CN121368942A - Display device and electronic apparatus - Google Patents

Display device and electronic apparatus

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Publication number
CN121368942A
CN121368942A CN202480041866.9A CN202480041866A CN121368942A CN 121368942 A CN121368942 A CN 121368942A CN 202480041866 A CN202480041866 A CN 202480041866A CN 121368942 A CN121368942 A CN 121368942A
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CN
China
Prior art keywords
layer
light emitting
display device
partition wall
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202480041866.9A
Other languages
Chinese (zh)
Inventor
末益淳志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Semiconductor Solutions Corp
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Sony Semiconductor Solutions Corp
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Filing date
Publication date
Application filed by Sony Semiconductor Solutions Corp filed Critical Sony Semiconductor Solutions Corp
Publication of CN121368942A publication Critical patent/CN121368942A/en
Pending legal-status Critical Current

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    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00Optical elements other than lenses
    • G02B5/20Filters
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/85Arrangements for extracting light from the devices
    • H10K50/858Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/122Pixel-defining structures or layers, e.g. banks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/30Devices specially adapted for multicolour light emission
    • H10K59/38Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

提供了一种能够抑制相邻像素之间的漏光的显示装置。该显示装置设置有:二维布置的多个发光元件;堆叠在多个发光元件上的多个层;以及分隔壁,在俯视时布置在相邻的发光元件之间并且横跨包括在多个层中的两个或更多个层形成。分隔壁的截面形状包括正锥形形状。

A display device is provided that can suppress light leakage between adjacent pixels. The display device includes: a plurality of light-emitting elements arranged in a two-dimensional manner; a plurality of layers stacked on the plurality of light-emitting elements; and partition walls arranged between adjacent light-emitting elements when viewed from above and spanning two or more layers included in the plurality of layers. The cross-sectional shape of the partition walls includes a positive conical shape.

Description

Display device and electronic apparatus
Technical Field
The present disclosure relates to a display device and an electronic apparatus including the same.
Background
In recent years, a display device in which a plurality of light emitting elements are two-dimensionally arranged has been widely used. In this type of display device, light leakage may occur between adjacent pixels, and color mixing may occur between pixels. For this reason, a technique for preventing light leakage between adjacent pixels has been studied. For example, patent document 1 proposes a technique of preventing light leakage between adjacent pixels by providing an isolation portion in a protective layer in a display device including a substrate, a plurality of light emitting elements, a protective layer, and a color filter.
List of references
Patent literature
Patent document 1 Japanese patent application laid-open No. 2018-92873
Disclosure of Invention
Problems to be solved by the invention
However, the technique described in patent document 1 cannot sufficiently prevent light leakage, and there is room for improvement.
An object of the present disclosure is to provide a display device capable of preventing light leakage between adjacent pixels and an electronic apparatus including the display device.
Solution to the problem
In order to solve the above-mentioned problems,
The display device according to the present disclosure includes:
A plurality of light emitting elements arranged two-dimensionally;
a plurality of layers stacked on the plurality of light emitting elements, and
A partition wall which is arranged between adjacent light emitting elements in a plan view and is formed on two or more layers included in the plurality of layers,
Wherein the cross-sectional shape of the partition wall includes a forward tapered shape.
Drawings
Fig. 1 is a cross-sectional view of a display device in which a color filter is formed on a glass substrate.
Fig. 2 is a cross-sectional view of a display device in which a color filter is formed on a driving substrate.
Fig. 3 is a cross-sectional view of a display device in which a color filter and a lens array are formed on a driving substrate.
Fig. 4 is a cross-sectional view of a display device having a gap between adjacent lenses.
Fig. 5 is a plan view of a display device according to an embodiment.
Fig. 6 is an enlarged cross-sectional view of a display area of a display device according to one embodiment.
Fig. 7a is a cross-sectional view of an OLED layer including a single layer light emitting unit. Fig. 7B is a cross-sectional view of an OLED layer including two light emitting cells.
Fig. 8 is a process diagram for describing a first example of a method for manufacturing a display device according to an embodiment.
Fig. 9 is a process diagram for describing a first example of a method for manufacturing a display device according to an embodiment.
Fig. 10 is a process diagram for describing a first example of a method for manufacturing a display device according to an embodiment.
Fig. 11 is a process diagram for describing a second example of a method for manufacturing a display device according to an embodiment.
Fig. 12 is a process diagram for describing a second example of a method for manufacturing a display device according to one embodiment.
Fig. 13 is a process diagram for describing a second example of a method for manufacturing a display device according to an embodiment.
Fig. 14 is an enlarged cross-sectional view of a display area of a display device according to a modification.
Fig. 15 is a cross-sectional view of a first example of a leak-proof structure.
Fig. 16 is a cross-sectional view of a second example of a leak-proof structure.
Fig. 17 is a cross-sectional view of a third example of a leak-proof structure.
Fig. 18 is a cross-sectional view of a fourth example of a leak-proof structure.
Fig. 19 is a cross-sectional view of a fifth example of a leak-proof structure.
Fig. 20 is a cross-sectional view of a sixth example of a leak-proof structure.
Fig. 21 is a cross-sectional view of a seventh example of a leak-proof structure.
Fig. 22 is an enlarged cross-sectional view of the trough shown in fig. 21.
Fig. 23 is a cross-sectional view of an eighth example of a leak-proof structure.
Fig. 24 is a cross-sectional view of a ninth example of the leakage preventing structure.
Fig. 25 is a plan view for describing the arrangement of the first electrode and the third electrode.
Fig. 26 a is a schematic sectional view for describing a first example of the resonator structure. Fig. 26B is a schematic sectional view for describing a second example of the resonator structure.
Fig. 27 a is a schematic sectional view for describing a third example of the resonator structure. Fig. 27B is a schematic sectional view for describing a fourth example of the resonator structure.
Fig. 28 a is a schematic cross-sectional view for describing a fifth example of the resonator structure. Fig. 28B is a schematic sectional view for describing a sixth example of the resonator structure.
Fig. 29 is a schematic cross-sectional view for describing a seventh example of the resonator structure.
Fig. 30 a is a front view of the digital camera. Fig. 30B is a rear view of the digital camera.
Fig. 31 is a perspective view of a head mounted display.
Fig. 32 is a perspective view of a television apparatus.
Fig. 33 is a perspective view of a see-through head mounted display.
Fig. 34 is a perspective view of a smart phone.
Fig. 35 a is a diagram showing an internal state of the vehicle as viewed from the rear side to the front side of the vehicle. Fig. 35B is a diagram showing an internal state of the vehicle as viewed from the inclined rear side to the inclined front side of the vehicle.
Detailed Description
Embodiments and the like of the present disclosure will be described in the following order.
1. Description of an outline of a display device according to the present disclosure
2. Resulting in the creation of a background for embodiments of the present disclosure
3. One embodiment (example of display device)
4. Modification examples
5. Examples of leak-proof structures
6. Examples of resonator Structure
7. Application example (example of electronic device)
The embodiments and the like described below are preferred specific examples of the present disclosure, and the disclosure is not limited to these embodiments and the like. Note that in the following description, components having substantially the same functional configuration will be denoted by the same reference numerals and characters, and redundant description thereof will be omitted as appropriate. Further, in order to prevent complexity of illustration, some of the components may be denoted by only reference numerals and characters, or illustration may be simplified or increased or decreased in size.
<1 Description of outline of display device according to the present disclosure >
The display device according to the present disclosure includes a plurality of light emitting elements arranged two-dimensionally, a plurality of layers stacked on the plurality of light emitting elements, and a partition wall arranged between adjacent light emitting elements in a plan view and formed on two or more layers including the plurality of layers, wherein a cross-sectional shape of the partition wall includes a forward tapered shape.
As described above, since the sectional shape of the partition wall includes a forward tapered shape, the incident angle of light incident on the side surface of the partition wall from each light emitting element increases, and the light may be totally reflected on the side surface of the partition wall. Further, since the partition wall is formed on two or more layers, the amount of light leaking from above and/or below the partition wall to the adjacent pixels can be reduced. Therefore, light leakage between adjacent pixels can be prevented. In this specification, the term "and/or" means "at least one", and for example, in the case where the term is used for the phrase "X and/or Y", the phrase means three cases of "X only", "Y only", and "X and Y".
In the display device according to the present disclosure, the refractive index of the partition wall is preferably lower than that of two or more layers included in the plurality of layers. This allows light emitted from each light emitting element to the wide-angle side to be totally reflected at an interface between the partition wall and any of the two or more layers.
In the display device according to the present disclosure, the plurality of layers may include a protective layer, a color filter, and a sealing resin layer in this order on the plurality of light emitting elements. In this case, two or more layers included in the plurality of layers preferably include a protective layer and a color filter. This allows light emitted from each light emitting element to the wide-angle side to be totally reflected at the interface between the partition wall and each protective layer and the color filter.
In the display device according to the present disclosure, the plurality of layers may include a protective layer, a first resin layer, a color filter, and a sealing resin layer in this order on the plurality of light emitting elements. In this case, two or more layers included in the plurality of layers preferably include a protective layer, a first resin layer, and a color filter. This allows light emitted from each light emitting element to the wide-angle side to be totally reflected at the interface between the partition wall and each of the protective layer, the first resin layer, and the color filter. The first resin layer may be a first planarization layer.
In the display device according to the present disclosure, the plurality of layers may include a protective layer, a first resin layer, a color filter, a second resin layer, a lens array, and a sealing resin layer in this order on the plurality of light emitting elements. In this case, two or more layers included in the plurality of layers preferably include a protective layer, a first resin layer, a color filter, and a second resin layer. This allows total reflection at the interface between the partition wall and each of the overcoat layer, the first resin layer, the color filter, and the second resin layer. The first resin layer and the second resin layer may be a first planarization layer and a second planarization layer, respectively.
In the display device according to the present disclosure, the refractive index of the partition wall is preferably the same as that of the sealing resin layer. This makes it possible to form the partition wall and the sealing resin layer using the same material, and thus prevent an increase in the types of materials required for manufacturing the display device.
In the display device according to the present disclosure, the sealing resin layer is in contact with the top of the partition wall, and the refractive index of the partition wall is preferably lower than that of the sealing resin layer. This allows light emitted from each light emitting element to be refracted and bent in the front direction at the interface between the top of the partition wall and the sealing resin layer. Therefore, the light extraction efficiency in the front direction can be improved.
In the display device according to the present disclosure, from the viewpoint of preventing light from leaking from above the partition wall to the adjacent pixels, the top of the partition wall is preferably positioned higher than the color filter with respect to each light emitting element.
In the display device according to the present disclosure, the plurality of light emitting elements may include an organic-containing layer including an organic light emitting layer, and the organic-containing layer may be continuous between adjacent light emitting elements. In this case, the bottom of the partition wall is preferably embedded in the protective layer from the viewpoint of preventing light from leaking from below the partition wall to the adjacent pixel.
In the display device according to the present disclosure, in the case where the plurality of light emitting elements include an organic layer including an organic light emitting layer, and the organic layer is continuous between adjacent light emitting elements, it is preferable that the protective layer has a surface on the light emitting element side, and the bottom of the partition wall is separated from the surface. This prevents the organic-containing layer from being exposed between the adjacent light-emitting elements without being covered with the protective layer. Therefore, deterioration of the protection function of the protection layer for the organic containing layer can be prevented.
In the display device according to the present disclosure, the height of the top of the partition wall preferably coincides with the height of the bottom surface of each lens included in the lens array. This makes it possible to prevent the layer covering the light condensing surface of the lens from being changed from the middle to the sealing resin layer from the partition wall, thereby preventing deterioration of the lens function. Further, light can be prevented from leaking from above the partition wall to the adjacent pixels.
In the display device according to the present disclosure, the bottom of the partition wall is preferably provided at a position that does not overlap with the light emitting region of each light emitting element in a plan view. Therefore, light emitted from the light emitting element to the wide-angle side can be prevented from being reflected by the bottom of the partition wall and becoming stray light.
The display device according to the present disclosure may be provided in an electronic apparatus. For example, the display device according to the present disclosure may be provided in a goggle device, such as a Virtual Reality (VR) device, a Mixed Reality (MR) device, or an Augmented Reality (AR) device, or may be provided in an Electronic Viewfinder (EVF), a small projector, or the like.
In the present disclosure, the forward taper shape refers to a shape in which the width of the partition wall narrows from the lowermost layer (layer on the light emitting element side) toward the uppermost layer (layer on the side opposite to the light emitting element side) among the plurality of layers stacked on the plurality of light emitting elements.
In the present disclosure, the sectional shape of the partition wall only needs to include a forward tapered shape, and the sectional shape of a portion of the partition wall in the thickness direction of the display device may be a forward tapered shape, or the sectional shape of the entire partition wall may be a forward tapered shape.
In the present disclosure, the forward taper includes a linear taper in which the width of the partition wall is linearly changed with respect to the height of the partition wall and the inclination angle of the side face of the partition wall is constant, and a nonlinear taper in which the width of the partition wall is non-linearly changed with respect to the height of the partition wall and the inclination angle of the side face of the partition wall is changed. The nonlinear taper is, for example, an exponential taper or a parabolic taper.
In the present disclosure, such as the expression "on the plurality of light emitting elements, the plurality of layers sequentially include the overcoat layer, the color filter, and the sealing resin layer", the "plurality of layers sequentially include the overcoat layer, the first resin layer, the color filter, and the sealing resin layer on the plurality of light emitting elements", and the "plurality of layers sequentially include the overcoat layer, the first resin layer, the color filter, the second resin layer, the lens array, and the sealing resin layer on the plurality of light emitting elements", each indicate a relative positional relationship of the layers. The expression includes not only a state in which each layer is in direct contact with another layer without any layer interposed therebetween, but also a state in which each layer is not in direct contact with another layer but another layer interposed therebetween.
In the present disclosure, the expression "on the object a" such as "providing the object B on the object a" indicates a relative positional relationship between the object a and the object B. The term "on the object a" includes not only a state in which the object B is directly located on the object a without interposing other objects therebetween, but also a state in which the object B is located on the object a with interposing at least one other object therebetween.
In the present disclosure, refractive indexes of various members such as a partition wall, a filling resin layer, and a lens each refer to a refractive index with respect to light having a wavelength of 589.3nm (D line of sodium).
<2 Resulting in creation of background of embodiments of the present disclosure >
Organic Light Emitting Diode (OLED) display devices are also deployed into AR headsets, VR headsets, and the like, and require higher definition and higher brightness.
(Technique for increasing definition of display device)
As shown in fig. 1, the conventional OLED display device 601 includes a driving substrate 611, a plurality of light emitting elements 612, an insulating layer 613, a protective layer 614, a filling resin layer 615, a color filter 616F, and a glass substrate 617. Each light emitting element 612 includes a first electrode 621, an OLED layer 622, and a second electrode 623. The color filter 616F includes a red color layer 616R, a green color layer 616G, and a blue color layer 616B.
The subpixel 610R includes a light emitting element 612 and a colored layer 616R disposed over the light emitting element 612. The subpixel 610G includes a light emitting element 612 and a colored layer 616G disposed over the light emitting element 612. The subpixel 610B includes a light emitting element 612 and a colored layer 616B disposed over the light emitting element 612. In the following description, the sub-pixels 610R, 610G, and 610B may be referred to as sub-pixels 610 in the case where they are not particularly distinguished, and are collectively referred to as sub-pixels 610. Further, without particular distinction, in the case where the color layer 616R, the color layer 616G, and the color layer 616B are collectively referred to as "color layer 616", the color layer 616R, the color layer 616G, and the color layer 616B may be simply referred to as "color layer 616".
In the above-described display device 601, since the glass substrate 617 on which the color filter 616F is formed is adhered to the driving substrate 611 through the filling resin layer 615, the distance D between the OLED layer 622 and the color filter 616F is long. For this reason, in the case where the resolution of this type of display device 601 increases and the pitch of the sub-pixels 610 becomes narrow, there is a problem in that light L emitted from the OLED layer 122 of a predetermined sub-pixel (self-pixel) 610 may leak to an adjacent sub-pixel 610.
Accordingly, in view of the above-described problems, as shown in fig. 2, a display device 602 provided with a color filter 616F on the driving substrate 611 side has been proposed. In the display device 602, since the distance D between the OLED layer 122 and the color filter 16 may be close to each other, light leakage to the adjacent sub-pixels 610 may be prevented. This makes it possible to prevent color mixing and improve viewing angle characteristics. Note that, in fig. 1 and 2, θ represents a viewing angle.
(Technique for increasing brightness of display device)
An increase in luminance of the display device is an important requirement because it also contributes to an increase in lifetime and low power consumption of the display device. Accordingly, as shown in fig. 3, a display device 603 is proposed in which a color filter 616F is provided on the drive substrate 611 side and a lens 618 is provided for each sub-pixel 610. In the display device 603, the light L emitted from the OLED layer 122 of each sub-pixel 610 is condensed by the lens 618, and extraction efficiency of the light L in the front direction can be enhanced to achieve higher luminance.
(Problem of display device 603)
However, even in the case where the color filter 616F is provided on the driving substrate 611 side, as shown in fig. 4, there is no small amount of light L1 leaked from the predetermined subpixel (self pixel) 610 to the adjacent subpixel 610. Such light L1 can be extracted not only in the front direction but also may cause color mixing.
Further, in fig. 3, the gap GP is not depicted between adjacent lenses 618, but when the lenses 618 are actually formed, the gap GP is generally formed between adjacent lenses 618, as shown in fig. 4. Since the light L2 incident on each gap GP is not condensed in the front direction, it is difficult to sufficiently improve the extraction efficiency of the light L in the front direction in the display device 603 forming the gap GP.
As described above, even in the display device 603, a small amount of light L1 and light L2 does not exist, they do not enter the colored layer 616 and the lens 618 of the own pixel (sub-pixel), and there is room for improvement in light leakage and light condensing characteristics between sub-pixels.
Accordingly, the present inventors have conducted extensive studies for improving light leakage and light condensing characteristics between sub-pixels. As a result, the display device 101 according to one embodiment described below was found.
<3 One embodiment >
[ Schematic configuration of display device 101 ]
Fig. 5 is a plan view of a display device 101 according to one embodiment. The display device 101 includes a display region RE1 and a peripheral region RE2 disposed around the display region RE 1.
In this specification, a first direction and a second direction orthogonal to each other on the display surface of the display device 101 are referred to as an X-axis direction and a Y-axis direction, respectively, and a third direction perpendicular to the display surface of the display device 101 is referred to as a Z-axis direction. In one embodiment, an example will be described in which the X-axis direction is the horizontal direction of the display surface and the Y-axis direction is the vertical direction of the display surface.
In one embodiment, an example will be described in which the display device 101 is a top emission type display device, but the type of the display device 101 is not limited to this example. The display device 101 may be a micro display. From the viewpoint of high definition of the display device 101, the pixel pitch of each sub-pixel 10 is preferably 10 μm or less.
Fig. 6 is an enlarged sectional view of the display region RE1 of the display device 101. The plurality of sub-pixels 10R, 10G, and 10B are two-dimensionally arranged in a prescribed arrangement pattern in the display area RE 1. The predetermined arrangement pattern may be a stripe arrangement, a mosaic arrangement, a square arrangement, a triangular arrangement, or an arrangement other than these. A pad portion 113, a video display driver (not shown), and the like are disposed in the peripheral region RE 2. A Flexible Printed Circuit (FPC) (not shown) may be connected to the pad portion 113.
The sub-pixel 10R may emit red light (first light). The sub-pixel 10G can emit green light (second light). The subpixel 10B may emit blue light (third light). In the following description, in the case where the sub-pixels 10R, 10G, and 10B are not particularly distinguished and they are collectively referred to as a sub-pixel 10, the sub-pixels 10R, 10G, and 10B may be simply referred to as sub-pixels 10. The pixel includes, for example, a plurality of adjacent sub-pixels 10R, 10G, and 10B. However, the configuration of one pixel is not limited to this example, and for example, one pixel may include a plurality of adjacent sub-pixels 10R, 10G, 10B, and 10B.
Layer configuration of display device 101
As shown in fig. 6, the display device 101 includes a driving substrate 11, a plurality of light emitting elements 12, an insulating layer 13, a protective layer 14, a planarizing layer 15, a color filter 16, a planarizing layer 17, a lens array 18, a partition wall 19, and a sealing resin layer 20. The protective layer 14, the planarizing layer 15, the color filter 16, the planarizing layer 17, the lens array 18, and the sealing resin layer 20 are examples of a plurality of layers stacked on the plurality of light emitting elements 12.
In this specification, one of two surfaces of each layer constituting the display device 101 on the display surface side (upper side) of the display device 101 may be referred to as a first surface (upper surface), and a surface on the opposite side (bottom side) of the display device 101 may be referred to as a second surface (bottom surface). In this specification, the peripheral edge portion of the first surface means a region having a predetermined width from the peripheral edge of the first surface toward the inside. In this specification, the top view refers to a top view when the object is viewed from a direction perpendicular to the first surface or the second surface.
(Drive substrate 11)
The driving substrate 11 is a so-called back plate and can drive a plurality of light emitting elements 12. For example, the driving substrate 11 includes a substrate 111 and an insulating layer 112 in this order.
A plurality of driving circuits (not shown) and the like are provided on the first surface side of the substrate 111. The substrate 111 may be, for example, a semiconductor substrate in which a transistor or the like can be easily formed, or may be a glass substrate or a resin substrate having low moisture permeability and oxygen permeability. The semiconductor substrate includes, for example, amorphous silicon, polycrystalline silicon, single crystal silicon, and the like. The glass substrate includes, for example, high strain point glass, soda glass, borosilicate glass, forsterite, lead glass, quartz glass, and the like. For example, the resin substrate includes at least one selected from the group consisting of polymethyl methacrylate, polyvinyl alcohol, polyvinyl phenol, polyether sulfone, polyimide, polycarbonate, polyethylene terephthalate, polyethylene naphthalate, and the like.
The insulating layer 112 is provided on the first surface of the substrate 111 and covers a plurality of driving circuits and the like. The insulating layer 112 includes a plurality of contact plugs 112b and 112g and a plurality of conductive lines 112a therein. The plurality of contact plugs 112b and 112g and the wiring 112a electrically connect the light emitting element 12 and the driving circuit. The contact plugs 112b and 112g include, for example, at least one metal selected from the group consisting of copper (Cu), titanium (Ti), and the like.
The insulating layer 112 is, for example, an organic insulating layer, an inorganic insulating layer, or a multilayer body thereof. The organic insulating layer includes, for example, at least one selected from the group consisting of polyimide resin, acrylic resin, novolac resin, and the like. For example, the inorganic insulating layer contains at least one selected from the group consisting of silicon oxide (SiO x), silicon nitride (SiN x), silicon oxynitride (SiO xNy), and the like.
(Light-emitting element 12)
The light emitting element 12 may emit white light under the control of a driving circuit or the like. In one embodiment, each light emitting element 12 is an organic light emitting diode element (OLED element). The light emitting element 12 is included in each of the sub-pixels 10R, 10G, and 10B of the respective colors.
The plurality of light emitting elements 12 are two-dimensionally arranged on the first surface of the driving substrate 11 in a predetermined arrangement pattern. The prescribed arrangement pattern is as described for the prescribed arrangement pattern of the plurality of sub-pixels 10. The light emitting elements 12 each include a first electrode 121, an OLED layer 122, and a second electrode 123 in this order on the first surface of the driving substrate 11.
(First electrode 121)
Each of the first electrodes 121 is disposed on the second surface side of the OLED layer 122. The first electrode 121 is an individual electrode provided individually in each of the plurality of light emitting elements 12. That is, the first electrode 121 is divided between the light emitting elements 12 adjacent in the in-plane direction of the first surface of the drive substrate 11. The first electrode 121 is an anode. When a voltage is applied between the first electrode 121 and the second electrode 123, holes are injected from the first electrode 121 into the OLED layer 122.
The first electrode 121 may be configured using, for example, a metal layer, or may be configured using a metal layer and a transparent conductive oxide layer. In the case where the first electrode 121 includes a metal layer and a transparent conductive oxide layer, the transparent conductive oxide layer is preferably disposed on the OLED layer 122 side from the standpoint of disposing a layer having a high work function adjacent to the OLED layer 122.
The metal layer may act as a reflective layer that reflects light L emitted from the OLED layer 122. For example, the metal layer includes at least one metal element selected from the group consisting of chromium (Cr), gold (Au), platinum (Pt), nickel (Ni), copper (Cu), molybdenum (Mo), titanium (Ti), tantalum (Ta), aluminum (Al), magnesium (Mg), iron (Fe), tungsten (W), and silver (Ag). The metal layer may contain at least one of the above-mentioned metal elements as a constituent element of the alloy. Specific examples of the alloy include aluminum alloy and silver alloy. Specific examples of the aluminum alloy include AlNd and AlCu.
A base layer (not shown) may be provided adjacent to the second surface side of the metal layer. The base layer can improve the crystalline orientation of the metal layer when the metal layer is formed. The base layer includes, for example, at least one metal element selected from the group consisting of titanium (Ti) and tantalum (Ta). The base layer may contain at least one of the above-described metal elements as a constituent element of the alloy.
The transparent conductive oxide layer includes a transparent conductive oxide. For example, the transparent conductive oxide contains at least one selected from the group consisting of an indium-containing transparent conductive oxide (hereinafter, referred to as an "indium-based transparent conductive oxide"), a tin-containing transparent conductive oxide (hereinafter, referred to as a "tin-based transparent conductive oxide"), and a zinc-containing transparent conductive oxide (hereinafter, referred to as a "zinc-based transparent conductive oxide").
The indium-based transparent conductive oxide includes, for example, indium Tin Oxide (ITO), indium Zinc Oxide (IZO), indium Gallium Oxide (IGO), indium Gallium Zinc Oxide (IGZO), or fluorine-doped indium oxide (IFO). Of these transparent conductive oxides, indium Tin Oxide (ITO) is particularly preferable. Indium Tin Oxide (ITO) has a particularly low barrier to hole injection into the OLED layer 122 in function, so that the driving voltage of the display device 101 can be particularly reduced. Tin-based transparent conductive oxides include, for example, tin oxide, antimony doped tin oxide (ATO), or fluorine doped tin oxide (FTO). The zinc-based transparent conductive oxide includes, for example, zinc oxide, aluminum doped zinc oxide (AZO), boron doped zinc oxide, or gallium doped zinc oxide (GZO).
(OLED layer 122)
The OLED layer 122 may emit white light. The OLED layer 122 is an example of an organic-containing layer including an organic light emitting layer. The OLED layer 122 is disposed between the plurality of first electrodes 121 and one second electrode 123. The OLED layer 122 is continuous between the light emitting elements 12 adjacent in the in-plane direction of the first surface of the driving substrate 11, and is a layer common to the plurality of light emitting elements 12.
The OLED layer 122 may include a multilayer body including an organic light emitting layer, and in this case, a portion (e.g., an electron injection layer) of the multilayer body may be an inorganic layer. The OLED layer 122 may be an OLED layer having a single layer of light emitting units U as shown in a of fig. 7, an OLED layer (stacked structure) having two layers of light emitting units U1 and U2 as shown in B of fig. 7, or an OLED layer having a structure different from those. The OLED layer 122 including the single-layer light emitting unit U has a configuration in which, for example, a hole injection layer 1221, a hole transport layer 1222, a red light emitting layer 1220R, a light emitting separation layer 1223, a blue light emitting layer 1220B, a green light emitting layer 1220G, an electron transport layer 1224, and an electron injection layer 1225 are stacked in this order from the first electrode 121 toward the second electrode 123. The OLED layer including the two light emitting units U1 and U2 has a configuration in which, for example, a hole injection layer 1221, a hole transport layer 1222, a blue light emitting layer 1220B, an electron transport layer 1226, a charge generation layer 1227, a hole transport layer 1228, a yellow light emitting layer 1220Y, an electron transport layer 1224, and an electron injection layer 1225 are stacked in order from the first electrode 121 toward the second electrode 123.
The hole injection layer 1221 can improve efficiency of injecting holes into the light emitting layers 1220R, 1220G, 1220B and prevent leakage. The hole transport layers 1222, 1228 may improve hole transport efficiency to the light emitting layers 1220R, 1220B, 1220Y. The electron injection layer 1225 may improve the efficiency of electron injection into the light emitting layers 1220G, 1220Y. The electron transport layers 1224, 1226 may enhance the efficiency of electron transport to the light emitting layers 1220G, 1220B, 1220Y. The light-emitting separation layer 1223 is a layer for adjusting carrier injection into the light-emitting layers 1220R, 1220G, 1220B, and light-emission balance of each color is adjusted by injecting electrons or holes into the light-emitting layers 1220R, 1220G, 1220B through the light-emitting separation layer 1223. The charge generation layer 1227 may supply electrons and holes to the blue light emitting layer 1220B and the yellow light emitting layer 1220Y, and the blue light emitting layer 1220B and the yellow light emitting layer 1220Y are provided to sandwich the charge generation layer 1227.
In response to application of an electric field to each of the red light emitting layer 1220R, the green light emitting layer 1220G, the blue light emitting layer 1220B, and the yellow light emitting layer 1220Y, holes injected from the first electrode 121 or the charge generating layer 1227 and electrons injected from the second electrode 123 or the charge generating layer 1227 are recombined, and red light, green light, blue light, and yellow light can be emitted.
(Second electrode 123)
The second electrode 123 is disposed on the first surface side of the OLED layer 122. The second electrode 123 is continuous between the light emitting elements 12 adjacent in the in-plane direction of the first surface of the drive substrate 11, and is an electrode common to a plurality of light emitting elements 12.
The second electrode 123 is a cathode. When a voltage is applied between the first electrode 121 and the second electrode 123, electrons are injected from the second electrode 123 into the OLED layer 122. The second electrode 123 has translucency for white light emitted from the OLED layer 122. The second electrode 123 is preferably a transparent electrode having transparency to visible light. In the present specification, visible light means light in a wavelength range of 360nm to 780 nm.
In order to improve light emitting efficiency, the second electrode 123 preferably includes a material having as high translucency and a low work function as possible. The second electrode 123 is configured using, for example, at least one of a metal layer or a transparent conductive oxide layer. More specifically, the second electrode 123 includes a single-layer film of a metal layer or a transparent conductive oxide layer, or a multi-layer film of a metal layer and a transparent conductive oxide layer. In the case where the second electrode 123 includes a multilayer film, a metal layer may be provided on the OLED layer 122 side, or a transparent conductive oxide layer may be provided on the OLED layer 122 side, but from the standpoint of providing a layer having a low work function adjacent to the OLED layer 122, the metal layer is preferably provided on the OLED layer 122 side.
For example, the metal layer includes at least one metal element selected from the group consisting of magnesium (Mg), aluminum (Al), silver (Ag), calcium (Ca), and sodium (Na). The metal layer may contain at least one of the above-mentioned metal elements as a constituent element of the alloy. Specific examples of the alloy include MgAg alloy, mgAl alloy, alLi alloy, and the like. The transparent conductive oxide layer includes a transparent conductive oxide. As the transparent conductive oxide, a material similar to the transparent conductive oxide of the first electrode 121 described above can be exemplified.
(Insulating layer 13)
The insulating layer 13 is provided on the first surface of the driving substrate 11 in a portion between the divided first electrodes 121. The insulating layer 13 is an insulating layer for isolating elements, and can insulate between the first electrodes 121 adjacent in the in-plane direction of the first surface of the drive substrate 11. The insulating layer 13 has a plurality of openings 13a. Each of the plurality of openings 13a is provided for a corresponding one of the light emitting elements 12. Each of the plurality of openings 13a may be disposed on a first surface (a surface on the OLED layer 122 side) of a corresponding one of the first electrodes 121. That is, the peripheral edge portion of the first surface of each first electrode 121 may be covered with the insulating layer 13. The first electrode 121 and the OLED layer 122 are in contact with each other through the opening 13a. The shape of each opening 120 in plan view is not particularly limited, and may be, for example, substantially rectangular, substantially circular, or substantially elliptical.
The insulating layer 13 is, for example, an organic insulating layer, an inorganic insulating layer, or a multilayer body thereof. The organic insulating layer includes, for example, at least one selected from the group consisting of polyimide resin, acrylic resin, novolac resin, and the like. For example, the inorganic insulating layer contains at least one selected from the group consisting of silicon oxide (SiO x), silicon nitride (SiN x), silicon oxynitride (SiO xNy), and the like.
(Protective layer 14)
The protective layer 14 is disposed on the first surface of the second electrode 123 and covers the plurality of light emitting elements 12. The protective layer 14 has translucency with respect to white light emitted from the light emitting element 12. The protective layer 14 may protect the plurality of light emitting elements 12 and the like. For example, the protective layer 14 may prevent moisture from entering the plurality of light emitting elements 12 or the like from the external environment. In addition, in the case where the second electrode 123 is configured using a metal layer, the protective layer 14 may have a function of preventing oxidation of the metal layer.
The protective layer 14 contains, for example, at least one of an inorganic material and an organic material having low hygroscopicity. The protective layer 14 may have a single-layer structure or a multi-layer structure. In the case where the thickness of the protective layer 14 increases, a multilayer structure is preferable. This is to alleviate the internal stress of the protective layer 14. For example, the inorganic material contains at least one selected from the group consisting of silicon oxide (SiO x), silicon nitride (SiN x), silicon oxynitride (SiO xNy), titanium oxide (TiO x), aluminum oxide (AlO x), and the like. For example, the organic material includes a cured product of at least one resin selected from the group consisting of a thermosetting resin composition and a photosensitive resin composition, and the like. The photosensitive resin composition includes, for example, an ultraviolet curable resin composition. Specifically, the organic material includes, for example, at least one selected from the group consisting of acrylic resin, polyimide resin, novolac resin, epoxy resin, norbornene resin, parylene resin, and the like.
Protective layer 14 preferably comprises a deposition layer on which an atomic layer is deposited. The deposited layer may be an Atomic Layer Deposition (ALD) layer. The protective layer 14 including the deposited layer makes it possible to improve the effect of the protective layer 14 to prevent entry of moisture. The protective layer 14 includes, for example, a metal oxide or a metal nitride. The metal oxide includes, for example, aluminum oxide (AlO x) or titanium oxide (TiO x). The metal nitride includes, for example, titanium nitride (TiN x).
(Flat layer 15)
A planarization layer 15 is disposed on the first surface of the protective layer 14. The planarizing layer 15 is an example of a first resin layer. The planarization layer 15 may fill irregularities of the first surface of the protective layer 14, and form a planar first surface over the protective layer 14. The planarization layer 15 has translucency for white light emitted from the light-emitting element 12. The planarization layer 15 contains at least one of an organic material and an inorganic material, for example.
The organic material includes, for example, a cured product of the photosensitive resin composition. The photosensitive resin composition may comprise a positive type photosensitive resin composition or a negative type photosensitive resin composition. Specifically, the photosensitive resin composition contains, for example, at least one selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole precursor, acrylic resin, phenolic resin, siloxane-based resin, and the like. As the inorganic material, a material similar to the inorganic material of the protective layer 14 can be exemplified.
(Color Filter 16)
The color filter 16 is a so-called on-chip color filter (OCCF). A color filter 16 is disposed over the plurality of light emitting elements 12. More specifically, the color filter 16 is disposed on the first surface of the planarization layer 15. The color filter 16 includes, for example, a plurality of colored layers 160R, a plurality of colored layers 160G, and a plurality of colored layers 160B. Note that in the following description, in the case where the colored layer 160R, the colored layer 160G, and the colored layer 160B are collectively referred to as the colored layer 160R, the colored layer 160G, and the colored layer 160B without particularly distinguishing the colored layer 160R, the colored layer 160G, and the colored layer 160B, they may be simply referred to as the colored layer 160.
The plurality of colored layers 160 are two-dimensionally arranged on the first surface of the planarization layer 15 in a prescribed arrangement pattern. The prescribed arrangement pattern is as described for the prescribed arrangement pattern of the plurality of sub-pixels 10. Each colored layer 160 is disposed over a light emitting element 12. Each sub-pixel 10R includes a light emitting element 12 and a colored layer 160R disposed over the light emitting element 12. Each sub-pixel 10G includes a light emitting element 12 and a colored layer 160G disposed over the light emitting element 12. Each sub-pixel 10B includes a light emitting element 12 and a colored layer 160B disposed over the light emitting element 12.
Each colored layer 160R has a red color. The colored layer 160R may absorb visible light components other than red light while transmitting red light components in white light emitted from the light emitting element 12. Each colored layer 160G has green color. The colored layer 160G may absorb visible light components other than green light while transmitting green light components in white light emitted from the light emitting element 12. Each colored layer 160B has a blue color. The colored layer 160B may absorb a visible light component other than blue light while transmitting a blue light component in white light emitted from the light emitting element 12.
Each colored layer 160R includes, for example, a red resist. Each colored layer 160G includes, for example, green resist. Each colored layer 160B includes, for example, a blue resist.
(Flat layer 17)
The planarization layer 15 is disposed on the first surface of the color filter 16. The planarizing layer 15 is an example of a second resin layer. The planarization layer 17 may fill irregularities of the first surface of the color filter 16 and form a flat first surface over the upper side of the color filter 16. The planarization layer 17 has translucency to red light, green light, and blue light emitted from the color filter 16. As a material of the planarizing layer 17, a material similar to that of the planarizing layer 15 can be exemplified.
(Lens array 18)
A lens array 18 is disposed on the first surface of the planarization layer 17. The lens array 18 includes a plurality of lenses 181. Each lens 181 may collect light L emitted upward from the light emitting element 12 and incident on the lens 181 through the colored layer 160 in the front direction. Further, the lens 181 may condense the light L emitted from the light emitting element 12 in an oblique direction in the front direction, reflected by the side surface of the partition wall 19, and then incident on the lens 181. The lens 181 is a convex lens having a convex condensing surface on a side opposite to the light emitting element 12 side. The lens 181 is a so-called on-chip microlens (OCL). The plurality of lenses 181 are two-dimensionally arranged on the first surface of the planarization layer 17 in a prescribed arrangement pattern. The prescribed arrangement pattern is as described for the prescribed arrangement pattern of the plurality of sub-pixels 10. The center of each lens 181 substantially coincides with the center of the light emitting region of the light emitting element 12 in plan view. Providing a gap between adjacent lenses 181. In one embodiment, an example in which a gap is provided between adjacent lenses 181 will be described, but it is not necessary to provide a gap between adjacent lenses 181.
The condensing surface of each lens 181 preferably has a convex curved shape. Examples of convex curved shapes include, but are not limited to, for example, generally parabolic shapes and generally hemispherical shapes. Here, the substantially parabolic shape or the substantially hemispherical shape is not limited to the parabolic shape or the hemispherical shape in a strict sense, and includes such a shape visually recognized as a shape approaching the parabolic shape or the hemispherical shape. Including, for example, a parabolic or hemispherical shape that twists or deforms within a range of tolerances, errors, etc.
The refractive index n 1 of each lens 181 is higher than the refractive index n 2 of the sealing resin layer 20. Since the refractive index n 1 of the lens 181 is higher than the refractive index n 2 of the sealing resin layer 20, the light L may be refracted and condensed at the interface between the lens 181 and the sealing resin layer 20. Therefore, the light extraction function can be improved.
Each lens 181 includes, for example, an organic material or an inorganic material that is transparent to visible light. The organic material includes, for example, a cured product of a photosensitive resin composition such as an ultraviolet-curable resin composition. For example, the inorganic material includes at least one selected from the group consisting of silicon nitride (SiN x), silicon oxynitride (SiO xNy), and the like. The lens 181 may include a filler. The refractive index n 1 of the lens 181 can be adjusted by adjusting the content of the filler contained in the lens 181. The filler may be a hollow filler. The filler may be an inorganic filler. The inorganic filler contains, for example, at least one selected from the group consisting of alumina (AlO x), titania (TiO x), zirconia (ZrO x), and the like.
(Partition wall 19)
Each of the partition walls 19 is configured to be capable of reflecting light emitted from the light emitting element 12 on a side surface. The partition wall 19 is substantially parallel to an axis (Z axis) extending in the thickness direction of the display device 101. The cross-sectional shape of the partition wall 19 is a forward taper. In the case where the sectional shape of the partition wall 19 is a forward taper, the incident angle of the light L incident on each side surface of the partition wall 19 from the light emitting element 12 increases, and the light L may be totally reflected on the side surface of the partition wall 19. Therefore, the light L incident from the light emitting element 12 on the side surface of the partition wall 19 is less likely to leak to the adjacent sub-pixel 10, and color mixing can be prevented. Further, since the amount of light entering each lens 181 can be increased, the extraction efficiency of the light L in the front direction can be improved.
In a top view, each partition wall 19 is arranged between adjacent light emitting elements 12. More specifically, for example, the partition wall 19 is provided at least one of a position between the light emitting elements 12 adjacent in the X-axis direction and a position between the light emitting elements 12 adjacent in the Y-axis direction in a plan view. The partition wall 19 may be provided to surround each light emitting element 12.
Each of the partition walls 19 is preferably formed over the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17. Since the partition walls 19 are formed on the plurality of layers in this way, the amount of light reflected on the side surfaces of the partition walls 19 can be increased.
The bottom of the partition wall 19 is preferably embedded in the protective layer 14 of the lowermost layer of the multilayer film on the plurality of light emitting elements 12. Therefore, the bottom of the partition wall 19 can be disposed near the light-emitting element 12, and the light L emitted from the light-emitting element 12 to the wide-angle side is less likely to leak from the sub-pixel 10 adjacent to the lower side of the partition wall 19.
The bottom of the partition wall 19 is preferably separated from the second surface (surface on the light emitting element 12 side) of the protective layer 14. This makes it possible to prevent the OLED layer 122 from being exposed without being covered by the protective layer 14 between adjacent light emitting elements 12. Accordingly, deterioration of the protection function of the protection layer 14 for the OLED layer 122 can be prevented. From the viewpoint of preventing deterioration of the protective function of the protective layer 14 to the OLED layer 122, the distance from the second surface of the protective layer 14 to the bottom of the partition wall 19 (the thickness of the protective layer 14 at the bottom of the partition wall 19) is preferably 0.5 μm or more.
The bottom of the partition wall 19 is preferably provided at a position not overlapping the light emitting region of the light emitting element 12 in a plan view. This makes it possible to prevent the light L emitted from each light emitting element 12 to the wide-angle side from being reflected by the bottom portion of the partition wall 19 and becoming stray light.
The top of each partition wall 19 is preferably positioned higher than the color filters 16 with respect to the light emitting elements 12, and more preferably coincides in height with the bottom surface of the lenses 181 included in the lens array 18.
Since the top of the partition wall 19 is located higher than the color filter 16 with respect to the light emitting elements 12, the light L emitted from each light emitting element 12 to the wide-angle side is less likely to leak from the sub-pixel 10 adjacent to the upper side of the partition wall 19, and color mixing can be prevented. Further, since the amount of light entering each lens 181 can be increased, the extraction efficiency of the light L in the front direction can be improved.
Since the top of the partition wall 19 coincides with the height of the lower surface of the lens 181, the light L emitted from each light emitting element 12 to the wide-angle side is less likely to leak from the sub-pixel 10 adjacent to the upper side of the partition wall 19, and the following effects can be obtained. That is, the layer covering the light condensing surface of the lens 181 can be prevented from being changed from the partition wall 19 to the sealing resin layer 20 from the middle, and deterioration of the function of the lens 181 can be prevented.
The top of each partition wall 19 may be positioned between adjacent lenses 181 in a top view. In this case, the top of the partition wall 19 is preferably in contact with the sealing resin layer 20. Thus, the top of the partition wall 19 is positioned higher than the light emitting elements 12, and the light L emitted from each light emitting element 12 to the wide-angle side is less likely to leak from the sub-pixel 10 adjacent to the upper side of the partition wall 19, and color mixing can be prevented.
The refractive index n 3 of each partition wall 19 is preferably lower than the refractive index of any of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17 that are in contact with the side surfaces of the partition wall 19. In this case, the light emitted from each light emitting element 12 may be totally reflected at the interface between the partition wall 19 and each of the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17.
The refractive index n 3 of the partition wall 19 is preferably the same as the refractive index n 2 of the sealing resin layer 20. In the case where the refractive index n 3 of the partition wall 19 is the same as the refractive index n 2 of the sealing resin layer 20, the partition wall 19 and the sealing resin layer 20 may be formed of the same material, so that an increase in the types of materials required for manufacturing the display device 101 may be prevented.
In order to prevent the reduction in luminance due to light absorption by each of the partition walls 19, the partition walls 19 preferably have translucency for white light emitted from the light emitting element 12. However, the optical characteristics of the partition wall 19 are not limited thereto, and may have non-translucency with respect to white light emitted from the light emitting element 12.
The partition wall 19 is made of an organic material or an inorganic material. The organic material includes, for example, a cured product of a photosensitive resin composition such as an ultraviolet-curable resin composition. For example, the inorganic material includes at least one selected from the group consisting of silicon nitride (SiN x), silicon oxynitride (SiO xNy), and the like. The partition wall 19 may include a filler. Adjusting the content of the filler contained in the partition wall 19 can adjust the refractive index n 3 of the partition wall 19. The filler may be a hollow filler. The filler may be an inorganic filler. The inorganic filler contains, for example, at least one selected from the group consisting of alumina (AlO x), titania (TiO x), zirconia (ZrO x), and the like.
(Sealing resin layer 20)
The sealing resin layer 20 covers the lens array 18. The sealing resin layer 20 may protect components such as the plurality of light emitting elements 12 from moisture, impact, and the like. The sealing resin layer 20 contains a cured product of the sealing resin composition. For example, the sealing resin composition contains at least one selected from the group consisting of a thermosetting resin composition, a photosensitive resin composition, and the like. The photosensitive resin composition includes, for example, an ultraviolet curable resin composition. The sealing resin layer 20 may include a hard coat layer. In this case, characteristics of the display device 101 such as scratch resistance and weather resistance can be improved.
[ Method for manufacturing display device 101 ]
(First example of method for manufacturing display device 101)
Hereinafter, a first example of a method for manufacturing the display device 101 according to one embodiment will be described with reference to fig. 8 to 10.
(Step of Forming the planarization layer 15)
First, a photosensitive resin composition is applied to the first surface of the color filter 16 by, for example, spin coating, and the resin composition is cured. As shown in step (S1) of fig. 8, this forms a planarization layer 17 on the first surface of the color filter 16.
(Step of forming partition wall 19)
Next, as shown in step (S2) of fig. 8, a silicon nitride (SiN x) layer 31a is formed on the first surface of the planarization layer 17 by, for example, a Chemical Vapor Deposition (CVD) method.
Next, as shown in step (S3) of fig. 8, an opening 31b is formed in a portion of the silicon nitride layer 31a located above a portion between adjacent light emitting elements 12 by, for example, a dry etching process. This forms the hard mask 31.
Next, as shown in step (S4) of fig. 9, the planarization layer 17, the color filter 16, and the planarization layer 15 are sequentially processed through the hard mask 31 to form grooves 19a over portions between adjacent light emitting elements 12. As a method for processing the planarizing layer 17, the color filter 16, and the planarizing layer 15, for example, a dry etching process is used. The cross-sectional shape of the groove 19a is a forward taper. Here, the forward taper shape refers to a shape in which the width of the groove 19a decreases from the second surface of the planarizing layer 15 (the surface on the light emitting element 12 side) toward the first surface of the planarizing layer 17 (the surface on the opposite side of the light emitting element 12).
Next, as shown in step (S5) of fig. 9, the bottom of each trench 19a is excavated downward by, for example, etching back to position the bottom of the trench 19a in the protective layer 14, and the hard mask 31 is removed. At this time, the processing of the groove 19a is preferably stopped before the second surface (the surface on the light emitting element 12 side) of the protective layer 14. This makes it possible to prevent deterioration of the protection function of the protection layer 14 for the OLED layer 122.
Next, a photosensitive resin composition is coated on the first surface of the planarizing layer 17, the groove 19a is filled with the photosensitive resin composition, and then the photosensitive resin composition is cured by light irradiation. As shown in step (S6) of fig. 9, a low refractive index resin layer 19b filling the groove 19a is formed. The refractive index of the low refractive index resin layer 19b is preferably lower than the refractive index of any one of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17 constituting the side surface of each groove 19 a. Next, as shown in step (S7) of fig. 10, the entire first surface of the low refractive index resin layer 19b is treated, for example, by etching back, to expose the first surface of the planarization layer 17.
(Step of Forming lens array 18)
Next, a photosensitive resin composition as a lens material is coated on the first surface of the planarization layer 17 and cured by light irradiation to form a photosensitive resin layer as a lens material layer. Next, the photosensitive resin layer is patterned by, for example, a photolithography technique to form a plurality of pillars on the first surface of the planarizing layer 17. Next, the plurality of columnar bodies are processed into a convex curved surface shape by, for example, reflow processing (heat processing) or etchback. As shown in step (S8) of fig. 10, this forms a plurality of lenses 181 on the first surface of the planarization layer 17.
(Step of Forming sealing resin layer 20)
Next, as shown in step (S9) of fig. 10, a sealing resin composition is applied to cover the plurality of lenses 181, and then cured to form a sealing resin layer 20. Through the above steps, the display device 101 according to one embodiment is obtained.
(Second example of method for manufacturing display device 101)
Hereinafter, a second example of a method for manufacturing the display device 101 according to one embodiment will be described with reference to fig. 11 to 13.
(Step of Forming protective layer 14)
First, as shown in step (S1) of fig. 11, the protective layer 14 is formed on the first surface of the second electrode 123 by, for example, a CVD method.
(Step of forming partition wall 19)
Next, after forming a resist layer on the first surface of the protective layer 14, the resist layer is pattern-exposed and then developed. As shown in step (S2) of fig. 11, this forms a resist pattern 32 having openings 32a on portions between adjacent light emitting elements 12 on the first surface of the protective layer 14.
Next, the protective layer 14 is processed through the resist pattern 32 to form grooves 14a over portions between adjacent light emitting elements 12, as shown in step (S3) of fig. 11. As a method for processing the protective layer 14, for example, a dry etching process is used. The cross-sectional shape of the groove 19a is a forward taper. Here, the forward taper shape refers to a shape in which the width of the groove 19a decreases from the first surface (the surface on the light emitting element 12 side) toward the second surface (the surface on the opposite side of the light emitting element 12) of the protective layer 14. Next, the resist pattern 32 is removed from the first surface of the protective layer 14.
Next, as shown in step (S4) of fig. 11, a photosensitive resin composition is applied to the first surface of the protective layer 14, the groove 14a is filled with the photosensitive resin composition, and then the photosensitive resin composition is cured by light irradiation to form the low refractive index resin layer 19c. The low refractive index resin layer 19c preferably has a refractive index lower than that of the protective layer 14 constituting the side surface of each groove 14 a.
Next, after forming a resist layer on the first surface of the low refractive index resin layer 19c, the resist layer is pattern-exposed and then developed. As shown in step (S5) of fig. 12, a resist pattern 33 having an opening 33a is formed on a portion between adjacent light emitting elements 12 on the first surface of the low refractive index resin layer 19 c.
Next, as shown in step (S6) of fig. 12, the low refractive index resin layer 19c is processed through the resist pattern 33 to expose the protective layer 14, thereby forming grooves 19d over the respective light emitting elements 12. At this time, the process conditions are controlled so that the side surface of the groove 14a substantially coincides with the side surface of the groove 19d. This forms partition walls 19 over portions between adjacent light emitting elements 12. As a processing method of the low refractive index resin layer 19c, for example, a dry etching process is used. Each groove 19d has an inverted cone shape. Here, the inverted cone shape refers to a shape in which the width of the groove 19d increases from the first surface (the surface on the light emitting element 12 side) toward the second surface (the surface on the opposite side from the light emitting element 12 side) of the low refractive index resin layer 19 c. Next, the resist pattern 33 is removed from the upper portion of the partition wall 19.
(Step of Forming the planarization layer 15)
Next, for example, by an inkjet method, the photosensitive resin composition is applied to each bottom of the groove 19d at the position where the sub-pixel 10R is formed, each bottom of the groove 19d at the position where the sub-pixel 10G is formed, and each bottom of the groove 19d at the position where the sub-pixel 10B is formed. Next, the photosensitive resin composition is irradiated with ultraviolet rays and cured to form the planarizing layer 15.
(Step of Forming color Filter 16)
Next, for example, by an inkjet method, the bottom of each groove 19d at the position where the sub-pixel 10R is formed, the bottom of each groove 19d at the position where the sub-pixel 10G is formed, and the bottom of each groove 19d at the position where the sub-pixel 10B is formed are coated with red resist, green resist, and blue resist, respectively. Next, the resist of each color is irradiated with ultraviolet rays and cured. As shown in step (S7) of fig. 12, this forms the red layer 160R, the green layer 160G, and the blue layer 160B in the grooves 19d each located at the position where the sub-pixel 10R is formed, the grooves 19d each located at the position where the sub-pixel 10G is formed, and the grooves 19d each located at the position where the sub-pixel 10B is formed, respectively. That is, the color filter 16 is formed on the first surface of the planarization layer 15.
(Step of Forming planar layer 17)
Next, a photosensitive resin composition is applied onto the first surface of the color filter 16 by, for example, spin coating, and each groove 19d is filled with the photosensitive resin composition. Next, as shown in step (S8) of fig. 13, the photosensitive resin composition is irradiated with ultraviolet rays and cured to form the planarizing layer 17. Next, as shown in step (S9) of fig. 13, the entire first surface of the planarizing layer 17 is processed by, for example, etching back to expose the top of the partition wall 19.
(Step of forming lens array 18 and step of forming sealing resin layer 20)
Since the step of forming the lens array 18 and the step of forming the sealing resin layer 20 are similar to those in the first example of the method for manufacturing the display device 101, a description thereof will be omitted. Through the above steps, the display device 101 according to one embodiment is obtained.
[ Action and Effect ]
In the display device 101 according to one embodiment, each partition wall 19 is arranged between adjacent light emitting elements 12 in a plan view, and is formed over the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17. As shown in fig. 6, this causes total reflection of the wide-angle component of the light L emitted from each OLED layer 122 at the interface between the partition wall 19 and each of the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17. The totally reflected wide-angle component light L is incident on the lens 181 of each sub-pixel 10 as a self-pixel, and is condensed in the front direction by the lens 181.
Further, in the display device 101 according to one embodiment, the cross-sectional shape of each partition wall 19 is a forward taper. Therefore, the incident angle of the light L incident on each side surface of the partition wall 19 from the light emitting element 12 increases, and the light L may be totally reflected by the side surface of the partition wall 19.
Accordingly, light leakage and light condensing characteristics between the sub-pixels 10 can be improved. Therefore, color mixing (color crosstalk) can be prevented, and extraction efficiency of the light L in the front direction can be improved. Further, improving the extraction efficiency of the light L in the front direction makes it possible to improve the light emission efficiency.
In the display device according to patent document 1, the isolation portion is formed only in the protective layer, and the cross-sectional shape of the isolation portion is rectangular. Therefore, it is difficult to sufficiently prevent light leakage between adjacent light emitting elements, and there is room for improvement. In contrast, in the display device according to one embodiment, each of the partition walls 19 is formed over the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17, and the cross-sectional shape of the partition wall 19 is a forward taper. This can reduce light leakage between adjacent light emitting elements 12.
<4 Modification >
First modification example
In one embodiment, an example is described in which the refractive index n 3 of the partition wall 19 is the same as the refractive index n 2 of the sealing resin layer 20. However, the relationship between the refractive index n 3 of the partition wall 19 and the refractive index n 2 of the sealing resin layer 20 is not limited to this example, and for example, the refractive index n 3 of the partition wall 19 may be lower than the refractive index n 2 of the sealing resin layer 20. In this case, as shown in fig. 14, the light L emitted from the light emitting element 12 may be refracted at the interface between the top of the partition wall 19 and the sealing resin layer 20, and the light beam may be bent in the front direction. Accordingly, the front luminance of the display device 101 can be further increased. Note that in fig. 14, light L0 represents light in the case where the refractive index n 3 of the partition wall 19 is the same as the refractive index n 2 of the sealing resin layer 20.
Second modification example
In one embodiment, an example has been described in which the display device 101 includes the lens array 18. However, the lens array 18 is not an indispensable component, and the display device 101 does not need to include the lens array 18. In this case, the display device 101 does not need to include the second planarization layer.
Third modification example
In one embodiment, an example in which the display device 101 includes the flat layer 15 and the flat layer 17 has been described. However, the planarizing layer 15 and the planarizing layer 17 are not necessary components, and the display device 101 need not include at least one of the planarizing layer 15 and the planarizing layer 17.
Fourth modification example
The partition wall 19 may be disposed only between the adjacent light emitting elements 12 included in a predetermined region of the display region RE 1. For example, although the partition wall 19 is arranged between the adjacent light emitting elements 12 included in the central region (first region) of the display region RE1, the partition wall 19 need not be arranged between the adjacent light emitting elements 12 included in the peripheral edge region (second region) of the display region RE 1.
In the center region of the display region RE1, the center of each lens 181 may substantially coincide with the center of the light emitting region of the light emitting element 12 in plan view. In contrast, in the peripheral edge region of the display region RE1, the center of each lens 181 may be offset to the peripheral side of the display region RE1 with respect to the center of the light emitting region of the light emitting element 12 in plan view. In this case, when the Chief Ray Angle (CRA) of the central area of the display area RE1 is set to 0 °, the CRA of the peripheral edge area of the display area RE1 is set to a predetermined angle θ.
In the center region of the display region RE1, the center of each colored layer 160 may substantially coincide with the center of the light emitting region of the light emitting element 12 in plan view. In contrast, in the peripheral edge region of the display region RE1, the center of each colored layer 160 may be offset to the peripheral side of the display region RE1 with respect to the center of the light emitting region of the light emitting element 12 in plan view. In this case, when CRA of the central area of the display area RE1 is set to 0 °, CRA of the peripheral edge area of the display area RE1 is set to a predetermined angle θ.
[ Fifth modification ]
In one embodiment, an example has been described in which the refractive index n 3 of each partition wall 19 is lower than the refractive index of any of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17 that are in contact with the side surfaces of the partition wall 19. However, the relationship between the refractive index n 3 of the partition wall 19 and the refractive indices of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17 in contact with the side surface of the partition wall 19 is not limited to this example. For example, the refractive index n 3 of the partition wall 19 may be lower than that of at least one of the protective layer 14, the planarization layer 15, the color filter 16, and the planarization layer 17, which are in contact with the side surfaces of the partition wall 19. In this case, the light L emitted from the light emitting element 12 to the wide-angle side may be totally reflected at the interface between the partition wall 19 and at least one of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17.
Sixth modification example
In one embodiment, an example has been described in which each partition wall 19 is formed over the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17. However, the configuration of the partition wall 19 is not limited to this example, and for example, the partition wall 19 may be formed on at least two layers of the protective layer 14, the planarizing layer 15, the color filter 16, and the planarizing layer 17.
Seventh modification example
The display device 101 may further include a substrate. The substrate may be disposed on the first surface of the sealing resin layer 20. In this case, the sealing resin layer 20 may have a function as an adhesive layer for adhering the lens array 18 and the substrate. The substrate seals the first surface of the driving substrate 11 where the plurality of light emitting elements 12 and the like are provided. The substrate has translucency for each color of light L emitted from the color filter 16. The substrate is, for example, a glass substrate.
Eighth modification example
Each light emitting element 12 may have a resonator structure from the viewpoint of improving light extraction efficiency and/or improving color purity.
In the case where each of the first electrodes 121 is a reflective electrode having a function as a reflective layer, the resonator structure may be configured by the first electrode 121 and the second electrode 123. In this case, the optical distance between the first electrode 121 and the second electrode 123 may be set by the thickness of the OLED layer 122, may be set by selecting the material of the first electrode 121, or may be set by a combination thereof.
In the case where the first electrode 121 is a transparent electrode, a reflective layer may be disposed under the transparent electrode, and the reflective layer and the second electrode 123 may constitute a resonator structure. In this case, the optical distance between the reflective layer and the second electrode 123 may be set by the thickness of the OLED layer 122, may be set by selecting the material of the reflective layer, may be set by the thickness of an insulating layer disposed between the first electrode 121 (transparent electrode) and the reflective layer, or may be set by a combination of two or more thereof.
Ninth modification example
In one embodiment, an example has been described in which the display device 101 includes a plurality of light emitting elements 12 capable of emitting white light and color filters 16, and a color image can be displayed by a combination thereof. However, the method of coloring the display device 101 is not limited thereto. For example, instead of the plurality of light emitting elements 12 capable of emitting white light, the display device 101 may include a plurality of light emitting elements capable of emitting red light, a plurality of light emitting elements capable of emitting green light, and a plurality of light emitting elements capable of emitting blue light. In this case, the color filter is not an essential component, and may or may not be provided.
Examples of the light emitting element capable of emitting light of a predetermined color (red light, green light, or blue light) include (1) a light emitting element including a light emitting layer capable of emitting light of a predetermined color (red light, green light, or blue light), (2) a light emitting element including a light emitting layer capable of emitting white light, the light emitting element being capable of enhancing light of a predetermined wavelength (red light, green light, or blue light) included in the white light emitted by the light emitting layer by resonating with a resonator structure, and (3) a light emitting element including a light emitting layer capable of emitting light of a predetermined color (red light, green light, or blue light), the light emitting element being capable of enhancing light of a predetermined wavelength included in the light of the predetermined color emitted by the light emitting layer by resonating with a resonator structure.
Tenth modification example
In one embodiment, an example of disposing the color filter 16 has been described, but a quantum dot layer may be disposed instead of the color filter 16, or may be disposed together with the color filter 16. The quantum dot layer is a color conversion layer including quantum dots (semiconductor particles), and is capable of converting the color of light L emitted from a plurality of light emitting elements. In this case, the plurality of light emitting elements 12 may be configured to be capable of emitting blue light.
Eleventh modification example
In one embodiment, an example has been described in which each light emitting element 12 is an OLED element. However, the light emitting element is not limited to this example, and may be, for example, a self-luminous light emitting element such as a Light Emitting Diode (LED) element, an Inorganic Electroluminescence (IEL) element, a quantum dot light emitting diode (QLED) element, or a semiconductor laser element. The display device 101 may be provided with two or more types of light emitting elements.
[ Other modifications ]
Although one embodiment of the present disclosure and modifications thereof (hereinafter referred to as "one embodiment or the like") have been specifically described above, the present disclosure is not limited to one embodiment or the like, and various modifications are possible based on the technical idea of the present disclosure.
For example, the configurations, methods, steps, shapes, materials, values, etc. described in one embodiment, etc. are merely examples, and different configurations, methods, steps, shapes, materials, values, etc. may be employed as desired.
The configurations, methods, steps, shapes, materials, values, and the like in one embodiment and the like may be combined with each other without departing from the gist of the present disclosure.
Unless otherwise indicated, the materials exemplified in one embodiment and the like may each be used alone or in combination of two or more.
Two or more structures of the first modification example to the tenth modification example may be combined.
Further, the present disclosure may employ the following configuration.
(1)
A display device, comprising:
A plurality of light emitting elements arranged two-dimensionally;
A plurality of layers stacked on the plurality of light emitting elements, and
A partition wall which is arranged between adjacent light emitting elements in a plan view and is formed on two or more layers included in the plurality of layers,
Wherein the cross-sectional shape of the partition wall includes a forward tapered shape.
(2)
The display device according to (1), wherein,
The refractive index of the partition wall is lower than that of two or more layers.
(3)
The display device according to (1) or (2), wherein,
The plurality of layers includes a protective layer, a color filter, and a sealing resin layer over the plurality of light emitting elements yici.
(4)
The display device according to (3), wherein,
More than two layers include an overcoat layer and a color filter.
(5)
The display device according to (1) or (2), wherein,
The plurality of layers includes a protective layer, a first resin layer, a color filter, and a sealing resin layer over the plurality of light emitting elements yici.
(6)
The display device according to (5), wherein,
The two or more layers include a protective layer, a first resin layer, and a color filter.
(7)
The display device according to (1) or (2), wherein,
The plurality of layers sequentially includes a protective layer, a first resin layer, a color filter, a second resin layer, a lens array, and a sealing resin layer on the plurality of light emitting elements.
(8)
The display device according to (7), wherein,
The two or more layers include a protective layer, a first resin layer, a color filter, and a second resin layer.
(9)
The display device according to any one of (3) to (8), wherein,
The refractive index of the partition wall is the same as that of the sealing resin layer.
(10)
The display device according to any one of (3) to (8), wherein,
A sealing resin layer in contact with the top of the partition wall, and
The refractive index of the partition wall is lower than that of the sealing resin layer.
(11)
The display device according to any one of (3) to (10), wherein,
The top of the partition wall is positioned higher than the color filter with respect to the light emitting element.
(12)
The display device according to any one of (3) to (11), wherein,
The plurality of light emitting elements includes an organic-containing layer including an organic light emitting layer,
Comprising an organic layer which is continuous between adjacent light-emitting elements, and
The bottom of the partition wall is embedded in the protective layer.
(13)
The display device according to (12), wherein,
The protective layer has a surface on one side of the light emitting element, and
The bottom of the partition wall is separated from the surface.
(14)
The display device according to (7) or (8), wherein,
The height of the top of the partition wall coincides with the height of the bottom surface of the lenses included in the lens array.
(15)
The display device according to any one of (1) to (14), wherein,
The bottom of the partition wall is provided at a position not overlapping with the light emitting region of each light emitting element in a plan view.
(16)
An electronic apparatus comprising the display device according to any one of (1) to (15).
<5 Example of leakage preventing Structure >
The OLED layer 122 of the display device 101 according to one embodiment or the like is continuous between the light emitting elements 12 adjacent in the in-plane direction of the first surface of the drive substrate 11, and is a common layer for a plurality of light emitting elements 12. Therefore, in the display device 101 according to one embodiment or the like, current leakage may occur between adjacent light emitting elements 12. Hereinafter, an example of a leakage prevention structure for preventing such current leakage between the light emitting elements 12 will be described. Note that, in the following first to seventh examples, an example in which the OLED layer 122 includes two layers of light emitting units U1 and U2 will be described.
(Leak-proof Structure: first embodiment)
Fig. 15 is a cross-sectional view of a first example of a leak-proof structure. Note that in fig. 15, a layer over the second electrode 123 is not illustrated. Similarly, in the sectional views for describing the leak-proof structures of the second example to the ninth example, illustration of the layers above the second electrode 123 is omitted.
The insulating layer 13 has an opening 13a on each first electrode 121, and covers the first electrode 121 from a peripheral edge portion of the first surface of the first electrode 121 to a side surface (end surface) of the first electrode 121. Specifically, the insulating layer 13 includes a sidewall portion 13b and an extension portion 13c. The side wall portion 13b stands perpendicular to the first surface of the drive substrate 11 and covers the side surface of the first electrode 121. The extension portion 13c extends from the upper end of the inner peripheral surface of the side wall portion 13b toward the center of the first surface of the first electrode 121, and covers the peripheral edge portion of the first surface of the first electrode 121.
The inner peripheral portion of each opening 13a of the insulating layer 13 has a protruding portion 132b, and the protruding portion 132b has an eave shape protruding toward the center of the opening 13 a. The protruding portion 132b is separated from the first surface of the first electrode 121. The protruding portion 132b is preferably provided on the entire periphery of the peripheral portion of the opening 13a, but may be provided on a part of the entire periphery of the peripheral portion of the opening 13 a.
The resistances of the light emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or increased by each protrusion 132b (region a shown in fig. 15). This can prevent current leakage between adjacent light emitting elements 12. Here, the increase in resistance means that the light emitting unit U1 and the charge generation layer 1227 have an ultrathin film thickness at the protruding portion 132b, thereby increasing resistance. Due to the shielding effect of the protrusion 132b when the OLED layer 122 is formed, cutting or an increase in resistance of the protrusion 132b to the light emitting unit U1 and the charge generation layer 1227 may occur. An air gap 132c may be formed between the protrusion 132b and the first electrode 121.
The insulating layer 13 has a first insulating layer 131 and a second insulating layer 132 on the first surface of the driving substrate 11 and the first surface of each first electrode 121 in sequence. The first insulating layer 131 has a plurality of first openings 131a. The second insulating layer 132 has a plurality of second openings 132a. Each opening 13a includes a first opening 131a and a second opening 132a overlapping each other. An inner peripheral portion of the second opening 132a of the second insulating layer 132 protrudes further toward the inside of the opening 13a than an inner peripheral portion of the first opening 131a of the first insulating layer 131 to form a protruding portion 132b.
(Anticreep structure: second embodiment)
Fig. 16 is a cross-sectional view of a second example of a leak-proof structure. The second example is different from the first example in that the insulating layer 13 includes a third insulating layer 133 in addition to the first insulating layer 131 and the second insulating layer 132.
The third insulating layer 133 is disposed between the driving substrate 11 and the first insulating layer 131 and between the first electrode 121 and the first insulating layer 131. The third insulating layer 133 has a third opening 133a on the first surface of each first electrode 121. In the second example, the opening 13a is constituted by a first opening 131a, a second opening 132a, and a third opening 133a that overlap each other. The inner peripheral portion of the third opening 133a protrudes further inward of the opening 13a than the inner peripheral portion of the first opening 131 a. An air gap 132c may be formed between the protrusion 132b and the third insulating layer 133.
(Leak-proof Structure: third example and fourth example)
In the first example and the second example, an example has been described in which the inner peripheral portion of each opening 13a of the insulating layer 13 has one protruding portion 132 b. However, the number of the protruding portions included in the inner peripheral portion of the opening 13a of the insulating layer 13 is not limited to these examples, and the inner peripheral portion of the opening 13a of the insulating layer 13 may include two or more protruding portions. Hereinafter, an example (third example) in which the inner peripheral portion of the opening 13a of the insulating layer 13 has two protrusions will be described, and an example (fourth example) in which the inner peripheral portion of the opening 13a of the insulating layer 13 has three protrusions will be described.
Fig. 17 is a cross-sectional view of a third example of a leak-proof structure. The third example is different from the second example in that the insulating layer 13 has a fourth insulating layer 134 and a fifth insulating layer 135 in this order on the first surface of the second insulating layer 132, and the inner peripheral portion of each opening 13a of the insulating layer 13 has two protruding portions 132b and 135b each having an eave shape.
The resistances of the light emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or increased by the protruding portions 132b and the protruding portions 135 b. The protruding portion 135b is disposed at a higher position than the protruding portion 132b with respect to the first surface of the first electrode 121, and is separated from the first surface of the second insulating layer 132. The protruding portion 135b is retreated with respect to the protruding portion 132b in a direction away from the center of the opening 13 a.
The fourth insulating layer 134 has a fourth opening 134a. The fifth insulating layer 135 has a fifth opening 135a. In the third embodiment, each opening 13a is constituted by a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, and a fifth opening 135a that overlap each other. The inner peripheral portion of the fourth opening 134a recedes in a direction away from the center of the opening 13a than the inner peripheral portion of the second opening 132a and the inner peripheral portion of the fifth opening 135a. The inner peripheral portion of the fifth opening 135a protrudes further inward than the fourth opening 134a than the opening 13a to form a protruding portion 135b.
Fig. 18 is a cross-sectional view of a fourth example of a leak-proof structure. The fourth example is different from the third example in that the insulating layer 13 includes a sixth insulating layer 136 and a seventh insulating layer 137 in this order on the first surface of the fifth insulating layer 135, and the inner peripheral portion of each opening 13a of the insulating layer 13 includes three protruding portions 132b, 135b, and 137b each having an eave shape.
The resistances of the light emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or increased by the protruding portions 132b, 135b, and 137 b. The protruding portion 137b is disposed at a higher position than the protruding portion 135b with respect to the first surface of the first electrode 121, and is separated from the first surface of the fifth insulating layer 135. The protruding portion 137b is retreated with respect to the protruding portion 135b in a direction away from the center of the opening 13 a.
The sixth insulating layer 136 has a sixth opening 136a. The seventh insulating layer 137 has a seventh opening 137a. In the fourth example, each of the openings 13a includes a first opening 131a, a second opening 132a, a third opening 133a, a fourth opening 134a, a fifth opening 135a, a sixth opening 136a, and a seventh opening 137a that overlap with each other. The inner peripheral portion of the sixth opening 136a is retreated in a direction away from the center of the opening 13a than the inner peripheral portion of the fifth opening 135a and the inner peripheral portion of the seventh opening 137a. The inner peripheral portion of the seventh opening 137a protrudes toward the inside of the opening 13a with respect to the sixth opening 136a to form a protruding portion 137b.
(Leak-proof Structure: fifth example)
Fig. 19 is a cross-sectional view of a fifth example of a leak-proof structure. The fifth example is different from the second example in that the insulating layer 13 has an eighth insulating layer 138 in addition to the first insulating layer 131, the second insulating layer 132, and the third insulating layer 133, and the inner peripheral portion of each opening 13a of the insulating layer 13 has two protruding portions 132b and 133b, and each protruding portion 132b and 133b has an eave shape.
The resistances of the light emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or increased by the protruding portions 132b and the protruding portions 133 b. Each projection 133b projects inward of the opening 13a than the projection 132 b. The protruding portion 133b is provided at a position lower than the protruding portion 132b with respect to the first surface of the first electrode 121. The protruding portion 133b is separated from the first surface of the first electrode 121.
The eighth insulating layer 138 is disposed between the driving substrate 11 and the third insulating layer 133 and between the first electrode 121 and the third insulating layer 133. The eighth insulating layer 138 has an eighth opening 138a. In the fifth embodiment, the opening 13a is constituted by the first opening 131a, the second opening 132a, the third opening 133a, and the eighth opening 138a that overlap each other. The inner peripheral portion of the third opening 133a of the third insulating layer 133 protrudes further into the opening 13a than the inner peripheral portion of the eighth opening 138a of the eighth insulating layer 138, forming a protruding portion 133b.
(Leak-proof Structure: sixth example)
Fig. 20 is a cross-sectional view of a sixth example of a leak-proof structure. The sixth example is different from the first example in that the insulating layer 13 has a protruding portion 13b1 on the outer peripheral portion of each side wall portion 13b, instead of having a protruding portion 132b on the inner peripheral portion of each opening 13 a. Fig. 20 shows an example of a laminated structure in which the insulating layer 13 has a single-layer structure but may have two or more layers.
The protruding portion 13b1 protrudes outward from the outer peripheral portion of the side wall portion 13 b. The concave portion 13b2 is provided at a position separated downward by a predetermined distance from the upper end of the outer peripheral portion of the side wall portion 13 b. Thus, by providing the recess 13b2 in the outer peripheral portion of the side wall portion 13b, the protruding portion 13b1 is formed in the upper end portion of the outer peripheral portion of the side wall portion 13 b. The protruding portion 13b1 and the recessed portion 13b2 are preferably provided on the entire circumference of the outer peripheral portion of the side wall portion 13b, but may be provided on a part of the entire circumference of the outer peripheral portion of the side wall portion 13 b.
The resistances of the light emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or increased by each of the protrusions 132b (region a shown in fig. 20). This can prevent current leakage between adjacent light emitting elements 12.
In the sixth example, an example has been described in which the outer peripheral portion of each side wall portion 13b has one protruding portion 13b1 and one recessed portion 13b2. However, the number of protruding portions 13b1 and the number of recessed portions 13b2 included in the outer peripheral portion of the side wall portion 13b are not limited to this example, and the outer peripheral portion of the side wall portion 13b may include two or more protruding portions 13b1 and two or more recessed portions 13b2. In this case, two or more concave portions 13b2 may be provided in order from the upper end to the lower end of the outer peripheral portion of the side wall portion 13b while being separated from each other by a predetermined distance.
(Anticreep structure: seventh example)
Fig. 21 is a cross-sectional view of a seventh example of a leak-proof structure. The grooves 13Gv are provided between the adjacent light emitting elements 12, respectively. Each groove 13Gv may be provided between the light emitting elements 12 adjacent in a predetermined direction (for example, Y-axis direction), or may be provided so as to surround the light emitting elements 12. The groove 13Gv is formed on the insulating layer 13 and the insulating layer 112.
The resistances of the light emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or increased by each groove 13Gv. This can prevent current leakage between adjacent light emitting elements 12. Here, the increase in resistance means that, as shown in fig. 22, the light emitting unit U1 and the charge generation layer 1227 each have an ultrathin film thickness in the groove 13Gv, thereby increasing the resistance. Among the layers included in the OLED layer 122, the light emitting unit U2 located above the charge generating layer 1227 spans the groove 13Gv.
(Leak-proof Structure: eighth example)
Fig. 23 is a cross-sectional view of an eighth example of a leak-proof structure. A plurality of wires 112a, a plurality of contact plugs 112b, and a plurality of contact electrodes 112c are disposed in the insulating layer 112. Each contact plug 112b electrically connects the first electrode 121 and the line 112a. The grooves 13Gv are provided between the adjacent light emitting elements 12, respectively. The bottom surface of each groove 13Gv is constituted by the first surface of the contact electrode 112 c. The auxiliary electrode 112d is provided on a side surface of each groove 13 Gv. The auxiliary electrode 112d is in contact with the first surface of the contact electrode 112 c.
The OLED layer 122 is cut by the groove 13 Gv. Although fig. 23 shows an example in which the second electrode 123 is also cut by the groove 13Gv, the second electrode 123 need not be cut by the groove 13Gv and may be continuous between adjacent light emitting elements 12. The second electrode 123 is in contact with the auxiliary electrode 112d on a side surface of each groove 13 Gv. Further, the second electrode 123 is in contact with the contact electrode 112c on the bottom surface of each groove 13 Gv. The protective layer 14 may be disposed on the first surface of the second electrode 123 to follow the second electrode 123.
In the eighth embodiment, leakage current can be drawn to the auxiliary electrode 112d and the contact electrode 112c between the adjacent light emitting elements 12. Therefore, current leakage between adjacent light emitting elements 12 can be prevented.
(Leak-proof Structure: ninth example)
Fig. 24 is a cross-sectional view of a ninth example of the leakage preventing structure. In a ninth example, the display device 101 includes a plurality of third electrodes 124. Similar to the plurality of first electrodes 121, a plurality of third electrodes 124 are disposed on the second surface side of the OLED layer 122. Each third electrode 124 is disposed between adjacent first electrodes 121.
Fig. 25 is a plan view for describing the arrangement of the first electrode 121 and the third electrode 124. The plurality of third electrodes 124 are island-shaped electrode groups having an area smaller than that of the first electrode 121. The plurality of third electrodes 124 are regularly arranged at equal intervals from the first electrodes 121 adjacent to each other in a plan view. From another point of view, in a top view, a plurality of third electrodes 124 are arranged to be spaced apart from each first electrode 121 by a predetermined distance so as to surround the first electrode 121.
A plurality of wirings 112a, a plurality of wirings 112e, a plurality of contact plugs 112b, and a plurality of contact plugs 112f are provided in the insulating layer 112. Each contact plug 112b electrically connects the first electrode 121 and the line 112a. Each contact plug 112f electrically connects the third electrode 124 and the electric wire 112e.
The plurality of third electrodes 124 are connected to an internal circuit of the display device 101 via the contact plug 112f, the wiring 112e, and the like, and are set to a common constant potential. Specifically, when a voltage is applied to the OLED layer 122, the potential of each third electrode 124 is set to be smaller than a value obtained by adding the threshold voltage of the OLED layer 122 to the potential of the second electrode 123. Accordingly, even in the case where a voltage is applied to the OLED layer 122 through the first electrode 121 and the second electrode 123, and thus a leakage current is generated from the first electrode 121, the leakage current preferentially flows through the third electrode 124. Accordingly, leakage current is prevented from flowing from the first electrode 121 to the adjacent first electrode 121.
(Leak-proof Structure: other examples)
In the first to seventh examples, an example has been described in which the OLED layer 122 includes two layers of light emitting units U1 and U2. However, the configuration of the OLED layer 122 is not limited to this example, and the OLED layer 122 may have a single-layer light emitting unit U or may have three or more layers of light emitting units U.
In the first to seventh examples, examples have been described in which the resistances of the light emitting unit U1 and the charge generating layer 1227 included in the OLED layer 122 are cut or increased by the protrusions 132b, 133b, 135b, 137b, and 13b1 and the grooves 13Gv (hereinafter referred to as "protrusions 132b, grooves 13Gv, and the like"). However, the layer cutting or resistance increase by the protrusion 132b, the groove 13Gv, or the like is not limited to this example. For example, the hole injection layer 1221 or the hole transport layer 1222 included in the OLED layer 122 may be cut or increased in resistance by the protrusion 132b, the groove 13Gv, or the like, and the hole injection layer 1221 and the hole transport layer 1222 included in the OLED layer 122 may be cut or increased in resistance by the protrusion 132b, the groove 13Gv, or the like. In the case where the OLED layer 122 includes three or more light emitting units U, the resistances of two or more light emitting units U and two or more charge generating layers 1227 included in the OLED layer 122 may be cut or increased by the protrusions 132b, the grooves 13Gv, and the like.
<6 Example of resonator Structure >
The sub-pixels 10 included in the display device 101 according to one embodiment or the like may each include a resonator structure resonating light generated by the light emitting element 12. The resonator structure will be described below with reference to the drawings. Further, in the following description, the first surface of each layer may be referred to as an upper surface.
(Resonator Structure: first example)
Fig. 26 a is a schematic sectional view for describing a first example of the resonator structure. In the following description, in the case where light emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B are not particularly distinguished, those light emitting elements may be referred to as light emitting elements 12. In the case of distinguishing light emitting elements provided corresponding to the sub-pixels 10R, 10G, and 10B, those light emitting elements may be referred to as light emitting elements 12 R、12G and 12 B. The portions of OLED layer 122 corresponding to sub-pixels 10R, 10G, and 10B may be referred to as OLED layer 122 R, OLED layer 122 G, and OLED layer 122 B, respectively.
In the first example, the first electrode 121 is formed across the light emitting element 12 to have a common film thickness. The same applies to the second electrode 123.
The reflector 71 is disposed under the first electrode 121 of each light emitting element 12 with the optical adjustment layer 72 interposed therebetween. A resonance structure that causes resonance of light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. In the following description, the optical adjustment layers 72 disposed corresponding to the sub-pixels 10R, 10G, and 10B may be referred to as optical adjustment layers 72 R、72G and 72 B, respectively.
The reflector 71 is formed across the light emitting element 12 to have a common film thickness. The film thickness of each optical adjustment layer 72 varies depending on the color to be displayed by the sub-pixel. Since the optical adjustment layers 72 R、72G and 72 B have different film thicknesses, an optical distance at which optimal resonance occurs for the wavelength of light corresponding to the color to be displayed can be set.
In the example shown in a of fig. 26, the upper surfaces of the reflectors 71 in the light emitting elements 12 R、12G and 12 B are arranged in alignment. As described above, since the film thickness of each optical adjustment layer 72 changes according to the color displayed by the sub-pixel, the position of the upper surface of the second electrode 123 changes according to the types of the light emitting elements 12 R、12G and 12 B.
The reflector 71 may be formed using, for example, a metal such as aluminum (Al), silver (Ag), or copper (Cu), or an alloy containing one of these metals as a main component.
The optical adjustment layer 72 may include an inorganic insulating material such as silicon nitride (SiN x), silicon oxide (SiO x), or silicon oxynitride (SiO xNy), or an organic resin material such as an acrylic resin or a polyimide resin. Each optical modifier layer 72 may be a single layer or may be a multilayer film comprising such multiple materials. Furthermore, the number of layers may vary depending on the type of light emitting element 12.
The first electrode 121 may be formed using a transparent conductive material such as Indium Tin Oxide (ITO), indium Zinc Oxide (IZO), or zinc oxide (ZnO).
The second electrode 123 needs to function as a semi-transparent reflective film. The second electrode 123 may be formed using magnesium (Mg), silver (Ag), a magnesium-silver alloy (MgAg) containing one of these as a main component, an alloy containing an alkali metal or an alkaline earth metal, or the like.
(Resonator Structure: second example)
Fig. 26B is a schematic sectional view for describing a second example of the resonator structure.
Also in the second example, the first electrode 121 and the second electrode 123 are formed at a common film thickness across the light emitting element 12.
Further, also in the second example, the reflector 71 is arranged below the first electrode 121 of each light emitting element 12 with the optical adjustment layer 72 interposed therebetween. A resonance structure that causes resonance of light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. Similar to the first example, the reflectors 71 are formed with a common film thickness across the light emitting elements 12, and the film thickness of each optical adjustment layer 72 varies according to the color to be displayed by the sub-pixels.
In the first example shown in a of fig. 26, the upper surfaces of the reflectors 71 in the light emitting elements 12 R、12G and 12 B are arranged in alignment, and the positions of the upper surfaces of the second electrodes 123 are different depending on the types of the light emitting elements 12 R、12G and 12 B.
In contrast, in the second example shown in B of fig. 26, the upper surface of the second electrode 123 is arranged to be aligned across the light emitting elements 12 R、12G and 12 B. In order to align the upper surfaces of the second electrodes 123, in the light emitting elements 12 R、12G and 12 B, the reflectors 71 are arranged such that the positions of the upper surfaces vary according to the types of the light emitting elements 12 R、12G and 12 B. Therefore, the lower surface of the reflector 71 (in other words, the upper surface of the base layer (insulating layer) 73) forms a stepped shape according to the type of the light emitting element 12.
The materials of the reflector 71, the optical adjustment layer 72, the first electrode 121, and the second electrode 123, and the like are similar to those described in the first example, and the description thereof is omitted.
(Resonator Structure: third example)
Fig. 27 a is a schematic sectional view for describing a third example of the resonator structure. In the following description, the reflectors 71 disposed corresponding to the sub-pixels 10R, 10G, and 10B may be referred to as reflectors 71 R、71G and 71 B, respectively.
In the third example, the first electrode 121 and the second electrode 123 are also formed at a common film thickness across the light emitting element 12.
Then, also in the third example, a reflector 71 is arranged under the first electrode 121 of each light emitting element 12 with the optical adjustment layer 72 interposed therebetween. A resonance structure that causes resonance of light generated by the OLED layer 122 is formed between the reflector 71 and the second electrode 123. Similar to the first example and the second example, the film thickness of each optical adjustment layer 72 varies according to the color displayed by the sub-pixel. Then, similarly to the second example, the position of the upper surface of the second electrode 123 is arranged to be aligned across the light emitting elements 12 R、12G and 12 B.
In the second example shown in B of fig. 27, in order to align the upper surface of the second electrode 123, the lower surface of the reflector 71 is formed in a stepped shape according to the type of the light emitting element 12.
In contrast, in the third example shown in a of fig. 27, the film thickness of the reflector 71 is set to be different according to the types of the light emitting elements 12 R、12G and 12 B. More specifically, the film thickness is set to align the lower surfaces of the reflectors 71 R、71G and 71 B.
The materials of the reflector 71, the optical adjustment layer 72, the first electrode 121, and the second electrode 123, and the like are similar to those described in the first example, and the description thereof is omitted.
(Resonator Structure: fourth example)
Fig. 27B is a schematic sectional view for describing a fourth example of the resonator structure. In the following description, the first electrodes 121 disposed corresponding to the sub-pixels 10R, 10G, and 10B may be referred to as first electrodes 121 R、121G and 121 B, respectively.
In the first example shown in a of fig. 27, the first electrode 121 and the second electrode 123 of each light emitting element 12 are formed to have a common film thickness. Then, a reflector 71 is disposed under the first electrode 121 of each light emitting element 12 with an optical adjustment layer 72 interposed therebetween.
In contrast, in the fourth example shown in B of fig. 27, the optical adjustment layer 72 is omitted, and the film thickness of the first electrode 121 is set to be different according to the types of the light emitting elements 12 R、12G and 12 B.
The reflector 71 is formed across the light emitting element 12 to have a common film thickness. The film thickness of each first electrode 121 varies according to the color to be displayed by the subpixel. Since the first electrodes 121 R、121G and 121 B have different film thicknesses, an optical distance that generates optimal resonance of the wavelength of light can be set according to the color to be displayed.
The materials of the reflector 71, the optical adjustment layer 72, the first electrode 121, and the second electrode 123, and the like are similar to those described in the first example, and the description thereof is omitted.
(Resonator Structure: fifth example)
Fig. 28 a is a schematic cross-sectional view for describing a fifth example of the resonator structure.
In the first example shown in a of fig. 26, the first electrode 121 and the second electrode 123 are formed across the light emitting element 12 to have a common film thickness. Then, a reflector 71 is disposed under the first electrode 121 of each light emitting element 12 with an optical adjustment layer 72 interposed therebetween.
In contrast, in example 5 shown in a of fig. 28, the optical adjustment layer 72 is omitted, and the oxide film 74 is formed on the surface of the reflector 71. The film thickness of the oxide film 74 varies depending on the types of the light emitting elements 12 R、12G and 12 B. In the following description, the oxide films 74 provided corresponding to the sub-pixels 10R, 10G, and 10B may be referred to as oxide films 74R, 74G, and 74B, respectively.
The film thickness of each oxide film 74 differs depending on the color displayed by the sub-pixel. Since the oxide films 74R, 74G, and 74B have different film thicknesses, the optical distances at which optimal resonance occurs in the wavelength of light corresponding to the color to be displayed can be set.
The oxide film 74 is a film obtained by oxidizing the surface of the reflector 71, and includes, for example, aluminum oxide, tantalum oxide, titanium oxide, magnesium oxide, zirconium oxide, and the like. Each oxide film 74 serves as an insulating film for adjusting the optical path length (optical distance) between the reflector 71 and the second electrode 123.
The oxide film 74 having a different film thickness can be formed as follows, for example, according to the types of the light emitting elements 12 R、12G and 12 B.
First, an electrolyte is filled in a container, and a substrate on which the reflector 71 is formed is immersed in the electrolyte. Furthermore, the electrodes are arranged to face the reflector 71.
Then, a positive voltage is applied to the reflector 71 with respect to the electrode to anodize the reflector 71. The film thickness of the oxide film caused by anodic oxidation is proportional to the voltage value of the counter electrode. Accordingly, the anodic oxidation is performed in a state where a voltage corresponding to the type of the light emitting element 12 is applied to each of the reflectors 71 R、71G and 71 B. This enables the oxide films 74 having different film thicknesses to be formed together.
The materials of the reflector 71, the first electrode 121, and the second electrode 123, and the like are similar to those described in the first example, and the description thereof is omitted.
(Resonator Structure: sixth example)
Fig. 28B is a schematic sectional view for describing a sixth example of the resonator structure.
In the sixth example, each light emitting element 12 includes a first electrode 121, an OLED layer 122, and a second electrode 123 stacked on one another. Note that in the sixth example, each first electrode 121 is formed to function as both an electrode and a reflector. The first electrode (also functioning as a reflector) 121 is formed using a material having an optical constant selected according to the types of the light emitting elements 12 R、12G and 12 B. The phase shift caused by the first electrode (also acting as a reflector) 121 changes and thus the optical distance causing the optimal resonance of the wavelength of light can be set according to the color to be displayed.
The first electrode (also functioning as a reflector) 121 may be formed using a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu) or an alloy containing one of these metals as a main component. For example, the first electrode (also functioning as a reflector) 121 R of the light emitting element 12 R may be formed using copper (Cu), and the first electrode (also functioning as a reflector) 121 G of the light emitting element 12 G and the first electrode (also functioning as a reflector) 121 B of the light emitting element 12 B may be formed using aluminum.
The material of the second electrode 123 and the like are similar to those described in the first example, and the description thereof is omitted.
(Resonator Structure: seventh example)
Fig. 29 is a schematic cross-sectional view for describing a seventh example of the resonator structure.
In the seventh example, basically, the sixth example is applied to the light emitting elements 12 R and 12 G, and the first example is applied to the light emitting element 12 B. Further, in this configuration, the optical distance that causes the optimal resonance of the wavelength of light can be set according to the color to be displayed.
The first electrodes (also functioning as reflectors) 121 R and 121 G for the light emitting elements 12 R and 12 G can be formed using a single metal such as aluminum (Al), silver (Ag), gold (Au), or copper (Cu) or an alloy containing one of these as a main component.
The materials constituting the reflector 71 B, the optical adjustment layer 72 B, and the first electrode 121 B for the light emitting element 12 B, and the like are similar to those described in the first example, and thus description thereof is omitted.
<7 Application example >
(Electronic device)
The display device 101 according to one embodiment or the like may be provided in various electronic apparatuses. The display device 101 according to one embodiment or the like is particularly suitable for an eyeglass device, such as a head-mounted display, an electronic viewfinder of a video camera or a single-lens reflex camera, or the like, which requires high resolution and is used near the eyes in an enlarged manner.
(Specific example 1)
An example of the appearance of the digital still camera 310 is shown in a of fig. 30 and B of fig. 30. The digital still camera 310 is a single-lens reflex type of interchangeable lens, and includes an interchangeable imaging lens unit (interchangeable lens) 312 substantially at the center of the front of a camera body portion (camera body) 311, and a grip portion 313 to be gripped by a person capturing an image on the left front side.
The monitor 314 is provided at a position offset leftward from the center of the rear surface of the camera body portion 311. Above the monitor 314, an electronic viewfinder (eyepiece window) 315 is provided. By looking at the electronic viewfinder 315, the person capturing the image can determine the composition by visually recognizing the optical image of the subject guided from the imaging lens unit 312. The electronic viewfinder 315 includes any one of the display devices 101 according to one embodiment or the like.
(Specific example 2)
Fig. 31 shows an example of the appearance of the head-mounted display 320. The head mounted display 320 is an example of an eyeglass device. For example, the head-mounted display 320 includes ear hook portions 322 worn on the head of the user on both sides of the glasses-shaped display unit 321. The display unit 321 includes any one of the display devices 101 according to one embodiment or the like.
(Specific example 3)
Fig. 32 shows an example of the appearance of a television apparatus 330. The television device 330 includes, for example, a video display screen unit 331 including a front panel 332 and a filter 333, and the video display screen unit 331 includes any display device 101 or the like according to one embodiment.
(Specific example 4)
Fig. 33 shows an example of the appearance of a see-through head mounted display 340. See-through head mounted display 340 is an example of a goggle device. The see-through head mounted display 340 includes a main body portion 341, an arm 342, and a lens barrel 343.
The body portion 341 is connected to the arms 342 and the glasses 350. Specifically, an end of the main body portion 341 in the long-side direction is coupled to the arm 342, and one side of a side surface of the main body portion 341 is coupled to the glasses 350 via a connection member. Note that the main body portion 341 may be worn directly on the head of a human body.
The main body portion 341 includes a control board and a display unit for controlling the operation of the see-through head mounted display 340. The arm 342 connects the main body portion 341 and the lens barrel 343 and supports the lens barrel 343. Specifically, the arm 342 is coupled to an end of the body portion 341 and an end of the lens barrel 343, and fixes the lens barrel 343. Further, the arm 342 contains a signal line for communicating data related to an image supplied from the main body portion 341 to the lens barrel 343.
The lens barrel 343 projects image light supplied from the main body portion 341 via the arm 342 toward the eyes of a user wearing the see-through head-mounted display 340 through the eyepiece 351. In the see-through head-mounted display 340, the display unit of the main body portion 341 includes any display device 101 according to one embodiment or the like.
(Specific example 5)
Fig. 34 shows an example of the appearance of a smart phone 360. The smart phone 360 includes a display unit 361 that displays various information, an operation unit 362 that includes buttons for receiving operation inputs from a user, and the like. The display unit 361 includes any one of the display devices 101 according to one embodiment and the like.
(Specific example 6)
The display device 101 according to one embodiment or the like may be provided in various displays provided in a vehicle.
Fig. 35 a and 35B are diagrams showing an example of an internal configuration of a vehicle 500 provided with various displays. Specifically, a in fig. 35 is a diagram showing an example of the internal state of the vehicle 500 from the rear to the front of the vehicle 500, and B in fig. 35 is a diagram showing an example of the internal state of the vehicle 500 from the diagonally rear to the diagonally front of the vehicle 500.
The vehicle 500 includes a central display 501, a console display 502, a heads-up display 503, a digital rear mirror 504, a steering wheel display 505, and a rear entertainment display 506. At least one of these displays includes any of the display devices 101 according to one embodiment or the like. For example, all of these displays may include any of the display devices 101 according to one embodiment, or the like.
The center display 501 is arranged on an instrument panel portion facing the driver seat 508 and the passenger seat 509. Fig. 35 a and 35B show examples of the center display 501 having a horizontally elongated shape extending from the driver seat 508 side to the passenger seat 509 side, but the screen size and arrangement position of the center display 501 are appropriately determined. The central display 501 is capable of displaying information sensed by various sensors. As a specific example, the center display 501 can display an image captured by an image sensor, an image of a distance between an obstacle in front of or on the side of the vehicle 500 measured by a ToF sensor, a body temperature of an occupant detected by an infrared sensor, or the like. The central display 501 may be used to display at least one of safety related information, operation related information, life log, health related information, authentication/identification related information, or entertainment related information, for example.
The safety-related information is information about drowsiness sensing, gaze sensing, sensing of miscreants of children riding together, presence or absence of wearing of the seat belt, sensing of departure of the passenger, and the like, and is information sensed by a sensor arranged on the rear surface side of the center display 501 in an overlapping manner, for example. The operation-related information senses a gesture related to an operation performed by the occupant using the sensor. The sensed gestures may include the operation of various devices in the vehicle 500. For example, the operation of an air conditioner, a navigation device, an AV device, a lighting device, or the like is sensed. The lifeguard includes the lifeguard of all occupants. For example, the life log includes a record of the actions of each occupant in the vehicle. By obtaining and storing the life-saving log, the state of each passenger at the time of accident can be checked. The health-related information is information obtained by estimating the health condition of the occupant based on the body temperature of the occupant sensed by a sensor such as a temperature sensor. Alternatively, the face of the occupant may be imaged by using an image sensor, and the health condition of the occupant may be estimated from the imaged facial expression. Further, a dialogue with the occupant may be automatically conducted by voice, and the health condition of the occupant may be estimated based on the content of the response from the occupant. The authentication/recognition related information includes information on a keyless input function of performing face authentication by using a sensor, a function of automatically adjusting the seat height and position by face recognition, and the like. The entertainment-related information includes a function of detecting operation information of the AV device performed by the occupant using the sensor, a function of recognizing the face of the occupant by the sensor and providing content suitable for the occupant by the AV device, and the like.
For example, the console display 502 may be used to display life log information. The console display 502 is disposed near a gear lever 511 of the center console 510 between the driver seat 508 and the passenger seat 509. The console display 502 may also display information sensed by the different sensors. Further, the console display 502 may display an image of the vehicle periphery captured by the image sensor, or may display an image of the distance to an obstacle of the vehicle periphery.
The heads-up display 503 is virtually displayed in front of a windshield 512 in front of the driver's seat 508. For example, the heads-up display 503 may be used to display at least one of safety-related information, operation-related information, life-saving logs, health-related information, authentication/identification-related information, or entertainment-related information. Since the head-up display 503 is virtually provided in front of the driver seat 508 in many cases, it is adapted to display information directly related to the operation of the vehicle 500, such as the speed of the vehicle 500 and the remaining amount of fuel (battery).
The digital rear view mirror 504 can display not only the rear of the vehicle 500 but also the state of the rear seat occupant, and thus, for example, by disposing a sensor on the rear surface side of the digital rear view mirror 504 in an overlapping manner, it can be used to display the lifeguard information.
The steering wheel display 505 is disposed near the center of the steering wheel 513 of the vehicle 500. The steering wheel display 505 may be used to display at least one of safety-related information, operation-related information, life-saving logs, health-related information, authentication/identification-related information, or entertainment-related information, for example. Specifically, since the steering wheel display 505 is close to the driver's hand, it is suitable for displaying life-journal information such as the body temperature of the driver, or for displaying information on the operation of AV devices, air-conditioning devices, or the like.
The rear entertainment display 506 is attached to the rear surface side of the driver seat 508 or the passenger seat 509, and is for viewing by a passenger in the rear seat. The post-entertainment display 506 may be used to display at least one of, for example, safety-related information, operation-related information, life-saving logs, health-related information, authentication/identification-related information, or entertainment-related information. In particular, since the rear entertainment display 506 is in front of the passenger in the rear seat, information about the passenger in the rear seat is displayed. For example, information about the operation of the AV device or the air conditioner may be displayed, or a result of measuring the body temperature of the passenger in the rear seat or the like by the temperature sensor may be displayed.
The sensors may be arranged on the rear surface side of the display device 101 or the like in an overlapping manner so that the distance to an object existing in the surrounding environment can be measured in this configuration. Optical ranging methods are broadly classified into passive type and active type. By the passive type method, distance measurement is performed by receiving light from the object without projecting light from the sensor to the object. Passive methods include a lens focusing method, a stereoscopic method, a monocular vision method, and the like. With the active type method, distance measurement is performed by projecting light to an object and measuring reflected light from the object using a sensor. The active type methods include an optical radar method, an active stereo method, an illuminance difference stereo method, a moire morphology method, an interference method, and the like. The display device 101 according to one embodiment or the like may be applied to any of these types of distance measurement. The above-described passive-type or active-type distance measurement can be performed by using sensors arranged in an overlapping manner on the rear surface side of the display device 101.
REFERENCE SIGNS LIST
10R,10G,10B sub-pixels
11. Driving substrate
111. Substrate board
112. Insulating layer
112B, 112g contact plugs
112A wire
113. Pad portion
12. Light-emitting element
121. First electrode
122 OLED layer
123. Second electrode
13. Insulating layer
13A opening
14. Protective layer
15. Planarization layer (first resin layer)
16. Color filter
160R, 160G, 160B colored layers
17. Planarization layer (second resin layer)
18. Lens array
181. Lens
19. Partition wall
20. Sealing resin layer
101. Display device
310. Digital still camera
320. Head-mounted display
330. Television apparatus
340. See-through head mounted display
360. Intelligent telephone
500. Vehicle with a vehicle body having a vehicle body support
U1, U2 light emitting unit
RE1 display area
RE2 peripheral area.

Claims (16)

1. A display device, comprising:
A plurality of light emitting elements arranged two-dimensionally;
a plurality of layers stacked on the plurality of light emitting elements, and
A partition wall which is arranged between adjacent light emitting elements in a plan view and is formed on two or more layers included in the plurality of layers,
Wherein the cross-sectional shape of the partition wall includes a forward tapered shape.
2. The display device according to claim 1, wherein,
The refractive index of the partition wall is lower than the refractive index of the two or more layers.
3. The display device according to claim 1, wherein,
The plurality of layers sequentially include a protective layer, a color filter, and a sealing resin layer on the plurality of light emitting elements.
4. The display device according to claim 3, wherein,
The two or more layers include the overcoat layer and the color filter.
5. The display device according to claim 1, wherein,
The plurality of layers includes a protective layer, a first resin layer, a color filter, and a sealing resin layer in this order on the plurality of light emitting elements.
6. The display device according to claim 5, wherein,
The two or more layers include the protective layer, the first resin layer, and the color filter.
7. The display device according to claim 1, wherein,
The plurality of layers includes a protective layer, a first resin layer, a color filter, a second resin layer, a lens array, and a sealing resin layer in this order on the plurality of light emitting elements.
8. The display device according to claim 7, wherein,
The two or more layers include the protective layer, the first resin layer, the color filter, and the second resin layer.
9. The display device according to claim 3, wherein,
The refractive index of the partition wall is the same as that of the sealing resin layer.
10. The display device according to claim 3, wherein,
The sealing resin layer is in contact with the top of the partition wall, and
The refractive index of the partition wall is lower than that of the sealing resin layer.
11. The display device according to claim 3, wherein,
The top of the partition wall is positioned higher than the color filter with respect to the light emitting element.
12. The display device according to claim 3, wherein,
A plurality of the light emitting elements include an organic-containing layer including an organic light emitting layer,
The organic layer is continuous between adjacent light emitting elements, and
The bottom of the partition wall is embedded in the protective layer.
13. The display device of claim 12, wherein,
The protective layer has a surface on one side of the light emitting element, and
The bottom of the partition wall is separated from the surface.
14. The display device according to claim 7, wherein,
The height of the top of the partition wall coincides with the height of the bottom surface of the lenses included in the lens array.
15. The display device according to claim 1, wherein,
The bottom of the partition wall is disposed at a position not overlapping with the light emitting region of each of the light emitting elements in a plan view.
16. An electronic device comprising the display device according to claim 1.
CN202480041866.9A 2023-07-26 2024-07-23 Display device and electronic apparatus Pending CN121368942A (en)

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JP2015128027A (en) * 2013-12-27 2015-07-09 シャープ株式会社 Organic el device and display device
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