CN116445864B

CN116445864B - System and method for monitoring and regulating uniformity of coating

Info

Publication number: CN116445864B
Application number: CN202310498962.3A
Authority: CN
Inventors: 臧世伟; 刘文卿
Original assignee: Chongqing Jinmei New Material Technology Co Ltd
Current assignee: Chongqing Jinmei New Material Technology Co Ltd
Priority date: 2023-05-05
Filing date: 2023-05-05
Publication date: 2025-12-23
Anticipated expiration: 2043-05-05
Also published as: CN116445864A

Abstract

The embodiment of the invention provides a coating uniformity monitoring and regulating system and method, wherein the system comprises a vacuum winding coating device, a temperature measuring device, a surface resistance testing device and a control device, wherein the vacuum winding coating device comprises an unreeling mechanism, an evaporating mechanism and a reeling mechanism, the evaporating mechanism is used for evaporating a base film, the temperature measuring device is used for measuring the temperature value of the evaporating mechanism, the surface resistance testing device is used for measuring the surface resistance value of the base film, and the control device is used for controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film so as to enable the thickness of a coating layer along the moving direction of the base film to have uniformity. The invention can realize more uniform thickness uniformity of the film coating in the film running direction based on the matching of temperature control and film coating speed.

Description

System and method for monitoring and regulating uniformity of coating

Technical Field

The invention relates to a film layer uniformity monitoring and controlling system in a vacuum winding film coating process, in particular to a film uniformity monitoring and controlling system and method for verifying the MD direction (film moving direction) of a film transmission direction.

Background

In the field of vacuum coating, in particular to a large-area flexible substrate surface coating equipment system, wherein the coating mode comprises vacuum magnetron sputtering coating and vacuum thermal evaporation system coating. The vacuum thermal evaporation system is generally divided into two aspects, namely, the vacuum thermal evaporation system adopts an evaporation boat to perform film coating, for example, the film coating in the field of packaging films is most common, namely, related wire feeding mechanisms are used for continuously conveying film coating materials to the surface of the evaporation boat in a high-temperature state, when the materials are contacted or nearly contacted with the surface of the evaporation boat, the materials are instantaneously gasified and deposited on the surface of a base film under the condition that the materials are far higher than the melting temperature of the materials, the temperature rising and the temperature lowering processes of the related mechanisms are very fast, but the fatal problem is that serious corrosion pits appear on the surface along with the prolonging of the service time of the evaporation boat, sputtering phenomena are easy to form in the evaporation process after the evaporated materials are placed near the corrosion pits, so that the burning of the flexible base film is caused, and the use of the film coating materials is restrained.

Based on the above problems, another technical means is developed, in which the material to be evaporated is first placed in a high temperature resistant container, the container is located inside an electric heating device and a thermal insulation/temperature measurement system, and when the electric heating device is turned on, the temperature of the high temperature resistant container increases, so that the material to be evaporated in the container is converted from a solid state, a liquid state and a gaseous state, and finally the material is deposited on the surface of the substrate. The method has the remarkable advantages that the state of the material in the evaporation process is relatively stable, and the problem that the related evaporated material generates sputtering and hole burning is not easy to occur, so that the application defect of a film coating product is avoided more remarkably.

However, there are some disadvantages to this method, such as the system heats the container by electric heating and heat conduction, and the container heats the evaporated material again, so as to achieve the effect of vaporizing the evaporated material. The heating process of the whole system is relatively slow, the time for the temperature of the evaporated material in the container and the container/thermal insulation material to reach a relatively stable balance is longer, especially the evaporation amount of the evaporated material along with the temperature rise in the process is larger, and the evaporation amount in the process is unstable, and in an unstable evaporation state, a large amount of the evaporated material is wasted by evaporation, especially the evaporated material is wasted by evaporating onto a coating baffle, which greatly reduces the number of meters and the like of an actual coating which can be coated and is loaded with a certain amount of the evaporated material.

On the other hand, since the electric heating element of the heater also changes its own heat output as the temperature of the hot environment increases, the film thickness uniformity in the MD direction is poor because the evaporation amount in the initial state is unstable, and thus the film is coated at a certain speed by directly opening the shutter.

Disclosure of Invention

Accordingly, an objective of the embodiments of the present invention is to provide a system and a method for monitoring and controlling uniformity of a plating film, so as to solve the problems in the prior art.

In a first aspect, an embodiment of the present invention provides a system for monitoring and controlling uniformity of a plating film, the system including:

the vacuum winding film plating device comprises an unreeling mechanism, an evaporating mechanism and a reeling mechanism, wherein the evaporating mechanism and the reeling mechanism are used for evaporating a base film;

A temperature measuring device for measuring a temperature value of the evaporation mechanism;

the surface resistance testing device is used for measuring the surface resistance value of the base film;

And the control device is used for controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film so as to ensure that the thickness of the coating along the moving direction of the base film is uniform.

In some possible embodiments, the control device is specifically configured to determine the real-time base film transmission speed of the unreeling mechanism according to a functional relationship between the base film transmission speed under a preset surface resistance threshold value and the temperature value of the evaporation mechanism, and the real-time temperature value of the evaporation mechanism.

In some possible embodiments, the evaporation mechanism comprises a first evaporation system and a second evaporation system, the first evaporation system being disposed upstream of the second evaporation system along the base film transport path;

The temperature measuring device comprises a first temperature detector, a second temperature detector and a first temperature sensor, wherein the first temperature detector is arranged on the first evaporation system and is used for measuring a first temperature value of the first evaporation system;

The surface resistance testing device comprises a first surface resistance tester and a second surface resistance tester, wherein the first surface resistance tester is arranged on a base film conveying path between a first evaporation system and a second evaporation system and is used for measuring a first surface resistance value of a current film plating surface of a base film, the second surface resistance tester is arranged on the base film conveying path between the second evaporation system and a winding mechanism and is used for measuring a total surface resistance value of a coating formed on two surfaces of the base film and obtaining a second surface resistance value of another film plating surface according to a difference value between the total surface resistance value and the first surface resistance value.

In some possible embodiments, the control device is specifically configured to determine a real-time base film transmission speed according to a first functional relationship between a base film transmission speed under the preset surface resistance threshold and a temperature value of the first evaporation system and a real-time temperature value of the first evaporation system when the first surface resistance value reaches the preset surface resistance threshold, obtain an ideal temperature value of the second evaporation system according to a second functional relationship between the base film transmission speed under the preset surface resistance threshold and the temperature value of the second evaporation system and the real-time base film transmission speed, and adjust heating power of the second evaporation system according to a comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system.

In some possible embodiments, the control device is specifically configured to:

If the ideal temperature value of the second evaporation system is larger than the actual temperature value of the second evaporation system, controlling to increase the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be larger than the heating power of the first evaporation system; if the ideal temperature value of the second evaporation system is smaller than the actual temperature value of the second evaporation system, controlling to reduce the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be smaller than the heating power of the first evaporation system.

In some possible embodiments, the control device is specifically configured to:

When the first surface resistance value reaches a preset surface resistance threshold value before the second surface resistance value, determining a real-time base film transmission speed according to a first functional relation between a base film transmission speed under the preset surface resistance threshold value and a temperature value of the first evaporation system and a real-time temperature value of the first evaporation system, obtaining an ideal temperature value of the second evaporation system according to a second functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the second evaporation system and the real-time base film transmission speed, adjusting the heating power of the second evaporation system according to a comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system, or

When the second surface resistance value reaches a preset surface resistance threshold value before the first surface resistance value, determining a real-time base film transmission speed according to a second functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the second evaporation system and a real-time temperature value of the second evaporation system, obtaining an ideal temperature value of the first evaporation system according to a first functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system and the real-time base film transmission speed, and adjusting the heating power of the first evaporation system according to a comparison result between the ideal temperature value of the first evaporation system and the actual temperature value of the first evaporation system.

In a second aspect, a method for monitoring and controlling uniformity of a plating film is provided, the method comprising:

Acquiring a temperature value of an evaporation mechanism;

Acquiring the surface resistance of the base film;

And controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film, so that the thickness of the coating along the moving direction of the base film is uniform.

In some possible embodiments, the controlling the base film transmission speed of the unreeling mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film specifically includes:

And determining the real-time base film transmission speed of the unreeling mechanism according to the functional relation between the base film transmission speed below the preset surface resistance threshold value and the temperature value of the evaporating mechanism and the real-time temperature value of the evaporating mechanism.

In some possible embodiments, the evaporation mechanism comprises a first evaporation system and a second evaporation system, the first evaporation system being disposed upstream of the second evaporation system along the base film transport path, the method specifically comprising:

Acquiring a first temperature value of the first evaporation system and a second temperature value of the second evaporation system;

acquiring a first surface resistance value of a current coating surface of the base film, acquiring a total surface resistance value of a coating formed on two surfaces of the base film, and acquiring a second surface resistance value of another coating surface according to a difference value between the total surface resistance value and the first surface resistance value;

When the first surface resistance value reaches a preset surface resistance threshold value, determining a real-time base film transmission speed according to a first functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system and a real-time temperature value of the first evaporation system;

Obtaining an ideal temperature value of the second evaporation system according to a second functional relation between the base film transmission speed under the preset surface resistance threshold and the temperature value of the second evaporation system and the real-time base film transmission speed;

And adjusting the heating power of the second evaporation system according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system.

In some possible embodiments, the adjusting the heating power of the second evaporation system according to the comparison between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system specifically includes:

If the ideal temperature value of the second evaporation system is larger than the actual temperature value of the second evaporation system, controlling to increase the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be larger than the heating power of the first evaporation system or controlling the temperature acceleration rate of the second evaporation system to be larger than the temperature acceleration rate of the first evaporation system; if the ideal temperature value of the second evaporation system is smaller than the actual temperature value of the second evaporation system, controlling to reduce the heating power of the second evaporation system, and controlling the heating power of the second evaporation system to be smaller than the heating power of the first evaporation system or controlling the temperature acceleration rate of the second evaporation system to be smaller than the temperature acceleration rate of the first evaporation system.

acquiring a first surface resistance value of a current coating surface of the base film, and acquiring a second surface resistance value of the double surfaces of the base film;

In a third aspect, a computer-readable storage medium is provided, on which a computer program is stored, which when executed by a processor implements any one of the methods of monitoring and controlling uniformity of a plating film described in the second aspect.

In a fourth aspect, there is provided a computer device comprising:

one or more processors;

a storage means for storing one or more programs;

the one or more programs, when executed by the one or more processors, cause the one or more processors to implement any of the plating film uniformity monitoring and controlling methods as described in the second aspect.

The technical scheme has the following beneficial effects:

the deviation of the surface resistance test values of the single-sided MD direction is within an expected range under the same coating speed, and further the deviation of the surface resistance test values of the double-sided MD direction is within a control range;

coating regulation and control with low evaporation capacity are performed in advance, so that the coating efficiency and the utilization rate of evaporation materials are improved;

The invalid deposited coating of the baffle plate above the high-temperature resistant evaporation container is reduced, so that the phenomenon that the deposited coating below the baffle plate is adhered to the high-temperature resistant container or inconvenient to process in the whole evaporation process is reduced, and finally falls into the high-temperature resistant container to form a splash phenomenon, thereby avoiding damaging the high-temperature resistant evaporation container and damaging the apparent mass of a base material.

Drawings

In order to more clearly illustrate the embodiments of the invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a system for monitoring and controlling uniformity of a plating film according to an embodiment of the present invention;

FIG. 2 is a schematic flow chart of a system for monitoring and controlling uniformity of a plating film according to an embodiment of the present invention;

FIG. 3 is a schematic flow chart of a system for monitoring and controlling uniformity of a plating film according to an embodiment of the invention.

Reference numerals illustrate:

A1, an unreeling roller, A2, a reeling roller;

B1, a first pass roller, B2, a second pass roller, B3, a third pass roller, B4 and a fourth pass roller;

C1, a first flattening roller, C2, a second flattening roller, C3, a third flattening roller;

d1, a first film plating cold drum, D2, a second film plating cold drum;

E1, a first evaporation system, E2, a second evaporation system;

E11, a first temperature detector, E21, a second temperature detector;

e12, a first heat-insulating material, E22, a second heat-insulating material;

E13, a first heating electrode, E23, a second heating electrode;

e14, a first evaporation vessel; E24, a second evaporation vessel;

f1, a first surface resistance tester, and F2, a second surface resistance tester.

Detailed Description

Features and exemplary embodiments of various aspects of the invention are described in detail below. In the following detailed description, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the invention by showing examples of the invention. In the drawings and the following description, at least some well-known structures and techniques have not been shown in order to avoid unnecessarily obscuring the present invention, and the dimensions of some of the structures may be exaggerated for clarity. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

The technical problems of the existing vacuum coating system in the industry, such as the change of the evaporation amount of the evaporated material of the evaporation source, the waste of the evaporated material and obvious non-uniformity of the coating thickness in the MD direction (film moving direction), are solved. The embodiment of the invention aims to better solve the problems by adopting the following technical scheme, and mainly realizes that the evaporation source system starts the baffle plate film running and coating action as early as possible even in an unsteady evaporation stage through the double regulation and control of the base film transmission speed and the evaporation system temperature, and realizes that the uniformity of the thickness of the MD-direction coating film is more consistent based on the matching of temperature control and coating speed (unreeling end group film transmission speed).

The technical problems to be solved by the embodiment of the invention include how to ensure the thickness consistency of the film layer in the film-feeding direction, how to utilize the film-coating evaporation system to carry out high-efficiency film coating and realize high utilization rate of film-coating materials, and how to avoid the influence on the subsequent production caused by excessively fast deposition of films with equivalent thickness on the baffle.

The embodiment of the invention provides a coating uniformity monitoring and regulating system, which comprises a system component with a basic vacuum winding coating function, in particular a temperature measuring device, a non-contact vortex resistance testing device and a coating substrate running speed control device, wherein the temperature measuring device is closest to a high-temperature evaporation source, and the non-contact vortex resistance testing device is arranged near an evaporation system, and the coating substrate running speed control device is used for controlling the coating running speed by collecting temperature data and resistance data.

According to the embodiment of the invention, the high-temperature resistant container is used for containing the coating material, the electric heating device for auxiliary heat preservation is used for heating the coating material, gasifying and evaporating the coating material and then forming a film on the surface of the substrate, the uniformity of the thickness of the coating layer in the MD direction of the coating material is regulated and controlled in an organic combination mode by controlling the coating speed and the temperature of the electric heating device, and a regulation and control instruction of the temperature and the coating speed is sent out by testing and feeding back results of the non-contact type surface resistance tester of the substrate.

The embodiment of the invention provides a plating film uniformity monitoring and regulating system, which comprises:

The temperature measuring device is used for measuring the temperature value of the evaporating mechanism, and specifically can be used for measuring the temperature value of the graphite heating electrode.

And the control device is used for controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film so as to ensure that the thickness of the coating layer along the moving direction of the base film has uniformity.

In some embodiments, a film coating baffle is arranged above the evaporation mechanism, and the control device is further used for controlling the unreeling mechanism to open the base film transmission and open the film coating baffle when the temperature value of the evaporation mechanism reaches a preset film coating temperature threshold value.

In some embodiments, the control device is specifically configured to determine the real-time base film transmission speed of the unreeling mechanism according to a functional relationship between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the evaporating mechanism, and the real-time temperature value of the evaporating mechanism.

As shown in fig. 1, the coating uniformity monitoring and controlling system comprises an unreeling roller A1, a first passing roller B1, a first flattening roller C1, a first coating cooling drum D1, a first evaporation system E1, a second passing roller B2, a third passing roller B3, a first surface resistance tester F1, a second flattening roller C2, a second coating cooling drum D2, a second evaporation system E2, a fourth passing roller B4, a second surface resistance tester F2, a third flattening roller C3 and a reeling roller A2.

The first evaporation system E1 is arranged below the first film plating cold drum D1, and the first evaporation system E1 comprises a first temperature detector E11, a first heat preservation material E12, a first heating electrode E13 and a first evaporation container E14. At least one hole is arranged in the first heating electrode E13, one or more first evaporation containers E14 are arranged in the corresponding holes of the first heating electrode E13, and evaporation materials are arranged in the first evaporation containers E14. The first heat-retaining material E12 may be located at the periphery of the first heating electrode E13 (e.g., graphite heating electrode) and may also be located at the periphery of the first evaporation vessel E14 (e.g., crucible).

The second evaporation system E2 is arranged below the second coating cold drum D2, and the second evaporation system E2 comprises a second temperature detector E21, a second heat insulation material E22, a second heating electrode E23 and a second evaporation container E24. At least one hole is arranged in the second heating electrode E23, one or more second evaporation containers E24 are arranged in the corresponding holes of the second heating electrode E23, and evaporation materials are arranged in the second evaporation containers E24. The second insulating material E22 may be located at the periphery of the second heating electrode E23 (e.g., graphite heating electrode) and may also be located at the periphery of the second evaporation vessel E24 (e.g., crucible).

The film to be coated starts from the unreeling roller A1 and sequentially passes through a first passing roller B1, a first flattening roller C1, a first coating cooling drum D1, a second passing roller B2, a third passing roller B3, a second flattening roller C2, a second coating cooling drum D2, a fourth passing roller B4 and a third flattening roller C3 to reach the reeling roller A2.

The first flattening roller C1 and the second passing roller B2 are respectively arranged at two sides of the first film plating cold drum D1, and the second flattening roller C2 and the fourth passing roller B4 are respectively arranged at two sides of the second film plating cold drum D2. The first pass roller B1 is arranged between the unreeling roller A1 and the first flattening roller C1, the third pass roller B3 is arranged between the second pass roller B2 and the second flattening roller C2, and the third flattening roller C3 is arranged between the fourth pass roller B4 and the reeling roller A2.

In other embodiments, the number of over-rolls and nip rolls described above may be increased or decreased.

The first and second resistance testers F1 and F2 can perform non-contact measurement on the resistance values of one or both sides of the film.

In some embodiments, the evaporation mechanism includes a first evaporation system E1 and a second evaporation system E2, the first evaporation system E1 being disposed upstream of the second evaporation system E2 along the base film conveyance path;

The temperature measuring device comprises a first temperature detector E11, a second temperature detector E21, a first temperature sensor E2, a second temperature sensor E2 and a first temperature sensor E1, wherein the first temperature detector E11 is arranged on a first evaporation system E1 and is used for measuring a first temperature value of the first evaporation system E1;

the surface resistance testing device comprises a first surface resistance tester F1, a second surface resistance tester F2, a first surface resistance tester and a second surface resistance tester, wherein the first surface resistance tester F1 is arranged on a base film conveying path between a first evaporation system E1 and a second evaporation system E2 and is used for measuring a first surface resistance value of a current film plating surface of a base film;

The control device is specifically configured to determine a real-time base film transmission speed according to a first functional relationship between a base film transmission speed under a preset surface resistance threshold and a temperature value of the first evaporation system E1 and a real-time temperature value of the first evaporation system E1 when the first surface resistance value reaches the preset surface resistance threshold, obtain an ideal temperature value of the second evaporation system E2 according to a second functional relationship between the base film transmission speed under the preset surface resistance threshold and a temperature value of the second evaporation system E2 and the real-time base film transmission speed, and adjust a heating power of the second evaporation system E2 according to a comparison result between the ideal temperature value of the second evaporation system E2 and an actual temperature value of the second evaporation system E2.

In some embodiments, the control device is specifically configured to:

If the ideal temperature value of the second evaporation system E2 is greater than the actual temperature value of the second evaporation system E2, the heating power of the second evaporation system E2 is controlled to be increased and the heating power of the second evaporation system E2 is controlled to be greater than the heating power of the first evaporation system E1, and if the ideal temperature value of the second evaporation system E2 is less than the actual temperature value of the second evaporation system E2, the heating power of the second evaporation system E2 is controlled to be decreased and the heating power of the second evaporation system E2 is controlled to be less than the heating power of the first evaporation system E1.

In some embodiments, the control device may be further specifically configured to:

When the first surface resistance value reaches a preset surface resistance threshold value before the second surface resistance value, determining a real-time base film transmission speed according to a first functional relation between a base film transmission speed under the preset surface resistance threshold value and a temperature value of a first evaporation system E1 and a real-time temperature value of the first evaporation system E1, obtaining an ideal temperature value of the second evaporation system E2 according to a second functional relation between the base film transmission speed under the preset surface resistance threshold value and a temperature value of the second evaporation system E2 and the real-time base film transmission speed, adjusting the heating power of the second evaporation system E2 according to a comparison result between the ideal temperature value of the second evaporation system E2 and an actual temperature value of the second evaporation system E2, or

When the second surface resistance value reaches a preset surface resistance threshold value before the first surface resistance value, determining a real-time base film transmission speed according to a second functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the second evaporation system E2 and a real-time temperature value of the second evaporation system E2, obtaining an ideal temperature value of the first evaporation system E1 according to a first functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system E1 and the real-time base film transmission speed, and adjusting the heating power of the first evaporation system E1 according to a comparison result between the ideal temperature value of the first evaporation system E1 and the actual temperature value of the first evaporation system E1.

In some embodiments, the control device is further configured to control to increase the base film transfer speed of the unwind mechanism when the first resistance exceeds a preset resistance threshold, and to increase the heating power of the second evaporation system E2 if the second resistance decreases.

The system can be in a single-sided coating mode or a double-sided coating mode, and further, if the system is in the double-sided coating mode, the control instructions of temperature regulation and control nearby each side of coating and calculation of surface resistance test sending speed are needed. Further, the double-sided coating mode finally obtains the thickness agreement of the coating under the condition of the same coating running speed.

The technical effects achieved by the embodiment of the invention include:

The following is a more detailed description:

In the vacuum coating system shown in fig. 1, when the high temperature resistant container (the first evaporation container E14 and/or the second evaporation container E24) is filled with a preset evaporated material and related equipment, vacuum pumping is started, after the vacuum pumping is better than 5×10 ^-2 Pa, the electric heating device (the first heating electrode E13 and/or the second heating electrode E23) starts to start to raise the temperature of the evaporation system (the first evaporation system E1 and/or the second evaporation system E2) gradually, and the baffle plate for shielding the base film material above the high temperature resistant containers E14 and E24 is always located above during the continuous temperature raising process, which is mainly used for preventing the evaporated material from evaporating to the surface of the base film material under the unexpected condition or radiating excessive heat to the base film material. Materials needing evaporation coating, such as Al, ag and the like, are placed in the high-temperature resistant evaporation containers E14 and E24. In the embodiment of the invention, taking Al material as an example, al begins to melt at about 600 ℃, is gradually transformed from solid state to liquid state, and finally, with the temperature of an electric heating device rising, the liquid aluminum gradually gasifies, namely is transformed into gas state, and the stable evaporation coating of the Al material is required to be at about 1200 ℃ under the normal condition. The temperature rise of the electric heating device in the vacuum environment is mainly conducted by heat conduction and radiation, and in order to enable the electric heating device to be used for a safer and longer-life period, it is generally required that the electric heating device (in the vicinity of the high-temperature resistant evaporation vessel) has a steady state in which the temperature increases from around 600 ℃ to around 1200 ℃ for a considerable period of time, for example, 60 minutes, and the saturated vapor pressure is higher, that is, the evaporation amount is higher, especially, the closer to the high temperature.

The electric heating device or the electric heater specifically comprises a graphite heating electrode, the evaporation system comprises the graphite heating electrode, a crucible and evaporation materials, the graphite heating electrode is provided with a hole, the crucible is positioned in the hole, and the crucible is internally provided with the evaporation materials.

Therefore, the technical scheme of the embodiment of the invention is that when the temperature is increased to a certain range, the base film transmission is started, for example, the temperature is about 950 ℃, meanwhile, the film coating running speed of 56m/min is kept, and the shielding plates above the evaporation containers E14 and E24 are opened for film coating. The temperature of the heater is continuously increased to a steady state during the film plating process, namely the evaporation amount or the deposition rate of the film is continuously increased, the film plating running speed is continuously increased in the process to keep the thickness of the coating in the front and rear MD directions consistent, and the film plating running speed is comprehensively corrected according to the thickness of the coating of the non-contact vortex resistance test instrument F1 shown in figure 1.

As shown in fig. 1, if the single-sided evaporation system is adopted, only the coating speed, the first evaporation system E1, the corresponding first temperature detector E11 and the first non-contact eddy current resistance testing instrument F1 are involved, wherein the non-contact eddy current resistance testing instrument F1 only tests the surface resistance of one side of the non-contact eddy current resistance testing instrument to convert the surface resistance into the corresponding coating thickness.

If the system is a double-sided coating system, a second evaporation system E2, a related second temperature detector E21 and a second non-contact eddy current resistance testing instrument F2 are additionally arranged on the basis of the single-sided coating system, and the coating state is comprehensively adjusted through parameters acquired by the testing instruments. The film plating running speed is determined mainly according to parameters of a first temperature detector E11, a second temperature detector E21, a first non-contact eddy current resistance testing instrument F1 and a second non-contact eddy current resistance testing instrument F2 and the change trend of the parameters. In particular, in the case of a system for simultaneous coating of two sides, in order to ensure that the thicknesses of the coatings on both sides are the same (or the difference is within an acceptable quality control range) and that the running speed of the whole coating is compatible, the parameters of the first temperature detector E11 and the second temperature detector E21 need to be set.

The following parameters need to be determined before the speed regulation mode is determined:

The first temperature detector E11 tests the temperature T10 at the initial start of film coating, the film coating running speed V1 and the surface resistance test R10, the first temperature detector E11 tests the temperature T20 at the steady state film coating, the film coating running speed V2 and the surface resistance test R11 are consistent under the conditions of keeping the initial state and the steady state, namely R10 is approximately equal to R11, and the fluctuation range of the surface resistance test R11 is within an acceptable range. In such a case, the relation between the coating running speed and the temperature of the electric heater under the preset surface resistance is finally obtained by changing the coating running speed to match the evaporation amount of the material under different temperatures, and of course, the input power and the heating time of the electric heater related to the process are used as the process control conditions under the mode, and the mutual relation can be obtained by carrying out curve fitting through numerical simulation, wherein, in the relation formula, x1 represents the temperature, and Y1 represents the unreeling speed. The formula I described below is a formula for the first evaporation system E1, x1 represents a temperature value of the first evaporation system E1, Y1 represents an unreeling speed corresponding to the first evaporation system E1, and the formula II is a formula for the second evaporation system E2, x1 represents a temperature value of the second evaporation system E2, and Y1 represents an unreeling speed corresponding to the second evaporation system E2.

The above relation indicates that when the evaporation baffle is just started to be opened, the coating running speed v1=78m/min reaches the surface resistance R10, and when the evaporation amount gradually increases with the increase of the heating temperature, the coating running speed changes when the surface resistances of R11 and R10 are kept close after coating, for example, when the temperature is 1200 ℃, the coating running speed is 125m/min, i.e., in this case, the fitting formula x1=1200, and y1=125.

Based on the same thought, if the embodiment of the invention is to control the double-sided coating, the calculation and simulation of the evaporation rate of the second evaporation system E2 can be performed first. Namely, when the coating running speed of v1=78m/min reaches the R10 surface resistance, the temperature value measured by the temperature detector E21 of the second evaporation system E2 is kept, and the temperatures and the evaporation rates of the different evaporation source systems are different, so that the process is further based on the fact that the same coating running speed is kept when single-sided coating and double-sided coating are performed and the same surface resistance is kept when each surface is independently coated, and the consistency of the surface resistances when double-sided simultaneous coating is obtained. Through a series of data measurement and simulation, the temperature of the second evaporation system E2 is controlled at a coating speed corresponding to the condition of the evaporation system E1, namely, the temperature control of the second evaporation system is determined by reverse fitting.

However, in practice, since it has been mentioned that the electric heater is affected by heat conduction efficiency and heat capacity in a vacuum environment, it is difficult to reach a desired control range in a short time, that is, control of temperature has hysteresis. Therefore, in the actual control process, the embodiment of the invention can utilize a similar algorithm of the temperature control PID to synchronously control the temperature of the first evaporation system E1 and the second evaporation system E2, so as to ensure that the surface resistances of the newly added coating tests of F1 and F2 are the same or similar (namely, meet the allowable range) within a certain speed regulation and control range. The surface resistances of the newly added coatings of the first non-contact vortex resistance testing instrument F1 and the second non-contact vortex resistance testing instrument F2 are the same, so that it can be understood that if the surface resistance of the first non-contact vortex resistance testing instrument F1 is 800mΩ during double-sided coating, the corresponding thickness d1 can be calculated under the condition of setting a certain conductivity, and the surface resistance control of the second non-contact vortex resistance testing instrument F2 is calculated after the thickness d1 is further thickened to be 2d 1.

The actual control process requires the first evaporation system E1 and the second evaporation system E2 to perform control of temperature rise or temperature drop, and control of coating speed. When the first evaporation system E1 and the second evaporation system E2 reach a certain temperature which can open the baffle, the baffle is opened, and then film coating is carried out, in this case, the film coating speed of V1 is set, speed increment control is carried out according to the results of the tested non-contact vortex resistance test instrument F1 and the non-contact vortex resistance test instrument F2, and the temperature of the first evaporation system E1 and the second evaporation system E2 is gradually increased again.

Aiming at the condition of a plurality of evaporation sources, the prior art always uses a baffle plate to block the plating material before the plating film reaches a steady state, and the problem of waste of the plating material exists. The MD direction refers to the film-running direction, and the larger the surface resistance is, the thinner the plating layer is. Since the characteristics of the second evaporation system E2 and the first evaporation system E1 are different, for example, the first evaporation system E1 can achieve a surface resistance of 800 milliohms at 1300 ℃ and 55m/min, and the second evaporation system E2 can achieve a surface resistance of 800 milliohms at 1400 ℃ and 55 m/min.

The embodiment of the invention hopefully can embody a control mode, and the practical empirical formulas of fitting of different equipment, different sheet resistance control of the same equipment and the like can be different. According to the embodiment, the film thickness of the final two-sided film coating can be the same through multiple times of adjustment by the PID algorithm, namely, single-sided sheet resistance test is carried out by Fang Zuyi in contact, and the displayed sheet resistances are very close. I.e. the thickness of the single sided film calculated based on the characteristic resistivity is very close or the difference is within acceptable limits for quality control.

The following illustrates that more accurate data is obtained in connection with actual plant operation and that previous data is corrected in this way, for example:

First surface data, such as setting the surface resistance 600mΩ;900℃-35m/min;950℃-41m/min;1000℃-50m/min;1050℃-62m/min;1100℃-75m/min;1150℃-92m/min;1200℃-113m/min;1250℃-129m/min;1300℃-132m/min, in order to obtain a relatively stable evaporation state, while taking into account factors such as effective operation and maintenance protection of the apparatus, the actual temperature should not be increased continuously.

The embodiment can simulate the empirical formula according to the similar values, and can obtain the similar empirical formula when the second surface is independently coated, the related difference is not very large, and the adjustment can be performed on the range of the difference of a few meters in the coated meter.

In addition, the lower the surface resistance, the thicker the film thickness, and the film coating speed needs to be reduced if the evaporation efficiency (which can be regarded as evaporation temperature) and the like are not changed, and conversely, the lower the sheet resistance value, the larger the coating thickness, if the film coating speed is unchanged at higher evaporation temperatures.

The method comprises the steps of testing 600mΩ of a first surface by using specific electrical parameters to calculate the thickness of about 65nm (if the plating film is an Al film), substituting the specific resistance parameter of the copper film to calculate if the plating film is a copper film, and calculating if the plating film is an Al film, wherein the numerical value of a second position of the sheet resistance testing instrument is the result of eddy current induction measurement of the two-side plating film layers, the target value is about 300mΩ, so that the thickness of the second surface coating is about 65nm, and the method can be understood as that 300mΩ is the sheet resistance corresponding to the sum of the thicknesses of the two surfaces coating.

FIG. 2 is a flowchart showing a method for monitoring and controlling uniformity of a plating film according to an embodiment of the present invention. As shown in fig. 2, the method comprises the steps of:

S110, acquiring a temperature value of an evaporation mechanism;

s120, acquiring the surface resistance of the base film;

S130, controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film, so that the thickness of the coating layer along the moving direction of the base film is uniform.

In some embodiments, the step S130 of controlling the base film transmission speed of the unreeling mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film specifically comprises determining the real-time base film transmission speed of the unreeling mechanism according to the functional relation between the base film transmission speed below the preset surface resistance threshold value and the temperature value of the evaporating mechanism and the real-time temperature value of the evaporating mechanism.

In some embodiments, the method further comprises controlling the unreeling mechanism to open the base film drive and to open the coating baffle on the evaporating mechanism when the temperature value of the evaporating mechanism reaches a preset coating temperature threshold.

In some embodiments, the evaporation mechanism includes a first evaporation system and a second evaporation system, the first evaporation system disposed upstream of the second evaporation system along the base film transport path.

FIG. 3 is a second flowchart of a method for monitoring and controlling uniformity of a plating film according to an embodiment of the present invention. As shown in fig. 3, the method specifically includes the following steps:

S110', acquiring a first temperature value of a first evaporation system and a second temperature value of a second evaporation system;

S120', acquiring a first surface resistance value of a current coating surface of the base film, acquiring a total surface resistance value of a coating formed on two surfaces of the base film, and acquiring a second surface resistance value of another coating surface according to a difference value between the total surface resistance value and the first surface resistance value;

S131, when the first surface resistance value reaches a preset surface resistance threshold value, determining a real-time base film transmission speed according to a first functional relation between the base film transmission speed under the preset surface resistance threshold value and a temperature value of a first evaporation system and a real-time temperature value of the first evaporation system;

S132, obtaining an ideal temperature value of a second evaporation system according to a second functional relation between a base film transmission speed and a temperature value of the second evaporation system under a preset surface resistance threshold and the real-time base film transmission speed;

And S133, adjusting the heating power of the second evaporation system according to the comparison result between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system.

In some embodiments, adjusting the heating power of the second evaporation system in S133 according to a comparison between the ideal temperature value of the second evaporation system and the actual temperature value of the second evaporation system specifically includes:

if the ideal temperature value of the second evaporation system is larger than the actual temperature value of the second evaporation system, the heating power of the second evaporation system is controlled to be increased, and the heating power of the second evaporation system is controlled to be larger than the heating power of the first evaporation system or the temperature acceleration rate of the second evaporation system is controlled to be larger than the temperature acceleration rate of the first evaporation system, and if the ideal temperature value of the second evaporation system is smaller than the actual temperature value of the second evaporation system, the heating power of the second evaporation system is controlled to be decreased, and the heating power of the second evaporation system is controlled to be smaller than the heating power of the first evaporation system or the temperature acceleration rate of the second evaporation system is controlled to be smaller than the temperature acceleration rate of the first evaporation system.

In some embodiments, the method further comprises the steps of:

Acquiring a first temperature value of a first evaporation system and acquiring a second temperature value of a second evaporation system;

When the first surface resistance value reaches a preset surface resistance threshold value before the second surface resistance value, determining a real-time basic film transmission speed according to a first functional relation between a basic film transmission speed under the preset surface resistance threshold value and a temperature value of a first evaporation system and a real-time temperature value of the first evaporation system; according to a second functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the second evaporation system and the real-time base film transmission speed, obtaining an ideal temperature value of the second evaporation system;

Or when the second surface resistance value reaches a preset surface resistance threshold value before the first surface resistance value, determining the real-time base film transmission speed according to a second functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the second evaporation system and the real-time temperature value of the second evaporation system, obtaining the ideal temperature value of the first evaporation system according to the first functional relation between the base film transmission speed under the preset surface resistance threshold value and the temperature value of the first evaporation system and the real-time base film transmission speed, and adjusting the heating power of the first evaporation system according to the comparison result between the ideal temperature value of the first evaporation system and the actual temperature value of the first evaporation system.

The following is a detailed description of the above method:

According to the method for monitoring and controlling uniformity of a coating film of the present embodiment, during a coating process, a value measured by the first surface resistance tester F1 needs to be fixed (to reach a target surface resistance value), an actual temperature of the first evaporation system E1 can be obtained first, an unwinding speed can be obtained according to a formula one, and the unwinding speed is adjusted to be the real-time unwinding speed. Because the temperatures of the first evaporation system E1 and the second evaporation system E2 are increased until the steady state of the film coating is reached, the real-time unreeling speed can be obtained in real time according to the first formula, and the unreeling speed is adjusted to be the real-time unreeling speed. At this time, according to the second formula, the real-time unreeling speed is used as an input, and the ideal temperature value of the second evaporation system E2 can be obtained. And when the ideal temperature value of the second evaporation system E2 is reached, the square resistance value measured by the second surface resistance tester F2 is converted into the thickness value which is 2 times of the thickness value measured by the first surface resistance tester F1, so that the thicknesses of the double-sided films are the same.

According to the method for monitoring and controlling uniformity of a film coating in the embodiment, the first evaporation system E1 and the second evaporation system E2 are heated during the whole film coating process. If the ideal temperature value of the second evaporation system E2 is larger than the actual temperature value of the second evaporation system E2, increasing the heating power of the second evaporation system E2, controlling the heating power of the second evaporation system E2 to be larger than the heating power of the first evaporation system E1, controlling the heating speed of the second evaporation system E2 to be larger than the heating speed of the first evaporation system E1, and if the ideal temperature value of the second evaporation system E2 is smaller than the actual temperature value of the second evaporation system E2, decreasing the heating power of the second evaporation system E2, decreasing the heating speed of the second evaporation system E2, controlling the heating power of the second evaporation system E2 to be smaller than the heating power of the first evaporation system E1, and controlling the heating speed of the second evaporation system E2 to be smaller than the heating speed of the first evaporation system E1. If the ideal temperature value of the second evaporation system E2 is equal to the actual value of the second evaporation system E2, no adjustment is made.

The method for monitoring and controlling uniformity of a film coating in this embodiment is executed by a control device, wherein the first evaporation system E1 corresponds to a formula one, the second evaporation system E2 corresponds to a formula two, and the first resistance tester F1 is defined as 800 milliohms, and the method includes the following steps of adjusting the temperature value of the second evaporation system E2 in real time:

Acquiring a real-time temperature value of the first evaporation system E1 in real time, and adjusting the unreeling speed in real time according to the formula I and the real-time temperature value of the first evaporation system E1, so that an ideal temperature value of the second evaporation system E2 can be obtained according to the formula II and the real-time unreeling speed;

comparing the ideal temperature value of the second evaporation system E2 with the actual temperature value of the second evaporation system E2;

If the ideal temperature value of the second evaporation system E2 is larger, controlling the temperature acceleration rate of the second evaporation system E2 to be larger than the temperature acceleration rate of the first evaporation system E1;

If the ideal value of the second evaporation system E2 is small, the temperature increase rate of the second evaporation system E2 is controlled to be smaller than the temperature increase rate of the first evaporation system E1.

As is clear from the above, if the ideal temperature value of the second evaporation system E2 is greater than the actual temperature value thereof, the heating power of the second evaporation system E2 is controlled to be increased, and the heating power of the second evaporation system E2 is controlled to be greater than the heating power of the first evaporation system E1, that is, the temperature increase rate of the second evaporation system E2 is controlled to be greater than the temperature increase rate of the first evaporation system E1.

The measured value of the first surface resistance tester F1 is always 800 milliohms, and along with the real-time adjustment of the unreeling speed, the measured value of the second surface resistance tester F2 is always about 800 milliohms, so that the thickness of the coating meets the quality requirement.

The method for monitoring and regulating the uniformity of the coating film is executed by a control device, and in order to solve the problem that the adjustment is not proper at any time or the temperature adjustment has hysteresis, the following method is adopted:

judging which measured value of the first surface resistance tester F1 and the second surface resistance tester F2 reaches the surface resistance threshold value first;

If the first surface resistance tester F1 reaches the surface resistance threshold value, the real-time unreeling speed is adjusted according to the temperature value of the first evaporation system E1, an ideal temperature value of the second evaporation system E2 is obtained according to a formula II and the real-time unreeling speed, and the actual temperature value of the second evaporation system E2 is adjusted according to the ideal temperature value of the second evaporation system E2;

And according to the formula I and the real-time unreeling speed, obtaining a theoretical temperature value of the first evaporation system E1, and controlling the heating power to adjust the actual temperature value of the first evaporation system E1 through the theoretical temperature value of the first evaporation system E1.

Further, the method for monitoring and regulating the uniformity of the coating film further comprises the following steps:

And detecting two surface resistance values (the surface resistance values measured by the F1 and the F2 respectively) in real time, and increasing the heating power of the second evaporation system E2 if the thickness value measured by the second surface resistance tester F2 or the surface resistance value is reduced at the moment.

Further, if the temperature increases too fast, it is not possible to decrease the heating power until now, so it is preferable to increase the temperature slowly so that the ideal temperature value of the second evaporation system E2 is always larger than the actual temperature value thereof. Therefore, the method for monitoring and regulating the uniformity of the coating film further comprises the step of regulating the temperature of the second surface resistance tester F2 to increase by a certain proportion when the measured value of the second surface resistance tester reaches the lower limit of the surface resistance threshold value.

The embodiment of the invention has the beneficial technical effects that:

1. The waste of evaporated materials in an evaporation boat system in the film deposition process is reduced;

2. the consistency of the overall thickness of the coating film layer on the surface of the substrate along the MD direction is better achieved through the dual regulation and control of the temperature and the coating belt speed of the evaporation system;

3. the phenomenon that the deposited coating on the surface of the baffle plate is influenced by the waste heat of the evaporation system after the coating is finished can be reduced because the invalid deposited coating on the surface of the baffle plate is avoided, and the performance of equipment is influenced.

In the description of the present invention, it should be noted that the orientation or positional relationship indicated by "upper, lower, inner and outer", etc. in terms are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first, second, or third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

The terms "mounted, connected, and coupled" as used herein, unless otherwise specifically indicated and defined, shall be construed broadly and include, for example, fixed, removable, or integral, as well as mechanical, electrical, or direct, as well as indirect via intermediaries, or communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.

While the invention has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present invention is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.

Claims

1.A plating film uniformity monitoring and control system, the system comprising:

The control device is used for controlling the base film transmission speed of the unreeling mechanism and/or the heating power of the evaporating mechanism according to the temperature value of the evaporating mechanism and the surface resistance value of the base film so as to ensure that the thickness of the coating along the moving direction of the base film is uniform;

The control device is specifically configured to determine a real-time base film transmission speed of the unreeling mechanism according to a functional relationship between a base film transmission speed under a preset surface resistance threshold and a temperature value of the evaporating mechanism, and a real-time temperature value of the evaporating mechanism;

The evaporation mechanism comprises a first evaporation system and a second evaporation system, wherein the first evaporation system is arranged at the upstream of the second evaporation system along the base film conveying path;

2. The system for monitoring and controlling uniformity of a coating film according to claim 1, wherein said control device is specifically configured to determine a real-time base film transmission speed according to a first functional relationship between a base film transmission speed under a preset surface resistance threshold and a temperature value of said first evaporation system and a real-time temperature value of said first evaporation system when said first surface resistance value reaches the preset surface resistance threshold, obtain an ideal temperature value of said second evaporation system according to a second functional relationship between the base film transmission speed under the preset surface resistance threshold and the temperature value of said second evaporation system and said real-time base film transmission speed, and adjust a heating power of said second evaporation system according to a comparison result between the ideal temperature value of said second evaporation system and an actual temperature value of said second evaporation system.

3. The system for monitoring and controlling uniformity of a coating film according to claim 1, wherein said control means is specifically configured to control to increase the heating power of said second evaporation system if the desired temperature value of said second evaporation system is greater than the actual temperature value of said second evaporation system, and to control the heating power of said second evaporation system to be greater than the heating power of said first evaporation system or to control the temperature increase of said second evaporation system to be greater than the temperature increase of said first evaporation system, and to control to decrease the heating power of said second evaporation system if the desired temperature value of said second evaporation system is less than the actual temperature value of said second evaporation system, and to control the heating power of said second evaporation system to be less than the heating power of said first evaporation system or to control the temperature increase of said second evaporation system to be less than the temperature increase of said first evaporation system.

4. The system for monitoring and controlling uniformity of a coating film according to claim 1, wherein said control device is specifically configured to:

5. A method for monitoring and controlling uniformity of a coating, wherein the method is applied to a system for monitoring and controlling uniformity of a coating according to any one of claims 1 to 4, and the method comprises:

Acquiring a temperature value of an evaporation mechanism;

Acquiring the surface resistance of the base film;

6. The method for monitoring and controlling uniformity of a coating film according to claim 5, wherein the step of controlling a base film transmission speed of an unreeling mechanism according to a temperature value of the evaporating mechanism and a surface resistance value of the base film comprises the following steps:

7. The method of claim 5, wherein the evaporation mechanism comprises a first evaporation system and a second evaporation system, the first evaporation system being disposed upstream of the second evaporation system along a substrate film transport path, the method comprising:

8. The method for monitoring and controlling uniformity of a coating film according to claim 5, wherein said adjusting heating power of said second evaporation system according to a comparison between an ideal temperature value of said second evaporation system and an actual temperature value of said second evaporation system comprises: