CN114864458A

CN114864458A - Wafer cassette, wafer transfer apparatus, control method, electrical apparatus, and storage medium

Info

Publication number: CN114864458A
Application number: CN202210575366.6A
Authority: CN
Inventors: 张原�; 杨青峰; 潘国瑞; 崔智敏; 韩宁宁
Original assignee: Shenzhen Sking Intelligent Equipment Co Ltd
Current assignee: Shenzhen Sking Intelligent Equipment Co Ltd
Priority date: 2022-05-24
Filing date: 2022-05-24
Publication date: 2022-08-05
Anticipated expiration: 2042-05-24
Also published as: CN114864458B

Abstract

The embodiment of the application discloses a wafer box, wafer carrying equipment, a control method, electrical equipment and a storage medium. The wafer box comprises a bearing piece and a light source, wherein the bearing piece comprises two side plate parts and a plurality of bearing plates which are oppositely arranged, an accommodating space and a taking and placing opening which is positioned at one side of the accommodating space are formed between the two side plate parts, the accommodating space is used for accommodating a plurality of wafers, the plurality of bearing plates are connected to one side of the two side plate parts, which is close to the accommodating space, and the two adjacent bearing plates and the side plate parts jointly form an accommodating groove; and the light source is arranged on one side of the accommodating space, which is far away from the taking and placing port, and one side of the at least one side plate part, which is close to the accommodating groove, and is used for emitting light towards the accommodating groove.

Description

Wafer cassette, wafer transfer apparatus, control method, electrical apparatus, and storage medium

Technical Field

The application relates to the technical field of semiconductors, in particular to a wafer box, wafer carrying equipment, a control method, electrical equipment and a storage medium.

Background

In the process of semiconductor packaging and testing, wafers need to be transported among different devices to perform operations such as scribing, probe detection or die bonding, and automatic wafer transportation and detection become important links in the process flow of semiconductor manufacturing. Different wafer operation process equipment requires different sizes, surface quality and grain yield of supplied wafers, the wafers are influenced by environment and operation in the storage, transportation and carrying operation processes, and certain damage and defective rate exist, so that the problems that the conventional wafer taking and placing processes cannot carry out clear force sensing, counting and the like all bring challenges to accurate alignment, carrying and automatic operation of the wafers.

Disclosure of Invention

The embodiment of the application discloses a wafer box, wafer carrying equipment, a control method, electrical equipment and a storage medium, and aims of accurate alignment, carrying and automatic operation of wafers can be achieved.

On one hand, the embodiment of the application discloses a wafer box, which comprises a bearing piece and a light source, wherein the bearing piece comprises two side plate parts and a plurality of bearing plates which are oppositely arranged, an accommodating space and a pick-and-place opening which is positioned at one side of the accommodating space are arranged between the two side plate parts, the accommodating space is used for accommodating a plurality of wafers, the bearing plates are connected to one side of the two side plate parts, which is close to the accommodating space, and the two adjacent bearing plates and the side plate parts jointly form an accommodating groove for accommodating the edges of the wafers; and the light source is arranged on one side of the accommodating space, which is far away from the taking and placing port, and one side of the at least one side plate part, which is close to the accommodating groove, and is used for emitting light towards the accommodating groove.

Compared with the prior art, the wafer box that this application provided is through accommodation space keeps away from get one side and at least one of putting the mouth the curb plate portion is close to one side of accomodating the groove sets up the light source can accomodate the groove and accomodate during the wafer, the partial light quilt of light source the wafer shelters from, another partial light directive of light source get and put the mouth, thereby make light and shade contrast in the wafer box is stronger, the more clear observation of being convenient for in the wafer box the situation of depositing of wafer.

According to an embodiment of the application, the light source including set up in accommodation space keeps away from get the first light source of putting one side of mouth, set up in one the curb plate is close to the second light source of holding groove one side and sets up in another the curb plate is close to the third light source of holding groove one side. Through setting up first light source, second light source with the third light source can make light in the wafer box shines more evenly, and it is difficult for producing the shadow influence to the observation of depositing of wafer.

According to an embodiment of the present application, the first light source includes a light emitting plate connected between the two side plate portions for emitting light toward the access opening side via the accommodating space; the number of the second light sources, the number of the third light sources and the number of the receiving grooves are all multiple, and each of the second light sources and each of the third light sources are used for emitting light towards the corresponding receiving groove. Through setting up the first light source includes the luminescent plate, every the second light source and every the third light source is used for the orientation to correspond it is luminous to accomodate the groove, makes the light source is right accommodation space forms the C type and gives out light, more matches the shape of wafer is difficult for producing the shadow, is convenient for more clear observation in the wafer box the condition of depositing of wafer.

According to an embodiment of the application, hold carrier still includes the backplate portion, the backplate portion is connected in two the curb plate portion is kept away from the one end of taking and putting the mouth, the quantity of light source is a plurality ofly, the quantity of accomodating the groove is a plurality of, every the light source corresponds one accomodate the groove setting and including set up in the backplate portion is close to accommodation space one side first light source, set up in one the curb plate portion is close to accomodate groove one side the second light source with set up in another the curb plate portion is close to accomodate groove one side the third light source. Through set up in back plate portion is close to accommodation space one side first light source, set up in one the curb plate portion is close to accomodate groove one side the second light source with set up in another the curb plate portion is close to accomodate groove one side the third light source is used for the orientation to correspond it is luminous to accomodate the groove, makes the light source is right accommodation space forms the C type and gives out light, more matches the shape of wafer is difficult for producing the shadow, is convenient for clearer observation among the wafer box the condition of depositing of wafer.

According to an embodiment of the application, the first light source, the second light source and the third light source emit light independently and/or at least two of the first light source, the second light source and the third light source are connected in one body and emit light simultaneously.

According to an embodiment of the application, the first light source, the second light source and the third light source each comprise a light-emitting surface corresponding to a side surface of the wafer, and the height of the top of the light-emitting surface is higher than that of the top of the corresponding wafer; the back plate part is an arc-shaped plate protruding towards the outside of the accommodating space or the surface of the back plate part close to the accommodating space is an arc-shaped surface protruding towards the outside of the accommodating space. By arranging that the first light source, the second light source and the third light source respectively comprise light-emitting surfaces corresponding to the side surfaces of the wafer, the height of the top of each light-emitting surface is higher than that of the top of the corresponding wafer, when the wafer is irradiated by the light source, partial light of the light source is shielded by the wafer, another part of the light can be emitted to the fetching and placing port, so that a user or other operation equipment can conveniently and clearly observe the wafer storage condition in the wafer box from the fetching and placing port, simultaneously, through setting up the backplate portion is for facing the outer bellied arc of accommodation space or the backplate portion is close to accommodation space's surface is for facing the outer bellied arc surface of accommodation space, can with the shape of wafer more matches, is more convenient for deposit of wafer.

In a second aspect, an embodiment of the present application further discloses a wafer carrying apparatus, which includes the wafer cassette, the carrying module, the vision sensing module and the control module according to any one of the above embodiments; the carrying module is used for acquiring or placing the wafer from the pick-and-place opening; the visual sensing module is used for shooting the accommodating space at one side of the pick-and-place port and outputting a first shot image; and the control module is electrically connected with the carrying module and the visual sensing module and used for receiving and controlling the carrying module to carry out alignment according to the first shot image and controlling the carrying module to carry out the acquisition or placement of the wafer after the alignment is finished.

Compared with the prior art, the wafer carrying equipment provided by the application is through get and put mouthful one side and shoot accommodation space and output first shooting image make control module group basis first shooting image control carry out counterpointing of transport module, and control the transport module carries out acquireing or placing of wafer, the realization is right the accurate counterpoint and the snatching of the wafer in the wafer box to the realization is to accurate transport and the automation mechanized operation of wafer.

In three aspects, the embodiment of the application also discloses a wafer handling control method, which comprises the following steps:

providing a wafer box, wherein the wafer box adopts the wafer box in any one of the embodiments;

when the light source emits light, acquiring a first shot image of the accommodating space shot at one side of the taking and placing opening;

controlling the carrying module to carry out alignment according to the first shot image; and

and after the alignment is finished, controlling the carrying module to acquire or place the wafer.

Compared with the prior art, the wafer carrying control method provided by the application acquires a first shooting image of the accommodating space shot on one side of the taking and placing port when the light source faces the accommodating space to emit light, and controls the carrying module to align according to the first shooting image, so that the wafer is acquired or placed, the wafer in the wafer box is accurately aligned and grabbed, and the accurate carrying and automatic operation of the wafer are realized.

In a fourth aspect, an embodiment of the present application further discloses an electrical device, where the electrical device includes a memory and a processor, where the memory stores computer-readable instructions, and the computer-readable instructions, when executed by the processor, cause the processor to implement the wafer handling control method according to any one of the above aspects.

In a fifth aspect, an embodiment of the present application further discloses a computer-readable storage medium, on which computer-readable instructions are stored, and when the computer-readable instructions are executed by a processor, the method for controlling wafer handling according to any one of the above aspects is implemented.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.

FIG. 1 is a schematic perspective view of a wafer handling apparatus according to one embodiment of the present invention;

fig. 2 is a schematic perspective view of a wafer cassette according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of the wafer pod of FIG. 2;

FIG. 4 is a top view of the wafer pod of FIG. 2;

fig. 5 is a top view of a wafer cassette according to another embodiment of the present invention;

fig. 6 is a perspective view of a carrying module according to an embodiment of the present invention;

FIG. 7 is a flowchart illustrating a wafer handling control method according to an embodiment of the present invention;

FIG. 8 is a flowchart illustrating operation of a wafer handling apparatus using the wafer handling control method of FIG. 5 according to one embodiment of the present disclosure;

FIG. 9 is a partial flowchart of a wafer handling apparatus employing the wafer handling control method of FIG. 5 in accordance with one embodiment of the present disclosure;

FIG. 10 is a schematic structural diagram of an electrical apparatus disclosed in one embodiment of the present invention;

fig. 11 is a schematic structural diagram of a computer-readable storage medium according to an embodiment of the disclosure.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

In the present invention, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "center", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate an orientation or positional relationship based on the orientation or positional relationship shown in the drawings. These terms are used primarily to better describe the invention and its embodiments and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.

Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meanings of these terms in the present invention can be understood by those skilled in the art as appropriate.

Furthermore, the terms "mounted," "disposed," "provided," "connected," and "connected" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meanings of the above terms in the present invention can be understood by those of ordinary skill in the art according to specific situations.

Furthermore, the terms "first," "second," and the like, are used primarily to distinguish one device, element, or component from another (the specific nature and configuration may be the same or different), and are not used to indicate or imply the relative importance or number of the indicated devices, elements, or components. "plurality" means two or more unless otherwise specified.

In some related technologies, wafer carrying equipment is positioned and carried in a sensor mode, however, some sensor-based methods are indirect measurement, and when there is an installation error or a position deviation between a sensor position and a real wafer position, reliability and safety of accurate alignment carrying are not easily guaranteed. In addition, some related art apparatuses and methods do not have the functions of wafer pre-inspection and classification during the wafer transportation process, the wafer transportation process essentially serves the previous and subsequent process steps, and the subsequent process steps of wafer transportation without detection and classification may process the defective wafer, which wastes manpower and material resources and reduces the wafer processing and manufacturing efficiency.

In order to solve the above problem, the embodiment of the present application discloses a wafer cassette 10, a wafer transporting apparatus 1, a control method, an electrical apparatus 2, and a storage medium 3, which can achieve the purpose of accurately transporting and automatically operating wafers. The following are detailed below.

Referring to fig. 1 to 4, fig. 1 is a schematic perspective view of a wafer handling apparatus 1 according to an embodiment of the present application; fig. 2 is a perspective view of a wafer cassette 10 according to an embodiment of the present application; fig. 3 is a schematic cross-sectional view of the wafer cassette 10 shown in fig. 2; fig. 4 is a plan view of the wafer cassette 10 shown in fig. 2.

As shown in fig. 1, an embodiment of the present application discloses a wafer carrying apparatus 1, where the wafer carrying apparatus 1 includes a wafer cassette 10, a carrying module 20, a vision sensing module 30 and a control module 40, in this embodiment, the wafer cassette 10 includes a carrying member 11 and a light source 12, and the carrying module 20 is configured to obtain or place the wafer from the pick-and-place port 112; the vision sensing module 30 is configured to capture the accommodating space 111 at one side of the pick-and-place opening 112 and output a first captured image; the control module 40 is electrically connected to the carrying module 20 and the vision sensing module 30, and is configured to receive and control the carrying module 20 to perform alignment according to the first captured image, and control the carrying module 20 to perform the wafer acquisition or placement after the alignment is completed.

It can be understood that the wafer carrying apparatus 1 provided in the present application can obtain or place the wafer from the wafer cassette 10, in the process of carrying the wafer, the vision sensing module 30 shoots the accommodating space 111 on the side of the pick-and-place port 112 and outputs a first shot image, and the control module 40 controls the carrying module 20 to perform alignment according to the first shot image, and completes the obtaining or placing of the wafer. Therefore, the wafer carrying device 1 can realize accurate alignment and grabbing of the wafers in the wafer box 10, and further realize accurate carrying and automatic operation of the wafers.

The utility model provides a wafer handling equipment 1 is through get and put mouthful 112 one side and shoot accommodation space 111 and the first image of shooing of output make control module 40 foundation first image control of shooing carry module 20 counterpoint, and control carry module 20 goes on the acquireing or placing of wafer, it is right to realize the accurate counterpoint and the snatching of the wafer in the wafer box 10 to the realization is to accurate transport of wafer and automation mechanized operation.

Specifically, referring to fig. 2 to 4, in the embodiment, the wafer cassette 10 includes a carrier 11 and a light source 12, the carrier 11 includes two side plate portions 113b and a plurality of carrier plates 114 that are oppositely disposed, an accommodating space 111 and a pick-and-place opening 112 located at one side of the accommodating space 111 are formed between the two side plate portions 113b, the accommodating space 111 is used for accommodating a plurality of wafers, the plurality of carrier plates 114 are connected to one side of the two side plate portions 113b close to the accommodating space 111, and the two carrier plates 114 and the side plate portions 113b which are adjacently disposed jointly form an accommodating groove 115 for accommodating edges of the wafers; and the light source 12 is disposed on a side of the accommodating space 111 away from the pick-and-place port 112 and a side of at least one of the side plate portions 113b close to the accommodating groove 115, and is configured to emit light toward the accommodating groove 115, when the accommodating groove 115 accommodates an edge of the wafer, a part of light of the light source 12 is shielded by the wafer, and another part of light of the light source 12 is emitted to the pick-and-place port 112.

It can be understood that, by providing the light source 12 in the side of the accommodating space 111 away from the pick-and-place port 112 and in the side of the at least one side plate portion 113b close to the accommodating groove 115, when the edge of the wafer is accommodated in the accommodating groove 115, a part of light of the light source 12 is shielded by the wafer, so that the accommodating groove 115 accommodating the wafer is darkened, and another part of light of the light source 12 is emitted to the pick-and-place port 112, so that the accommodating groove 115 not accommodating the wafer is lightened, thereby forming a more obvious light and dark contrast in the wafer box 10, and facilitating to more clearly observe the wafer storage condition in the wafer box 10.

Further, the light source 12 includes a first light source 12a disposed on a side of the accommodating space 111 away from the pick-and-place opening 112, a second light source 12b disposed on a side of one of the side plate portions 113b close to the accommodating groove 115, and a third light source 12c disposed on a side of the other side plate portion 113b close to the accommodating groove 115. Through the arrangement of the first light source 12a, the second light source 12b and the third light source 12c, light irradiation in the wafer box 10 can be more uniform, and the observation of the storage of the wafer due to the influence of shadows is not easy to generate.

Further, the first light source 12a includes a light emitting plate 113c, and the light emitting plate 113c is connected between the two side plate portions 113b, and is configured to emit light toward the pick-and-place port 112 side via the accommodating space 111; the number of the second light sources 12b, the third light sources 12c and the accommodating grooves 115 is plural, and each of the second light sources 12b and the third light sources 12c is configured to emit light toward the corresponding accommodating groove 115. It can be understood that the first light source 12a is a light emitting plate 113C, and can emit light from a side of the accommodating space 111 away from the pick-and-place port 112 toward a side of the pick-and-place port 112, and the second light source 12b and the third light source 12C emit light toward the corresponding accommodating groove 115, and form C-shaped light with the first light source 12a, so as to better match the shape of the wafer, and not easily generate shadows, so as to facilitate more clearly observing the storage conditions of the wafer in the wafer cassette 10.

Specifically, the first light source 12a, the second light source 12b and the third light source 12c emit light independently and/or at least two of the first light source 12a, the second light source 12b and the third light source 12c are connected to emit light integrally and simultaneously.

Referring to fig. 5, fig. 5 is a top view of a wafer cassette 10 disclosed in another embodiment of the present application, in other embodiments, the carrier 11 further includes a back plate portion 113a, the back plate portion 113a is connected to one end of each of the two side plate portions 113b far away from the pick-and-place port 112, the number of the light sources 12 is multiple, the number of the accommodating grooves 115 is multiple, each of the light sources 12 is disposed corresponding to one of the accommodating grooves 115 and includes the first light source 12a disposed on one side of the back plate portion 113a close to the accommodating space 111, the second light source 12b disposed on one side of the side plate portion 113b close to the accommodating groove 115, and the third light source 12c disposed on the other side of the side plate portion 113b close to the accommodating groove 115. It can be understood that the first light source 12a disposed on the side of the back plate portion 113a close to the accommodating space 111, the second light source 12b disposed on one side of the side plate portion 113b close to the accommodating groove 115, and the third light source 12C disposed on the other side of the side plate portion 113b close to the accommodating groove 115 are used for emitting light toward the corresponding accommodating groove 115, so that the light sources 12 emit light to the accommodating space 111 in a C-shape, which is more suitable for the shape of the wafer, and is not easy to generate shadows, thereby facilitating more clear observation of the storage condition of the wafer in the wafer box 10.

Further, the first light source 12a, the second light source 12b, and the third light source 12c each include a light emitting surface 121 corresponding to a side surface of the wafer, and a height of a top of the light emitting surface 121 is higher than a height of a top of the corresponding wafer; the back plate portion 113a is an arc-shaped plate protruding outward of the accommodating space 111 or a surface of the back plate portion 113a near the accommodating space 111 is an arc-shaped surface protruding outward of the accommodating space 111. By arranging the first light source 12a, the second light source 12b and the third light source 12c to respectively include the light-emitting surface 121 corresponding to the side surface of the wafer, and the height of the top of the light-emitting surface 121 is higher than the height of the top of the corresponding wafer, when the light source 12 irradiates the wafer, part of light of the light source 12 is shielded by the wafer, and the other part of light can also be emitted to the pick-and-place port 112, so that a user or other operation equipment can conveniently and clearly observe the wafer storage condition in the wafer cassette 10 from the pick-and-place port 112, and meanwhile, by arranging the back plate portion 113a as an arc-shaped plate protruding towards the outside of the accommodating space 111 or the surface of the back plate portion 113a close to the accommodating space 111 as an arc-shaped surface protruding towards the outside of the accommodating space 111, the shape of the back plate can be more matched with the shape of the wafer, the storage of the wafer is more convenient.

Further, the wafer cassette 10 further includes a pressure sensor 13, a counting module 14 and a communication module 15, the pressure sensor 13 is disposed on one side of the carrier plate 114 carrying the wafers and electrically connected to the counting module 14 and the communication module 15, the communication module 15 is electrically connected to the control module 40, the pressure sensor 13 is configured to sense whether the wafer is placed in the accommodating slot 115 and send a first sensing signal to the counting module 14, so that the counting module 14 counts the wafers in the wafer cassette 10 according to the first sensing signal, and the communication module 15 sends a counting result recorded by the counting module 14 to the control module 40; the counting module 14 is further configured to display the counting result; the pressure sensors 13 are disposed on two of the carrier plates 114, and the number of the pressure sensors 13 is twice the number of the wafers that can be accommodated by the wafer cassette 10; the pressure sensor 13 is located in the middle region of the wafer-carrying side of the carrier plate 114. Through two of loading board 114 all be provided with on the loading board 114 pressure sensor 13 can acquire through pressure sensing accuracy the condition of placing of wafer in the wafer box 10, then pass through count module 14 counts and shows, simultaneously, through communication module 15 with the count result send to control module 40, be convenient for control module 40 carries out control operation to the realization is to accurate transport of wafer and automated operation.

Further, referring to fig. 6, the carrying module 20 includes a moving module 21 electrically connected to the control module 40 and a wafer carrier 22 connected to the moving module 21, the moving module 21 is used for driving the wafer carrier 22 to move under the control of the control module 40, the vision sensing module 30 is disposed on the wafer carrier 22, and the vision sensing module 30 can move together with the wafer carrier 22. Through will vision sensing module 30 sets up in transport module 20 on the wafer carrier 22 for vision sensing module 30 can with wafer carrier 22 moves jointly, and then need not other device and drive alone vision sensing module 30 moves, and can make vision sensing module 30 shoot the visual angle of the first picture of shooing is the same with the operation visual angle of wafer carrier 22, makes the control algorithm simpler, and difficult mistake, when realizing accurate transport of wafer and automated operation, has higher operating efficiency.

Specifically, the moving assembly 21 includes a base 211, a first moving joint 212 disposed on the base 211 and capable of extending and retracting along a second preset direction, a first rotating arm 213 having one end rotatably connected to the first moving joint 212, a second rotating arm 214 having one end rotatably connected to the other end of the first rotating arm 213, and the wafer carrier 22 rotatably connected to the other end of the second rotating arm 214. In this embodiment, the first preset direction and the second preset direction may be the same direction, it can be understood that the moving assembly 21 is a multi-degree-of-freedom robot, the second rotating arm 214 and the wafer carrier 22 may be integrally connected or rotatably connected, and the moving assembly 21 may implement precise wafer carrying and automatic operation.

Further, the wafer carrier 22 includes a connection base 221 and a carrying portion 222, the connection base 221 is disposed on the moving assembly 21 along the second predetermined direction, and the carrying portion 222 is connected to one side of the connection base 221; the vision sensing module 30 is disposed on a side of the connection base 221 away from the moving assembly 21 along the second predetermined direction, and the vision sensing module 30 is used for shooting towards a side where the carrying portion 222 is located. It can be understood that the first moving joint 212, the connecting base 221 and the vision sensing module 30 are all disposed along the second predetermined direction, so that position conversion is not required in the process of taking and placing, and the positioning accuracy and efficiency in the process of taking and placing the wafer are improved.

Further, the vision sensing module 30 includes a camera mounting plate 31 disposed on the connection base 221, a first industrial camera 32 disposed on the camera mounting plate 31, and a first lens 33 mounted on the first industrial camera 32. In this embodiment, the first lens 33 may be a telecentric lens.

Further, the wafer handling apparatus 1 further includes a wafer sensor 50, the wafer sensor 50 is disposed on a surface of the handling portion 222 close to one side of the wafer and located at an end of the handling portion 222 away from the connection substrate 221, the wafer sensor 50 is electrically connected to the control module 40 for sensing the wafer and outputting a second sensing signal to the control module 40, so that the control module 40 counts and/or monitors the wafer handled by the handling module 20. By arranging the wafer sensor 50 on the surface of the carrying part 222 close to the wafer and at the end of the carrying part 222 far from the connection substrate 221, the control module 40 can sense the contact state of the wafer and the carrying part 222 in real time through the second sensing signal, and accurately sense and synchronously count the wafer picking and placing, so as to ensure the reliability of the wafer picking and placing and carrying processes.

Specifically, the carrying unit 222 includes two arm portions 222a, each of the two arm portions 222a is connected to the connection substrate 221 and is enclosed into a U shape having an opening facing a side away from the connection substrate 221, and the wafer sensor 50 is disposed at an end of the arm portion 222a away from the connection substrate 221; one side of the two arm portions 222a carrying the wafer is respectively provided with one wafer sensor 50; the wafer sensor 50 is a pressure membrane sensor. In this embodiment, the optical axis direction of the first industrial camera 32 and the first lens 33 coincides with the axial direction of the U-shaped opening surrounded by the two arm portions 222 a. The wafer sensors 50 are respectively arranged on one sides of the two arm parts 222a for bearing the wafer, so that pressure sensing of the wafer is not influenced by the position deviation of the wafer, and the sensing is more accurate.

Further, the control module 40 monitors whether the carrying module 20 obtains the wafer from the wafer cassette 10 according to the second sensing signal, when the control module 40 determines that the carrying module 20 is in an idle state according to the second sensing signal, the control module 40 controls the vision sensing module 30 to capture the accommodating space 111 from the pick-and-place port 112 again to update the first captured image, performs further alignment again according to the updated first captured image, and controls the carrying module 20 to obtain the wafer after the further alignment is completed. It can be understood that, after each operation of acquiring the wafer by the carrying module 20, the control module 40 detects the acquiring operation, and when it is detected that the carrying module 20 is in an idle state, it proves that the acquiring operation of the wafer is failed at this time, the control module 40 may control the vision sensing module 30 to shoot the first shot image updated by the accommodating space 111 from the pick-and-place port 112 again, and perform the alignment again according to the updated first shot image, and perform the acquiring of the wafer again, so as to avoid that the subsequent accurate acquiring operation cannot be performed due to an erroneous operation, and even the whole wafer carrying apparatus 1 is stopped. Through the judgment that the control module 40 judges whether the carrying module 20 is in the no-load state according to the second sensing signal, the alignment can be performed again when the carrying module 20 is in the no-load state, and the wafer is obtained again, so that the shutdown is avoided, and meanwhile, the operation efficiency is improved.

Further, it is understood that the wafer transporting apparatus 1 having the wafer cassette 10, the transporting module 20 and the vision sensing module 30 can be applied to transporting the wafers in the wafer cassette 10 to other cassettes (such as the first cassette 60 or the second cassette 70), and also can be applied to transporting the wafers in other cassettes to the wafer cassette 10 for storage. The following description will mainly take the wafer transfer apparatus 1 as an example to transfer the wafers in the wafer cassette 10 to another magazine.

Specifically, in an embodiment, the wafer transporting apparatus 1 further includes a first magazine 60, the transporting module 20 is configured to obtain the wafer from the wafer cassette 10 and transport the wafer to the first magazine 60, and when the control module 40 determines that the transporting module 20 is still in a carrying state after performing the placing operation of placing the wafer to the first magazine 60 according to the second sensing signal, the control module 40 controls the transporting module 20 to perform the placing operation of placing the wafer to the first magazine 60 again. It can be understood that, after the wafer is placed in the first magazine 60, the control module 40 detects the placing operation, and when it is detected that the carrying module 20 is still in the carrying state, it proves that the placing operation of the wafer fails at this time, the control module 40 may control the carrying module 20 to perform the placing operation of placing the wafer in the first magazine 60 again, so as to avoid damage to the wafer caused by the dislocation operation, and even cause the shutdown of the entire wafer carrying apparatus 1. Whether the carrying module 20 is in a bearing state after the carrying module 20 carries out the placing action of placing the wafer to the first material box 60 or not is judged through the control module 40 according to the second sensing signal, the placing action of placing the wafer to the first material box 60 can be carried out again when the carrying module 20 is in the bearing state, damage and shutdown to the wafer are avoided, and meanwhile, the operation efficiency is improved.

Further, the wafer carrying equipment 1 may further include a second material box 70 and a defect detecting module 80, the defect detecting module 80 is located on a carrying path of the carrying module 20 from the wafer box 10 to the first material box 60, the defect detecting module 80 is electrically connected to the control module 40, the defect detecting module 80 is used for performing defect detection on the wafer transported by the carrying module 20 and outputting defect detection information to the control module 40, the control module 40 is further used for controlling the carrying module 20 to place the qualified wafer in the first material box 60 and place the unqualified wafer in the second material box 70 according to the defect detection information. It can be understood that the carrying module 20 carries the wafer from the wafer cassette 10 to the first magazine 60 on the carrying path, and passes through the defect detecting module 80 first, and performs defect detection at the defect detecting module 80, and the control module 40 controls the carrying module 20 to place the wafer qualified for detection in the first magazine 60 and place the wafer unqualified for detection in the second magazine 70 according to the defect detection information detected by the defect detecting module 80. The defect detection module 80 is arranged on the conveying path from the wafer box 10 to the first material box 60, meanwhile, the defect detection is carried out on the wafer, so that the conveying error of the wafer in the conveying process can be reduced, the conveying time is saved, the detection efficiency is improved, meanwhile, the wafer which is unqualified in detection is placed in the second material box 70, the pre-detection classification can be carried out in the conveying process, a pre-detection sample is provided for the subsequent processing technological process of the wafer, the waste material is prevented from entering the subsequent processing procedure, the production efficiency is improved, and the occupied space of equipment is reduced.

It is understood that the first and

second cartridges

60 and 70 may have the same structure as the wafer cassette 10, and a detailed description of the first and

second cartridges

60 and 70 will not be repeated here.

Further, the vision sensing module 30 is further configured to shoot the accommodating space 111 of the first magazine 60 from the pick-and-place opening 112 of the first magazine 60 to obtain a second shot image before the wafer is placed in the first magazine 60 by the transport module 20, and the control module 40 is further configured to control the transport module 20 to perform a pick-and-place operation according to the second shot image, and control the transport module 20 to perform a placing operation of placing the wafer in the first magazine 60 or a step of detecting the wafer after the pick-and-place operation is completed; and/or the vision sensing module 30 is further configured to shoot a third shot image from the receiving and placing opening 112 of the second material box 70 before the carrying module 20 places the wafer into the second material box 70, and the control module 40 is further configured to control the carrying module 20 to perform the placing operation of placing the wafer into the second material box 70 or the step of detecting the wafer according to the third shot image, and after the placing operation is completed, the carrying module 20 is controlled to perform the placing operation of placing the wafer into the second material box 70. By shooting the accommodating space 111 of the first material box 60 from the taking and placing opening 112 of the first material box 60 before the wafer is placed on the first material box 60 by the carrying module 20 to obtain a second shot image and/or shooting the accommodating space 111 of the second material box 70 from the taking and placing opening 112 of the second material box 70 before the wafer is placed on the second material box 70 by the carrying module 20 to obtain a third shot image, the operation of the carrying module 20 in the process of obtaining and/or placing the wafer at each time can be more accurate, the reliability of the wafer taking and placing operation is guaranteed, and the operation efficiency is also guaranteed.

Further, the defect detection information includes a detection image, the defect detection module 80 includes a camera module 81 and a support 82 supporting the camera module 81, the camera module 81 is used for shooting the wafer transported by the carrying module 20 obtains the detection image, the control module 40 is further used for analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified.

Further, the bracket 82 includes a support main body 821, a camera support part 822 connected to one side of the support main body 821, and a light source support part 823 connected to one side of the support main body 821, the image pickup module 81 includes a second industrial camera 811, a second lens 812 and a light supplement lamp 813, the second lens 812 is mounted on the second industrial camera 811, and the second industrial camera 811 is disposed at one end of the camera support part 822 far away from the support main body 821; the light supplement lamp 813 is disposed at one end of the light source supporting portion 823 away from the supporting body 821; the wafer carried by the carrying module 20 is used for being placed in parallel with the first reference plane, the second industrial camera 811 faces the wafer, and the optical axis of the second industrial camera 811 is perpendicular to the first reference plane; the light supplement lamp 813 includes an annular light emitting member, the annular light emitting member is located between the second industrial camera 811 and the carrying module 20 and is used for facing the wafer to emit light, and the second industrial camera 811 is used for shooting the wafer through a hollow area of the annular light emitting member to acquire the detection image. In this embodiment, the second lens 812 may be a telecentric lens. Through setting up the wafer of transport module 20 transport is on a parallel with the first reference surface is placed, second industry camera 811 orientation the wafer just the optical axis of second industry camera 811 is perpendicular to the first reference surface, can make second industry camera 811 shoot perpendicularly the wafer, simultaneously, under the shining of light filling lamp 813, can make the defect detection of defect detection module 80 is more accurate, and the precision is higher.

Referring to fig. 7, fig. 7 is a flowchart of a wafer transportation control method according to an embodiment of the present invention, in an embodiment of the present application, when the wafer transportation apparatus 1 performs the picking and placing operation of the wafer, the wafer transportation control method may be executed to complete the picking and placing of the wafer, and the wafer transportation control method includes the following steps:

step S101: a wafer pod 10 is provided.

The wafer cassette 10 includes a carrier 11 and a light source 12, the carrier 11 includes two side plates 113b and a plurality of carrier plates 114, which are oppositely disposed, an accommodating space 111 and a pick-and-place opening 112 located at one side of the accommodating space 111 are provided between the two side plates 113b, the accommodating space 111 is used for accommodating a plurality of wafers, the plurality of carrier plates 114 are connected to one side of the two side plates 113b close to the accommodating space 111, and the two adjacent carrier plates 114 and the side plates 113b jointly form an accommodating groove 115 for accommodating an edge of the wafer; and the light source 12 is disposed on a side of the accommodating space 111 away from the pick-and-place port 112 and a side of at least one of the side plate portions 113b close to the accommodating groove 115, and is configured to emit light toward the accommodating groove 115, when the accommodating groove 115 accommodates an edge of the wafer, a part of light of the light source 12 is shielded by the wafer, and another part of light of the light source 12 is emitted to the pick-and-place port 112. Specifically, after the wafer carrying apparatus 1 is turned on, the light source 12 can emit light, and when viewed from the side of the pick-and-place port 112, a place without the wafer can have bright stripes, and can form a strong light-dark contrast with dark stripes caused by the light shielding of the wafer at the place where the wafer is placed, so that the position of the wafer can be known conveniently.

Step S102: when the light source 12 emits light, a first captured image of the accommodating space 111 captured on the pick-and-place port 112 side is acquired.

It can be understood that, after the wafer is placed in the wafer box 10 and is supported on the supporting plate, the wafer box 10 is irradiated by the light source 12, due to the irradiation of light and the shielding of the wafer, the brightness of the area where the wafer is supported is smaller than the brightness of the area where the wafer is not placed, the first shot image is an image where a part of the shot area in the accommodating space 111 is bright and a part of the shot area is dark, when the first shot image is subjected to image analysis, a preset brightness threshold value can be set, when the brightness of the part of the shot area in the first shot image is smaller than the preset brightness threshold value, the wafer is considered to be placed at the part, and when the brightness of the part of the shot area in the first shot image is greater than or equal to the preset brightness threshold value, the wafer is considered to be not placed at the part. That is, when a plurality of wafers are placed in the wafer cassette 10, the first captured image in step S102 is an image with a bright-dark contrast formed by the wafer cassette 10 under the irradiation of the light source 12.

It is understood that the wafer handling control method may further include the steps of:

step S301: before the first shot image is obtained, the carrying module 20 is controlled to move to the current detection position according to the current detection position parameters.

In this embodiment, the current detection position may be a position at which the wafer is taken or placed is detected, and the current detection position may be a position at which the first captured image is captured.

Step S302: and judging whether the current material taking position or the current blanking position corresponding to the current detection position has the wafer or not according to the first shot image, and executing the step S103 if the current material taking position has the wafer or the current blanking position does not place the wafer.

It should be understood that the method with wafer handling control described above may be applied to material taking or material unloading when the wafers in the wafer cassette 10 are handled to other cassettes (such as the first cassette 60 or the second cassette 70), and may also be applied to material unloading when the wafers in other cassettes are handled and placed in the wafer cassette 10. The following description will be given by taking a magazine for unloading wafers from the wafer cassette 10 by the wafer transfer device 1.

In step S302, during material taking, if the current material taking position has the wafer, material taking is performed after alignment, and during material discharging, if the current material discharging position does not have the wafer placed therein, material discharging is performed after alignment. Through judging whether the current material taking position or the current blanking position corresponding to the current detection position exists or not, the wafer controls the carrying module 20 to align, so that the current material taking position does not exist or the current blanking position is placed, dislocation operation during wafer processing is avoided, damage to the wafer is avoided, halt caused by operation errors can be avoided, and reliability and operation efficiency of operation are improved.

In this embodiment, in step S302, if there is no wafer at the current material taking position or the wafer is placed at the current material discharging position, it is determined whether the current detection position is the maximum detection position, and if the current detection position is the maximum detection position, the carrying module 20 is controlled to return to the initial position; if the current detection position is not the maximum detection position, respectively adjusting preset values of the current detection position parameter, the current material taking position parameter or the current blanking position parameter, and returning to execute the step of controlling the carrying module 20 to move to the current detection position according to the current detection position parameter after adjustment.

It should be noted that the wafer cassette 10 has limited wafer storage positions, and each storage position is separated by a preset separation distance, in this embodiment, the preset separation distance may be Δ z, the maximum detection position is a detection position corresponding to the last storage position of the wafer cassette 10 for placing the wafer, and when the current detection position is the maximum detection position, the carrying module 20 is controlled to return to the initial position, which may be a set default position; when the current detection position is not the maximum detection position, adjusting preset values of the current detection position parameter, the current material taking position parameter, or the current blanking position parameter respectively to obtain updated current detection position parameter, current material taking position parameter, or current blanking position parameter, where in this embodiment, the preset value may be a preset interval distance, that is, Δ z, of the wafer cassette 10. By judging that the current detection position is the maximum detection position, the carrying module 20 can be quickly returned to the initial position for subsequent operation after reaching the maximum detection position, and the operation efficiency is improved.

Step S103: and controlling the carrying module 20 to perform alignment according to the first shot image.

Performing image analysis on the first shot image obtained in step S102, wherein the position of the dark stripe in the first shot image is the position where the wafer is located, so as to obtain the storage information of the wafer in the wafer cassette 10, thereby controlling the carrying module 20 to perform alignment.

It is understood that the current material taking level parameter or the current material discharging level parameter may be stored in the control module 40 of the wafer handling apparatus 1, and specifically, the step S102 may include the following steps:

step S201: correcting the current material taking position parameter or the current blanking position parameter according to the first shot image to obtain a corrected material taking position parameter or a corrected blanking position parameter, and updating the current material taking position parameter or the current blanking position parameter according to the corrected material taking position parameter or the corrected blanking position parameter;

it can be understood that the current material taking position parameter is a position parameter of the wafer in the wafer box 10, which needs to take the material currently, the current material discharging position parameter is a position parameter of the wafer, which needs to be discharged currently, to be placed in the wafer box 10, and the current material taking position parameter or the current material discharging position parameter can be obtained through calculation. In order to ensure the accuracy of the operation, before the material taking or discharging operation is carried out, the image analysis can be carried out on the shot first shot image, so that a corrected material taking level parameter or a corrected discharging level parameter is obtained, finally, the current material taking level parameter or the current discharging level parameter is updated according to the corrected material taking level parameter or the corrected discharging level parameter, after the material taking or discharging operation is completed, the updated current material taking level parameter or the current discharging level parameter is respectively plus delta z, and then the current material taking level parameter or the current discharging level parameter of the next material taking or discharging can be obtained.

Step S202: and controlling the carrying module 20 to move to the current material taking position or the current material discharging position according to the corrected material taking position parameter or the corrected material discharging position parameter.

It can be understood that through the basis first shooting image obtains the material level parameter is got in the correction or material level parameter control is got down in the correction the transport module 20 removes and gets the material level or the material level is got down at present, can make the operation more accurate, thereby avoid right the damage of wafer can also avoid the shut down that the operation mistake brought, promotes the reliability and the operating efficiency of operation.

Step S104: and after the alignment is completed, controlling the carrying module 20 to acquire or place the wafer.

According to the corrected material taking level parameter or the corrected material discharging level parameter, the carrying module 20 is controlled to move to the current material taking level or the current material discharging level, namely, the carrying module 20 stretches into the wafer box 10, the current material taking level or the current material discharging level is achieved, and the carrying module 20 can take materials or perform material discharging operation.

Specifically, the step of controlling the carrying module 20 to place the wafer after the alignment is completed may include the step of controlling the carrying module 20 to place and return the wafer according to preset descending and returning parameters, which is executed after the step of moving the carrying module 20 to the current discharging position. It can be understood that, after the carrying module 20 moves to the current blanking position, it descends according to the preset descending parameter, so that the wafer is placed on the bearing member 11, the preset descending parameter may be a preset descending distance, then, the carrying module 20 returns according to the returning parameter, the returning parameter may be a default returning position or an operation position of the next operation, and by executing control after the step of moving to the current blanking position by the carrying module 20, the carrying module 20 places and returns the wafer according to the preset descending and returning parameter, the operation efficiency of the wafer taking and placing operation can be improved.

The step of controlling the carrying module 20 to acquire the wafer after the alignment may include the step of controlling the carrying module 20 to lift and take out the wafer according to preset lifting and taking-out parameters, which is executed after the step of moving the carrying module 20 to the current material taking position. It can be understood that, transport module 20 makes according to predetermineeing the lifting parameter lifting after moving to the present material level of getting the wafer place on the transport module 20, predetermine the lifting parameter and can be predetermined rise distance, then, transport module 20 takes out according to taking out the parameter the wafer, through control transport module 20 is right according to predetermineeing the lifting and taking out the parameter the wafer carries out the lifting and takes out, can effectively protect the wafer ensures to take out the reliability of operation.

According to the wafer carrying control method, when the light source 12 faces the accommodating space 111 emits light, the first shooting image of the accommodating space 111 is shot on one side of the taking and placing opening 112, the wafer is obtained or placed according to the first shooting image to control the carrying module 20 to align, and the wafer in the wafer box 10 is accurately aligned and grabbed, so that the wafer is accurately carried and automatically operated.

Further, in some embodiments, the carrying module 20 includes a wafer carrier 22 for carrying the wafer and a moving component 21 for driving the wafer carrier 22 to move, a wafer sensor 50 is disposed on the wafer carrier 22 for sensing a contact state between the wafer carrier 22 and the wafer, and the wafer carrying control method further includes the following steps:

step S401: judging whether the carrying module 20 is in an idle state or a carrying state according to the sensing signal output by the wafer sensor 50, returning to step S301 if the carrying module 20 is judged to be in the idle state, and executing step S402 if the carrying module 20 is judged to be in the carrying state.

Step S402: adjusting the current detection position parameter, the current material taking position parameter or the current blanking position parameter to preset values respectively, and placing the wafer carried by the wafer carrier 22.

Whether the wafer is on the wafer carrier 22 can be determined by sensing the pressure of the wafer placed on the wafer carrier 22 by the wafer sensor 50, when the wafer is not on the wafer carrier 22, that is, the carrying module 20 is in the idle state, the wafer is already placed at this time, the carrying module 20 moves to the current detection position according to the current detection position parameter for carrying out the next carrying, and when the wafer is on the wafer carrier 22, that is, the carrying module 20 is in the carrying state, step S402 is executed to place the wafer, and the current detection position parameter, the current material taking position parameter or the current material discharging position parameter is updated according to the preset value.

In the above embodiment, by determining whether the carrying module 20 is in the no-load state or the loading state, the carrying module 20 can move more accurately and more efficiently, so that the wafer is prevented from being damaged and stopped, and the operation efficiency is improved.

Specifically, the step of placing the wafers carried by the wafer carrier 22 includes the following steps:

step S501: the placing action of the carrying module 20 for placing the wafer in the first magazine 60 is performed according to the preset placing parameters.

Step S502: after the placing operation is performed, whether the carrying module 20 is in the idle state is determined according to the sensing signal of the wafer sensor 50, if the carrying module 20 is in the idle state, the step S301 is executed, and if the carrying module 20 is in the loading state, the step S501 is executed.

It is understood that the first magazine 60 may be a magazine for storing the wafers after the wafers are taken out of the wafer cassette 10. And after the wafer is taken out of the wafer box 10, the wafer is placed into the first material box 60 according to the placement parameters, if the wafer is placed successfully, the carrying module 20 is in the no-load state, the next material taking can be executed, and if the wafer is not placed successfully, the placing operation is continued. By judging whether the carrying module 20 is in the no-load state or the bearing state, the carrying module 20 can move more accurately and more efficiently, damage and halt to the wafer are avoided, and meanwhile, the operation efficiency is improved.

Further, before the step of placing the wafers carried by the wafer carrier 22, the step of inspecting the wafers may further include the following steps:

step S601: and moving the wafer to a preset detection position.

It should be noted that the preset detection position may be a fixed detection position, and the carrying module 20 may move the wafer to the preset detection position each time the wafer is obtained.

Step S602: carrying out defect detection on the wafer at the preset detection position; if the wafer is qualified, executing step S501; if the wafer is not qualified, step S603 is executed.

Specifically, the defect detection of the wafer may include the following steps:

step S701: and the wafers conveyed on the conveying module 20 shot at the preset detection position obtain a detection image.

Step S702: and analyzing the defect proportion of the wafer according to the detection image, and comparing the defect proportion with a preset proportion to judge whether the wafer is qualified.

In this embodiment, the defect detection is performed on the wafer, the defect ratio of the wafer is analyzed according to the detection image, which may be a wear defect ratio of the wafer, the preset ratio may be a preset wear defect ratio η, when the wear defect ratio of the wafer is smaller than the preset wear defect ratio η, the wafer is qualified for detection, the qualified wafer is placed in the first magazine 60, when the wear defect ratio of the wafer is greater than or equal to the preset wear defect ratio η, the wafer is not qualified for detection, the detection image is obtained through the wafer carried on the carrying module 20 photographed at the preset detection position, so as to determine whether the wafer is qualified or not, perform the pre-detection classification during the carrying process, provide a pre-detection sample for the subsequent processing process of the wafer, and prevent the waste material from entering the subsequent processing process, thereby improving the production efficiency and reducing the occupied space of the equipment.

Step S603: and executing the step of placing the wafer in the second magazine 70 by the carrying module 20, and returning to the step of moving to the current detection position according to the current detection position parameters.

The second material box 70 can be a recovery box of unqualified products, the wafers which are detected to be unqualified can be recovered through the second material box 70, when the wear defect proportion of the wafers is more than or equal to the preset wear defect proportion eta, the wafers are detected to be unqualified, and the unqualified wafers are placed into the second material box 70. Through the step of detecting the wafers carried by the wafer carrier 22 before the step of placing the wafers, the wafers can be detected in advance in the carrying process, defective products can be found in time, a pre-detection sample is provided for the subsequent processing process of the wafers, and the production efficiency is further improved.

In order to ensure the operation accuracy and reliability of the carrying module 20 for placing the wafers into the first magazine 60 and the second magazine 70, the wafer carrying control method may further include the following steps:

step S801: before the wafer is placed in the first magazine 60 by the carrying module 20, a second shot image of the accommodating space 111 of the first magazine 60 shot from the pick-and-place port 112 of the first magazine 60 is obtained, the carrying module 20 is controlled to carry out the placing and aligning according to the second shot image, and after the placing and aligning is completed, the carrying module 20 is controlled to carry out the placing action of placing the wafer in the first magazine 60.

Step S802: before the wafer is placed in the second material box 70 by the carrying module 20, a third shot image of the accommodating space 111 of the second material box 70 shot from the pick-and-place port 112 of the second material box 70 is acquired, the carrying module 20 is controlled to carry out emptying alignment according to the third shot image, and after the emptying alignment is finished, the carrying module 20 is controlled to carry out a placing action of placing the wafer in the second material box 70.

Step S801 and step S802 obtain a second shot image and a third shot image, control the carrying module 20 to perform the placing operation of placing the wafer in the first material box 60 and the second material box 70 according to the second shot image and the third shot image, control the carrying module 20 to perform the placing operation of placing the wafer in the first material box 60 and the second material box 70 after the placing operation is completed, and obtain the first shot image, control the carrying module 20 to perform the placing operation according to the first shot image, and control the carrying module 20 to perform the placing operation of placing the wafer in the wafer box 10 after the placing operation is completed, which is not repeated herein. By obtaining the second shot image before the carrying module 20 places the wafer into the first magazine 60 and/or obtaining the third shot image before the carrying module 20 places the wafer into the second magazine 70, the operation of the carrying module 20 in the process of obtaining and/or placing the wafer at each time can be more accurate, the reliability of the wafer taking and placing operation is guaranteed, and the operation efficiency is also guaranteed.

Referring to fig. 8, fig. 8 is a flowchart illustrating a wafer handling apparatus 1 according to an embodiment of the present invention, which uses the wafer handling control method shown in fig. 7. The wafer carrying equipment 1 starts to work, the light source is turned on, the control module 40 initializes each preset parameter (including a current material taking level parameter, a current material discharging level parameter, a maximum detection level parameter, a preset value, an abrasion defect proportion eta, and the like), then, the control module 40 controls the carrying module 20 and the vision sensing module 30 to move to a current detection level for vision detection according to the current detection level parameter, namely, the vision sensing module 30 shoots and obtains a first shot image, further, the control module 40 judges whether a wafer exists in the current detection level according to the first shot image, if the current detection level has a wafer, the current material taking level parameter is corrected according to the first shot image, and controls the carrying module to align with the current detection level and perform the action of obtaining the wafer according to the current material taking level parameter, if the current detection position has no wafer, determining whether the current detection position is the maximum detection position, if so, finishing the cycle, stopping the work, and waiting to start the work again, otherwise, adjusting the current detection position parameter by a preset value, and the control module 40 returning to the step of performing the visual detection according to the adjusted current detection position parameter, that is, controlling the carrying module 20 and the visual sensing module 30 to move to the next current detection position for the visual detection.

Further, after the carrying module 20 obtains the wafer, the control module 40 determines whether the carrying module 20 is in a load state or an idle state according to a second sensing signal output by the wafer sensor 50 on the carrying module 20, if the carrying module is in the idle state, the step of performing visual inspection is returned, if the carrying module is in the load state, the carrying module 20 carries the wafer to a preset inspection position for defect inspection, specifically, the defect inspection module obtains an inspection image, the control module 40 determines whether a defect proportion of the wafer is smaller than a preset value according to the inspection image, and if the defect proportion of the wafer is smaller than the preset value, the carrying module 20 may place the wafer on the first magazine 60. In addition, the detection image can be saved by the control module 40 for later reference.

Specifically, before the wafer is discharged to the first magazine 60, the carrying module 20 may be controlled to move to the current detection position of the first magazine 60 according to the prestored current detection position parameter of the first magazine 60, and then the accommodating space of the first magazine 60 is photographed by the vision sensing module 30 to obtain a second photographed image, so as to determine whether the wafer is present at the current discharge position of the first magazine 60 according to the second photographed image, and correct the current discharge position parameter of the first magazine 60 according to the second photographed image, so that the carrying module 20 performs accurate alignment and performs an action of placing the wafer to the first magazine 60 according to the corrected current discharge position parameter of the first magazine 60; similarly, before the wafers are fed to the second material box 70, the carrying module 20 may move to the current detection position of the second material box 70 according to the prestored current detection position parameter of the second material box 70, and then may shoot through the visual sensing module 30 the receiving space of the second material box 70 acquires a third shot image, so as to judge whether the current blanking position of the second material box 70 has the wafers according to the third shot image, and correct the current blanking position parameter of the second material box 70 according to the third shot image, so that the carrying module accurately aligns and executes the action of placing the wafers to the second material box 70 according to the corrected current blanking position parameter of the second material box 70.

Further, after the carrying module 20 performs the placing operation, the control module 40 further determines whether the carrying module 20 is in a loading state or an idle state according to the second sensing signal output by the wafer sensor 50, if the carrying module is in the idle state, updates the pre-stored current detection position parameter of the first magazine 60, such as adjusting a preset value, so as to correspond to a next detection position of the first magazine 60, and updates the pre-stored current detection position parameter of the second magazine 70, such as adjusting a preset value, so as to correspond to a next detection position, and returns to perform the next wafer obtaining operation of the wafer cassette 10; if the carrying state is the carrying state, the control module controls the carrying module 20 to return to perform the step of detecting the defect again according to the detected image, so as to further repeat the steps of detecting the defect detection module 80 to capture the second captured image or the third captured image, and the actions of placing the second captured image or the third captured image, and in other embodiments, as shown in fig. 9, if the carrying state is the carrying state, the control module 40 may also control the carrying module 20 to return to perform the steps of detecting the defect detection module 80 to capture the second captured image or the third captured image, and the actions of placing the second captured image or the third captured image again.

In summary, in the wafer carrying apparatus 1 and the wafer carrying control method provided in the embodiments of the present application,

1. the light source 12 and the first industrial camera 32 directly detect the wafer and the wafer box 10, are not affected by assembly errors between the actual accommodating grooves of the wafer, can realize automatic alignment and accurate taking and placing in the wafer carrying process, can also accurately judge whether the wafer has composite functions such as counting and the like in real time, has certain self-adaptive adjustment capability on positioning errors caused by environmental disturbance, and has better flexibility, flexibility and reliability.

2. According to the wafer carrying equipment 1 and the wafer carrying method, the pressure sensors 13 and the wafer sensors 50 symmetrically arranged at the tail ends of the wafer carriers 22 are symmetrically arranged on each layer of the bearing plate 114 of the wafer box 10, so that the contact states of the wafers and the bearing plate 114 of the wafer box 10 and the contact states of the wafers and the wafer carriers 22 are sensed in real time, the wafers are picked and placed, and the wafers are accurately sensed and synchronously counted, and therefore the reliability of the wafer picking, placing and carrying processes is ensured.

3. According to the wafer carrying equipment 1 and the wafer carrying method, the second industrial camera 811 is adopted to carry out wafer pre-detection on a path where wafers need to be taken and placed, the pre-detection classification process in the carrying process can provide pre-detection samples for the subsequent processing technological process of the wafers, waste materials are prevented from entering the subsequent processing procedure, and therefore production efficiency is improved.

Referring to fig. 10, fig. 10 is a schematic structural diagram of an electrical device 2 according to an embodiment of the disclosure, where the electrical device 2 includes a memory 91 and a processor 92.

The memory 91 stores computer readable instructions 93, and when executed by the processor 92, the computer readable instructions 93 cause the processor 92 to implement the wafer handling control method as described in any one of the above.

Referring to fig. 11, fig. 11 is a schematic structural diagram of a computer-readable storage medium 3 according to an embodiment of the disclosure, the computer-readable storage medium 3 has computer-readable instructions 93 stored thereon, and the computer-readable instructions 93 are executed by a processor 92 to implement the wafer handling control method according to any of the above embodiments.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. Those skilled in the art should also appreciate that the embodiments described in this specification are all alternative embodiments and that the acts and modules involved are not necessarily required for this application.

In various embodiments of the present application, it should be understood that the size of the serial number of each process described above does not mean that the execution sequence is necessarily sequential, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit. The integrated unit can be realized in a form of hardware, and can also be realized in a form of a software functional unit.

The integrated units, if implemented as software functional units and sold or used as a stand-alone product, may be stored in a computer accessible memory. Based on such understanding, the technical solution of the present application, which is a part of or contributes to the prior art in essence, or all or part of the technical solution, can be embodied in the form of a software product, stored in a memory, including several requests for causing an electrical device (which may be a personal computer, a server, or a network device, etc., and may specifically be a processor in the electrical device) to execute part or all of the steps of the above-mentioned method of the embodiments of the present application.

It will be understood by those skilled in the art that all or part of the steps in the methods of the above embodiments may be implemented by hardware instructions related to a program, and the program may be stored in a computer-readable storage medium, and the computer-readable storage medium 3 includes a Read-Only Memory (ROM), a Random Access Memory (RAM), a Programmable Read-Only Memory (PROM), an Erasable Programmable Read-Only Memory (EPROM), a One-time Programmable Read-Only Memory (OTPROM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), an optical Disc (Compact Disc-Read-Only Memory, CD-ROM), or other memories, Disk storage, tape storage, or any other medium readable by a computer that can be used to carry or store data.

The above detailed descriptions of the wafer cassette 10, the wafer handling apparatus 1, the control method thereof, the electrical apparatus 2, and the storage medium 3 disclosed in the embodiments of the present application are provided, and specific examples are applied herein to explain the principles and embodiments of the present application. Meanwhile, for a person skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. a wafer cassette, is characterized in that, described wafer cassette comprises:

A carrier, comprising two opposite side plate parts and a plurality of carrying plates, a receiving space and a pick-and-place opening on one side of the receiving space are arranged between the two side plate parts, and the receiving space is used for receiving A plurality of wafers, a plurality of the carrier plates are connected to one side of the two side plate portions close to the accommodating space, and the two adjacently arranged carrier plates and the side plate portions together form a receiving slot , for receiving the edge of the wafer; and

The light source is arranged on the side of the accommodating space away from the pick-and-place opening and on the side of at least one of the side plates close to the accommodating slot, and is used to emit light toward the accommodating trough. When the edge of the wafer is placed, a part of the light of the light source is blocked by the wafer, and another part of the light of the light source is directed to the pick-and-place port.

2 . The wafer cassette according to claim 1 , wherein the light source comprises a first light source disposed on a side of the accommodating space away from the pick-and-place opening, and a first light source disposed on one side of the side plate close to the opening. 3 . The second light source on one side of the storage slot and the third light source arranged on the other side of the side plate portion close to the storage slot.

3 . The wafer cassette according to claim 2 , wherein the first light source comprises a light-emitting plate, and the light-emitting plate is connected between the two side plate parts, and is used for facing toward the accommodating space through the accommodating space. 4 . One side of the pick-and-place port emits light; the number of the second light source, the third light source and the storage slot is multiple, and each of the second light source and each of the third light sources is used to face The corresponding receiving slot emits light.

4 . The wafer cassette according to claim 2 , wherein the carrier further comprises a back plate portion, and the back plate portion is connected to one end of the two side plate portions away from the pick-and-place port, 5 . The number of the light sources is multiple, the number of the storage slots is multiple, and each of the light sources is set corresponding to one of the storage slots and includes all the light sources arranged on the side of the back plate portion close to the storage space. The first light source, the second light source disposed on one side of the side plate portion close to the receiving groove, and the third light source disposed on the side of the other side plate portion close to the receiving groove.

5. The wafer cassette according to claim 3 or 4, wherein the first light source, the second light source and the third light source emit light independently and/or the first light source, the second light source and the At least two of the third light sources are connected together and emit light at the same time.

6 . The wafer cassette according to claim 4 , wherein the first light source, the second light source, and the third light source all include light-emitting surfaces corresponding to the side surfaces of the wafer, and the The height of the top of the light-emitting surface is higher than the height of the corresponding top of the wafer; the back plate part is an arc-shaped plate protruding toward the outside of the accommodating space or the surface of the back plate part close to the accommodating space is facing An arc-shaped surface is protruded outside the accommodating space.

7. A wafer handling equipment, characterized in that, the wafer handling equipment comprises:

The wafer cassette according to any one of claims 1-6;

a handling module for obtaining or placing the wafer from the pick-and-place port;

a visual sensing module for photographing the accommodating space on one side of the pick-and-place port and outputting a first photographed image; and

a control module, electrically connecting the transport module and the visual sensing module, for receiving and controlling the alignment of the transport module according to the first captured image, and after completing the alignment The handling module is controlled to obtain or place the wafers.

8. a wafer handling control method, is characterized in that, comprises the following steps:

A wafer cassette is provided, and the wafer cassette adopts the wafer cassette according to any one of claims 1-6;

When the light source emits light, acquiring a first photographed image of the accommodating space on the side of the pick-and-place port;

Controlling the alignment of the conveying module according to the first captured image; and

After the alignment is completed, the handling module is controlled to obtain or place the wafer.

9. An electrical device, comprising a memory and a processor, wherein computer-readable instructions are stored in the memory, and when the computer-readable instructions are executed by the processor, the processor implements the process of claim 8 Methods.

10. A computer-readable storage medium having computer-readable instructions stored thereon, wherein the computer-readable instructions implement the method of claim 8 when executed by a processor.