plate to obtain an A2 core plate;
a3. and adhering the two veneers to the upper side and the lower side of the A2 core plate respectively, and then gluing and pre-pressing at normal temperature for 30-60 minutes to obtain the A substrate.
And b, putting the assembled plain plate into a hot press, heating and hot-pressing the plain plate from the normal temperature through the hot press, heating to 90-100 ℃ within 1 minute, then quickly heating to 108-116 ℃ after heat preservation and hot pressing for 30 seconds, and finishing the hot pressing after heat preservation and hot pressing for 30 seconds.
The pre-pressing process of the MDI formaldehyde-free glue is further optimized according to the bonding effect of the MDI formaldehyde-free glue, the core plate is heated to the pre-pressing temperature higher than that of the MDI formaldehyde-free glue, so that the core plate and the MDI formaldehyde-free glue can be effectively prevented from being rapidly cooled in the process of cooling the core plate and the MDI formaldehyde-free glue together, the MDI formaldehyde-free glue is ensured to be completely permeated into wood pores, the bonding effect of the invention on the core plate is improved, and the control of a manufacturer on the MDI formaldehyde-free glue in the pre-pressing process is facilitated.
Meanwhile, in the heating and hot-pressing process of the plain board, the plain board is quickly heated to 90-100 ℃ and is subjected to heat preservation, so that the thermosetting adhesive film paper can be completely melted into a liquid state and permeates into wood pores in the heating and heat preservation processes; and then, the liquid glue can be completely cured at the temperature by heat preservation and hot pressing for 30 seconds, so that the gluing effect on the plain plate is ensured.
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110115236.XA CN112917618B (en) | 2021-01-28 | 2021-01-28 | Low-formaldehyde high-quality solid wood composite floor and processing technology |
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| CN202110115236.XA CN112917618B (en) | 2021-01-28 | 2021-01-28 | Low-formaldehyde high-quality solid wood composite floor and processing technology |
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| Publication Number | Publication Date |
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| CN112917618A true CN112917618A (en) | 2021-06-08 |
| CN112917618B CN112917618B (en) | 2023-03-17 |
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Cited By (4)
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| CN113668287A (en) * | 2021-09-09 | 2021-11-19 | 永清霍尔茨门业有限公司 | Production method of super-soft fireproof plate |
| CN114311180A (en) * | 2022-01-13 | 2022-04-12 | 本溪市地板厂（普通合伙） | Solid wood composite floor and preparation method thereof |
| CN114571812A (en) * | 2022-04-02 | 2022-06-03 | 德尔未来科技控股集团股份有限公司 | Spareribs wood core composite floor and preparation method thereof |
| CN115972334A (en) * | 2022-12-21 | 2023-04-18 | 大亚人造板集团有限公司 | A kind of preparation method of high thermal conductivity heat-spreading floor base material |
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| Publication number | Publication date |
|---|---|
| CN112917618B (en) | 2023-03-17 |
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