CN115908552B - Bonding method - Google Patents
Bonding methodInfo
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- CN115908552B CN115908552B CN202211499895.9A CN202211499895A CN115908552B CN 115908552 B CN115908552 B CN 115908552B CN 202211499895 A CN202211499895 A CN 202211499895A CN 115908552 B CN115908552 B CN 115908552B
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Abstract
本申请涉及一种贴合方法，用于贴合第一目标件和第二目标件。贴合方法包括获取第一目标件的重心线和第二目标件的对位线。第二目标件上开设有多个沿第一方向贯穿第一表面和第二表面的对位孔，每一对位孔具有位于第一表面的第一开口和位于第二表面的第二开口，对位线是基于全部第二开口的中心所共同确定的。基于目标位置控制第一目标件运动至贴合于第一表面。其中，第二开口在参考面上的正投影位于第一开口在参考面上的正投影内。本申请在第二目标件上开设多个对位孔确定第二目标件的对位线，提高了将第一目标件贴合至第二目标件上时的贴合精准度，从而在第一目标件带动第二目标件振动时，缓解因精度较差而导致的振动不良。
The present application relates to a bonding method for bonding a first target part and a second target part. The bonding method includes obtaining the center of gravity line of the first target part and the alignment line of the second target part. The second target part is provided with a plurality of alignment holes that pass through the first surface and the second surface along the first direction, and each alignment hole has a first opening located on the first surface and a second opening located on the second surface, and the alignment line is determined based on the centers of all the second openings. The first target part is controlled to move to be bonded to the first surface based on the target position. The orthographic projection of the second opening on the reference surface is located within the orthographic projection of the first opening on the reference surface. The present application provides a plurality of alignment holes on the second target part to determine the alignment line of the second target part, thereby improving the bonding accuracy when bonding the first target part to the second target part, thereby alleviating the poor vibration caused by poor precision when the first target part drives the second target part to vibrate.
Description
Technical Field
The application relates to the technical field of bonding, in particular to a bonding method.
Background
In some devices, such as pressure feedback devices or sensing devices, it is necessary to implement a feedback function by means of a vibrating element. When the vibration element is controlled to vibrate, other elements attached to the vibration element are driven to resonate, and the attaching between the elements has tolerance, so that the vibration frequency is affected to cause poor vibration.
Disclosure of Invention
Accordingly, a bonding method capable of improving bonding accuracy is provided to solve the problem of poor vibration caused by poor bonding position.
A bonding method for bonding a first target piece and a second target piece, wherein the second target piece is provided with a first surface and a second surface which are arranged opposite to each other along a first direction, the first surface is used for bonding the first target piece, the second surface is provided with a convex part, and the symmetry axis of the convex part and the symmetry axis of the second target piece are mutually overlapped, the bonding method comprises the following steps:
The method comprises the steps of obtaining a gravity center line of a first target piece and an alignment line of a second target piece, wherein the second target piece is provided with a plurality of alignment holes penetrating through a first surface and a second surface along a first direction, each alignment hole is provided with a first opening positioned on the first surface and a second opening positioned on the second surface, and the alignment lines are determined based on the centers of all the second openings;
The first target piece is controlled to move until the gravity center line reaches the target position, wherein the gravity center line is positioned at the target position, the front projection of the gravity center line on the reference surface and the front projection of the alignment line on the reference surface have preset relative positions, and the gravity center line and the alignment line are parallel to each other;
Controlling the first target piece to move along a first direction close to the first surface of the second target piece based on the target position until the first target piece is attached to the first surface;
The orthographic projection of the second opening on the reference plane is located in the orthographic projection of the first opening on the reference plane, and the reference plane is a plane perpendicular to the first direction.
In one embodiment, before acquiring the heavy line of the first target and the alignment line of the second target, the method further comprises:
Acquiring image information of a first target piece and image information of a second target piece;
Determining a gravity center line of the first target piece according to the image information of the first target piece;
acquiring position information of a plurality of alignment holes relative to the second target piece according to the image information of the second target piece;
And determining the alignment line of the second target piece according to the position information of the alignment holes.
In one embodiment, acquiring the image information of the first target and the image information of the second target specifically includes:
acquiring image information of a first target piece and image information of a second target piece by means of a spectroscope and a camera module;
The spectroscope is obliquely arranged between the first target piece and the second target piece so as to acquire an image beam of the first target piece and an image beam of the second target piece;
The camera module is configured to receive the image beam from the beam splitter and convert the image beam into image information of the first target and image information of the second target.
In one embodiment, the camera module includes a charge coupled device.
In one embodiment, the method further comprises the step of controlling the first target member to move close to the first surface of the second target member along the first direction based on the target position until the first target member is attached to the first surface:
filling colloid into the alignment hole so as to enable the second target piece to be attached to the third target piece;
The third target piece is positioned on one side of the second target piece, which faces away from the first target piece.
In one embodiment, the first target is provided in a plurality;
all of the first target and the second target are configured to form a stack;
the heavy line of the stacked member coincides with the alignment line of the second target.
In one embodiment, the radial dimension of the inner wall of the alignment hole gradually decreases from the first surface to the second surface in the first direction.
In one embodiment, the orthographic projection of the first opening on the reference plane and the orthographic projection of the second opening on the reference plane are concentric circles.
In one embodiment, the foot of the alignment line is located on the symmetry axis of the second target.
In one embodiment, the center of the second opening is located on the symmetry axis of the boss.
In one embodiment, the first target is configured as an axisymmetric structure;
The vertical leg of the gravity center line is positioned on the symmetry axis of the first target piece.
According to the laminating method, the plurality of alignment holes are formed in the second target piece, the second target piece is positioned at the center of the second opening of the second surface by means of all the alignment holes, the alignment line of the second target piece is determined, and the laminating position of the first target piece is determined through the preset relative position between the gravity center line of the first target piece and the alignment line of the second target piece, so that laminating accuracy when the first target piece is laminated to the second target piece is improved, and vibration failure caused by poor accuracy is relieved when the first target piece drives the second target piece to vibrate.
Drawings
FIG. 1 is a schematic diagram of a first target and a second target according to an embodiment of the related art;
FIG. 2 is a schematic cross-sectional view of a stack of components according to an embodiment of the related art;
FIG. 3 is a schematic process diagram of a bonding method according to an embodiment of the related art;
FIG. 4 is a schematic process diagram of a bonding method according to another embodiment of the related art;
FIG. 5 is a flow chart of a bonding method according to an embodiment of the application;
FIG. 6 is a block diagram of a second object of an embodiment of the present application;
FIG. 7 is a schematic cross-sectional view of a stack of components according to an embodiment of the application;
FIG. 8 is a schematic diagram of an orthographic projection of a first opening and a second opening according to an embodiment of the present application;
FIG. 9 is a schematic view of symmetry axes of a second object according to an embodiment of the application;
FIG. 10 is a schematic view of an alignment hole according to an embodiment of the present application;
FIG. 11 is a schematic view of an alignment hole according to another embodiment of the present application;
FIG. 12 is a flow chart of a bonding method according to another embodiment of the present application;
FIG. 13 is a schematic process diagram of a bonding method according to an embodiment of the application;
FIG. 14 is a schematic view of a third object according to an embodiment of the present application;
FIG. 15 is a cross-sectional view of an alignment hole according to an embodiment of the present application;
FIG. 16 is a schematic diagram of a measurement data box of a bonding method according to an embodiment of the application.
Brief description of the reference numerals 10, 100, first target 20, 200, second target
21. 220 First surface 22, 230 second surface 22a, 232 protrusion 30 CCD camera S, S stack a, b center line D, D preset relative position 221 first opening
231 Second openings 221a, 231a orthographic projection
300 Spectroscope 400 camera module
500 Third target 600 colloid
A is a gravity center line B is an alignment line
P, midpoint L, symmetry axis
R is reference plane T, T is actual distance
Detailed Description
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the application, whereby the application is not limited to the specific embodiments disclosed below.
In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
It will be understood that when an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Moreover, the figures are not drawn to a 1:1 scale, and the relative sizes of elements are drawn in the figures by way of example only and are not necessarily drawn to true scale.
In order to facilitate understanding of the technical solutions of the embodiments of the present application, before explaining specific implementation manners of the embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong are first explained briefly.
A CCD camera (Charge Coupled Device ) is an image generating device capable of converting light into electric charge, storing and transferring the electric charge, and taking out the stored electric charge to change the voltage. CCD cameras are widely used because they are small in size, light in weight, not affected by magnetic fields, and have vibration and impact resistance.
In order to facilitate understanding of the technical solution of the present application, before the detailed description, a lamination method in the related art will be described first.
Fig. 1 shows a schematic view of a first object 10 and a second object 20 of an embodiment of the related art, and fig. 2 shows a schematic cross-sectional view of a stack member s of an embodiment of the related art.
As shown in fig. 1 and 2, in the related art embodiment, when attaching two first target pieces 10 to the second target piece 20, it is generally necessary to attach the first target pieces 10 to the second target piece 20 symmetrically with respect to the symmetry axis of the second target piece 20. The center line b of the first target 10 and the center line b of the second target 20 after bonding have a predetermined relative position d therebetween. The first target 10 can vibrate under the control of an electric field, and drive the second target 20 to vibrate together.
Fig. 3 is a process diagram of a bonding method according to an embodiment of the related art.
Referring to fig. 3, an attaching method of the related art is illustrated by sequentially acquiring a center line a of the first target 10 and a center line b of the second target 20 by one CCD camera 30. Wherein the second target 20 has a first surface 21 and a second surface 22 arranged opposite to each other, the first surface 21 facing the first target 10. It will be appreciated that the first surface 21 is the abutment surface. The second surface 22 is at least partially convex towards the side facing away from the first surface 21 to form a convex portion 22a, the symmetry axis of the convex portion 22a coinciding with the symmetry axis of the second target 20. In this way, by acquiring the symmetry axis of the boss 22a of a smaller size, the accuracy of acquiring the center line b is improved to some extent, and the cost of the machine of one CCD camera 30 is also lower. However, the inventors found that since the CCD camera 30 needs to acquire the center line a of the first target 10 and the center line b of the second target 20, respectively, both moving the CCD camera 30 and moving the first target 10 or the second target 20 causes an increase in error, and re-inspection after the attachment is completed is also impossible.
The laminated member s formed by the lamination by the above method is poor in vibration frequency, and a series of problems are caused by other products manufactured in a downstream process. The inventors have further studied the reason and found that, after the first target 10 is bonded to the second target 20 having a symmetrical structure, the bonding accuracy of the first target 10 is often affected by the existence of a tolerance, and the center of gravity of the stacked member s and the center of gravity of the second target 20 are also deviated from each other, so that the vibration frequency and the vibration amplitude of the entire stacked member s are affected, and the stacked member s is determined as a defective member because the vibration balance cannot be maintained.
Fig. 4 is a process diagram of a bonding method according to another embodiment of the related art.
The inventors made a preliminary improvement on the basis of the attaching method shown in fig. 3. As shown in fig. 4, the inventors tried to acquire the center line a of the first target 10 and the center line b of the second target 20 simultaneously by two CCD cameras 30. One of the CCD cameras 30 is located on a side of the first target member 10 facing away from the second target member 20, and the other CCD camera 30 is located on a side of the second target member 20 facing away from the first target member 10. In this way, compared with the bonding method using one CCD camera 30 in the related embodiment described above, the bonding method using two CCD cameras 30 improves the bonding accuracy and can perform the recheck after bonding. However, the cost of the two CCD cameras 30 is high.
Based on this, the present inventors have made intensive studies to improve the structure of the second target 20, so that the alignment relationship between the first target 10 and the second target 20 can be more accurately obtained before lamination, thereby achieving an improvement in lamination accuracy between the first target 10 and the second target 20.
For convenience of description, the drawings show only structures related to the embodiments of the present application.
Fig. 5 shows a flow chart of a bonding method according to an embodiment of the present application, fig. 6 shows a structural diagram of a second object 200 according to an embodiment of the present application, fig. 7 shows a schematic cross-sectional view of a stacked member S according to an embodiment of the present application, fig. 8 shows schematic orthographic projections of a first opening 221 and a second opening 231 according to an embodiment of the present application, and fig. 9 shows a schematic view of a symmetry axis L of a second object 200 according to an embodiment of the present application.
Referring to fig. 5, and referring to fig. 6 to 9, in an attaching method according to an embodiment of the present application, the attaching method is used for attaching a first object 100 and a second object 200, the second object 200 has a first surface 220 and a second surface 230 opposite to each other along a first direction (i.e. an x-axis direction shown in fig. 5), the first surface 220 is used for attaching the first object 100, the second surface 230 is provided with a protrusion 232, and a symmetry axis of the protrusion 232 and a symmetry axis L of the second object 200 are overlapped with each other. The method comprises the following steps:
S110, acquiring a center of gravity line A of the first target piece 100 and an alignment line B of the second target piece 200, wherein a plurality of alignment holes 210 penetrating through the first surface 220 and the second surface 230 along the first direction are formed in the second target piece 200, each alignment hole 210 is provided with a first opening 221 positioned on the first surface 220 and a second opening 231 positioned on the second surface 230, and the alignment line B is commonly determined based on the center P of all the second openings 231;
S120, controlling the first target piece 100 to move to a gravity center line A to a target position, wherein the gravity center line A is positioned at the target position, a preset relative position D is arranged between the orthographic projection of the gravity center line A on the reference surface R and the orthographic projection of the alignment line B on the reference surface R, and the gravity center line A and the alignment line B are parallel to each other;
S130, controlling the first target member 100 to move close to the first surface 220 of the second target member 200 along the first direction based on the target position until the first target member 100 is attached to the first surface 220, wherein the orthographic projection 231a of the second opening 231 on the reference plane R is located in the orthographic projection 221a of the first opening 221 on the reference plane R, and the reference plane R is a plane perpendicular to the first direction.
It should be noted that, referring to fig. 7, the first target 100 in the embodiment of the present application can be controlled by an electric field to generate vibration, and in combination with the foregoing embodiments, in applications such as some haptic feedback and sensing devices, the first target 100 may be used to drive other components to vibrate together. The first target 100 may be a piezoelectric ceramic block, for example, and the second target 200 may be a metal plate, for example. Of course, the first target 100 and the second target 200 are not limited to the above materials and structures, and are not limited to application in the haptic feedback and sensing device, and the bonding method provided by the present application can be adopted in a scene where the first target 100 and the second target 200 need to be aligned and bonded, and is not limited herein.
In addition, according to the analysis of the above-described related art embodiment, if the bonding position of the first target 100 to the second target 200 is not good during the vibration, the center of gravity shifts, and thus, the vibration amplitude increases and the resonance frequency fluctuates during the vibration. Therefore, the laminating accuracy is improved, namely, the consistency of the center of gravity before and after lamination is improved.
As shown in fig. 9, the second target 200 is constructed in an axisymmetric structure, and the alignment line B can be more easily obtained. Specifically, the homeotropic foot of the alignment line B is located on the symmetry axis L of the second target 200, that is, the alignment line B is perpendicular to and intersects the symmetry axis L of the second target 200. On the basis that the second target 200 has an axisymmetric structure, the accuracy of the alignment line B on the symmetry axis L can be improved. As shown in connection with fig. 7, the second surface 230 is convex toward a side facing away from the first surface 220 to form a convex portion 232. The symmetry axis of the boss 232 coincides with the symmetry axis L of the second target 200, so that the symmetry axis L of the second target 200 can be obtained by obtaining the symmetry axis of the boss 232, thereby obtaining the alignment line B more easily.
As shown in fig. 5, and in conjunction with fig. 7, in step S110, the center of gravity refers to the point in the gravitational field where the resultant of the gravity forces of all the constituent fulcrums passes when the object is in any orientation. And the gravity center line a refers to a vertical line passing through the gravity center point of the first target 100.
In the present application, the first target 100 is constructed in an axisymmetric structure, and the homeotropic foot of the gravity center line a is located on the symmetry axis of the first target 100. It will be appreciated that the centre of gravity of an object of uniform density due to regularity is the geometric centre thereof. Of course, in other embodiments, the first target member 100 having an irregularly shaped outline may also have its center of gravity line a obtained by other means, which is not limited herein.
Fig. 10 shows a schematic view of a registration hole 210 according to an embodiment of the present application, and fig. 11 shows a schematic view of a registration hole 210 according to another embodiment of the present application.
As shown in fig. 10 and 11, the alignment line B is commonly determined based on the centers P of all the second openings 231, that is, the centers P of two adjacent second openings 231 are sequentially connected until all the alignment holes 210 are traversed, and then the position of the alignment line B is determined through all the connection lines. In the embodiment shown in fig. 10, when the alignment holes 210 are provided in two, the centers P of the second openings 231 of the two alignment holes 210 are connected to form a straight line, and the alignment line B is a perpendicular foot about the midpoint of the straight line. When the alignment holes 210 are provided in three or more, the lines of the centers P of all the second openings 231 form a regular closed shape, which includes a central symmetrical pattern including, for example, an ellipse, a diamond, a rectangle, an even-numbered regular polygon (an even-numbered regular polygon), a parallelogram, or a special-shaped shape. For another example, the special-shaped shape is a shape composed of a combination of a rectangle and an ellipse. The regular closed shape may also be a trapezoid, a regular odd-numbered polygon (regular polygon with an even number of sides), or the like, which is not particularly limited in the embodiments of the present disclosure. In the embodiment shown in fig. 11, when the alignment holes 210 are provided in four, the centers P of the second openings 231 of the four alignment holes 210 are sequentially connected to form a rectangle, and the alignment line B is hung on the midpoint of the rectangle. Alternatively, when the number of the alignment holes 210 is three, the centers P of the second openings 231 of the three alignment holes 210 are sequentially connected to form a triangle, and the alignment line B is perpendicular to the middle point of the triangle. Of course, when the alignment holes 210 are provided in three or more rows, all the alignment holes 210 may be aligned in a row, that is, all the centers P of the second openings 231 may be sequentially connected to form a straight line.
Referring to fig. 7 again, in step S120, the preset relative position D refers to a preset distance between the center of gravity line a and the opposite line B. Before the first target 100 is attached, the position where the first target 100 is attached can be determined by means of the preset relative position D. Moreover, the center of gravity line a and the alignment line B are parallel to each other, and the influence on the bonding effect due to the angle between the two bonding surfaces of the first target 100 and the second target 200 is avoided.
In step S130, the preset relative position D is always maintained between the center of gravity line a of the first target 100 and the alignment line B of the second target 200 based on the target position, that is, during the process of controlling the first target 100 to approach the second target 200, so that the preset relative position D can be maintained after the first target 100 is attached to the second target 200, thereby improving the attaching accuracy. Moreover, the orthographic projection 231a of the second opening 231 is positioned within the orthographic projection 221a of the first opening 221, improving the ease of grasping the edge profile of the second opening 231.
Specifically, as shown in fig. 8, the orthographic projection 221a of the first opening 221 on the reference plane R and the orthographic projection 231a of the second opening 231 on the reference plane R are concentric circles. In this way, the first opening 221 is concentric with the second opening 231, the fitting accuracy can be further improved, and the reinspection by means of the first opening 221 can be easily performed after the fitting is completed.
According to the bonding method provided by the embodiment of the application, the plurality of alignment holes 210 are formed in the second target piece 200, the second target piece 200 is positioned at the center P of the second opening 231 of the second surface 230 by means of all the alignment holes 210, the alignment line B of the second target piece 200 is determined, and then the bonding position of the first target piece 100 is determined by the preset relative position D between the gravity center line A of the first target piece 100 and the alignment line B of the second target piece 200, so that the bonding accuracy when the first target piece 100 is bonded to the second target piece 200 is improved, and the poor vibration caused by poor accuracy is relieved when the first target piece 100 drives the second target piece 200 to vibrate.
Fig. 12 is a flowchart of a bonding method according to another embodiment of the present application.
Referring to fig. 12, in another embodiment of the present application, there is further provided a fitting method, including:
S210, acquiring image information of the first target 100 and image information of the second target 200;
S220, determining a gravity center line A of the first target piece 100 according to the image information of the first target piece 100;
s230, acquiring position information of the plurality of alignment holes 210 relative to the second target 200 according to the image information of the second target 200;
S240, determining an alignment line B of the second target 200 according to the position information of the plurality of alignment holes 210;
S250, acquiring a center of gravity line A of the first target part 100 and an alignment line B of the second target part 200, wherein a plurality of alignment holes 210 penetrating through the first surface 220 and the second surface 230 along the first direction are formed in the second target part 200, each alignment hole 210 is provided with a first opening 221 positioned on the first surface 220 and a second opening 231 positioned on the second surface 230, and the alignment line B is commonly determined based on the center P of all the second openings 231;
S260, controlling the first target piece 100 to move to a gravity center line A to a target position, wherein the gravity center line A is positioned at the target position, the orthographic projection of the gravity center line A on the reference surface R and the orthographic projection of the alignment line B on the reference surface R are provided with preset relative positions D, and the gravity center line A and the alignment line B are parallel to each other;
S270, controlling the first target member 100 to move close to the first surface 220 of the second target member 200 along the first direction based on the target position until the first target member 100 is attached to the first surface 220, wherein the orthographic projection 231a of the second opening 231 on the reference plane R is located in the orthographic projection 221a of the first opening 221 on the reference plane R, and the reference plane R is a plane perpendicular to the first direction.
In step S250, step S260 and step S270, the details of the foregoing embodiments may be referred to, and will not be described herein. It should be noted that, the steps S210, S220, S230 and S240 are not in a predetermined sequence. In the embodiment of the present application, this may be accomplished simultaneously, that is, to acquire the image information of the first target 100 and the second target 200 simultaneously, and to determine the gravity line a and the alignment line B simultaneously. In other embodiments, the image information of the first target 100 may be acquired first and the center of gravity line a thereof may be determined, the image information of the second target 200 may be acquired second and the alignment line B thereof may be determined, the image information of the second target 200 may be acquired first and the alignment line B thereof may be determined, and the image information of the first target 100 may be acquired second and the center of gravity line a thereof may be determined.
Fig. 13 is a schematic process diagram of a bonding method according to an embodiment of the application.
As shown in fig. 13, in some embodiments, step S210 specifically includes acquiring image information of the first target 100 and image information of the second target 200 by means of the beam splitter 300 and the camera module 400. The beam splitter 300 is disposed between the first target 100 and the second target 200 in an inclined manner to acquire an image beam of the first target 100 and an image beam of the second target 200. The camera module 400 is configured to receive the image beam from the beam splitter 300 and convert the image beam into image information of the first target 100 and image information of the second target 200. In this way, the beam splitter 300 can simultaneously acquire the image beams of the first target 100 and the second target 200, and at the same time, the image beam is received by the image capturing module 400 and converted into image information, so that the image information of the first target 100 and the second target 200 can be acquired at one time, thereby improving the precision and reducing the cost. Illustratively, the camera module 400 includes a charge coupled device, i.e., a CCD camera.
With continued reference to fig. 13, and in conjunction with fig. 10 and 11, in conjunction with the foregoing embodiments, after the image information of the first object 100 and the image information of the second object 200 are obtained, that is, the outline shape of the first object 100 is obtained, and the pattern on the second object 200 is obtained by connecting the centers P of the second openings 231 of the alignment holes 210. Thus, the center of gravity line a coordinate of the first target 100 and the alignment line B coordinate of the second target 200 can be obtained through calculation, that is, the relative position between the first target 100 and the second target 200 before the first target is attached is determined, and then the target position of the first target 100 attached to the second target 200 is determined by means of the preset relative position D. It should be noted that, the shape and structure of the first target 100 and the second target 200, the manner of obtaining the position information of the first target 100 and the second target 200, and the preset relative position D may be designed according to the actual requirement, which is not limited in particular in the embodiment of the present application.
Fig. 14 shows a schematic view of a conformable third object 500 according to an embodiment of the present application.
Referring to fig. 14 in combination with fig. 12, in some embodiments, after step S270, a step of filling the alignment hole 210 with the glue 600 is further included to attach the second target 200 to the third target 500. Wherein the third target 500 is located on the side of the second target 200 facing away from the first target 100. In this way, the adhesion between the second target 200 and the third target 500 can be achieved by means of the gel 600. The third target 500 may be a metal plate, for example. Moreover, the volume of the gel 600 can be increased by the boss 232, thereby increasing the adhesion between the second target 200 and the third target 500.
Referring again to fig. 7, in some embodiments, the first target 100 is provided in a plurality. All of the first target 100 and the second target 200 are configured to form a stack member S, the center of gravity line a of which coincides with the alignment line B of the second target 200. In this way, when it is necessary to attach the plurality of first target materials 100 to the second target material 200, the alignment line B of the second target material 200 can be overlapped with the center line of gravity of the laminated member S by the above-described attaching method. In connection with the foregoing embodiments and fig. 7, the two first target pieces 100 are attached to the second target piece 200 for illustration, and by means of the preset relative positions D, the two first target pieces 100 are respectively attached to two sides of the second target piece 200 symmetrically with respect to the symmetry axis L of the second target piece 200, so that the phenomenon that the amplitude of the attached stacked member S increases and the vibration frequency changes during vibration is alleviated on the basis of improving the attaching accuracy.
Fig. 15 shows a cross-sectional view of alignment hole 210 in accordance with one embodiment of the present application.
Referring to fig. 14 and 15, the glue 600 is poured from the alignment hole 210 when the second object 200 is attached to the third object 500 through the alignment hole 210 penetrating the first surface 220 and the second surface 230, thereby increasing the adhesive force between the second object 200 and the third object 500.
The inventors have attempted to set the radial dimensions of the inner wall of the registration hole 210 to be uniform from the first surface 220 to the second surface 230 (not shown in the figures), and as such, it is understood that this is a through hole. However, during the research, the inventors found that, when the alignment hole 210 is formed, the punching position is determined based on the protrusion 232 and the accuracy of the through hole is detected, that is, the accuracy of the alignment hole 210 is actually based on the second opening 231. Specifically, the center P of the second opening 231 is located on the symmetry axis of the boss 232. In this way, the protrusion 232 has a smaller gripping range than the entire surface of the second target 200, thereby further improving the accuracy. However, during the fitting process, the only feature that can be grasped is the first opening 221 on the first surface 220. Based on the above analysis, the edges of the hole and the hole that can be grasped when actually bonding are a first opening 221 on the first surface 220 and a second opening 231 on the second surface 230, respectively. That is, the features that can be grasped on both sides are different, and the more features that need to be grasped, the greater the accuracy error.
Based on this, referring to fig. 14 and 15, in some embodiments, the radial dimension of the inner wall of the alignment hole 210 gradually decreases from the first surface 220 to the second surface 230 along the first direction (i.e., the x-axis direction shown in fig. 14). Thus, the second opening 231 with a smaller size can be grasped during the attaching process, and as in the above analysis, the second opening 231 is the opening located on the side where the boss 232 is located in the second target 200, thereby further improving the attaching accuracy and reducing the error due to grasping more features as much as possible. In addition, the inner wall of the alignment hole 210 on the first surface 220 has a larger radial dimension, so that the gel 600 can be poured more easily, and the volume of the gel 600 in the alignment hole 210 is increased, thereby further improving the bonding reliability between the second target 200 and the third target 500.
FIG. 16 is a schematic diagram of a bonding method according to an embodiment of the application.
The following describes the bonding method provided by the embodiment of the present application with reference to the foregoing embodiments and fig. 2 and fig. 7. Taking the preset relative position of 1.725 mm as an example, the first target member 10 is attached to the second target member 20 without the alignment holes by the attaching method in the related art. As can be seen from the measurement data box graph (fig. 16) obtained by Minitab software, the center line a of the first target 10 and the center line b of the second target 20 are rechecked after bonding, and the actual distance T between the center line a and the center line b is 1.65 mm to 1.8 mm. It is understood that the tolerance is 75 microns. The inventors have also performed experiments on the bonding method of the second target piece with the through hole, and measured that the tolerance is 50 micrometers. By the bonding method in the embodiment of the present application, after bonding by means of the alignment hole 210, the actual distance T between the center line a of the first target 100 and the alignment line B of the second target 200 is 1.7 mm to 1.75 mm. It will be appreciated that the tolerance is reduced to 25 microns. With reference to fig. 16, it can be clearly known that the bonding scheme provided by the application can greatly improve bonding precision.
Referring to fig. 5 to 16, in the attaching method provided by the embodiment of the present application, a plurality of alignment holes 210 are formed in the second target 200, the second target 200 determines the alignment line B of the second target 200 by means of the center P of the second opening 231 of the second surface 230 where all the alignment holes 210 are located, and then determines the attaching position of the first target 100 by means of the preset relative position D between the center of gravity line a of the first target 100 and the alignment line B of the second target 200, thereby improving the attaching accuracy when the first target 100 is attached to the second target 200, and alleviating the poor vibration caused by poor precision when the first target 100 drives the second target 200 to vibrate. Further, with the help of the spectroscope 300 and the image pickup module 400, it is possible to simultaneously acquire the image information of the first target 100 and the second target 200 at a time. In addition, the radial dimension of the inner wall of the alignment hole 210 gradually decreases from the first surface 220 to the second surface 230, so that the second opening 221 with smaller radial dimension can be directly grasped when grasping the feature, and the accuracy of the alignment hole 210 is improved. When the glue 600 is poured into the alignment hole 210 to achieve the adhesion between the second target 200 and the third target 500, the adhesion of both can be improved by means of the alignment hole 210.
It should be noted that some of the technical solutions described above may be implemented as independent embodiments in the actual implementation process, or may be implemented as combined embodiments by combining them with each other. Some of the technical solutions described above are exemplary solutions, and specific how to implement the combination, and may be selected according to actual needs, and embodiments of the present application are not limited specifically. In addition, in describing the foregoing embodiments of the present application, the different embodiments are described in a corresponding order based on the idea of convenience in description, for example, the order is preset according to the requirements in the actual implementation process, and the execution order of the different embodiments is not limited. Accordingly, in an actual implementation, if multiple embodiments provided by the embodiments of the present application are required to be implemented, the order of execution provided when the embodiments are set forth according to the present application is not necessarily required, but the order of execution between different embodiments may be arranged according to the requirements.
It should be understood that, although the steps in the flowcharts of fig. 5 and 12 are shown in order as indicated by the arrows, these steps are not necessarily performed in order as indicated by the arrows. The steps are not strictly limited to the order of execution unless explicitly recited herein, and the steps may be executed in other orders. Moreover, at least a portion of the steps in fig. 5 and 12 may include a plurality of steps or stages, which are not necessarily performed at the same time, but may be performed at different times, and the order of the execution of the steps or stages is not necessarily sequential, but may be performed in rotation or alternatively with at least a portion of the steps or stages in other steps or steps.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the application, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the application, which are all within the scope of the application. Accordingly, the scope of protection of the present application is to be determined by the appended claims.
Claims (10)
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102486621A (en) * | 2010-12-02 | 2012-06-06 | 上海微电子装备有限公司 | Alignment adjusting device and alignment adjusting method |
| CN110470225A (en) * | 2019-09-23 | 2019-11-19 | 业成科技（成都）有限公司 | Abutted equipment and applying method |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE29713594U1 (en) * | 1997-07-30 | 1997-11-13 | Arturo Salice S.P.A., Novedrate, Como | Fastening plate for a fitting part, preferably for fastening a hinge arm to a supporting wall of a piece of furniture |
| CN215637929U (en) * | 2021-04-16 | 2022-01-25 | 格力电器（武汉）有限公司 | Paste positioning device for curved boards |
| CN216001764U (en) * | 2021-07-12 | 2022-03-11 | 江苏立导科技有限公司 | Laminating tool and laminating equipment |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102486621A (en) * | 2010-12-02 | 2012-06-06 | 上海微电子装备有限公司 | Alignment adjusting device and alignment adjusting method |
| CN110470225A (en) * | 2019-09-23 | 2019-11-19 | 业成科技（成都）有限公司 | Abutted equipment and applying method |
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