CN1139103C - Cover tape for chip transportation and sealed structure - Google Patents

Abstract

A covering adhesive tape for chip transportation, which is bonded to a carrier tape that forms a plurality of chip receiving parts at a certain interval in the length direction, and seals the sealing chip receiving parts, wherein the covering tape includes a tape-shaped base The material and the pressure-sensitive adhesive portion are laminated on one surface of the tape-shaped base material so that the pressure-sensitive adhesive portion does not face the chip receiving portion. It avoids the separation of the covering tape from the carrier tape due to the difference in heat shrinkage ratio when using polystyrene carrier tapes, and avoids the formation of adhesive residues on the carrier tape when using quite high polarity carrier tapes thing.

Description

Covering Tapes and Sealing Structures for Chip Shipping

The present invention relates to a covering tape that can be used to seal carrier tapes for individual packaging small products (hereinafter also referred to as "chips"), such as small electronic components, without making them contact each other. Storage, transportation and automatic removal of chips. Furthermore, the present invention also relates to a sealing structure using the above-mentioned covering tape.

In recent years, the miniaturization of electronic components such as resistors, capacitors and integrated circuits into chips has progressed very rapidly. Therefore, various methods that can simultaneously store, transport and automatically take out chips have been proposed, and among them, the method using a carrier tape is considered to be the most promising.

Conventional carrier tape methods are classified into two methods of using a substrate having through holes as a carrier tape and using a substrate having recessed portions as a carrier tape.

In the method using a through-holed carrier tape, a plurality of through-holes at given intervals are provided by punching or otherwise forming a plurality of through-holes at given intervals in a carrier tape consisting of, for example, a cardboard strip, so as to provide receiving locations. In addition, a plurality of feeding holes are also provided on the carrier belt. The base tape is bonded to one side surface of the carrier tape, and each small electronic component or other chip is placed in the receiving part. Then, a covering tape is laminated on the other side surface of the carrier tape, thereby sealing the chip in the receiving site.

In the method of using a base material having depressed portions as a carrier tape, a carrier tape made by providing a plurality of depressed portions at given intervals on a belt-like plastic tape as accommodating portions is used, and further in Multiple feed holes are provided on the plastic belt. Small electronic components or other chips are placed in the receptacle, and the covering tape is then laminated to the carrier tape, thereby sealing the chip in the receptacle.

Covering tape is used in both methods. The covering tape employed above includes a tape-shaped base material and adhesive layers placed on both edges of one side of the belt-shaped base material in the lengthwise direction. The tape-shaped substrate consists, for example, of polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyvinyl chloride, nylon or an ionomer. A conventional general-purpose acrylic, polyester or rubber pressure-sensitive adhesive is used as the above-mentioned adhesive layer. Furthermore, the carrier tape with recesses consists, for example, of polystyrene, polycarbonate, polyvinyl chloride or an amorphous polyethylene terephthalate.

However, with the above-mentioned conventional covering tape and carrier tape, there is a problem that the covering tape peels off and separates (wrinkles) from the carrier tape during transportation due to the environment in which it is transported, and the When the cover tape is peeled off the carrier tape, the adhesive is transferred to the side of the carrier tape (adhesive residue forms on the carrier tape side).

For example, cover tapes and carrier tapes are exposed to high temperatures (eg, 50°C or higher, often 70°C or higher) when transported in sunlight or at sea. In such a high temperature environment, the polystyrene tape typically used as a carrier tape shrinks by about 2%. On the other hand, the shrinkage ratio of polyethylene terephthalate used as a base material for the cover tape is 0.1% or less, and therefore, a difference in shrinkage ratio occurs between the cover tape and the carrier tape. As a result, the covering tape is too long and peels off from the carrier tape so that the covering tape and the carrier tape are separated from each other.

The above-mentioned problems can be solved by increasing the adhesive strength of the adhesive layer of the covering tape. However, the increased bond strength introduces the problem that, when using carrier tapes of rather high polarity (such as polycarbonate, polyvinyl chloride, or amorphous polyethylene terephthalate), the Adhesive residue will occur. If the adhesive remains on the carrier tape, a malfunction occurs when the chip is loaded, and the adhesive sticks to the winder, so that the winding operation cannot be performed smoothly when the carrier tape is wound up after use. Moreover, there is also a disadvantage that the carrier tape cannot be used repeatedly.

The inventors of the present invention have conducted extensive and intensive studies to solve the above-mentioned problems. As a result, it was found that the above-mentioned problems can be solved by using a specific silicone pressure-sensitive adhesive for the adhesive layer of the covering tape. It is on the basis of this discovery that the present invention has been accomplished.

Japanese Patent No. 2,500,879 discloses a cover tape using a silicone pressure sensitive adhesive. However, this patent does not disclose a phenyl-containing silicone pressure sensitive adhesive which is necessary for the present invention.

In addition, when the polydimethylsiloxane pressure-sensitive adhesive described in Japanese Patent No. 2,500,879 is used for covering the tape, an expensive release agent (such as fluorosilicone release agent) must be used on the covering tape. mold agent). If a common release agent is used, a large unwinding force is required when unwinding and sealing the cover tape to the carrier tape, thereby increasing the load on the sealing device.

The present invention has been achieved after taking the above prior art into consideration. It is an object of the present invention to avoid, when using polystyrene carrier tapes, peeling or separation of the covering tape from the carrier tape due to differences in thermal shrinkage ratio. A second object of the invention is to avoid adhesive residues on the carrier tape when using rather high polarity carrier tapes such as polycarbonate, polyvinyl chloride or amorphous polyethylene terephthalate tapes thing. Still another object of the present invention is to ensure a small unwinding force irrespective of the type of release agent used, so as to reduce the load on the sealing device and perform efficient sealing.

The covering adhesive tape for chip transport of the present invention is an adhesive tape bonded to the surface of the carrier tape, and the carrier tape forms a plurality of receiving parts for the chip at a certain interval in its length direction, and the covering tape includes a strip-shaped base material and the pressure-sensitive adhesive portion laminated on one side of the tape-shaped substrate so that the pressure-sensitive adhesive portion does not face the chip receiving portion,

The above-mentioned pressure-sensitive adhesive part comprises a silicone pressure-sensitive adhesive and a crosslinking agent (C) capable of crosslinking the adhesive,

The silicone pressure-sensitive adhesives described above include:

(A) silicone resin component and

(B) a silicone rubber component having the following structural formula: Wherein R ¹ , R ² , R ³ and R ⁴ may be the same or different from each other, and they may be methyl, ethyl or propyl;

Any one of X and Y is a hydroxyl group, and the other is a hydroxyl group, hydrogen or an alkyl group with 1-13 carbon atoms;

R ^l , R ^m , R ⁿ , R ^l , R ^m and R ^n' are independently phenyl, alkyl having 1-13 carbon atoms, CF ₃ CH ₂ CH ₂ - or vinyl, as long as R ^l , R At least one of ^m , ^Rn , Rl ^' , Rm ^' and ^Rn' is 1-30% of the total amount of Rl, ^Rm , ^Rn , Rl ^' , ^{Rm' and Rn'} (mole) of phenyl; and

x, y and z are independently integers within 1-10.

In the present invention, the probe take energy value of the pressure-sensitive adhesive portion is preferably within 2.0×10 ^-3 to 1.0×1- ^-1 N·m.

In addition, in the cover tape for chip transport of the present invention, the surface of the base material having no pressure-sensitive adhesive portion is preferably applied with a release agent layer.

Sealing structure of the present invention comprises:

A carrier tape having a plurality of chip receiving locations spaced apart in the longitudinal direction,

a plurality of chips disposed in the chip receiving location, and

Covering tape for chip shipping that can seal the chip receiving part,

Wherein the covering tape for chip transportation is the above-mentioned covering tape for chip transportation of the present invention.

The invention as described above prevents separation of the covering tape from the carrier tape due to the difference in thermal shrinkage ratio when the polystyrene carrier tape is used. In addition, the invention avoids the formation of adhesive residues on the carrier tape when using relatively high polarity carrier tapes such as polycarbonate, polyvinyl chloride or amorphous polyethylene terephthalate tapes. The invention also ensures a low unwinding force regardless of the release agent used, thereby reducing the load on the sealing device and allowing the sealing operation to be performed efficiently.

1-3 are partial cross-sectional perspective views of the covering tape for chip transportation of the present invention;

Fig. 4 is a schematic diagram of a sealing structure of the present invention; Fig. 5 is a schematic diagram of another sealing structure of the present invention.

Hereinafter, the covering tape for chip transport of the present invention will be described in detail with reference to the examples shown in the drawings. The covering adhesive tape for chip transportation of the present invention is bonded to one surface of the carrier tape (the carrier tape is formed at a certain interval in the length direction to accommodate many parts of the chip) when in use, thereby using the covering adhesive tape Seal the chip receiving site.

Figures 1 to 3 are schematic partial cross-sectional views of some forms of covering tapes for chip transport according to the present invention. Figures 4 and 5 illustrate the use of the covering tape having the structure of Figure 1 .

Referring to Figs. 1 to 3, the covering adhesive tape for chip transportation of the present invention comprises a tape-shaped substrate 1 and a pressure-sensitive adhesive layer 2 laminated on one surface of the tape-shaped substrate 1 along the two edges in the longitudinal direction, so that the pressure-sensitive The adhesive layer 2 is exposed. Specifically, strips of the pressure-sensitive adhesive layer 2 may be provided on both edges of the substrate 1 along the length direction, as shown in FIG. 1 . In addition, the substrate 1 may be provided with strips of the pressure-sensitive adhesive layer 2 on both edges along the length direction, and a non-adhesive portion 3 may be inserted in the middle of the pressure-sensitive adhesive layer 2, as shown in FIG. 2 . Also, the pressure-sensitive adhesive layer 2 may be provided on the entire surface of one side of the substrate 1, and the non-adhesive portion 3 covers the middle portion of the pressure-sensitive adhesive layer 2, as shown in FIG. The non-adhesive portion 3 may be provided by coating and applying a non-adhesive resin and then making it into a film, or separately first preparing a non-adhesive resin film and then laminating it.

The tape-shaped substrate 1 is preferably transparent. The adoption of the transparent substrate facilitates confirmation of placed chips, thereby reducing errors in chip loading.

Various synthetic resins can be used as the material of the base material 1 . Preferred examples include oriented polyethylene terephthalate (PET), oriented polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), oriented poly Propylene (PP), oriented polyamide, oriented polyvinyl chloride (PVC), polystyrene (PS), polycarbonate (PC), polyethylene (PE) and polyacrylonitrile (PAN). Also, laminated films made from these polymers can be used as the substrate 1 . Among the above-mentioned polymers, oriented polyethylene terephthalate (PET), oriented polybutylene terephthalate (PBT) and polyethylene naphthalate (PEN) are examples of the present invention. particularly good.

The thickness of the base material is preferably between 6-200 μm, more preferably between 10-100 μm.

An antistatic agent can be mixed into the substrate 1, or one or both sides of the substrate 1 can be coated with an antistatic agent.

When using a covering tape without antistatic treatment, the degree of static electricity peeled off during unwinding is very high, sometimes damaging the performance of electronic components. However, damage to electronic components caused by static electricity can be avoided by adopting the above-mentioned antistatic treatment.

A pressure-sensitive adhesive layer 2 is formed on one surface of a substrate 1 . Although the thickness of the pressure-sensitive adhesive layer 2 is not particularly limited, it is preferably about 5-50 µm, more preferably 10-30 µm.

The pressure-sensitive adhesive layer 2 contains a silicone pressure-sensitive adhesive comprising (A) a silicone resin component and a crosslinking agent capable of crosslinking the adhesive. (B) Silicone rubber component.

Silicone whose structural unit is selected from R ₃ SiO _1/2 , R ₂ SiO, RSiO _3/2 and SiO ₂ units (R of the former is independently methyl, ethyl, propyl, phenyl or vinyl) can be used An oxane resin is used as the silicone resin component (A), without other specific limitations.

The silicone rubber component (B) has the following structural formula: Wherein R ¹ , R ² , R ³ and R ⁴ may be the same or different, and they may be methyl, ethyl or propyl. Of these groups, methyl and ethyl are preferred.

Either one of X and Y is hydroxy, and the other is hydroxy, hydrogen or an alkyl group having 1 to 13 carbon atoms. Alkyl can be, for example, methyl or ethyl. When at least one of X and Y is a hydroxyl group, a condensation reaction occurs between the silicone resin component (A) and the silicone rubber component (B), or the silicone rubber component (B) itself condenses with each other .

R ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' are independently phenyl, alkyl having 1-13 carbon atoms, CF ₃ CH ₂ CH ₂ - or vinyl. Alkyl is, for example, methyl, ethyl or propyl.

At least one of R ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' is phenyl. The molar percentage of phenyl is 1-30% in every 100% of the total moles of R ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' , preferably 3-25%, 5-20% is more preferred. When the phenyl content on the side chain of the silicone rubber component (B) is less than 1% by mole, its affinity with silicone resins or long-chain alkyl resins generally used as release agents is very high, making it difficult to unwind the tape from the roll. On the other hand, when the phenyl group content exceeds 30% by mole, the reactivity between the silicone resin component (A) and the silicone rubber component (B) decreases, thereby making the pressure-sensitive adhesive sticky. Insufficient synergy.

In addition, at least one of R ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' is preferably a vinyl group. The content of the vinyl group is preferably in the range of 0.01-10 mole % per 100 mole % of the total of R ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' , or 0.03-5 % (mole) is preferable, and 0.05-3 (mole) is more preferable. When the functional group in the crosslinking agent (C) described below is a hydroxyl group, a vinyl group is preferably used.

In formula (I), each of x, y and z is independently an integer within 1-10, preferably 2-9.

When the silicone rubber component (B) has a vinyl group as its functional group, a siloxane component with hydrogen at both ends can be used as a crosslinking agent (C), and the siloxane component has the following structural formula express: Wherein each R independently represents a methyl group, an ethyl group or a propyl group, and n is an integer within 3-20.

When the above-mentioned crosslinking agent is used, hydrogen undergoes an addition reaction with the vinyl group of the silicone rubber component (B), thereby improving the adhesive force of the pressure-sensitive adhesive. The addition reaction can be carried out in the presence of a platinum catalyst to speed up the reaction.

In addition, a crosslinked structure can be formed by crosslinking the side chain alkyl groups of the silicone resin component (A) and the silicone rubber component (B) with each other using a peroxide as a crosslinking agent (C). Examples of suitable peroxides include benzoyl peroxide, di-t-butyl peroxide and dicumyl peroxide. When using these peroxides, heating is carried out at relatively high temperatures (eg, about 120-180°C). Therefore, it is advisable to use a heat-resistant substrate. The ratio (A/B, weight ratio) of the silicone resin component (A) to the silicone resin component (B) should be between 70/30 and 30/70, preferably 60/40 to 50/50 .

The ratio of crosslinking agent (C) to the sum of silicone resin component (A) and silicone rubber component (B) (C/A+B, weight ratio) should be between 0.01/100 and 10/100 , preferably 0.1/100 to 5/100.

Silicone pressure-sensitive adhesive can be produced by simply mixing silicone resin component (A) and silicone rubber component (B) as main components, or by mixing them in the presence of a condensation reaction catalyst It is produced by dehydrogenating the terminal hydroxyl group (OH) of silicone rubber and the hydroxyl group of silicone resin. In the former method, the adhesion at high temperature is poor. In the latter method, however, the adhesion can be improved by dehydrocondensation.

The pressure-sensitive adhesive layer 2 can be produced by applying a pressure-sensitive adhesive-forming coating solution containing silicone oxide including the above-mentioned components (A) and (B) on the substrate 1. alkane pressure-sensitive adhesive and crosslinker (C), and then heat the coated substrate for a short time.

This heating step is preferably carried out in the temperature range of 60-180°C (preferably 80-130°C, more preferably 90-120°C) for a period of time (depending on the heating temperature, usually 0.5-3 minutes, 1- 2 minutes is preferred).

The probe viscous energy value of the pressure-sensitive adhesive layer 2 should be between 2.0×10 ^-3 -1.0×10 ^-1 N·m, preferably 3.0×10 ^-3 -0.5×10 ^-2 N·m, 5.0 ×10 ^-3 -3.0×10 ^-2 N·m is more preferable.

The probe viscous energy value is measured by the following method. The load curve is obtained by using a device to measure the load applied to the probe tip of the probe tack tester specified in ASTM D2979 as a function of time, peeling the probe and the test sample from each other at a fixed speed. Determine the value of the area enclosed between the load curve and the time axis (that is, the distance axis) as the value of the viscous energy of the probe.

When the probe viscous energy value is less than 2.0×10 ⁻³ N·m, the adhesive strength between the pressure-sensitive adhesive and the carrier tape is insufficient, and peeling/separation (wrinkling) may occur when stored at a high temperature. On the other hand, when the viscous energy value of the probe exceeds 1.0×10 ⁻¹ N·m, adhesive residues are formed on the carrier tape after the cover tape is separated.

Moreover, the pressure-sensitive adhesive layer 2 of the present invention may contain different amounts of Tackifying resins, pigments, dyes, defoamers, preservatives, etc. that will adversely affect the purpose of the present invention. These other components are preferably used in an amount of about 0.01 to 20 parts by weight per 100 parts by weight of the silicone pressure sensitive adhesive main component, but the amount may also vary according to each specific component.

In the covering tape for chip shipping of the present invention, a release layer may be provided on one surface of the substrate 1 (the surface on which the pressure-sensitive adhesive layer 2 is not provided). The release layer can be composed of dimethylsiloxane, fluorosilicone or other fluorinated resins or long chain alkyl resins. Dimethicone or long chain alkyl release agents are usually used because fluorosilicone release agents are very expensive. It is difficult to use conventional silicone pressure sensitive adhesives when using dimethyl silicone release agents. The reason for this may be that the composition of the release agent is very close to that of the pressure-sensitive adhesive, thus creating a strong bond between them. However, in the present invention, by introducing a phenyl group on the side chain of the silicone pressure-sensitive adhesive, it is possible to use an inexpensive and easy-to-handle dimethylsiloxane release agent with the silicone pressure-sensitive adhesive. Mixture layers are used in combination.

Also, antistatic treatment may be performed on the base material 1 and the release layer. This can be achieved by coating antistatic agents comprising carbon, metals, metal oxides, cationic, anionic, nonionic, organic polymer conductors, and the like. Likewise, one surface of the substrate can be corona treated to enhance the bond between the substrate and the pressure sensitive adhesive.

The covering tape for chip transport of the present invention can be produced, for example, by the following steps.

In the preparation of the adhesive tape having the structure of Fig. 1, first, the surface of the base material 1 is subjected to a release treatment using, for example, a roll coater or a gravure coater. Then, the pressure-sensitive adhesive layer 2 is applied to both edges in the lengthwise direction of the other side of the substrate using, for example, a roll coater or a knife coater. Alternatively, the die shipping cover tape of the present invention may be prepared by applying multiple stripes of pressure-sensitive adhesive by coating along the length of the sheet, and then Cut the pressure sensitive adhesive strips.

In preparing the adhesive tape having the structure of FIG. 2 , the adhesive tape can be obtained by coating and drying the applied non-adhesive resin while applying the pressure-sensitive adhesive layer 2 .

In preparing the adhesive tape having the structure of Fig. 3, the adhesive tape can be prepared by forming a pressure-sensitive adhesive layer 2 on the entire surface of the adhesive tape opposite to the release-treated surface, and then applying a non-adhesive resin to the pressure-sensitive adhesive tape. The surface of the adhesive layer is applied to the middle portion of the adhesive tape and dried, or a non-adhesive resin film prepared in advance is laminated on the adhesive tape.

Even if a polystyrene carrier tape is used, the above-mentioned covering tape 10 for chip transport of the present invention can be effectively bonded to the carrier tape, so that unfavorable separation of the covering tape and the carrier tape due to the difference in thermal shrinkage ratio can be avoided. . Furthermore, the formation of adhesive residues on the carrier tape can be avoided when using relatively high polarity carrier tapes such as polycarbonate, polyvinyl chloride or amorphous polyethylene terephthalate tapes.

The covering tape for chip shipping of the present invention can be used, for example, as a sealing structure without any special modification to conventional tape carrier systems.

When adopting the base material that is provided with recessed part as carrier tape (referring to Fig. 4), the sealing structure that interior accommodates a plurality of electronic components can be obtained like this: provide carrier tape 12, and this adhesive tape is provided with a plurality of intervals between them. A plastic tape is used to form the recessed part of the receiving part and provided with feeding holes 13, and then chips 14 (such as small electronic components) are placed in the receiving part, and then laminated and sealed with covering tape 10.

In systems using a carrier tape provided with through holes (see FIG. 5 ), the sealing structure can be obtained by providing a carrier tape 15 (for example, providing a plurality of through holes punched at regular intervals with punched holes to form accommodating locations). thick paper strips, wherein a plurality of feed holes 13 are additionally provided), secondly the base tape is connected to one face of the carrier tape 15, then the chip 14 (such as a small electronic component) is placed in the holding position, and then the A cover tape 10 is laminated on the other side of the carrier tape 15 to seal the chip inside.

The foregoing describes the covering tape for chip transport and the sealing structure according to the present invention, however, it does not limit the scope of the present invention. It should be understood that partial changes, additions and the like are also within the scope of the present invention. For example, the material of the base material is not limited to the above-mentioned kind, and it may be changed as long as the change does not adversely affect the object of the present invention. In addition, the chip placed in the carrier tape accommodation is not limited to small electronic components, it can also be small mechanical parts, tablets or the like.

It is apparent from the foregoing that the present invention not only prevents peeling or separation of the covering tape from the carrier tape during transportation at high temperatures, but also avoids the formation of adhesive residues on the carrier tape. Therefore, the present invention provides a sealing structure that can stably transport electronic components in large quantities. Also, in the present invention, regardless of the type of release agent used, a small unwinding force can be ensured, thereby reducing the load on the sealing device and effectively performing the sealing operation.

The present invention will be described in more detail below with reference to the following examples, which do not limit the scope of the present invention. In the following examples and comparative examples, "tape peeling", "adhesive residue", "adhesive strength", "probe viscous energy value", "peel strength" and "tape unwinding property" were used in the following method to test or observe.

"Tape Peeling"

The covering tapes for chip transport obtained in the respective Examples and Comparative Examples were bonded to polystyrene carrier tapes, and allowed to stand at 70° C. for 24 hours. Then, visually inspect the covering tape for peeling.

"Adhesive Residue"

After observing the above-mentioned "tape peeling", the cover tape was peeled off from the carrier tape. Visually inspect the polystyrene carrier tape for adhesive residue.

"Adhesive Strength"

The covering tapes obtained in the respective Examples and Comparative Examples were wound into a wound body. The cover tape was then bonded to each carrier tape and allowed to stand for 20 minutes at 23° C. and 65% relative humidity. Then, the adhesive strength was measured with a general-purpose tensile testing machine at a peeling speed of 300 mm/min and a peeling angle of 180°.

"Probe Viscous Energy Value"

The probe viscous energy value is obtained by contacting the test sample (10 mm × 10 mm) with a probe with a diameter of 5 mm (all probes of the probe viscous test machine specified in ASTM D2979) for 60 seconds, and then at 1 mm/min A load curve is obtained by peeling the sample off the probe at a rate of 100 ft using a device that measures the load applied to the probe as a function of time. Determine the value of the area enclosed between the load curve and the time axis (that is, the distance axis) as the value of the viscous energy of the probe.

"Peel Strength"

The peel strength of the 25 mm wide laminates used in the Examples and Comparative Examples, which were passed through the A release layer composed of a release agent and a release agent is laminated to a pressure-sensitive adhesive sheet composed of a base material and a pressure-sensitive adhesive.

"Tape Unwinding Performance"

For the wound body of the covering tape obtained in each of Examples and Comparative Examples, unwinding of the tape was performed with a sealing device (ETM-104, manufactured by Shibuya Kogyo K.K.). When the tape was unwound without any problem, the evaluation was marked "A", and when the tape could not be unwound, the evaluation was marked "B".

Example 1

[Preparation of Coating Liquid for Forming Silicone Pressure-Sensitive Adhesive]

In toluene/xylene solvent at 125°C, make 59 parts by weight of (CH ₃ ) ₃ SiO _1/2 units and SiO ₂ units (the ratio of [(CH ₃ ) ₃ SiO _1/2 ] to [SiO ₂ ] is 0.7) silicone resin (as silicone resin component) and 41 parts by weight of silicone rubber (phenyl content: 15% (mol), vinyl content: 0.1% (mol), terminal hydroxyl content: 0.001% (mole), terminal hydrogen content: 0.001% (mole)) (as a silicone rubber component) mixed, in the presence of NaOH catalyst, the terminal hydroxyl group of the silicone resin and the terminal hydroxyl group of the silicone rubber A condensation reaction occurs. Thus a silicone pressure sensitive adhesive was synthesized.

Then, 0.5 parts by weight of a silicone crosslinking agent (XC90-B0368, manufactured by Toshiba Silicone Co., Ltd.) containing a platinum catalyst and having hydrogen at both terminals was added to the silicone pressure-sensitive adhesive.

[Manufacture of covering tape for chip transportation]

Dimethicone release treatment was performed on one surface of a polyethylene terephthalate (PET) film having a thickness of 25 μm, and the coating solution prepared above was applied on the opposite surface , so that the coating thickness after drying is 30 μm. The width of the portion coated with the pressure-sensitive adhesive was 1 mm, and the width of the portion not coated with the pressure-sensitive adhesive was 7.3 mm. The thus-coated film was heated at 120° C. for 1 minute, and cut into a width of 9.3 mm so that both edges had 1 mm-wide pressure-sensitive adhesive-coated portions. In this way, the covering tape for chip transport shown in FIG. 1 was obtained.

The adhesive strength of the covering tape thus obtained to each glued body was measured. The results are listed in Table 1.

In addition, "Tape Peeling", "Adhesive Residue" and "Probe Viscous Energy Value" were evaluated by the methods described above. The results are listed in Table 2.

Table 3 shows the evaluation results of "peel strength" and "tape unwinding property".

Comparative Example 1

The same operations and evaluations were carried out as in Example 1, except that the silicone pressure-sensitive adhesive was replaced by an acrylic pressure-sensitive adhesive (based on butyl acrylate/hydroxyethyl acrylate copolymer). The results are listed in Tables 1-3.

Example 2

The covering tape was obtained by the method of Example 1, except that the dimethylsiloxane release treatment was replaced by the long-chain alkyl release treatment. The results of the ratings for "peel strength" and "tape unwinding properties" are listed in Table 3.

Comparative Example 2

The covering tape was obtained by the method of Comparative Example 1, except that the release treatment of dimethylsiloxane was replaced by long-chain alkyl release treatment. Table 3 shows the evaluation results of "peel strength" and "tape unwinding property".

Comparative Example 3

A covering tape was obtained by the method of Comparative Example 1, except that the acrylic pressure-sensitive adhesive was replaced by polydimethylsiloxane pressure-sensitive adhesive. Table 3 shows the evaluation results of "peel strength" and "tape unwinding property".

Comparative Example 4

A covering tape was obtained by the method of Comparative Example 2, except that the acrylic pressure-sensitive adhesive was replaced by polydimethylsiloxane pressure-sensitive adhesive. Table 3 shows the evaluation results of "peel strength" and "tape unwinding property".

Table 1: Adhesive strength to the coated body (grams) Colloid P.S. pvc A-PET PC PP Example 1 45 42 44 47 44 Comparative Example 1 30 88 5 95 5 PS: polystyrene (surface tension: 35 dyne/cm) PVC: polyvinyl chloride (surface tension: 45 dyne/cm) A-PET: amorphous polyethylene terephthalate (surface tension: 40 Dyne/cm) PC: Polycarbonate (Surface Tension: 40 Dyne/cm) PP: Polypropylene (Surface Tension: 33 Dyne/cm)

Table 2 Probing Viscous Energy Values Peeling of covering tape (with or without) Adhesive residue (with or without) Example 1 7.8×10 ^-3 No No Comparative Example 1 1.5×10 ^-3 have No

table 3 Peel Strength (g/25mm) Unwind performance Example 1 10 A Example 2 130 A Comparative Example 1 5 A Comparative Example 2 320 B Comparative Example 3 500 or more B Comparative Example 4 500 or more B

Claims (4)

1. A covering adhesive tape for chip transportation, which is bonded to the surface of a carrier tape that forms a plurality of chip receiving parts at certain intervals in the length direction, and as a result seals each chip receiving part, wherein said Covering tape comprising a tape-shaped substrate and a pressure-sensitive adhesive portion laminated on one surface of the tape-shaped substrate, the pressure-sensitive adhesive portion not facing the chip receiving portion, The pressure-sensitive adhesive part comprises a silicone pressure-sensitive adhesive and a crosslinking agent (C) capable of crosslinking the adhesive, The silicone pressure sensitive adhesive comprises: (A) silicone resin component and (B) a silicone rubber component having the following structural formula:

Wherein R ¹ , R ² , R ³ and R ⁴ may be the same or different from each other, and may be methyl, ethyl or propyl; Any one of X and Y is a hydroxyl group, and the other is a hydroxyl group, hydrogen or an alkyl group with 1-13 carbon atoms; R ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' are each independently phenyl, alkyl having 1-13 carbon atoms, CF ₃ CH ₂ CH ₂ - or vinyl, as long as R At least one of ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' is phenyl, and the percentage of phenyl is per 100% of R ^l , R ^m , R ⁿ , R ^l' , R ^m' and R ^n' molar totals have 1-30% phenyl; x, y and z are all independently integers within 1-10. 2. The covering tape for chip transport according to claim 1, wherein the probe viscosity energy value of the pressure-sensitive adhesive portion is 2.0×10 ⁻³ to 1.0×10 ⁻¹ N·m. 3. The covering tape for chip transport according to claim 1 or 2, wherein a release agent layer is provided on the surface of the substrate on which the pressure-sensitive adhesive is not provided. 4. A sealing structure comprising: a carrier tape having a plurality of chip receiving locations spaced apart in the length direction, a plurality of chips disposed in the chip receiving location, and Covering tape for chip shipping that can seal the chip receiving part, Wherein the covering tape for chip transport is the covering tape required by any one of claims 1 to 3.

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