CN1196870A - 电路板的射频屏蔽盒 - Google Patents

电路板的射频屏蔽盒 Download PDF

Info

Publication number
CN1196870A
CN1196870A CN96197100.2A CN96197100A CN1196870A CN 1196870 A CN1196870 A CN 1196870A CN 96197100 A CN96197100 A CN 96197100A CN 1196870 A CN1196870 A CN 1196870A
Authority
CN
China
Prior art keywords
box
case
shielding
profile
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN96197100.2A
Other languages
English (en)
Chinese (zh)
Inventor
马修P·卡塞博尔特
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Metricom Inc
Original Assignee
Metricom Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/569,403 external-priority patent/US5774344A/en
Application filed by Metricom Inc filed Critical Metricom Inc
Publication of CN1196870A publication Critical patent/CN1196870A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
CN96197100.2A 1995-09-22 1996-09-11 电路板的射频屏蔽盒 Pending CN1196870A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US419795P 1995-09-22 1995-09-22
US60/004,197 1995-09-22
US08/569,403 US5774344A (en) 1995-12-06 1995-12-06 RF shield for circuit card having a solid first flange
US08/569,403 1995-12-06

Publications (1)

Publication Number Publication Date
CN1196870A true CN1196870A (zh) 1998-10-21

Family

ID=26672740

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96197100.2A Pending CN1196870A (zh) 1995-09-22 1996-09-11 电路板的射频屏蔽盒

Country Status (6)

Country Link
EP (1) EP0852108A4 (fr)
JP (1) JPH11511595A (fr)
CN (1) CN1196870A (fr)
CA (1) CA2231150A1 (fr)
MX (1) MX9802266A (fr)
WO (1) WO1997011592A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100394236C (zh) * 2001-09-14 2008-06-11 莫莱克斯公司 小型因子连接盒
CN102122766A (zh) * 2010-12-24 2011-07-13 向荣集团有限公司 一种管型母线的连接器
CN101166412B (zh) * 2006-10-16 2011-11-30 英华达(上海)电子有限公司 一种屏蔽盖的制造方法和利用该方法制造的屏蔽盖
US8362370B2 (en) 2007-11-26 2013-01-29 Nec Display Solutions, Ltd. Electronic circuit board and electronic circuit board shield method and construction
CN106449602A (zh) * 2015-08-10 2017-02-22 爱思开海力士有限公司 具有emi屏蔽部分的半导体封装及其制造方法
WO2018099170A1 (fr) * 2016-11-30 2018-06-07 广州视源电子科技股份有限公司 Dispositif de blindage électrostatique
WO2019024515A1 (fr) * 2017-08-03 2019-02-07 深圳市道通智能航空技术有限公司 Structure de blindage électromagnétique et dispositif électronique pourvu de la structure de blindage électromagnétique

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE29914661U1 (de) * 1999-08-13 1999-11-11 Detewe-Deutsche Telephonwerke Ag & Co, 10997 Berlin Abschirmung zum Verhindern des Durchtritts elektromagnetischer Strahlung
KR20200114709A (ko) * 2019-03-29 2020-10-07 엘지전자 주식회사 기판 구조체 및 그 제어 방법

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5354951A (en) * 1993-03-15 1994-10-11 Leader Tech, Inc. Circuit board component shielding enclosure and assembly

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100394236C (zh) * 2001-09-14 2008-06-11 莫莱克斯公司 小型因子连接盒
CN101166412B (zh) * 2006-10-16 2011-11-30 英华达(上海)电子有限公司 一种屏蔽盖的制造方法和利用该方法制造的屏蔽盖
US8362370B2 (en) 2007-11-26 2013-01-29 Nec Display Solutions, Ltd. Electronic circuit board and electronic circuit board shield method and construction
CN102122766A (zh) * 2010-12-24 2011-07-13 向荣集团有限公司 一种管型母线的连接器
CN106449602A (zh) * 2015-08-10 2017-02-22 爱思开海力士有限公司 具有emi屏蔽部分的半导体封装及其制造方法
CN106449602B (zh) * 2015-08-10 2019-09-13 爱思开海力士有限公司 具有emi屏蔽部分的半导体封装及其制造方法
WO2018099170A1 (fr) * 2016-11-30 2018-06-07 广州视源电子科技股份有限公司 Dispositif de blindage électrostatique
WO2019024515A1 (fr) * 2017-08-03 2019-02-07 深圳市道通智能航空技术有限公司 Structure de blindage électromagnétique et dispositif électronique pourvu de la structure de blindage électromagnétique
CN109392295A (zh) * 2017-08-03 2019-02-26 深圳市道通智能航空技术有限公司 电磁屏蔽结构及具有此电磁屏蔽结构的电子设备

Also Published As

Publication number Publication date
WO1997011592A1 (fr) 1997-03-27
MX9802266A (es) 1998-11-29
EP0852108A4 (fr) 1999-05-26
JPH11511595A (ja) 1999-10-05
CA2231150A1 (fr) 1997-03-27
EP0852108A1 (fr) 1998-07-08

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C01 Deemed withdrawal of patent application (patent law 1993)
WD01 Invention patent application deemed withdrawn after publication