CN113906830A - 电路板及电子设备 - Google Patents

电路板及电子设备 Download PDF

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Publication number
CN113906830A
CN113906830A CN201980097033.3A CN201980097033A CN113906830A CN 113906830 A CN113906830 A CN 113906830A CN 201980097033 A CN201980097033 A CN 201980097033A CN 113906830 A CN113906830 A CN 113906830A
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pin group
signal
signal line
chip
group
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CN201980097033.3A
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CN113906830B (zh
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熊琳
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Dram (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

本申请提供一种电路板及电子设备，该电路板用于连接第一芯片和第二芯片，所述电路板包括：两层布线层；所述两层布线层上布置有第一引脚组和第二引脚组，所述第一引脚组用于为所述第一芯片内部的多个功能区提供访问接口，所述第二引脚组用于所述第二芯片内部的多个功能区提供访问接口；所述两层布线层上还布置有信号线、地线以及电源线；其中，所述信号线用于连接所述第一芯片和所述第二芯片对应功能区的引脚，单根所述信号线的两侧分别相邻布置有所述地线。在满足芯片之间正常连接以及传输速率要求的同时，还有效地降低了实现芯片之间连接功能的电路板的制造成本。

Description

PCT国内申请，说明书已公开。

Claims (11)

  1. PCT国内申请，权利要求书已公开。
CN201980097033.3A 2019-06-11 2019-06-11 电路板及电子设备 Active CN113906830B (zh)

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PCT/CN2019/090732 WO2020248125A1 (zh) 2019-06-11 2019-06-11 电路板及电子设备

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CN113906830A true CN113906830A (zh) 2022-01-07
CN113906830B CN113906830B (zh) 2024-04-12

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WO (1) WO2020248125A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115510801B (zh) * 2022-10-18 2024-12-27 中科可控信息产业有限公司 一种数据传输系统、方法、装置及存储介质

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007458A (ja) * 1999-06-18 2001-01-12 Matsushita Electric Ind Co Ltd 差動平衡信号伝送基板
CN102630118A (zh) * 2011-02-07 2012-08-08 索尼公司 层叠的布线板
CN106104792A (zh) * 2014-03-24 2016-11-09 技术研究组合光电子融合基盘技术研究所 用于将ic芯片搭载在基板上的基板上的焊盘阵列结构、以及具有该焊盘阵列结构的光模块
US20170062021A1 (en) * 2006-02-10 2017-03-02 Renesas Electronics Corporation Data processing device
CN108566724A (zh) * 2018-06-13 2018-09-21 晶晨半导体（深圳）有限公司 Ddr存储器的布线板、印刷电路板及电子装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003224408A (ja) * 2002-01-30 2003-08-08 Kyocera Corp 高周波用配線基板
JP2006041193A (ja) * 2004-07-27 2006-02-09 Sharp Corp フレキシブル配線板、電子機器、ならびに配線配置方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001007458A (ja) * 1999-06-18 2001-01-12 Matsushita Electric Ind Co Ltd 差動平衡信号伝送基板
US20170062021A1 (en) * 2006-02-10 2017-03-02 Renesas Electronics Corporation Data processing device
CN102630118A (zh) * 2011-02-07 2012-08-08 索尼公司 层叠的布线板
CN106104792A (zh) * 2014-03-24 2016-11-09 技术研究组合光电子融合基盘技术研究所 用于将ic芯片搭载在基板上的基板上的焊盘阵列结构、以及具有该焊盘阵列结构的光模块
CN108566724A (zh) * 2018-06-13 2018-09-21 晶晨半导体（深圳）有限公司 Ddr存储器的布线板、印刷电路板及电子装置

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WO2020248125A1 (zh) 2020-12-17
CN113906830B (zh) 2024-04-12

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