CN116445864A - System and method for monitoring and regulating uniformity of coating - Google Patents

System and method for monitoring and regulating uniformity of coating Download PDF

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CN116445864A
CN116445864A CN202310498962.3A CN202310498962A CN116445864A CN 116445864 A CN116445864 A CN 116445864A CN 202310498962 A CN202310498962 A CN 202310498962A CN 116445864 A CN116445864 A CN 116445864A
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evaporation system
base film
temperature value
surface resistance
evaporation
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CN116445864B (en
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臧世伟
刘文卿
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Chongqing Jinmei New Material Technology Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24Vacuum evaporation
    • C23C14/26Vacuum evaporation by resistance or inductive heating of the source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/543Controlling the film thickness or evaporation rate using measurement on the vapor source
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54Controlling or regulating the coating process
    • C23C14/542Controlling the film thickness or evaporation rate
    • C23C14/545Controlling the film thickness or evaporation rate using measurement on deposited material
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10Energy storage using batteries

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

本发明实施例提供一种镀膜均匀性监测与调控系统和方法,该系统包括:真空卷绕镀膜装置,其包括放卷机构、用于对基膜进行蒸镀的蒸发机构和收卷机构;温度测定装置,用于测量所述蒸发机构的温度值;面阻测试装置,用于测量所述基膜的面阻值;控制装置,用于根据所述蒸发机构的温度值和所述基膜的面阻值,控制所述放卷机构的基膜传动速度和/或所述蒸发机构的加热功率,以使得镀层沿着基膜移动方向的厚度具有均匀性。本发明能够基于温控与镀膜速度的匹配实现走膜方向镀膜厚度均匀性更加一致。

The embodiment of the present invention provides a coating uniformity monitoring and control system and method, the system includes: a vacuum winding coating device, which includes an unwinding mechanism, an evaporation mechanism and a winding mechanism for evaporating the base film; Measuring device for measuring the temperature value of the evaporation mechanism; surface resistance testing device for measuring the surface resistance value of the base film; control device for according to the temperature value of the evaporation mechanism and the base film The area resistance value is used to control the transmission speed of the base film of the unwinding mechanism and/or the heating power of the evaporation mechanism, so that the thickness of the coating layer along the moving direction of the base film is uniform. The present invention can achieve more consistent coating thickness uniformity in the film running direction based on the matching of temperature control and coating speed.

Description

一种镀膜均匀性监测与调控系统和方法A coating uniformity monitoring and control system and method

技术领域technical field

本发明涉及真空卷绕镀膜制程镀膜膜层的均匀性监测与调控控制系统,尤其是验证镀膜传动方向的MD方向(走膜方向)的镀膜均匀性问题,具体涉及一种镀膜均匀性监测与调控系统和方法。The invention relates to a uniformity monitoring and regulation control system of a coating film layer in a vacuum winding coating process, especially to verify the uniformity of the coating film in the MD direction (moving direction) of the coating film transmission direction, and specifically relates to a coating uniformity monitoring and control system systems and methods.

背景技术Background technique

在真空镀膜领域,尤其是大面积柔性基材表面镀膜设备系统,其中镀膜的方式包含真空磁控溅射镀膜和真空热蒸发系统镀膜。真空热蒸发系统镀膜通常又分为两个方面,其一是采用蒸发舟的方式镀膜,例如包装薄膜领域镀膜最为常见,即有相关的送丝机构连续地往高温状态下的蒸发舟表面输送镀膜材料,当材料接触或快要接触蒸发舟表面时候由于远高于材料融化温度的情况下瞬间被气化沉积在基膜表面,该方式的优势在于相关机构的升温和降温过程非常快,但是存在致命的问题在于随着蒸发舟使用时间的延长表面出现严重的腐蚀坑,当被蒸发材料置于腐蚀坑附近后蒸发过程容易形成溅射现象,从而造成柔性基膜的烧孔,致使镀膜材料的使用受到抑制。In the field of vacuum coating, especially large-area flexible substrate surface coating equipment systems, the coating methods include vacuum magnetron sputtering coating and vacuum thermal evaporation system coating. Vacuum thermal evaporation system coating is usually divided into two aspects. One is coating by evaporation boat. For example, coating in the field of packaging film is the most common, that is, there are related wire feeding mechanisms that continuously transport the coating to the surface of the evaporation boat under high temperature. When the material touches or is about to touch the surface of the evaporation boat, it is instantly vaporized and deposited on the surface of the base film because it is much higher than the melting temperature of the material. The advantage of this method is that the heating and cooling process of the relevant mechanism is very fast, but there are fatal The problem is that with the prolongation of the use time of the evaporation boat, serious corrosion pits appear on the surface. When the evaporated material is placed near the corrosion pit, the evaporation process is easy to form a sputtering phenomenon, which causes burning holes in the flexible base film, resulting in the use of coating materials. suppressed.

基于这样的问题则开发了另外一种技术手段,先将被蒸发材料置于耐高温的容器,该容器处于有电加热装置和保温/测温系统内部,当电加热装置开启后耐高温容器温度升高,致使内部的被蒸发材料从固态--液态--气态过程的转变,最终材料沉积到基材表面。该方式具有的显著优点是蒸发过程物料的状态相对比较稳定,不容易出现相关的被蒸发材料产生溅射烧孔的问题,从而更显著的规避了镀膜产品面临的应用缺陷。Based on this problem, another technical means has been developed. First, the evaporated material is placed in a high-temperature resistant container, which is inside the electric heating device and the heat preservation/temperature measuring system. When the electric heating device is turned on, the temperature of the high-temperature resistant container Elevation, resulting in the transformation of the internal evaporated material from a solid-liquid-gas process, and finally the material is deposited on the surface of the substrate. The significant advantage of this method is that the state of the material during the evaporation process is relatively stable, and the problem of sputtering hole burning in the evaporated material is not easy to occur, thus more significantly avoiding the application defects faced by the coated product.

然而,该方式也存在一些缺点,如该系统是通过电加热热传导方式将容器加热、容器再将被蒸发物料加热,最终达成被蒸发材料气化的效果。整个系统的升温过程相对较慢,容器内的被蒸发材料及容器/保温材料温度达到一个相对稳定平衡的时间更长,尤其是该过程中被蒸发材料随着温度的升高其蒸发的量越大,并且该过程蒸发量是不稳定的,在不稳定的蒸发状态下,这些蒸发料将大量被蒸发浪费掉,尤其是蒸发到镀膜挡板之上而被浪费,这将造成装载一定量的被蒸发物的实际可镀膜的米数等大幅度降低。However, this method also has some disadvantages. For example, the system heats the container by means of electric heating and heat conduction, and then the container heats the material to be evaporated, and finally achieves the effect of vaporizing the material to be evaporated. The heating process of the whole system is relatively slow, and it takes longer for the temperature of the material to be evaporated in the container and the temperature of the container/insulation material to reach a relatively stable equilibrium. Large, and the process evaporation is unstable, in an unstable evaporation state, a large amount of these evaporation materials will be evaporated and wasted, especially on the coating baffle and will be wasted, which will cause a certain amount of loading The actual number of meters of the evaporated material that can be coated is greatly reduced.

另一方面,由于加热器的电加热部件随着热环境温度的增加其自身工作的热输出也会发生改变,因此由于初始状态的蒸发量是不稳定的,故直接开启挡板以一定的速度镀膜则MD方向的膜层均匀性是比较差的。On the other hand, since the electric heating part of the heater will also change its own heat output with the increase of the thermal environment temperature, so the evaporation amount in the initial state is unstable, so the baffle is opened directly at a certain speed The uniformity of the coating in the MD direction is relatively poor.

发明内容Contents of the invention

有鉴于此,本发明实施例的目的在于提供一种镀膜均匀性监测与调控系统和调控方法,以解决现有技术中的问题。In view of this, the purpose of the embodiments of the present invention is to provide a coating uniformity monitoring and regulation system and regulation method, so as to solve the problems in the prior art.

第一方面,本发明实施例提供了一种镀膜均匀性监测与调控系统,所述系统包括:In the first aspect, an embodiment of the present invention provides a coating uniformity monitoring and control system, the system comprising:

真空卷绕镀膜装置,其包括放卷机构、用于对基膜进行蒸镀的蒸发机构和收卷机构;A vacuum winding coating device, which includes an unwinding mechanism, an evaporation mechanism and a winding mechanism for evaporating the base film;

温度测定装置,用于测量所述蒸发机构的温度值;a temperature measuring device for measuring the temperature value of the evaporation mechanism;

面阻测试装置,用于测量所述基膜的面阻值;Area resistance testing device, for measuring the area resistance value of described base film;

控制装置,用于根据所述蒸发机构的温度值和所述基膜的面阻值,控制所述放卷机构的基膜传动速度和/或所述蒸发机构的加热功率,以使得镀层沿着基膜移动方向的厚度具有均匀性。The control device is used to control the transmission speed of the base film of the unwinding mechanism and/or the heating power of the evaporation mechanism according to the temperature value of the evaporation mechanism and the surface resistance value of the base film, so that the coating layer along the The thickness of the base film in the moving direction has uniformity.

在一些可能的实施方式中,所述控制装置,具体用于根据在预设面阻阈值下的基膜传动速度与所述蒸发机构的温度值之间的函数关系,以及所述蒸发机构的实时温度值,确定所述放卷机构的实时基膜传动速度。In some possible implementation manners, the control device is specifically configured to, according to the functional relationship between the transmission speed of the base film under the preset surface resistance threshold and the temperature value of the evaporation mechanism, and the real-time The temperature value determines the real-time base film transmission speed of the unwinding mechanism.

在一些可能的实施方式中,所述蒸发机构包括第一蒸发系统和第二蒸发系统,所述第一蒸发系统设置在所述第二蒸发系统的沿基膜传送路径的上游;In some possible implementations, the evaporating mechanism includes a first evaporating system and a second evaporating system, the first evaporating system is arranged upstream of the second evaporating system along the transport path of the base film;

所述温度测定装置包括:第一温度探测仪,设置在所述第一蒸发系统上,用于测量所述第一蒸发系统的第一温度值;以及,第二温度探测仪,设置在所述第二蒸发系统上,用于测量所述第二蒸发系统的第二温度值;The temperature measurement device includes: a first temperature detector, arranged on the first evaporation system, for measuring the first temperature value of the first evaporation system; and, a second temperature detector, arranged on the On the second evaporation system, used to measure the second temperature value of the second evaporation system;

所述面阻测试装置包括:第一面阻测试仪,设置于所述第一蒸发系统和所述第二蒸发系统之间的基膜传送路径上,用于测量所述基膜的当前镀膜面的第一面阻值;以及,第二面阻测试仪,设置于所述第二蒸发系统与所述收卷机构之间的基膜传送路径上,用于测量所述基膜的双面上形成的镀层的总面阻值,以及根据所述总面阻值与所述第一面阻值的差值得到另一镀膜面的第二面阻值。The surface resistance testing device includes: a first surface resistance tester, which is arranged on the base film transmission path between the first evaporation system and the second evaporation system, and is used to measure the current coating surface of the base film The first surface resistance value; and, the second surface resistance tester is arranged on the base film transmission path between the second evaporation system and the winding mechanism, and is used to measure both sides of the base film The total areal resistance of the formed coating, and the second areal resistance of another coating surface obtained according to the difference between the total areal resistance and the first areal resistance.

在一些可能的实施方式中,所述控制装置,具体用于当所述第一面阻值达到预设的面阻阈值时,根据在所述预设的面阻阈值下的基膜传动速度与所述第一蒸发系统的温度值之间的第一函数关系,以及所述第一蒸发系统的实时温度值,确定实时基膜传动速度;根据在所述预设的面阻阈值下的基膜传动速度与所述第二蒸发系统的温度值之间的第二函数关系,以及所述实时基膜传动速度,获得所述第二蒸发系统的理想温度值;根据所述第二蒸发系统的理想温度值和所述第二蒸发系统的实际温度值之间的比较结果,调节所述第二蒸发系统的加热功率。In some possible implementation manners, the control device is specifically configured to, when the first surface resistance value reaches a preset surface resistance threshold, according to the base film transmission speed and The first functional relationship between the temperature values of the first evaporation system and the real-time temperature values of the first evaporation system determines the real-time transmission speed of the base film; according to the base film under the preset area resistance threshold The second functional relationship between the transmission speed and the temperature value of the second evaporation system, and the real-time base film transmission speed, obtain the ideal temperature value of the second evaporation system; according to the ideal temperature value of the second evaporation system As a result of the comparison between the temperature value and the actual temperature value of the second evaporation system, the heating power of the second evaporation system is adjusted.

在一些可能的实施方式中,所述控制装置,具体用于:In some possible implementation manners, the control device is specifically used for:

如果所述第二蒸发系统的理想温度值大于所述第二蒸发系统的实际温度值,则控制增加所述第二蒸发系统的加热功率,并且控制所述第二蒸发系统的加热功率大于所述第一蒸发系统的加热功率;如果所述第二蒸发系统的理想温度值小于所述第二蒸发系统的实际温度值,则控制减小所述第二蒸发系统的加热功率,并且控制所述第二蒸发系统的加热功率小于所述第一蒸发系统的加热功率。If the ideal temperature value of the second evaporating system is greater than the actual temperature value of the second evaporating system, control to increase the heating power of the second evaporating system, and control the heating power of the second evaporating system to be greater than the The heating power of the first evaporating system; if the ideal temperature value of the second evaporating system is less than the actual temperature value of the second evaporating system, then control to reduce the heating power of the second evaporating system, and control the first The heating power of the second evaporation system is smaller than the heating power of the first evaporation system.

在一些可能的实施方式中,所述控制装置,具体用于:In some possible implementation manners, the control device is specifically used for:

当所述第一面阻值先于所述第二面阻值达到预设的面阻阈值时,根据在所述预设的面阻阈值下的基膜传动速度与所述第一蒸发系统的温度值之间的第一函数关系,以及所述第一蒸发系统的实时温度值,确定实时基膜传动速度;根据在所述预设的面阻阈值下的基膜传动速度与所述第二蒸发系统的温度值之间的第二函数关系,以及所述实时基膜传动速度,获得所述第二蒸发系统的理想温度值;根据所述第二蒸发系统的理想温度值和所述第二蒸发系统的实际温度值之间的比较结果,调节所述第二蒸发系统的加热功率;或者,When the first area resistance reaches the preset area resistance threshold before the second area resistance, according to the base film transmission speed under the preset area resistance threshold and the first evaporation system The first functional relationship between the temperature values and the real-time temperature value of the first evaporation system determine the real-time base film transmission speed; according to the base film transmission speed under the preset area resistance threshold and the second The second functional relationship between the temperature values of the evaporation system and the real-time base film transmission speed obtains the ideal temperature value of the second evaporation system; according to the ideal temperature value of the second evaporation system and the second adjusting the heating power of said second evaporation system as a result of the comparison between the actual temperature values of the evaporation system; or,

当所述第二面阻值先于所述第一面阻值达到预设的面阻阈值时,根据在所述预设的面阻阈值下的基膜传动速度与所述第二蒸发系统的温度值之间的第二函数关系,以及所述第二蒸发系统的实时温度值,确定实时基膜传动速度;根据在所述预设的面阻阈值下的基膜传动速度与所述第一蒸发系统的温度值之间的第一函数关系,以及所述实时基膜传动速度,获得所述第一蒸发系统的理想温度值;根据所述第一蒸发系统的理想温度值和所述第一蒸发系统的实际温度值之间的比较结果,调节所述第一蒸发系统的加热功率。When the second area resistance reaches the preset area resistance threshold before the first area resistance value, according to the transmission speed of the base film under the preset area resistance threshold and the second evaporation system The second functional relationship between the temperature values and the real-time temperature value of the second evaporation system determine the real-time base film transmission speed; according to the base film transmission speed under the preset area resistance threshold and the first The first functional relationship between the temperature values of the evaporation system and the real-time base film transmission speed obtains the ideal temperature value of the first evaporation system; according to the ideal temperature value of the first evaporation system and the first As a result of the comparison between the actual temperature values of the evaporation system, the heating power of the first evaporation system is adjusted.

第二方面,提供一种镀膜均匀性监测与调控方法,所述方法包括:In a second aspect, a coating uniformity monitoring and regulation method is provided, the method comprising:

获取蒸发机构的温度值;Obtain the temperature value of the evaporation mechanism;

获取基膜的面阻值;Obtain the areal resistance of the base film;

根据所述蒸发机构的温度值和所述基膜的面阻值,控制放卷机构的基膜传动速度和/或所述蒸发机构的加热功率,以使得镀层沿着基膜移动方向的厚度具有均匀性。According to the temperature value of the evaporation mechanism and the area resistance value of the base film, the transmission speed of the base film of the unwinding mechanism and/or the heating power of the evaporation mechanism are controlled so that the thickness of the coating along the moving direction of the base film has Uniformity.

在一些可能的实施方式中,所述的根据所述蒸发机构的温度值和所述基膜的面阻值,控制放卷机构的基膜传动速度,具体包括:In some possible implementation manners, the controlling the transmission speed of the base film of the unwinding mechanism according to the temperature value of the evaporation mechanism and the area resistance value of the base film specifically includes:

根据在预设面阻阈值下的基膜传动速度与所述蒸发机构的温度值之间的函数关系,以及所述蒸发机构的实时温度值,确定所述放卷机构的实时基膜传动速度。The real-time base film transmission speed of the unwinding mechanism is determined according to the functional relationship between the base film transmission speed under the preset surface resistance threshold and the temperature value of the evaporation mechanism, and the real-time temperature value of the evaporation mechanism.

在一些可能的实施方式中,所述蒸发机构包括第一蒸发系统和第二蒸发系统,所述第一蒸发系统设置在所述第二蒸发系统的沿基膜传送路径的上游;所述方法具体包括:In some possible implementations, the evaporating mechanism includes a first evaporating system and a second evaporating system, the first evaporating system is arranged upstream of the second evaporating system along the transport path of the base film; the method specifically include:

获取所述第一蒸发系统的第一温度值,获取所述第二蒸发系统的第二温度值;acquiring a first temperature value of the first evaporation system, and acquiring a second temperature value of the second evaporation system;

获取所述基膜的当前镀膜面的第一面阻值,获取所述基膜的双面上形成的镀层的总面阻值,以及根据所述总面阻值与所述第一面阻值的差值得到另一镀膜面的第二面阻值;Acquiring the first surface resistance value of the current coating surface of the base film, obtaining the total surface resistance value of the coating layer formed on both sides of the base film, and according to the total surface resistance value and the first surface resistance value The difference of the second surface resistance value of the other coating surface is obtained;

当所述第一面阻值达到预设的面阻阈值时,根据在所述预设的面阻阈值下的基膜传动速度与所述第一蒸发系统的温度值之间的第一函数关系,以及所述第一蒸发系统的实时温度值,确定实时基膜传动速度;When the first surface resistance value reaches a preset surface resistance threshold value, according to the first functional relationship between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system , and the real-time temperature value of the first evaporation system to determine the real-time base film transmission speed;

根据在所述预设的面阻阈值下的基膜传动速度与所述第二蒸发系统的温度值之间的第二函数关系,以及所述实时基膜传动速度,获得所述第二蒸发系统的理想温度值;According to the second functional relationship between the base film transmission speed under the preset area resistance threshold and the temperature value of the second evaporation system, and the real-time base film transmission speed, the second evaporation system is obtained ideal temperature value;

根据所述第二蒸发系统的理想温度值和所述第二蒸发系统的实际温度值之间的比较结果,调节所述第二蒸发系统的加热功率。According to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system, the heating power of the second evaporation system is adjusted.

在一些可能的实施方式中,所述的根据所述第二蒸发系统的理想温度值和所述第二蒸发系统的实际温度值之间的比较结果,调节所述第二蒸发系统的加热功率,具体包括:In some possible implementation manners, the heating power of the second evaporation system is adjusted according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system, Specifically include:

如果所述第二蒸发系统的理想温度值大于所述第二蒸发系统的实际温度值,则控制增加所述第二蒸发系统的加热功率,并且控制所述第二蒸发系统的加热功率大于所述第一蒸发系统的加热功率或者控制所述第二蒸发系统的温度增速大于所述第一蒸发系统的温度增速;如果所述第二蒸发系统的理想温度值小于所述第二蒸发系统的实际温度值,则控制减小所述第二蒸发系统的加热功率,并且控制所述第二蒸发系统的加热功率小于所述第一蒸发系统的加热功率或者控制所述第二蒸发系统的温度增速小于所述第一蒸发系统的温度增速。If the ideal temperature value of the second evaporating system is greater than the actual temperature value of the second evaporating system, control to increase the heating power of the second evaporating system, and control the heating power of the second evaporating system to be greater than the The heating power of the first evaporation system or the temperature increase rate of the second evaporation system is greater than the temperature increase rate of the first evaporation system; if the ideal temperature value of the second evaporation system is smaller than the second evaporation system If the actual temperature value is lower, the heating power of the second evaporating system is controlled to be reduced, and the heating power of the second evaporating system is controlled to be smaller than the heating power of the first evaporating system or the temperature of the second evaporating system is controlled to increase. The speed is less than the temperature growth rate of the first evaporation system.

在一些可能的实施方式中,所述蒸发机构包括第一蒸发系统和第二蒸发系统,所述第一蒸发系统设置在所述第二蒸发系统的沿基膜传送路径的上游;所述方法具体包括:In some possible implementations, the evaporating mechanism includes a first evaporating system and a second evaporating system, the first evaporating system is arranged upstream of the second evaporating system along the transport path of the base film; the method specifically include:

获取所述第一蒸发系统的第一温度值,获取所述第二蒸发系统的第二温度值;acquiring a first temperature value of the first evaporation system, and acquiring a second temperature value of the second evaporation system;

获取所述基膜的当前镀膜面的第一面阻值,获取所述基膜的双面的第二面阻值;Obtaining the resistance value of the first surface of the current coating surface of the base film, and obtaining the resistance value of the second surface of both sides of the base film;

当所述第一面阻值先于所述第二面阻值达到预设的面阻阈值时,根据在所述预设的面阻阈值下的基膜传动速度与所述第一蒸发系统的温度值之间的第一函数关系,以及所述第一蒸发系统的实时温度值,确定实时基膜传动速度;根据在所述预设的面阻阈值下的基膜传动速度与所述第二蒸发系统的温度值之间的第二函数关系,以及所述实时基膜传动速度,获得所述第二蒸发系统的理想温度值;根据所述第二蒸发系统的理想温度值和所述第二蒸发系统的实际温度值之间的比较结果,调节所述第二蒸发系统的加热功率;或者,When the first area resistance reaches the preset area resistance threshold before the second area resistance, according to the base film transmission speed under the preset area resistance threshold and the first evaporation system The first functional relationship between the temperature values and the real-time temperature value of the first evaporation system determine the real-time base film transmission speed; according to the base film transmission speed under the preset area resistance threshold and the second The second functional relationship between the temperature values of the evaporation system and the real-time base film transmission speed obtains the ideal temperature value of the second evaporation system; according to the ideal temperature value of the second evaporation system and the second adjusting the heating power of said second evaporation system as a result of the comparison between the actual temperature values of the evaporation system; or,

当所述第二面阻值先于所述第一面阻值达到预设的面阻阈值时,根据在所述预设的面阻阈值下的基膜传动速度与所述第二蒸发系统的温度值之间的第二函数关系,以及所述第二蒸发系统的实时温度值,确定实时基膜传动速度;根据在所述预设的面阻阈值下的基膜传动速度与所述第一蒸发系统的温度值之间的第一函数关系,以及所述实时基膜传动速度,获得所述第一蒸发系统的理想温度值;根据所述第一蒸发系统的理想温度值和所述第一蒸发系统的实际温度值之间的比较结果,调节所述第一蒸发系统的加热功率。When the second area resistance reaches the preset area resistance threshold before the first area resistance value, according to the transmission speed of the base film under the preset area resistance threshold and the second evaporation system The second functional relationship between the temperature values and the real-time temperature value of the second evaporation system determine the real-time base film transmission speed; according to the base film transmission speed under the preset area resistance threshold and the first The first functional relationship between the temperature values of the evaporation system and the real-time base film transmission speed obtains the ideal temperature value of the first evaporation system; according to the ideal temperature value of the first evaporation system and the first As a result of the comparison between the actual temperature values of the evaporation system, the heating power of the first evaporation system is adjusted.

第三方面,提供一种计算机可读存储介质,其上存储有计算机程序,该程序被处理器执行时实现第二方面所述的任意一种镀膜均匀性监测与调控方法。In a third aspect, a computer-readable storage medium is provided, on which a computer program is stored, and when the program is executed by a processor, any method for monitoring and regulating coating uniformity described in the second aspect is implemented.

第四方面,提供一种计算机设备,其包括:In a fourth aspect, a computer device is provided, which includes:

一个或多个处理器;one or more processors;

存储装置,用于存储一个或多个程序;storage means for storing one or more programs;

当所述一个或多个程序被所述一个或多个处理器执行时,使得所述一个或多个处理器实现如第二方面所述的任意一种镀膜均匀性监测与调控方法。When the one or more programs are executed by the one or more processors, the one or more processors are made to implement any method for monitoring and regulating coating uniformity as described in the second aspect.

上述技术方案具有如下有益效果:The above technical scheme has the following beneficial effects:

相同的镀膜速度下单面MD方向的面阻测试数值偏差在预期范围内,进一步地双面的MD方向的面阻测试数值偏差都在控制范围内;Under the same coating speed, the value deviation of the surface resistance test in the single-sided MD direction is within the expected range, and the value deviation of the surface resistance test value in the MD direction on both sides is within the control range;

提前进行低蒸发量的镀膜调控,提升镀膜的效率及蒸发物料的利用率;Carry out coating regulation with low evaporation in advance to improve the efficiency of coating and the utilization rate of evaporated materials;

降低耐高温蒸发容器上方的挡板的无效沉积涂层,以至于减少其整个蒸发过程因为挡板下方的沉积涂层太多后粘附不了或处理不便,最终掉落到耐高温容器形成飞溅现象,避免损坏耐高温蒸发容器和破坏基材表观质量。Reduce the ineffective deposition coating on the baffle above the high-temperature resistant evaporation container, so as to reduce the entire evaporation process, because the deposited coating under the baffle is too much and cannot be adhered or handled inconveniently, and eventually falls into the high-temperature resistant container to form a splash phenomenon , to avoid damage to the high temperature evaporation container and damage the apparent quality of the substrate.

附图说明Description of drawings

为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention. Those skilled in the art can also obtain other drawings based on these drawings without creative work.

图1是本发明实施例的一种镀膜均匀性监测与调控系统的结构示意图;Fig. 1 is a schematic structural diagram of a coating uniformity monitoring and control system according to an embodiment of the present invention;

图2是本发明实施例的一种镀膜均匀性监测与调控系统的流程示意图一;2 is a schematic flow diagram of a coating uniformity monitoring and control system according to an embodiment of the present invention;

图3是本发明实施例的一种镀膜均匀性监测与调控系统的流程示意图二。FIG. 3 is a second schematic flow diagram of a coating uniformity monitoring and control system according to an embodiment of the present invention.

附图标号说明:Explanation of reference numbers:

A1、放卷辊;A2、收卷辊;A1, Unwinding roller; A2, Rewinding roller;

B1、第一过辊;B2、第二过辊;B3、第三过辊;B4、第四过辊;B1, the first roller; B2, the second roller; B3, the third roller; B4, the fourth roller;

C1、第一展平辊;C2、第二展平辊;C3、第三展平辊;C1, the first flattening roller; C2, the second flattening roller; C3, the third flattening roller;

D1、第一镀膜冷鼓;D2、第二镀膜冷鼓;D1, the first coating cooling drum; D2, the second coating cooling drum;

E1、第一蒸发系统;E2、第二蒸发系统;E1, the first evaporation system; E2, the second evaporation system;

E11、第一温度探测仪;E21、第二温度探测仪;E11, the first temperature detector; E21, the second temperature detector;

E12、第一保温材料;E22、第二保温材料;E12, the first thermal insulation material; E22, the second thermal insulation material;

E13、第一加热电极;E23、第二加热电极;E13, the first heating electrode; E23, the second heating electrode;

E14、第一蒸发容器;E24、第二蒸发容器;E14, the first evaporation container; E24, the second evaporation container;

F1、第一面阻测试仪;F2、第二面阻测试仪。F1, the first surface resistance tester; F2, the second surface resistance tester.

具体实施方式Detailed ways

下面将详细描述本发明的各个方面的特征和示例性实施例。在下面的详细描述中,提出了许多具体细节,以便提供对本发明的全面理解。但是,对于本领域技术人员来说很明显的是,本发明可以在不需要这些具体细节中的一些细节的情况下实施。下面对实施例的描述仅仅是为了通过示出本发明的示例来提供对本发明的更好的理解。在附图和下面的描述中,至少部分的公知结构和技术没有被示出,以便避免对本发明造成不必要的模糊;并且,为了清晰,可能夸大了部分结构的尺寸。此外,下文中所描述的特征、结构或特性可以以任何合适的方式结合在一个或更多实施例中。Features and exemplary embodiments of various aspects of the invention will be described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by showing examples of the present invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in order to avoid unnecessarily obscuring the present invention; and, for clarity, the dimensions of some structures may have been exaggerated. Furthermore, the features, structures, or characteristics described hereinafter may be combined in any suitable manner in one or more embodiments.

基于现有行业内的真空镀膜系统存在出现的蒸发源被蒸发物料蒸发量的变化、被蒸发材料的浪费及MD方向(走膜方向)的镀膜厚度存在明显的不均匀的技术问题。本发明实施例拟采用如下的技术方案更好地解决上述的问题,主要通过基膜传动速度与蒸发系统温度双重调控,实现蒸发源系统即便在非稳态的蒸发阶段尽早开启挡板跑膜镀膜动作,基于温控与镀膜速度(放卷端基膜传动速度)的匹配实现MD方向镀膜厚度均匀性更加一致。Based on the existing vacuum coating system in the industry, there are technical problems such as the change of the evaporation amount of the evaporated material at the evaporation source, the waste of the evaporated material, and the apparent unevenness of the coating thickness in the MD direction (film-moving direction). The embodiment of the present invention intends to use the following technical solutions to better solve the above-mentioned problems, mainly through the dual control of the transmission speed of the base film and the temperature of the evaporation system, so as to realize the early opening of the baffle plate to run the film coating even in the unsteady evaporation stage of the evaporation source system Action, based on the matching of temperature control and coating speed (unwinding end base film transmission speed), the uniformity of coating thickness in MD direction is more consistent.

本发明实施例要解决的技术问题包括如下多个:如何保证走膜方向膜层的厚度一致性;如何能够利用镀膜蒸发系统高效率镀膜以及实现镀膜材料的高利用率;如何避免挡板过快沉积相当厚度的薄膜对后续生产造成影响。The technical problems to be solved in the embodiments of the present invention include the following: how to ensure the consistency of the thickness of the film layer in the direction of the film; how to use the coating evaporation system to coat the film efficiently and realize the high utilization rate of the coating material; how to avoid the baffle too fast Depositing a considerable thickness of film will affect subsequent production.

本发明实施例提供一种镀膜均匀性监测与调控系统,其包含具有基本真空卷绕镀膜功能的系统部件,特别地具有蒸发系统最接近于高温蒸发源附近的温度测定装置、非接触式涡流电阻测试装置,以及镀膜基材走速控制装置,其通过采集温度数据与电阻数据发出指令以控制镀膜走速。An embodiment of the present invention provides a coating uniformity monitoring and control system, which includes system components with basic vacuum winding coating functions, especially a temperature measuring device that is closest to the high-temperature evaporation source in the evaporation system, a non-contact eddy current resistor The testing device and the speed control device of the coating substrate send instructions to control the coating speed by collecting temperature data and resistance data.

本发明实施例采用一种耐高温容器盛装镀膜材料,通过辅助保温的电加热装置加热镀膜材料气化蒸发后在衬底表面形成薄膜,通过镀膜膜速及电加热装置温度控制有机结合的方式进行镀膜材料MD方向膜层厚度均匀性的调控,并通过基材非接触式面阻测试仪测试反馈结果发出温度及膜速的调控指令。In the embodiment of the present invention, a high-temperature-resistant container is used to hold the coating material, and the coating material is heated by an electric heating device for auxiliary heat preservation to form a thin film on the surface of the substrate after vaporization and evaporation. The thickness uniformity of the film layer in the MD direction of the coating material is controlled, and the control command of the temperature and film speed is issued through the test feedback result of the non-contact surface resistance tester of the substrate.

本发明实施例提供了一种镀膜均匀性监测与调控系统,该系统包括:An embodiment of the present invention provides a coating uniformity monitoring and control system, the system includes:

真空卷绕镀膜装置,其包括放卷机构、用于对基膜进行蒸镀的蒸发机构和收卷机构;A vacuum winding coating device, which includes an unwinding mechanism, an evaporation mechanism and a winding mechanism for evaporating the base film;

温度测定装置,用于测量蒸发机构的温度值,具体可以是测量石墨加热电极的温度值。The temperature measurement device is used to measure the temperature value of the evaporation mechanism, specifically, it can measure the temperature value of the graphite heating electrode.

面阻测试装置,用于测量基膜的面阻值;Surface resistance testing device for measuring the surface resistance of the base film;

控制装置,用于根据蒸发机构的温度值和基膜的面阻值,控制放卷机构的基膜传动速度和/或蒸发机构的加热功率,以使得镀层沿着基膜移动方向的厚度具有均匀性。The control device is used to control the transmission speed of the base film of the unwinding mechanism and/or the heating power of the evaporation mechanism according to the temperature value of the evaporation mechanism and the area resistance value of the base film, so that the thickness of the coating layer along the moving direction of the base film is uniform. sex.

在一些实施例中,蒸发机构的上方设置有镀膜挡板,控制装置还用于当蒸发机构的温度值达到预设的镀膜温度阈值时,控制放卷机构开启基膜传动,以及开启镀膜挡板。In some embodiments, a coating baffle is arranged above the evaporation mechanism, and the control device is also used to control the unwinding mechanism to turn on the base film transmission and open the coating baffle when the temperature of the evaporation mechanism reaches the preset coating temperature threshold .

在一些实施例中,控制装置具体用于根据在预设面阻阈值下的基膜传动速度与蒸发机构的温度值之间的函数关系,以及蒸发机构的实时温度值,确定放卷机构的实时基膜传动速度。In some embodiments, the control device is specifically used to determine the real-time temperature of the unwinding mechanism according to the functional relationship between the base film transmission speed and the temperature value of the evaporation mechanism under the preset surface resistance threshold, and the real-time temperature value of the evaporation mechanism. Basement membrane transmission speed.

如图1所示,该镀膜均匀性监测与调控系统包括:放卷辊A1、第一过辊B1、第一展平辊C1、第一镀膜冷鼓D1、第一蒸发系统E1、第二过辊B2、第三过辊B3、第一面阻测试仪F1、第二展平辊C2、第二镀膜冷鼓D2、第二蒸发系统E2、第四过辊B4、第二面阻测试仪F2、第三展平辊C3和收卷辊A2。As shown in Figure 1, the coating uniformity monitoring and control system includes: unwinding roller A1, first passing roller B1, first flattening roller C1, first coating cooling drum D1, first evaporation system E1, second passing roller Roller B2, third passing roller B3, first surface resistance tester F1, second flattening roller C2, second coating cold drum D2, second evaporation system E2, fourth passing roller B4, second surface resistance tester F2 , the third flattening roll C3 and winding roll A2.

第一蒸发系统E1设置在第一镀膜冷鼓D1的下方,第一蒸发系统E1包括:第一温度探测仪E11、第一保温材料E12、第一加热电极E13和第一蒸发容器E14。第一加热电极E13中设置有至少一个孔,一个或多个第一蒸发容器E14安装设置在第一加热电极E13的相应孔中,第一蒸发容器E14中具有蒸发料。第一保温材料E12可以位于第一加热电极E13(例如石墨加热电极)周边,还可以位于第一蒸发容器E14(例如坩埚)周边。The first evaporation system E1 is arranged under the first coating cold drum D1, and the first evaporation system E1 includes: a first temperature detector E11, a first heat preservation material E12, a first heating electrode E13 and a first evaporation container E14. At least one hole is arranged in the first heating electrode E13, and one or more first evaporation containers E14 are installed in the corresponding holes of the first heating electrode E13, and the first evaporation container E14 has evaporation materials. The first thermal insulation material E12 may be located around the first heating electrode E13 (such as a graphite heating electrode), and may also be located around the first evaporation container E14 (such as a crucible).

第二蒸发系统E2设置在第二镀膜冷鼓D2的下方,第二蒸发系统E2包括:第二温度探测仪E21、第二保温材料E22、第二加热电极E23和第二蒸发容器E24。第二加热电极E23中设置有至少一个孔,一个或多个第二蒸发容器E24安装设置在第二加热电极E23的相应孔中,第二蒸发容器E24中具有蒸发料。第二保温材料E22可以位于第二加热电极E23(例如石墨加热电极)周边,还可以位于第二蒸发容器E24(例如坩埚)周边。The second evaporation system E2 is arranged below the second coating cold drum D2, and the second evaporation system E2 includes: a second temperature detector E21, a second heat preservation material E22, a second heating electrode E23 and a second evaporation container E24. At least one hole is provided in the second heating electrode E23, and one or more second evaporation containers E24 are installed in the corresponding holes of the second heating electrode E23, and the second evaporation container E24 has evaporation material. The second thermal insulation material E22 can be located around the second heating electrode E23 (such as a graphite heating electrode), and can also be located around the second evaporation container E24 (such as a crucible).

待镀膜的薄膜从放卷辊A1出发,依次经过第一过辊B1、第一展平辊C1、第一镀膜冷鼓D1、第二过辊B2、第三过辊B3、第二展平辊C2、第二镀膜冷鼓D2、第四过辊B4、第三展平辊C3,达到收卷辊A2。The film to be coated starts from the unwinding roller A1, and passes through the first roller B1, the first flattening roller C1, the first coating cold drum D1, the second roller B2, the third roller B3, and the second flattening roller. C2, the second coating cooling drum D2, the fourth passing roller B4, the third flattening roller C3, reaching the winding roller A2.

第一展平辊C1和第二过辊B2分别设置在第一镀膜冷鼓D1的两侧,第二展平辊C2和第四过辊B4分别设置在第二镀膜冷鼓D2的两侧。第一过辊B1设置在放卷辊A1和第一展平辊C1之间,第三过辊B3设置在第二过辊B2和第二展平辊C2之间,第三展平辊C3设置在第四过辊B4和收卷辊A2之间。The first flattening roll C1 and the second passing roll B2 are respectively arranged on both sides of the first coating cold drum D1, and the second flattening roll C2 and the fourth passing roll B4 are respectively arranged on both sides of the second coating cold drum D2. The first passing roller B1 is arranged between the unwinding roller A1 and the first flattening roller C1, the third passing roller B3 is arranged between the second passing roller B2 and the second flattening roller C2, and the third flattening roller C3 is arranged Between the fourth passing roller B4 and the winding roller A2.

在其他实施例中,上述过辊和展平辊的数量可以增加或者减少。In other embodiments, the number of the above-mentioned passing rolls and flattening rolls can be increased or decreased.

第一面阻测试仪F1和第二面阻测试仪F2能够对薄膜的单面或双面的面阻值进行非接触式测量。The first areal resistance tester F1 and the second areal resistance tester F2 can perform non-contact measurement of the areal resistance of one or both sides of the film.

在一些实施例中,蒸发机构包括第一蒸发系统E1和第二蒸发系统E2,第一蒸发系统E1设置在第二蒸发系统E2的沿基膜传送路径的上游;In some embodiments, the evaporation mechanism includes a first evaporation system E1 and a second evaporation system E2, and the first evaporation system E1 is arranged upstream of the second evaporation system E2 along the base film transport path;

温度测定装置包括:第一温度探测仪E11,设置在第一蒸发系统E1上,用于测量第一蒸发系统E1的第一温度值;第二温度探测仪E21,设置在第二蒸发系统E2上,用于测量第二蒸发系统E2的第二温度值;The temperature measurement device includes: a first temperature detector E11, set on the first evaporation system E1, for measuring the first temperature value of the first evaporation system E1; a second temperature detector E21, set on the second evaporation system E2 , for measuring the second temperature value of the second evaporation system E2;

面阻测试装置包括:第一面阻测试仪F1,设置于第一蒸发系统E1和第二蒸发系统E2之间的基膜传送路径上,用于测量基膜的当前镀膜面的第一面阻值;第二面阻测试仪F2,设置于第二蒸发系统E2与收卷机构之间的基膜传送路径上,用于测量基膜的双面上形成的镀层的总面阻值,以及根据总面阻值与第一面阻值的差值得到另一镀膜面的第二面阻值;The area resistance testing device includes: a first area resistance tester F1, which is arranged on the base film transmission path between the first evaporation system E1 and the second evaporation system E2, and is used to measure the first area resistance of the current coating surface of the base film. Value; The second area resistance tester F2 is arranged on the base film transmission path between the second evaporation system E2 and the winding mechanism, and is used to measure the total area resistance of the coating formed on both sides of the base film, and according to The difference between the total surface resistance and the first surface resistance obtains the second surface resistance of the other coating surface;

控制装置,具体用于当第一面阻值达到预设的面阻阈值时,根据在预设的面阻阈值下的基膜传动速度与第一蒸发系统E1的温度值之间的第一函数关系,以及第一蒸发系统E1的实时温度值,确定实时基膜传动速度;根据在预设的面阻阈值下的基膜传动速度与第二蒸发系统E2的温度值之间的第二函数关系,以及实时基膜传动速度,获得第二蒸发系统E2的理想温度值;根据第二蒸发系统E2的理想温度值和第二蒸发系统E2的实际温度值之间的比较结果,调节第二蒸发系统E2的加热功率。The control device is specifically used to, when the first surface resistance value reaches the preset surface resistance threshold value, according to the first function between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system E1 relationship, and the real-time temperature value of the first evaporation system E1, determine the real-time base film transmission speed; according to the second functional relationship between the base film transmission speed under the preset area resistance threshold and the temperature value of the second evaporation system E2 , and the real-time base film transmission speed to obtain the ideal temperature value of the second evaporation system E2; according to the comparison result between the ideal temperature value of the second evaporation system E2 and the actual temperature value of the second evaporation system E2, adjust the second evaporation system E2 heating power.

在一些实施例中,控制装置具体用于:In some embodiments, the control device is specifically used for:

如果第二蒸发系统E2的理想温度值大于第二蒸发系统E2的实际温度值,则控制增加第二蒸发系统E2的加热功率,并且控制第二蒸发系统E2的加热功率大于第一蒸发系统E1的加热功率;如果第二蒸发系统E2的理想温度值小于第二蒸发系统E2的实际温度值,则控制减小第二蒸发系统E2的加热功率,并且控制第二蒸发系统E2的加热功率小于第一蒸发系统E1的加热功率。If the ideal temperature value of the second evaporation system E2 is greater than the actual temperature value of the second evaporation system E2, the control increases the heating power of the second evaporation system E2, and controls the heating power of the second evaporation system E2 to be greater than that of the first evaporation system E1 Heating power; if the ideal temperature value of the second evaporating system E2 is less than the actual temperature value of the second evaporating system E2, then control to reduce the heating power of the second evaporating system E2, and control the heating power of the second evaporating system E2 to be less than the first Heating power of evaporation system E1.

在一些实施例中,控制装置,还可以具体用于:In some embodiments, the control device can also be specifically used for:

当第一面阻值先于第二面阻值达到预设的面阻阈值时,根据在预设的面阻阈值下的基膜传动速度与第一蒸发系统E1的温度值之间的第一函数关系,以及第一蒸发系统E1的实时温度值,确定实时基膜传动速度;根据在预设的面阻阈值下的基膜传动速度与第二蒸发系统E2的温度值之间的第二函数关系,以及实时基膜传动速度,获得第二蒸发系统E2的理想温度值;根据第二蒸发系统E2的理想温度值和第二蒸发系统E2的实际温度值之间的比较结果,调节第二蒸发系统E2的加热功率;或者,When the first area resistance value reaches the preset area resistance threshold value before the second area resistance value, according to the first value between the transmission speed of the base film at the preset area resistance threshold value and the temperature value of the first evaporation system E1 Functional relationship, and the real-time temperature value of the first evaporation system E1, determine the real-time base film transmission speed; according to the second function between the base film transmission speed under the preset area resistance threshold and the temperature value of the second evaporation system E2 relationship, and the real-time base film transmission speed to obtain the ideal temperature value of the second evaporation system E2; according to the comparison result between the ideal temperature value of the second evaporation system E2 and the actual temperature value of the second evaporation system E2, adjust the second evaporation heating power of system E2; or,

当第二面阻值先于第一面阻值达到预设的面阻阈值时,根据在预设的面阻阈值下的基膜传动速度与第二蒸发系统E2的温度值之间的第二函数关系,以及第二蒸发系统E2的实时温度值,确定实时基膜传动速度;根据在预设的面阻阈值下的基膜传动速度与第一蒸发系统E1的温度值之间的第一函数关系,以及实时基膜传动速度,获得第一蒸发系统E1的理想温度值;根据第一蒸发系统E1的理想温度值和第一蒸发系统E1的实际温度值之间的比较结果,调节第一蒸发系统E1的加热功率。When the second area resistance value reaches the preset area resistance threshold value before the first area resistance value, according to the second value between the transmission speed of the base film under the preset area resistance threshold value and the temperature value of the second evaporation system E2 Functional relationship, and the real-time temperature value of the second evaporation system E2, determine the real-time base film transmission speed; according to the first function between the base film transmission speed under the preset area resistance threshold and the temperature value of the first evaporation system E1 relationship, and the real-time base film transmission speed to obtain the ideal temperature value of the first evaporation system E1; according to the comparison result between the ideal temperature value of the first evaporation system E1 and the actual temperature value of the first evaporation system E1, adjust the first evaporation Heating power of system E1.

在一些实施例中,控制装置,还用于当第一面阻超过预设的面阻阈值时,控制增加放卷机构的基膜传动速度;并且如果第二面阻减小时,则增大第二蒸发系统E2的加热功率。In some embodiments, the control device is also used to control the increase of the base film transmission speed of the unwinding mechanism when the first area resistance exceeds the preset area resistance threshold; and if the second area resistance decreases, increase the second area resistance. The heating power of the second evaporation system E2.

本系统可以是单面镀膜方式,也可以是双面镀膜方式;进一步地,如果是双面镀膜方式则需要进行每一面镀膜附近的温度调控、面阻测试的计算发出速度的控制指令。进一步地,双面镀膜方式最终获得在相同镀膜走速的情况下镀膜的厚度达成一致。This system can be a single-sided coating method or a double-sided coating method; further, if it is a double-sided coating method, it is necessary to control the temperature near each side of the coating, calculate the surface resistance test, and issue speed control commands. Furthermore, the double-sided coating method finally achieves consistent coating thickness under the same coating speed.

本发明实施例达成的技术效果包括:The technical effects achieved by the embodiments of the present invention include:

相同的镀膜速度下单面MD方向的面阻测试数值偏差在预期范围内,进一步地双面的MD方向的面阻测试数值偏差都在控制范围内;Under the same coating speed, the value deviation of the surface resistance test in the single-sided MD direction is within the expected range, and the value deviation of the surface resistance test value in the MD direction on both sides is within the control range;

提前进行低蒸发量的镀膜调控,提升镀膜的效率及蒸发物料的利用率;Carry out coating regulation with low evaporation in advance to improve the efficiency of coating and the utilization rate of evaporated materials;

降低耐高温蒸发容器上方的挡板的无效沉积涂层,以至于减少其整个蒸发过程因为挡板下方的沉积涂层太多后粘附不了或处理不便,最终掉落到耐高温容器形成飞溅现象,避免损坏耐高温蒸发容器和破坏基材表观质量。Reduce the ineffective deposition coating on the baffle above the high-temperature resistant evaporation container, so as to reduce the entire evaporation process, because the deposited coating under the baffle is too much and cannot be adhered or handled inconveniently, and eventually falls into the high-temperature resistant container to form a splash phenomenon , to avoid damage to the high temperature evaporation container and damage the apparent quality of the substrate.

以下进行更加详细的说明:A more detailed description is given below:

如图1所示的真空镀膜系统,当耐高温容器(第一蒸发容器E14和/或第二蒸发容器E24)内填充预设的被蒸发材料及相关的设备状态就绪后,则开始抽真空,待真空抽至优于5*10-2Pa后,开始启动电加热装置(第一加热电极E13和/或第二加热电极E23)促使蒸发系统(第一蒸发系统E1和/或第二蒸发系统E2)的温度逐步升高,温度持续升高过程则耐高温容器E14、E24上方具有的遮挡基膜材料的挡板一直位于上方,其主要是用于避免被蒸发材料在非预期条件下蒸镀到基膜材料表面,或将过多的热量辐射至基膜材料。耐高温蒸发容器E14、E24内放置需要蒸发镀膜的材料,例如Al、Ag等材料。本发明实施例中以Al材料为例说明,Al大约600℃附近已经开始融化,由固态逐步转变成液态,最后随着电加热装置的温度的升高,液态的铝逐步会气化,即转变为气态,通常情况下Al材料的稳定蒸发镀膜需要温度在1200℃左右。在真空环境下电加热装置的升温主要通过热传导和辐射进行,该电加热装置中主要方式为传导,为了能够更安全和长寿命周期地使用电加热装置,通常情况下电加热装置(处于耐高温蒸发容器附近)的温度从600℃左右增加到1200℃左右的稳定状态需要相当长的时间,例如60分钟,期间尤其是越靠近高温则饱和蒸汽压越高,即蒸发量越大。The vacuum coating system shown in Figure 1, when the high temperature resistant container (the first evaporation container E14 and/or the second evaporation container E24) is filled with the preset material to be evaporated and the related equipment is ready, then start vacuuming, After the vacuum is better than 5*10 -2 Pa, start the electric heating device (the first heating electrode E13 and/or the second heating electrode E23) to promote the evaporation system (the first evaporation system E1 and/or the second evaporation system The temperature of E2) gradually increases, and during the continuous temperature increase process, the baffles that block the base film material above the high-temperature resistant containers E14 and E24 are always located at the top, which is mainly used to avoid evaporation of the evaporated material under unexpected conditions. to the surface of the base film material, or radiate excessive heat to the base film material. Materials that need to be evaporated and coated, such as Al, Ag, etc., are placed in the high-temperature resistant evaporation containers E14 and E24. In the embodiment of the present invention, the Al material is taken as an example. Al has begun to melt around 600°C, and gradually changes from a solid state to a liquid state. Finally, as the temperature of the electric heating device increases, the liquid aluminum will gradually gasify, that is, transform It is a gaseous state. Generally, the stable evaporation coating of Al materials requires a temperature of about 1200 ° C. In a vacuum environment, the temperature rise of the electric heating device is mainly carried out by heat conduction and radiation. The main method of the electric heating device is conduction. It takes a long time, such as 60 minutes, to increase the temperature from about 600°C to a stable state of about 1200°C, especially during the period, the closer to the high temperature, the higher the saturated vapor pressure, that is, the greater the evaporation.

其中,电加热装置或者电加热器,具体可以包括石墨加热电极;蒸发系统包括石墨加热电极、坩埚和蒸发料,石墨加热电极有孔,坩埚位于孔内,坩埚内具有蒸发料。Wherein, the electric heating device or electric heater may specifically include a graphite heating electrode; the evaporation system includes a graphite heating electrode, a crucible and an evaporation material, the graphite heating electrode has holes, the crucible is located in the hole, and the crucible has an evaporation material.

因此,本发明实施例的技术方案是当温度增加到某一范围时候开启基膜传动,例如温度在950℃附近,同时保持56m/min的镀膜走速,开启蒸发容器E14、E24上方的遮挡板进行镀膜。镀膜期间加热器的温度还在不断地上升至稳态的过程中,即蒸发量或薄膜的沉积速率继续增加,该过程则需要不断提高镀膜走速才能够保持前后的MD方向的镀层厚度一致;进一步地依据如图1所示的非接触式涡流电阻测试仪器F1的涂层厚度综合修正镀膜走速。Therefore, the technical solution of the embodiment of the present invention is to turn on the transmission of the base film when the temperature increases to a certain range, for example, when the temperature is around 950°C, while maintaining a coating speed of 56m/min, open the baffle plates above the evaporation containers E14 and E24 For coating. The temperature of the heater during the coating process is still rising to a steady state, that is, the evaporation rate or the deposition rate of the film continues to increase. In this process, the coating speed needs to be continuously increased to maintain the same thickness of the coating in the MD direction before and after; Further, the coating speed is comprehensively corrected according to the coating thickness of the non-contact eddy current resistance testing instrument F1 shown in FIG. 1 .

如图1所示,如果是单面蒸发系统,则仅仅涉及镀膜速度、第一蒸发系统E1、对应的第一温度探测仪E11及第一非接触式涡流电阻测试仪器F1,其中非接触式涡流电阻测试仪器F1仅测试其中单面的面阻即可转变对应为涂层厚度。As shown in Figure 1, if it is a single-sided evaporation system, it only involves the coating speed, the first evaporation system E1, the corresponding first temperature detector E11 and the first non-contact eddy current resistance testing instrument F1, wherein the non-contact eddy current The resistance testing instrument F1 only tests the surface resistance of one side, which can be converted into the corresponding coating thickness.

如果是双面镀膜系统,则在单面镀膜系统的基础上还增加第二蒸发系统E2、相关的第二温度探测仪E21及第二非接触式涡流电阻测试仪器F2,通过上述的测试仪器获取的参数综合进行镀膜状态的调整。主要是依据第一温度探测仪E11、第二温度探测仪E21、第一非接触式涡流电阻测试仪器F1、第二非接触式涡流电阻测试仪器F2的参数及其变化趋势确定镀膜走速。尤其是双面同时镀膜的系统为了保障双面的涂层厚度都相同(或者差值在可以接受的质量控制范围内)且整个镀膜的走速是兼顾设定的情况下,则需要借助第一温度探测仪E11和第二温度探测仪E21的参数进行设定。If it is a double-sided coating system, the second evaporation system E2, the related second temperature detector E21 and the second non-contact eddy current resistance testing instrument F2 are added on the basis of the single-sided coating system. The parameters of the coating are comprehensively adjusted for the coating state. The coating speed is determined mainly based on the parameters of the first temperature detector E11, the second temperature detector E21, the first non-contact eddy current resistance tester F1, and the second non-contact eddy current resistance tester F2 and their changing trends. Especially in order to ensure that the thickness of the coating on both sides is the same (or the difference is within the acceptable quality control range) and the speed of the entire coating is set in consideration of the setting of the double-sided simultaneous coating system, it is necessary to use the first The parameters of the temperature detector E11 and the second temperature detector E21 are set.

在确定速度调控方式之前有如下的参数需要确定:Before determining the speed control mode, the following parameters need to be determined:

初始开始镀膜时候第一温度探测仪E11测试温度T10,镀膜走速V1,面阻测试R10;稳态镀膜时候第一温度探测仪E11测试温度T20,镀膜走速V2,面阻测试R11,即保持初始状态和稳定状态情况下面阻测试都一致,即R10≈R11其波动范围在可接受的范围内。在这样的情况下通过改变镀膜走速而匹配不同的温度下的材料的蒸发量,最终获得在预设面阻下的镀膜走速与电加热器温度之间的关系,当然该过程相关的电加热器的输入功率、加热时间都作为该模式下的工艺控制条件,其相互的关系可以通过数值模拟进行曲线的拟合得出:Y1=0.0623e0.0057x1,该关系式中x1表示温度,Y1表示放卷速度。以下所述的公式一是针对第一蒸发系统E1的公式,x1表示第一蒸发系统E1的温度值,Y1表示第一蒸发系统E1对应的放卷速度;公式二是针对第二蒸发系统E2的公式,x1表示第二蒸发系统E2的温度值,Y1表示第二蒸发系统E2对应的放卷速度。At the beginning of the coating, the first temperature detector E11 tests the temperature T10, the coating speed V1, and the surface resistance test R10; when the coating is in a steady state, the first temperature detector E11 tests the temperature T20, the coating speed V2, and the surface resistance test R11, that is, keep Under the initial state and steady state, the lower resistance test is consistent, that is, the fluctuation range of R10≈R11 is within an acceptable range. In this case, by changing the coating speed to match the evaporation of the material at different temperatures, the relationship between the coating speed and the electric heater temperature under the preset surface resistance is finally obtained. Of course, the process-related electric The input power of the heater and the heating time are all used as the process control conditions in this mode, and the relationship between them can be obtained by fitting the curve through numerical simulation: Y1=0.0623e 0.0057x1 , where x1 represents the temperature, and Y1 Indicates the unwinding speed. Formula 1 described below is for the first evaporating system E1, x1 represents the temperature value of the first evaporating system E1, Y1 represents the unwinding speed corresponding to the first evaporating system E1; formula 2 is for the second evaporating system E2 In the formula, x1 represents the temperature value of the second evaporation system E2, and Y1 represents the unwinding speed corresponding to the second evaporation system E2.

上述的关系式则表示基于刚开始打开蒸发挡板时候按照1000℃作业,镀膜走速V1=78m/min达到面阻R10,则随着加热其温度的升高,蒸发量逐渐增大,则保持镀膜后R11与R10相近面阻时候则镀膜走速会变化,例如1200℃时候,镀膜走速为125m/min;即在该情况下基于拟合公式x1=1200,Y1=125。The above relational expression means that based on the operation at 1000°C when the evaporation baffle is opened at the beginning, the coating speed V1=78m/min reaches the surface resistance R10, and as the heating temperature rises, the evaporation rate gradually increases, and then maintains When R11 and R10 have similar surface resistance after coating, the coating speed will change. For example, at 1200°C, the coating speed is 125m/min; that is, in this case based on the fitting formula x1=1200, Y1=125.

基于同样的思路,如果本发明实施例要进行双面镀膜的控制,则可以先只进行第二蒸发系统E2的蒸发速率的测算与模拟。即保持V1=78m/min的镀膜走速达到R10面阻的时候,第二蒸发系统E2的温度探测仪E21测量的温度值,由于不同的蒸发源系统的温度与蒸发速率是不相同的,则该过程还基于单面镀膜和双面镀膜时镀膜要保持相同的镀膜走速以及单独每面镀膜时候的相同的面阻,从而获得双面同时镀膜时候的面阻的一致性。通过一系列的数据测算与模拟,则以对应于蒸发系统E1情况下的镀膜速度去控制第二蒸发系统E2的温度,即反向拟合确定第二蒸发系统的温度控制。Based on the same idea, if the embodiment of the present invention is to control the double-sided coating, then only the calculation and simulation of the evaporation rate of the second evaporation system E2 can be performed first. That is, when the coating speed of V1=78m/min reaches the surface resistance of R10, the temperature value measured by the temperature detector E21 of the second evaporation system E2, because the temperature and evaporation rate of different evaporation source systems are different, then The process is also based on maintaining the same coating speed during single-sided coating and double-sided coating, and the same surface resistance when coating each side separately, so as to obtain the consistency of surface resistance when coating both sides at the same time. Through a series of data calculations and simulations, the temperature of the second evaporation system E2 is controlled at the coating speed corresponding to the evaporation system E1, that is, the temperature control of the second evaporation system is determined by reverse fitting.

然而,实际上正式因为前述已经提到在真空环境下电加热器因为热传导效率及热容量影响,温度很难在短时间内达到希望控制的范围,即温度的控制具有滞后性。因此,在实际的控制过程中本发明实施例可以利用温控PID的类似算法进行第一蒸发系统E1和第二蒸发系统E2同步的温度控制,确保在一定的速度调控范围内达成F1和F2的新增的镀层测试的面阻是相同的或者相近的(即满足允许的范围)。其中第一非接触式涡流电阻测试仪器F1和第二非接触式涡流电阻测试仪器F2新增的镀层的面阻相同,可以这样来理解:双面镀膜时候第一非接触式涡流电阻测试仪器F1的面阻如果为800mΩ,在设定某一电导率的情况下可以计算其对应某一厚度d1,进一步地再增厚为2d1后推算第二非接触式涡流电阻测试仪器F2的面阻控制。However, in fact, it is formally mentioned above that the electric heater in a vacuum environment is affected by the heat conduction efficiency and heat capacity, and the temperature is difficult to reach the desired control range in a short time, that is, the temperature control has hysteresis. Therefore, in the actual control process, the embodiment of the present invention can use the similar algorithm of temperature control PID to carry out the temperature control of the first evaporation system E1 and the second evaporation system E2 synchronously, so as to ensure that the speed of F1 and F2 is achieved within a certain speed control range. The surface resistance of the newly added coating test is the same or similar (that is, meets the allowable range). Among them, the surface resistance of the newly added coating of the first non-contact eddy current resistance testing instrument F1 and the second non-contact eddy current resistance testing instrument F2 is the same, which can be understood as follows: when double-sided coating, the first non-contact eddy current resistance testing instrument F1 If the surface resistance is 800mΩ, it can be calculated corresponding to a certain thickness d1 under the condition of setting a certain conductivity, and further increase the thickness to 2d1 to calculate the surface resistance control of the second non-contact eddy current resistance testing instrument F2.

实际的控制过程需要第一蒸发系统E1和第二蒸发系统E2进行升温或降温的控制,并且进行镀膜速度的控制。即当第一蒸发系统E1和第二蒸发系统E2达到一定的可以开启挡板的温度附近后开启挡板,则进行镀膜,该情况下设定V1的镀膜速度,依据测试的非接触式涡流电阻测试仪器F1和非接触式涡流电阻测试仪器F2的结果进行速度增量的控制,其过程第一蒸发系统E1和第二蒸发系统E2都是再逐步升高温度的。The actual control process requires the first evaporation system E1 and the second evaporation system E2 to control the temperature rise or fall, and to control the coating speed. That is, when the first evaporating system E1 and the second evaporating system E2 reach a certain temperature near which the baffle can be opened, the baffle is opened, and then the coating is carried out. In this case, the coating speed of V1 is set, according to the non-contact eddy current resistance tested The results of the test instrument F1 and the non-contact eddy current resistance test instrument F2 are controlled by the speed increment, and the temperature of the first evaporation system E1 and the second evaporation system E2 is gradually increased in the process.

针对多个蒸发源的情况,目前现有技术在镀膜达到稳态之前,一直用挡板将镀料挡住,存在浪费镀料的问题。MD方向指走膜方向,面阻越大,镀层越薄。由于第二蒸发系统E2和第一蒸发系统E1两者的特性不相同,例如,第一蒸发系统E1在1300℃,55m/min时,可以使面阻达到800毫欧;而第二蒸发系统E2在1400℃,55m/min时,才可以使面阻达到800毫欧。In the case of multiple evaporation sources, the current prior art always uses baffles to block the coating material before the coating film reaches a steady state, which has the problem of wasting the coating material. The MD direction refers to the direction of the film, the greater the surface resistance, the thinner the coating. Since the characteristics of the second evaporation system E2 and the first evaporation system E1 are different, for example, the first evaporation system E1 can make the area resistance reach 800 milliohms at 1300 ° C and 55 m/min; while the second evaporation system E2 At 1400°C and 55m/min, the surface resistance can reach 800 milliohms.

本发明实施例希望能够体现这样的一种控制方式,实际的不同的设备、相同设备的不同方阻控制等其拟合的经验公式也可能是不相同的。本实施例能够通过PID的算法进行多次的调整而实现最终两面镀膜的膜层厚度是相同的,即采用接触时方阻仪进行单面的方阻测试,显现出来的方阻是非常接近的。即基于特性电阻率进行计算获得的单面的膜层厚度是非常接近的或者差异是在质量控制可接受的范围内。The embodiment of the present invention hopes to embody such a control mode, and the actual fitting empirical formulas of different devices and different square resistance controls of the same device may also be different. In this embodiment, multiple adjustments can be made through the PID algorithm to achieve the same film thickness on both sides of the coating, that is, the square resistance test of one side is carried out with a square resistance meter during contact, and the square resistance shown is very close. . That is, the thickness of the single-sided film layer calculated based on the characteristic resistivity is very close or the difference is within the acceptable range of quality control.

以下举例说明,结合实际的设备运行获得了更精确的数据,并以此对以前数据进行修正,例如:The following example shows that more accurate data is obtained in combination with actual equipment operation, and the previous data is corrected based on this, for example:

第一面数据:例如设定面阻600mΩ;900℃-35m/min;950℃-41m/min;1000℃-50m/min;1050℃-62m/min;1100℃-75m/min;1150℃-92m/min;1200℃-113m/min;1250℃-129m/min;1300℃-132m/min,为了获得一个相对稳定的蒸发状态,同时考虑设备的有效运行和维护保护等方面的因素,实际的温度不宜持续增加。First surface data: For example, set the surface resistance to 600mΩ; 900°C-35m/min; 950°C-41m/min; 1000°C-50m/min; 1050°C-62m/min; 92m/min; 1200°C-113m/min; 1250°C-129m/min; 1300°C-132m/min, in order to obtain a relatively stable evaporation state, while considering factors such as effective operation and maintenance of the equipment, the actual The temperature should not be continuously increased.

本实施例可以依据上述类似的数值进行经验公式的模拟,同步第二面单独镀膜的时候也可以获得上述类似的经验公式,相关的差异应该不是很大,可以就镀膜米数方面差异几米的范围进行调整。In this embodiment, the simulation of the empirical formula can be carried out based on the above-mentioned similar values, and the above-mentioned similar empirical formula can also be obtained when the second surface is coated separately. Make adjustments.

另外,面阻越低膜层厚度越厚,则如果蒸发效率(可视为蒸发温度)等没有变化则要获得更厚的膜层则需要降低镀膜速度;反之,如果蒸发温度越高则镀膜速度不变的情况下,则方阻数值越小,但是涂层厚度越大。In addition, the lower the surface resistance, the thicker the film thickness, and if the evaporation efficiency (which can be regarded as the evaporation temperature) does not change, the coating speed needs to be reduced to obtain a thicker film layer; on the contrary, if the evaporation temperature is higher, the coating speed In the case of constant, the smaller the square resistance value, but the larger the coating thickness.

举例说明:第一面方阻测试600mΩ,以特定的电学参数计算得出厚度约为65nm的厚度(如果镀膜为Al膜),如果镀膜为铜膜,则代入铜膜的电阻率参数计算即可;如果镀Al膜则第二位置的方阻测试仪器的数值为两面镀膜膜层经过涡流感应测得的结果,目标值则应该在300mΩ左右,从而得到第二面单面的涂层厚度在65nm左右,即可以理解为300mΩ是两面涂层厚度总和对应的方阻值。For example: the square resistance test of the first surface is 600mΩ, and the thickness is calculated to be about 65nm based on specific electrical parameters (if the coating is an Al film). If the coating is a copper film, just substitute the resistivity parameters of the copper film for calculation ; If the Al film is coated, the value of the square resistance testing instrument at the second position is the result measured by the eddy current induction of the coating film on both sides, and the target value should be around 300mΩ, so that the coating thickness of the second side and one side is 65nm It can be understood that 300mΩ is the square resistance value corresponding to the sum of the coating thicknesses on both sides.

图2是本发明实施例的一种镀膜均匀性监测与调控方法的流程图一。如图2所示,方法包括如下步骤:FIG. 2 is a flow chart 1 of a coating uniformity monitoring and control method according to an embodiment of the present invention. As shown in Figure 2, the method includes the following steps:

S110:获取蒸发机构的温度值;S110: acquiring the temperature value of the evaporation mechanism;

S120:获取基膜的面阻值;S120: acquiring the areal resistance of the base film;

S130:根据蒸发机构的温度值和基膜的面阻值,控制放卷机构的基膜传动速度和/或蒸发机构的加热功率,以使得镀层沿着基膜移动方向的厚度具有均匀性。S130: According to the temperature value of the evaporation mechanism and the area resistance value of the base film, control the transmission speed of the base film of the unwinding mechanism and/or the heating power of the evaporation mechanism, so that the thickness of the coating layer along the moving direction of the base film is uniform.

在一些实施例中,S130中根据蒸发机构的温度值和基膜的面阻值,控制放卷机构的基膜传动速度,具体包括:根据在预设面阻阈值下的基膜传动速度与蒸发机构的温度值之间的函数关系,以及蒸发机构的实时温度值,确定放卷机构的实时基膜传动速度。In some embodiments, in S130, the base film transmission speed of the unwinding mechanism is controlled according to the temperature value of the evaporation mechanism and the surface resistance value of the base film, which specifically includes: according to the transmission speed of the base film under the preset surface resistance threshold and the evaporation The functional relationship between the temperature values of the mechanism and the real-time temperature value of the evaporation mechanism determines the real-time base film transmission speed of the unwinding mechanism.

在一些实施例中,该方法还包括:当蒸发机构的温度值达到预设的镀膜温度阈值时,控制放卷机构开启基膜传动,以及开启蒸发机构上的镀膜挡板。In some embodiments, the method further includes: when the temperature of the evaporating mechanism reaches a preset coating temperature threshold, controlling the unwinding mechanism to start the base film transmission, and opening the coating baffle on the evaporating mechanism.

在一些实施例中,蒸发机构包括第一蒸发系统和第二蒸发系统,第一蒸发系统设置在第二蒸发系统的沿基膜传送路径的上游。In some embodiments, the evaporating mechanism includes a first evaporating system and a second evaporating system, the first evaporating system being disposed upstream of the second evaporating system along the transport path of the base film.

图3是本发明实施例的一种镀膜均匀性监测与调控方法的流程图二。如图3所示,该方法具体包括如下步骤:FIG. 3 is a second flow chart of a coating uniformity monitoring and control method according to an embodiment of the present invention. As shown in Figure 3, the method specifically includes the following steps:

S110’:获取第一蒸发系统的第一温度值,获取第二蒸发系统的第二温度值;S110': Obtain the first temperature value of the first evaporation system, and obtain the second temperature value of the second evaporation system;

S120’:获取基膜的当前镀膜面的第一面阻值,获取基膜的双面上形成的镀层的总面阻值,以及根据总面阻值与第一面阻值的差值得到另一镀膜面的第二面阻值;S120': Obtain the first surface resistance value of the current coating surface of the base film, obtain the total surface resistance value of the coating layer formed on both sides of the base film, and obtain another value according to the difference between the total surface resistance value and the first surface resistance value The resistance value of the second surface of a coated surface;

S131:当第一面阻值达到预设的面阻阈值时,根据在预设的面阻阈值下的基膜传动速度与第一蒸发系统的温度值之间的第一函数关系,以及第一蒸发系统的实时温度值,确定实时基膜传动速度;S131: When the first area resistance reaches the preset area resistance threshold, according to the first functional relationship between the transmission speed of the base film under the preset area resistance threshold and the temperature value of the first evaporation system, and the first The real-time temperature value of the evaporation system determines the real-time base film transmission speed;

S132:根据在预设的面阻阈值下的基膜传动速度与第二蒸发系统的温度值之间的第二函数关系,以及实时基膜传动速度,获得第二蒸发系统的理想温度值;S132: Obtain an ideal temperature value of the second evaporation system according to the second functional relationship between the transmission speed of the base film under the preset area resistance threshold and the temperature value of the second evaporation system, and the real-time transmission speed of the base film;

S133:根据第二蒸发系统的理想温度值和第二蒸发系统的实际温度值之间的比较结果,调节第二蒸发系统的加热功率。S133: Adjust the heating power of the second evaporation system according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system.

在一些实施例中,S133中根据第二蒸发系统的理想温度值和第二蒸发系统的实际温度值之间的比较结果,调节第二蒸发系统的加热功率,具体包括:In some embodiments, in S133, according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system, the heating power of the second evaporation system is adjusted, specifically including:

如果第二蒸发系统的理想温度值大于第二蒸发系统的实际温度值,则控制增加第二蒸发系统的加热功率,并且控制第二蒸发系统的加热功率大于第一蒸发系统的加热功率或者控制第二蒸发系统的温度增速大于第一蒸发系统的温度增速;如果第二蒸发系统的理想温度值小于第二蒸发系统的实际温度值,则控制减小第二蒸发系统的加热功率,并且控制第二蒸发系统的加热功率小于第一蒸发系统的加热功率或者控制第二蒸发系统的温度增速小于第一蒸发系统的温度增速。If the ideal temperature value of the second evaporation system is greater than the actual temperature value of the second evaporation system, the control increases the heating power of the second evaporation system, and the heating power of the second evaporation system is controlled to be greater than the heating power of the first evaporation system or the heating power of the second evaporation system is controlled. The temperature growth rate of the second evaporation system is greater than the temperature growth rate of the first evaporation system; if the ideal temperature value of the second evaporation system is less than the actual temperature value of the second evaporation system, the control reduces the heating power of the second evaporation system, and the control The heating power of the second evaporating system is smaller than that of the first evaporating system or the temperature increasing rate of the second evaporating system is controlled to be smaller than the temperature increasing rate of the first evaporating system.

在一些实施例中,该方法还包括如下步骤:In some embodiments, the method also includes the steps of:

获取第一蒸发系统的第一温度值,获取第二蒸发系统的第二温度值;acquiring a first temperature value of the first evaporation system, and acquiring a second temperature value of the second evaporation system;

获取基膜的当前镀膜面的第一面阻值,获取基膜的双面上形成的镀层的总面阻值,以及根据总面阻值与第一面阻值的差值得到另一镀膜面的第二面阻值;Obtain the first surface resistance value of the current coating surface of the base film, obtain the total surface resistance value of the coating layer formed on both sides of the base film, and obtain another coating surface value according to the difference between the total surface resistance value and the first surface resistance value The resistance value of the second surface;

当第一面阻值先于第二面阻值达到预设的面阻阈值时,根据在预设的面阻阈值下的基膜传动速度与第一蒸发系统的温度值之间的第一函数关系,以及第一蒸发系统的实时温度值,确定实时基膜传动速度;根据在预设的面阻阈值下的基膜传动速度与第二蒸发系统的温度值之间的第二函数关系,以及实时基膜传动速度,获得第二蒸发系统的理想温度值;根据第二蒸发系统的理想温度值和第二蒸发系统的实际温度值之间的比较结果,调节第二蒸发系统的加热功率;When the first area resistance value reaches the preset area resistance threshold value before the second area resistance value, according to the first function between the base film transmission speed at the preset area resistance threshold value and the temperature value of the first evaporation system relationship, and the real-time temperature value of the first evaporation system, determine the real-time base film transmission speed; according to the second functional relationship between the base film transmission speed under the preset area resistance threshold and the temperature value of the second evaporation system, and Real-time base film transmission speed to obtain the ideal temperature value of the second evaporation system; adjust the heating power of the second evaporation system according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system;

或者,当第二面阻值先于第一面阻值达到预设的面阻阈值时,根据在预设的面阻阈值下的基膜传动速度与第二蒸发系统的温度值之间的第二函数关系,以及第二蒸发系统的实时温度值,确定实时基膜传动速度;根据在预设的面阻阈值下的基膜传动速度与第一蒸发系统的温度值之间的第一函数关系,以及实时基膜传动速度,获得第一蒸发系统的理想温度值;根据第一蒸发系统的理想温度值和第一蒸发系统的实际温度值之间的比较结果,调节第一蒸发系统的加热功率。Or, when the second area resistance value reaches the preset area resistance threshold value before the first area resistance value, according to the first value between the transmission speed of the base film under the preset area resistance threshold value and the temperature value of the second evaporation system The second functional relationship, and the real-time temperature value of the second evaporation system, determine the real-time base film transmission speed; according to the first functional relationship between the base film transmission speed under the preset area resistance threshold and the temperature value of the first evaporation system , and the real-time base film transmission speed to obtain the ideal temperature value of the first evaporation system; according to the comparison result between the ideal temperature value of the first evaporation system and the actual temperature value of the first evaporation system, adjust the heating power of the first evaporation system .

以下对上述方法进行具体详细的说明:The above method is described in detail below:

根据本实施例的一种镀膜均匀性监测与调控方法,在镀膜过程中,需要将第一面阻测试仪F1测量得到的值固定住(达到目标面阻值),首先可以获得第一蒸发系统E1的实际温度,根据公式一可以得到放卷速度,并将放卷速度调整成该实时放卷速度。由于在达到镀膜稳态前,第一蒸发系统E1和第二蒸发系统E2的温度都是一直升高,因此,实时根据公式一可以得到实时放卷速度,并将放卷速度实时调整成该速度。此时,根据公式二,以该实时放卷速度作为输入,可以得到第二蒸发系统E2的理想温度值。在该第二蒸发系统E2的理想温度值时,第二面阻测试仪F2测量的方阻值,由该方阻值换算成厚度值等于第一面阻测试仪F1测量的厚度值的2倍,这样双面镀膜厚度相同。According to a coating uniformity monitoring and control method of this embodiment, in the coating process, the value measured by the first surface resistance tester F1 needs to be fixed (to reach the target surface resistance value), firstly, the first evaporation system can be obtained For the actual temperature of E1, the unwinding speed can be obtained according to formula 1, and the unwinding speed can be adjusted to the real-time unwinding speed. Since the temperature of the first evaporating system E1 and the second evaporating system E2 keeps rising before reaching the steady state of the coating, the real-time unwinding speed can be obtained according to formula 1 in real time, and the unwinding speed can be adjusted to this speed in real time . At this time, according to Formula 2, with the real-time unwinding speed as input, the ideal temperature value of the second evaporation system E2 can be obtained. At the ideal temperature value of the second evaporation system E2, the square resistance value measured by the second surface resistance tester F2 is converted into a thickness value equal to twice the thickness value measured by the first surface resistance tester F1 , so that the coating thickness on both sides is the same.

根据本实施例的一种镀膜均匀性监测与调控方法,在整个镀膜过程中,第一蒸发系统E1和第二蒸发系统E2都会升温。如果第二蒸发系统E2的理想温度值大于第二蒸发系统E2的实际温度值,则加大第二蒸发系统E2的加热功率,加大第二蒸发系统E2的升温速度,并且控制第二蒸发系统E2的加热功率大于第一蒸发系统E1的加热功率,控制第二蒸发系统E2的升温速度大于第一蒸发系统E1的升温速度;如果第二蒸发系统E2的理想温度值小于第二蒸发系统E2的实际温度值,则减小第二蒸发系统E2的加热功率,降低第二蒸发系统E2的升温速度,并且控制第二蒸发系统E2的加热功率小于第一蒸发系统E1的加热功率,控制第二蒸发系统E2的升温速度小于第一蒸发系统E1的升温速度。如果第二蒸发系统E2的理想温度值等于第二蒸发系统E2的实际值时,则不做调整。According to a coating uniformity monitoring and controlling method of this embodiment, during the entire coating process, the first evaporation system E1 and the second evaporation system E2 both heat up. If the ideal temperature value of the second evaporation system E2 is greater than the actual temperature value of the second evaporation system E2, increase the heating power of the second evaporation system E2, increase the temperature rise rate of the second evaporation system E2, and control the second evaporation system The heating power of E2 is greater than the heating power of the first evaporation system E1, and the temperature increase rate of the second evaporation system E2 is controlled to be greater than the temperature increase rate of the first evaporation system E1; if the ideal temperature value of the second evaporation system E2 is less than that of the second evaporation system E2 The actual temperature value, then reduce the heating power of the second evaporation system E2, reduce the temperature rise rate of the second evaporation system E2, and control the heating power of the second evaporation system E2 to be smaller than the heating power of the first evaporation system E1, control the second evaporation system E2 The temperature rise rate of the system E2 is smaller than the temperature rise rate of the first evaporation system E1. If the ideal temperature value of the second evaporation system E2 is equal to the actual value of the second evaporation system E2, no adjustment is made.

本实施例的一种镀膜均匀性监测与调控方法,由控制装置执行,第一蒸发系统E1对应于公式一,第二蒸发系统E2对应于公式二,限定第一面阻测试仪F1为800毫欧,该方法包括如下对第二蒸发系统E2的温度值进行实时调整的多个步骤:A coating uniformity monitoring and control method of the present embodiment is executed by a control device, the first evaporation system E1 corresponds to formula one, the second evaporation system E2 corresponds to formula two, and the first surface resistance tester F1 is limited to 800 mm Oh, the method includes multiple steps of adjusting the temperature value of the second evaporation system E2 in real time as follows:

实时获取第一蒸发系统E1的实时温度值,根据公式一和第一蒸发系统E1的实时温度值,实时调整放卷速度,从而根据公式二和实时放卷速度可以得到第二蒸发系统E2的理想温度值;Obtain the real-time temperature value of the first evaporation system E1 in real time, and adjust the unwinding speed in real time according to formula 1 and the real-time temperature value of the first evaporation system E1, so that the ideal value of the second evaporation system E2 can be obtained according to formula 2 and the real-time unwinding speed temperature value;

将该第二蒸发系统E2的理想温度值与第二蒸发系统E2的实际温度值进行比较;comparing the ideal temperature value of the second evaporation system E2 with the actual temperature value of the second evaporation system E2;

如果第二蒸发系统E2的理想温度值较大,则控制第二蒸发系统E2的温度增速大于第一蒸发系统E1的温度增速;If the ideal temperature value of the second evaporating system E2 is relatively large, the temperature growth rate of the second evaporating system E2 is controlled to be greater than the temperature growth rate of the first evaporating system E1;

如果第二蒸发系统E2的理想值较小,则控制第二蒸发系统E2的温度增速小于第一蒸发系统E1的温度增速。If the ideal value of the second evaporating system E2 is small, the temperature increasing rate of the second evaporating system E2 is controlled to be smaller than the temperature increasing rate of the first evaporating system E1 .

由上可知,如果第二蒸发系统E2的理想温度值大于其实际温度值,控制增加第二蒸发系统E2的加热功率,并且控制第二蒸发系统E2的加热功率大于第一蒸发系统E1的加热功率,也就是控制第二蒸发系统E2的温度增速大于第一蒸发系统E1的温度增速。It can be seen from the above that if the ideal temperature value of the second evaporation system E2 is greater than its actual temperature value, the control increases the heating power of the second evaporation system E2, and controls the heating power of the second evaporation system E2 to be greater than the heating power of the first evaporation system E1 , that is, the temperature increase rate of the second evaporation system E2 is controlled to be greater than the temperature increase rate of the first evaporation system E1.

第一面阻测试仪F1的测量值始终为800毫欧,随着放卷速度的实时调整,再后来第二面阻测试仪F2的测量值始终在800毫欧左右,使镀层厚度满足质量要求。The measured value of the first surface resistance tester F1 is always 800 milliohms. With the real-time adjustment of the unwinding speed, the measured value of the second surface resistance tester F2 is always around 800 milliohms, so that the coating thickness meets the quality requirements. .

本实施例的一种镀膜均匀性监测与调控方法,由控制装置执行,为了解决随时调整不太合适,或者温度调节具有滞后性的问题,采用如下方法:A coating uniformity monitoring and regulation method in this embodiment is executed by the control device. In order to solve the problem that the adjustment is not appropriate at any time, or the temperature regulation has hysteresis, the following method is adopted:

判断第一面阻测试仪F1和第二面阻测试仪F2的测量值哪个先达到面阻阈值;Determine which of the measured values of the first surface resistance tester F1 and the second surface resistance tester F2 reaches the surface resistance threshold first;

如果第一面阻测试仪F1先达到面阻阈值,则根据第一蒸发系统E1的温度值,调整实时放卷速度;并且根据公式二和实时放卷速度,得到第二蒸发系统E2的理想温度值,并根据第二蒸发系统E2的理想温度值,调节第二蒸发系统E2的实际温度值;If the first area resistance tester F1 first reaches the area resistance threshold, adjust the real-time unwinding speed according to the temperature value of the first evaporation system E1; and get the ideal temperature of the second evaporation system E2 according to formula 2 and the real-time unwinding speed value, and adjust the actual temperature value of the second evaporation system E2 according to the ideal temperature value of the second evaporation system E2;

如果第二面阻测试仪F2先达到面阻阈值,则根据第二蒸发系统E2的温度值,调整实时放卷速度;并且根据公式一和实时放卷速度,得到第一蒸发系统E1的理论温度值,并通过第一蒸发系统E1的理论温度值控制加热功率调节第一蒸发系统E1的实际温度值。If the second surface resistance tester F2 first reaches the surface resistance threshold, adjust the real-time unwinding speed according to the temperature value of the second evaporation system E2; and get the theoretical temperature of the first evaporation system E1 according to formula 1 and the real-time unwinding speed value, and control the heating power through the theoretical temperature value of the first evaporation system E1 to adjust the actual temperature value of the first evaporation system E1.

进一步地,该镀膜均匀性监测与调控方法还包括如下步骤:Further, the coating uniformity monitoring and control method also includes the following steps:

如果第一面阻测试仪F1测量的厚度超过面阻阈值,则控制增加放卷速度,以避免第一面阻测试仪F1的厚度超过面阻阈值;并且实时检测两个面阻值(F1和F2分别测量到的面阻值),如果此时第二面阻测试仪F2测量的厚度值或者面阻值减小,则增大第二蒸发系统E2加热功率。If the thickness measured by the first surface resistance tester F1 exceeds the surface resistance threshold, then the control increases the unwinding speed, so as to avoid the thickness of the first surface resistance tester F1 exceeding the surface resistance threshold; and detect two surface resistance values (F1 and F1 in real time) F2 respectively measured surface resistance), if the thickness or surface resistance measured by the second surface resistance tester F2 decreases at this time, then increase the heating power of the second evaporation system E2.

进一步地,如果温度增加过快,则到时候降低加热功率也不行了,因此最好是缓慢增加温度,使第二蒸发系统E2的理想温度值一直大于其实际温度值。因此该镀膜均匀性监测与调控方法还包括如下步骤:当第二面阻测试仪F2的测量值快要到达面阻阈值下限时,才调整其温度增加一定比例。Furthermore, if the temperature increases too fast, it will be useless to reduce the heating power at that time, so it is better to increase the temperature slowly so that the ideal temperature value of the second evaporation system E2 is always greater than its actual temperature value. Therefore, the coating uniformity monitoring and control method also includes the following steps: when the measured value of the second surface resistance tester F2 is about to reach the lower limit of the surface resistance threshold, the temperature is adjusted to increase by a certain percentage.

本发明实施例的有益技术效果在于:The beneficial technical effects of the embodiments of the present invention are:

1、减少薄膜沉积过程蒸发舟系统内的被蒸发材料浪费;1. Reduce the waste of evaporated materials in the evaporation boat system during the thin film deposition process;

2、通过蒸发系统温度调控及镀膜带速的双重调控更好达成基材表面镀膜膜层沿着MD方向的整体厚度的一致性;2. Through the dual control of evaporation system temperature control and coating belt speed, the consistency of the overall thickness of the coating film layer on the surface of the substrate along the MD direction is better achieved;

3、因规避挡板表面无效沉积镀层,可以降低镀膜完成后挡板表面的沉积涂层因蒸发系统余热影响至沉积的镀层掉了影响设备性能。3. By avoiding the ineffective deposition of the coating on the surface of the baffle, it can reduce the deposition of the coating on the surface of the baffle after the coating is completed. Due to the residual heat of the evaporation system, the deposited coating falls off and affects the performance of the equipment.

在本发明的描述中,需要说明的是,术语中的“上、下、内和外”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。此外,术语“第一、第二或第三”仅用于描述目的,而不能理解为指示或暗示相对重要性。In the description of the present invention, it should be noted that the orientation or positional relationship indicated by "upper, lower, inner and outer" in terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplified descriptions, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and thus should not be construed as limiting the invention. In addition, the terms "first, second or third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.

本发明中除非另有明确的规定和限定,术语“安装、相连、连接”应做广义理解,例如:可以是固定连接、可拆卸连接或一体式连接;同样可以是机械连接、电连接或直接连接,也可以通过中间媒介间接相连,也可以是两个元件内部的连通。对于本领域的普通技术人员而言,可以具体情况理解上述术语在本发明中的具体含义。Unless otherwise specified and limited in the present invention, the term "installation, connection, connection" should be understood in a broad sense, for example: it can be a fixed connection, a detachable connection or an integrated connection; it can also be a mechanical connection, an electrical connection or a direct connection. A connection can also be an indirect connection through an intermediary, or it can be an internal communication between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

虽然已经参考优选实施例对本发明进行了描述,但在不脱离本发明的范围的情况下,可以对其进行各种改进并且可以用等效物替换其中的部件。尤其是,只要不存在结构冲突,各个实施例中所提到的各项技术特征均可以任意方式组合起来。本发明并不局限于文中公开的特定实施例,而是包括落入权利要求的范围内的所有技术方案。While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for parts thereof without departing from the scope of the invention. In particular, as long as there is no structural conflict, the technical features mentioned in the various embodiments can be combined in any manner. The present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims (10)

1. A plating film uniformity monitoring and control system, the system comprising:
the vacuum winding film plating device comprises an unreeling mechanism, an evaporating mechanism and a reeling mechanism, wherein the evaporating mechanism and the reeling mechanism are used for evaporating a base film;
a temperature measuring device for measuring a temperature value of the evaporation mechanism;
the surface resistance testing device is used for measuring the surface resistance value of the base film;
and the control device is used for controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film so as to ensure that the thickness of the coating along the moving direction of the base film is uniform.
2. The system according to claim 1, wherein the control means is specifically configured to determine the real-time base film transfer speed of the unreeling mechanism based on a functional relationship between the base film transfer speed below a preset surface resistance threshold and the temperature value of the evaporating mechanism, and the real-time temperature value of the evaporating mechanism.
3. The system of claim 1, wherein the system further comprises a controller configured to control the controller,
the evaporation mechanism comprises a first evaporation system and a second evaporation system, wherein the first evaporation system is arranged at the upstream of the second evaporation system along the base film conveying path;
the temperature measurement device includes: the first temperature detector is arranged on the first evaporation system and is used for measuring a first temperature value of the first evaporation system; the second temperature detector is arranged on the second evaporation system and is used for measuring a second temperature value of the second evaporation system;
the surface resistance testing device comprises: the first surface resistance tester is arranged on a base film conveying path between the first evaporation system and the second evaporation system and is used for measuring a first surface resistance value of a current film coating surface of the base film; and the second surface resistance tester is arranged on the base film conveying path between the second evaporation system and the winding mechanism and is used for measuring the total surface resistance value of a coating formed on the two surfaces of the base film and obtaining the second surface resistance value of the other coating surface according to the difference value of the total surface resistance value and the first surface resistance value.
4. A system according to claim 3, characterized in that the control means are specifically adapted to: when the first surface resistance value reaches a preset surface resistance threshold value, determining a real-time base film transmission speed according to a first functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system and a real-time temperature value of the first evaporation system; obtaining an ideal temperature value of the second evaporation system according to a second functional relation between the base film transmission speed under the preset surface resistance threshold and the temperature value of the second evaporation system and the real-time base film transmission speed; and adjusting the heating power of the second evaporation system according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system.
5. The system according to claim 4, characterized in that said control means are specifically adapted to: if the ideal temperature value of the second evaporation system is larger than the actual temperature value of the second evaporation system, controlling to increase the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be larger than the heating power of the first evaporation system or controlling the temperature acceleration rate of the second evaporation system to be larger than the temperature acceleration rate of the first evaporation system; if the ideal temperature value of the second evaporation system is smaller than the actual temperature value of the second evaporation system, controlling to reduce the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be smaller than the heating power of the first evaporation system or controlling the temperature acceleration rate of the second evaporation system to be smaller than the temperature acceleration rate of the first evaporation system.
6. A system according to claim 3, characterized in that the control means are specifically adapted to:
when the first surface resistance value reaches a preset surface resistance threshold value before the second surface resistance value, determining a real-time base film transmission speed according to a first functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system and a real-time temperature value of the first evaporation system; obtaining an ideal temperature value of the second evaporation system according to a second functional relation between the base film transmission speed under the preset surface resistance threshold and the temperature value of the second evaporation system and the real-time base film transmission speed; adjusting the heating power of the second evaporation system according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system; or,
When the second surface resistance value reaches a preset surface resistance threshold value before the first surface resistance value, determining a real-time base film transmission speed according to a second functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the second evaporation system and a real-time temperature value of the second evaporation system; obtaining an ideal temperature value of the first evaporation system according to a first functional relation between the base film transmission speed under the preset surface resistance threshold and the temperature value of the first evaporation system and the real-time base film transmission speed; and adjusting the heating power of the first evaporation system according to the comparison result between the ideal temperature value of the first evaporation system and the actual temperature value of the first evaporation system.
7. A method for monitoring and controlling uniformity of a coating film, the method comprising:
acquiring a temperature value of an evaporation mechanism;
acquiring the surface resistance of the base film;
and controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film, so that the thickness of the coating along the moving direction of the base film is uniform.
8. The method according to claim 7, wherein the controlling the base film transmission speed of the unreeling mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film specifically comprises:
and determining the real-time base film transmission speed of the unreeling mechanism according to the functional relation between the base film transmission speed below the preset surface resistance threshold value and the temperature value of the evaporating mechanism and the real-time temperature value of the evaporating mechanism.
9. The method of claim 7, wherein the evaporation mechanism comprises a first evaporation system and a second evaporation system, the first evaporation system being disposed upstream of the second evaporation system along a base film transport path; the method specifically comprises the following steps:
acquiring a first temperature value of the first evaporation system and a second temperature value of the second evaporation system;
acquiring a first surface resistance value of a current coating surface of the base film, acquiring a total surface resistance value of a coating formed on two surfaces of the base film, and acquiring a second surface resistance value of another coating surface according to a difference value between the total surface resistance value and the first surface resistance value;
when the first surface resistance value reaches a preset surface resistance threshold value, determining a real-time base film transmission speed according to a first functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system and a real-time temperature value of the first evaporation system;
Obtaining an ideal temperature value of the second evaporation system according to a second functional relation between the base film transmission speed under the preset surface resistance threshold and the temperature value of the second evaporation system and the real-time base film transmission speed;
and adjusting the heating power of the second evaporation system according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system.
10. The method according to claim 9, wherein said adjusting the heating power of the second evaporation system based on the comparison between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system, comprises:
if the ideal temperature value of the second evaporation system is larger than the actual temperature value of the second evaporation system, controlling to increase the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be larger than the heating power of the first evaporation system or controlling the temperature acceleration rate of the second evaporation system to be larger than the temperature acceleration rate of the first evaporation system; if the ideal temperature value of the second evaporation system is smaller than the actual temperature value of the second evaporation system, controlling to reduce the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be smaller than the heating power of the first evaporation system or controlling the temperature acceleration rate of the second evaporation system to be smaller than the temperature acceleration rate of the first evaporation system.
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