CN121908175A

CN121908175A - An open-back headphone

Info

Publication number: CN121908175A
Application number: CN202510631892.3A
Authority: CN
Inventors: 解国林; 郑金波; 张承乾; 郭卜瑞; 全盛超; 张磊; 周文兵; 刘志青
Original assignee: Shenzhen Voxtech Co Ltd
Current assignee: Shenzhen Voxtech Co Ltd
Priority date: 2024-10-16
Filing date: 2025-05-15
Publication date: 2026-04-21
Also published as: WO2026081476A1

Abstract

This specification provides an open-back headphone, comprising: a housing; a support structure configured to place the housing near a user's ear without obstructing the ear canal when worn; a microphone assembly configured to receive external sound; a processing circuit configured to generate a first noise-reducing signal based on the external sound collected by the microphone assembly; and a speaker located within the housing, configured to generate noise-reduced sound under the drive of the first noise-reducing signal, wherein the speaker includes a magnetic circuit assembly and two diaphragms located on both sides of the magnetic circuit assembly, the two diaphragms being configured to vibrate synchronously in the same direction.

Description

Open earphone

Cross reference

The present specification claims priority from chinese application number 202411452809.8 filed on 10/16 of 2024, incorporated herein by reference in its entirety.

Technical Field

The present disclosure relates to the field of acoustics, and in particular, to an open earphone.

Background

Along with the continuous improvement of the living standard of people, the earphone becomes an indispensable article for people. The types of headphones are classified into various types according to the user's use requirements, and for example, headphones include in-ear headphones and open headphones. The open earphone of some types hangs on user's ear, and the play sound position of open earphone is located outside user's ear canal after wearing, even wear for a long time and also can not cause the ear canal uncomfortable. Because the open earphone does not block the auditory canal, ambient noise is easy to be transmitted into the auditory canal, so that a user can hear the noise in the ambient environment and the sound emitted by the open earphone at the same time, and the listening effect is affected.

It is therefore desirable to provide an open earphone that reduces the audible ambient noise to ensure the listening effect.

Disclosure of Invention

One of the embodiments of the present specification provides an open earphone including a housing, a support structure configured to place the housing in a worn state in a position where an ear canal is not blocked in the vicinity of an ear of a user, a microphone assembly configured to receive external sound, a processing circuit configured to generate a first noise reduction signal based on the external sound collected by the microphone assembly, and a speaker located within the housing and configured to generate noise reduction sound driven by the first noise reduction signal, wherein the speaker includes a magnetic circuit assembly and two diaphragms located on both sides of the magnetic circuit assembly, the two diaphragms configured to vibrate in a synchronous and same direction.

One of the embodiments of the present specification provides an open earphone including a housing, a support structure configured to place the housing in a worn state in a position where an ear canal is not blocked in the vicinity of an ear of a user, a front microphone assembly receiving external sound through a front sound receiving hole, wherein the housing includes a body and a connection portion configured to connect the body and the support structure, the front microphone assembly being disposed on the connection portion, a processing circuit configured to generate a noise reduction signal from the external sound collected by the front microphone assembly, and a speaker located within the housing configured to generate a noise reduction sound driven by the noise reduction signal.

One of the embodiments of the present specification provides an open earphone including a housing, a support structure configured to place the housing in a worn state in a position where an ear canal is not blocked near an ear of a user, an upper microphone assembly that receives external sound through an upper sound receiving hole, wherein an upper side surface of the housing is provided with an upper protrusion, and a second sound receiving hole is provided on the upper protrusion, a processing circuit configured to generate a noise reduction signal according to the external sound collected by the upper microphone assembly, and a speaker located within the housing and configured to generate a noise reduction sound driven by the noise reduction signal.

One of the embodiments of the present specification provides an open earphone including a housing, a support structure configured to place the housing in a worn state in a position where an ear canal is not blocked near an ear of a user, a rear microphone assembly receiving external sound through a rear sound receiving hole, wherein an inner side surface of the housing is provided with a rear projection on which the rear sound receiving hole is provided, a processing circuit configured to generate a noise reduction signal according to the external sound collected by the rear microphone assembly, and a speaker located within the housing and configured to generate a noise reduction sound driven by the noise reduction signal.

Additional features will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following and the accompanying drawings, or may be learned by the production or operation of the examples. The features of the present invention can be implemented and obtained by practicing or using the various aspects of the methods, tools, and combinations set forth in the following detailed examples.

Drawings

The present specification will be further elucidated by way of example embodiments, which will be described in detail by means of the accompanying drawings. The embodiments are not limiting, in which like numerals represent like structures, wherein:

FIG. 1 is an exemplary block diagram of an open earphone according to some embodiments of the present description;

fig. 2 is a schematic illustration of the wearing of an open earphone according to some embodiments of the present description;

FIG. 3 is a schematic diagram of an open earphone according to some embodiments of the present description;

FIG. 4 is yet another schematic diagram of an open earphone according to some embodiments of the present description;

FIG. 5 is a schematic cross-sectional view of an open earphone according to some embodiments of the present disclosure;

fig. 6 is a schematic illustration of the wearing of an open earphone according to some embodiments of the present description;

FIG. 7 is a schematic diagram of an open earphone according to some embodiments of the present description;

FIG. 8 is a schematic illustration of a plurality of exemplary locations of a second sound receiving aperture shown in accordance with some embodiments of the present description;

FIG. 9 is a plot of the frequency response of sound collected by the second sound receiving aperture at the plurality of exemplary positions shown in FIG. 8, respectively;

fig. 10 is a schematic structural view of a first microphone assembly according to some embodiments of the present disclosure;

FIG. 11 is a plot of the frequency response of wind noise collected by a first microphone with and without grooves or acoustic resistive mesh disposed on a structural member according to some embodiments of the present disclosure;

fig. 12 is a schematic structural view of a second microphone assembly according to some embodiments of the present disclosure;

Fig. 13 is a schematic structural view of a third microphone assembly according to some embodiments of the present disclosure;

Fig. 14 is a schematic diagram of an open earphone according to some embodiments of the present description.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

In order to more clearly illustrate the technical solutions of the embodiments of the present specification, the drawings used in the description of the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some examples or embodiments of the present specification, and it is possible for those of ordinary skill in the art to apply the present specification to other similar situations according to the drawings without inventive effort. It should be understood that these exemplary embodiments are presented merely to enable those skilled in the relevant art to better understand and practice the invention and are not intended to limit the scope of the invention in any way. Unless otherwise apparent from the context of the language or otherwise specified, like reference numerals in the figures refer to like structures or operations.

As used in this specification and the claims, the terms "a," "an," "the," and/or "the" are not specific to a singular, but may include a plurality, unless the context clearly dictates otherwise. In general, the terms "comprises" and "comprising" merely indicate that the steps and elements are explicitly identified, and they do not constitute an exclusive list, as other steps or elements may be included in a method or apparatus. The term "based on" is based at least in part on. The term "one embodiment" means "at least one embodiment" and the term "another embodiment" means "at least one other embodiment".

In the description of the present specification, it should be understood that the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an order of number or order of features indicated. Thus, a feature defining "a first", "a second", "a third", etc., may explicitly or implicitly include at least one such feature. In the description of the present specification, the meaning of "plurality" means at least two, for example, two, three, etc., unless explicitly defined otherwise.

A flowchart is used in this specification to describe the operations performed by the system according to embodiments of the present specification. It should be appreciated that the preceding or following operations are not necessarily performed in order precisely. Rather, the steps may be processed in reverse order or simultaneously. Also, other operations may be added to or removed from these processes.

Embodiments of the present disclosure provide an open earphone including a housing, a support structure, a first microphone assembly, a second microphone assembly, a processing circuit, and a speaker. The support structure is configured to place the housing in a worn state in a position adjacent to the ear of the user that does not block the ear canal, the first microphone assembly is configured to receive external sound through the first sound receiving aperture, and the second microphone assembly is configured to receive external sound through the second sound receiving aperture, wherein the first sound receiving aperture and the second sound receiving aperture are located on different sidewalls of the housing. The sound receiving holes described herein are located on the side wall (or side) of the housing, which may mean that the sound receiving holes are located on the side wall of the housing, or on other structures (e.g., protrusions) on the side wall of the housing. The processing circuit is configured to determine a target noise reduction strategy from a plurality of noise reduction strategies and to generate a first noise reduction signal in accordance with the target noise reduction strategy, wherein the plurality of noise reduction strategies includes at least two of taking the external sound collected by the first microphone assembly as ambient noise, taking the external sound collected by the second microphone assembly as ambient noise, and generating ambient noise in combination with the external sounds respectively collected by the first microphone assembly and the second microphone assembly. The speaker is located within the housing and is configured to generate a noise reduction sound driven by the first noise reduction signal. The embodiment of the specification can determine the target noise reduction strategy from various noise reduction strategies based on external sounds collected by a plurality of microphone assemblies (for example, a first microphone assembly, a second microphone assembly and the like) positioned at different positions on the shell, so that the accuracy of noise reduction processing of the open earphone is improved.

Fig. 1 is an exemplary block diagram of an open earphone according to some embodiments of the present specification, fig. 2 is a schematic diagram of wearing an open earphone according to some embodiments of the present specification, fig. 3 is a schematic diagram of an open earphone according to some embodiments of the present specification, and fig. 4 is yet another schematic diagram of an open earphone according to some embodiments of the present specification.

The open earphone 100 may be used to acquire and/or play sound. In a worn state (e.g., the worn state as shown in fig. 2), the open earphone 100 (e.g., the housing 110) may be worn in a position near the user's ear that does not occlude the ear canal. Because of the open nature, ambient noise is easily transmitted into the ear canal, so that the user may hear the noise in the ambient environment and the sound emitted by the open earphone at the same time, and the listening effect is affected. In some embodiments, a microphone assembly for capturing ambient noise and a speaker for converting electrical signals to sound may be provided on the open ended earphone 100. Based on the external sound collected by the microphone assembly, the speaker of the open earphone 100 may generate and play a noise reduction sound for canceling ambient noise, thereby reducing the influence of the ambient noise. In some embodiments, to enhance the conversation effect of the open earphone 100, the open earphone 100 may further utilize the microphone assembly described above, or otherwise configure other microphone assemblies to pick up sounds in a particular direction and/or a particular target range, such as, for example, the speaking voice of the user.

Referring to fig. 1-4, the open earphone 100 may include a housing 110, a support structure 120, a microphone assembly 200 (e.g., a first microphone assembly 130, a second microphone assembly 140, a third microphone assembly 170, etc.), a processing circuit 150, and a speaker 160.

The housing 110 is configured to carry one or more components of the open earphone 100. In some embodiments, the housing 110 may form a receiving cavity inside for receiving one or more components of the open earphone 100, such as the first microphone assembly 130, the second microphone assembly 140, the processing circuit 150, the speaker 160, and the like. In some embodiments, one or more components of the open ended headset 100 may be carried on the housing.

The housing 110 may be, for example, circular, oval, racetrack, polygonal, U-shaped, V-shaped, semi-circular, etc., regular or other irregular shape. In some embodiments, as shown in fig. 3, the housing 110 may have a long axis direction Y, a short axis direction X, and a thickness direction Z that are orthogonal to each other. The long axis direction Y may be defined as a direction having a larger extension in a shape of a two-dimensional projection plane of the case 110 (for example, a projection of the case 110 on a plane on which an inner side surface thereof is located in a wearing state, or a projection on a sagittal plane of a user) (for example, when the projection shape of the case 110 is rectangular or approximately rectangular, the long axis direction Y may also be referred to as a length direction of the case 110). For ease of description, the present description will be described in terms of a projection of the housing 110 on the sagittal plane when the open earphone 100 is worn on the human body. The short axis direction X may be defined as a direction perpendicular to the long axis direction Y in a shape of the hull 110 projected on the sagittal plane (for example, when the projected shape of the hull 110 is rectangular or nearly rectangular, the short axis direction X may also be referred to as a height direction of the hull 110). The thickness direction Z may be defined as a direction perpendicular to the sagittal plane, e.g. coincident with the direction of the coronal axis, both pointing in a direction to the left and right of the user's body.

In the fields of medicine, anatomy, etc., three basic tangential planes of the sagittal plane (SAGITTAL PLANE), the coronal plane (Coronal Plane), and the horizontal plane (HorizontalPlane) of the human body, and three basic axes of the sagittal Axis (Sagittal Axis), the coronal Axis (Coronal Axis), and the Vertical Axis (Vertical Axis) may be defined. The sagittal plane refers to a section perpendicular to the ground, which is taken along the front-back (e.g., front-to-back) direction of the body, and divides the human body into left and right parts, the coronal plane refers to a section perpendicular to the ground, which is taken along the left-right (e.g., left-to-right) direction of the body, and divides the human body into front-back parts, and the horizontal plane refers to a section parallel to the ground, which is taken along the up-down (e.g., top-to-bottom) direction of the body, and divides the human body into upper-lower parts. Accordingly, the sagittal axis refers to an axis along the anterior-posterior direction of the body and perpendicular to the coronal plane, the coronal axis refers to an axis along the lateral direction of the body and perpendicular to the sagittal plane, and the vertical axis refers to an axis along the superior-inferior direction of the body and perpendicular to the horizontal plane.

For convenience of description, the present specification defines different sides such as an inner side, an outer side, an upper side, a lower side, a front side, and a rear side for the case 110, wherein the inner side (e.g., the inner side IS shown in fig. 4) IS a side facing the ear of the user in a wearing state, the outer side (e.g., the outer side OS shown in fig. 2 and 3) IS a side facing away from the ear of the user in a wearing state, the upper side (e.g., the upper side US shown in fig. 2 and 3) IS a side facing the top of the user in the short axis direction X of the case 110 in a wearing state, the lower side (e.g., the lower side LS shown in fig. 2 and 4) IS a side facing away from the top of the user in the short axis direction X of the case in a wearing state, the front side FS (e.g., the front side FS shown in fig. 2 and 4) IS a side facing away from the back of the ear in the long axis direction Y in a wearing state, and the rear side BS (e.g., the rear side BS shown in fig. 2 and 4) IS a side facing the back of the ear in the long axis direction Y in a wearing state, based on the present specification.

As shown in fig. 2, the housing 110 may include a body 111 and a connection portion 112, and the connection portion 112 is used to connect the body 111 and the support structure 120. Illustratively, the body 111 may be used to carry a speaker assembly of the open earphone 100 and the connection may be used to carry a circuit board assembly of the open earphone 100. In some embodiments, the body 111 and the connection portion 112 may be an integrally formed structure. In some embodiments, the body 111 and the connection portion 112 may be a spliced structure. For convenience of description, the sides of the body 111 and the connection part 112 on the same side may be collectively referred to as sides of the housing 110. For example, the inner side IS of the housing 110 may refer to the inner side of the body 111 and/or the inner side of the connection portion 112. For another example, the outer side OS of the housing 110 may refer to the outer side of the body 111 and/or the outer side of the connection portion 112. In some embodiments, the body 111 and the connection part 112 may have different shapes, and the side of the body 111 may be mainly referred to at this time, thereby dividing the side of the connection part 112. By way of example only, the body 111 may be a rectangular parallelepiped, the connection portion 112 may be a cylinder, and the side surface of the connection portion 112 (e.g., a curved surface of the cylinder) may be divided into four portions corresponding to the rectangular parallelepiped, each portion corresponding to one side surface (i.e., an inner side surface, an outer side surface, an upper side surface, a lower side surface) of the body.

The support structure 120 is used to place the housing 110 in a worn state in a position adjacent to the user's ear that does not occlude the ear canal. As shown in fig. 2, in the worn state, the support structure 120 is positioned at the ear and supports the housing 110, and the support structure 120 can wear the housing 110 in a position near the ear canal but not blocking the mouth of the ear canal.

In some embodiments, the open earphone 100 may be an ear-hook earphone. As shown in fig. 2, the support structure 120 may be an arcuate structure that fits over the user's ear so that the open ended headset 100 may hang from the user's ear. In the worn state, the support structure 120 is located on the back side of the ear (i.e., the side of the pinna facing the head), and one end of the support structure 120 extends to the front side of the ear (i.e., the side of the pinna facing away from the head) and is connected to the connection portion 112 of the housing 110.

In some embodiments, the open earphone 100 may also be an ear clip earphone. Correspondingly, the open earphone 100 may further comprise an abutment against the back of the user's ear. For example, the abutment may abut against the back of the user's concha cavity. The abutment may be spherical, cylindrical, square, rectangular or other shape. The support structure 120 may connect the abutment with the housing 110. In the wearing state, the supporting structure 120 may bypass the anthelix and the auricle of the user, so that the housing 110 is located in the concha cavity of the user and contacts with the concha cavity wall, the abutting portion abuts against the ear of the user, and the housing 110, the abutting portion and the supporting structure 120 cooperate to clamp the anthelix and the anthelix of the user, thereby completing the wearing of the open earphone 100.

In some embodiments, to improve the stability of the open earphone 100 in the worn state, the open earphone 100 may employ any one or a combination of the following. First, at least a portion of the support structure 120 is configured as a contoured structure that conforms to at least one of the back side of the ear and the head to increase the contact area of the support structure 120 with the ear and/or the head, thereby increasing the resistance to the open ended earphone 100 falling off of the ear. Secondly, at least part of the supporting structure 120 is configured as an elastic structure, so that the supporting structure has a certain deformation amount in a wearing state, so as to increase the positive pressure of the supporting structure 120 on the ear and/or the head, thereby increasing the resistance of the open earphone 100 falling off from the ear. Third, the support structure 120 is at least partially configured to rest on the head in a worn state, such that it forms a reaction force against the ear such that the housing 110 is pressed against the front side of the ear, thereby increasing the resistance to the open earphone 100 falling off the ear. Fourth, the housing 110 and the supporting structure 120 are configured to clamp physiological parts such as an area where the antitragus is located, an area where the concha cavity is located, and the like from both front and rear sides of the ear in a wearing state, thereby increasing resistance of the open earphone 100 falling off from the ear. Fifth, the housing 110 or an auxiliary structure connected thereto is configured to extend at least partially into the user's concha cavity, concha boat, triangular fossa, and ear boat, etc., thereby increasing the resistance of the open earphone 100 from falling off the ear.

In some embodiments, a battery may be included in the open earphone 100, and the support structure 120 may also be used to house the battery.

In some embodiments, the microphone assembly 200 may include a first microphone assembly 130. The first microphone assembly 130 is used for capturing external sounds. In some embodiments, at least a portion of the first microphone assembly 130 may be disposed inside the housing 110. For example, the first microphone assembly 130 may be disposed in the receiving cavity of the housing 110 and receive external sound through the first sound receiving hole 131. For another example, a portion of the first microphone assembly 130 may be disposed within the receiving cavity of the housing 110, and another portion may be disposed protruding from the housing surface. In some embodiments, the first microphone assembly 130 may be disposed outside the housing 110. For example, the first microphone assembly 130 may also be disposed on a surface of the housing 110. In some embodiments, the first microphone assembly 130 may also be disposed in other structures of the open earphone 100, such as in the support structure 120 or on a surface of the support structure 120.

In some embodiments, the first microphone assembly 130 may be used to collect external ambient noise. The open earphone 100 (e.g., the processing circuit 150) may generate a noise reduction signal from the electrical signal generated by the first microphone assembly 130 and accordingly drive the speaker 160 to output noise reduction sounds capable of canceling the ambient noise.

To ensure that the ambient noise collected by the first microphone assembly 130 is closer to the noise of the user's surroundings (i.e., the ambient noise that is transmitted into the user's ear canal), the shielding of the first sound receiving aperture 131 by the auricle, the support structure 120, and the housing 110 when worn is reduced, and in some embodiments, the first sound receiving aperture 131 may be located on one of the front side, the outer side, and the lower side of the housing 110. For example, the first sound receiving hole 131 shown in fig. 3 is located on the outer side surface OS of the housing 110. In some embodiments, to avoid the first microphone assembly 130 from capturing sound generated by the open ended earphone 100 and thereby interfering with the ambient noise captured thereby, the first sound receiving aperture 131 may be disposed near the acoustic zero of the open ended earphone 100.

In some embodiments, the first microphone assembly 130 may also be used to collect the speaking voice of the user. At this time, the first microphone assembly 130 may cooperate with another microphone assembly or assemblies to form a microphone array directed toward the user's mouth, thereby primarily capturing the sound of the user's mouth.

For more details about the first microphone assembly 130 and/or the first sound receiving aperture 131, reference is made to fig. 6-10 and their associated descriptions, which are not repeated here.

In some embodiments, the microphone assembly 200 may include a second microphone assembly 140. The second microphone assembly 140 is used for capturing external sounds. In some embodiments, at least a portion of the second microphone assembly 140 may be disposed inside the housing 110. For example, the second microphone assembly 140 may be disposed in the receiving cavity of the housing 110 and receive external sound through the second sound receiving hole 141. For another example, a portion of the second microphone assembly 140 may be disposed within the receiving cavity of the housing 110, and another portion may be disposed protruding from the housing surface. The second microphone assembly 140 may be disposed outside the housing 110. For example, the second microphone assembly 140 may also be disposed on a surface of the housing 110. In some embodiments, the second microphone assembly 140 may also be disposed in other structures of the open earphone 100, for example, the second microphone assembly 140 may also be disposed in the support structure 120 or on a surface of the support structure 120. The second microphone assembly 140 may be disposed on the same structure as the first microphone assembly 130, for example, the second microphone assembly 140 and the first microphone assembly 130 may be disposed in the accommodating cavity. The second microphone assembly 140 may also be disposed on a different structure than the first microphone assembly 130, e.g., the second microphone assembly 140 may be disposed within the receiving cavity and the first microphone assembly 130 may be disposed in the support structure 120.

In some embodiments, the second microphone assembly 140 may be used to collect external ambient noise. The open earphone 100 (e.g., the processing circuit 150) may generate a noise reduction signal from the electrical signal generated by the second microphone assembly 140 and accordingly drive the speaker 160 to output noise reduction sounds capable of canceling the ambient noise. In some embodiments, the second sound receiving hole 141 may be provided on the upper side US. Through setting up the second radio hole 141 in the upside, auricle, bearing structure 120 and casing 110 can shelter from the part to the second radio hole 141 when wearing the state, reduce along sagittal axis from the air current in front of user's health to behind the health and cause the influence to the second radio hole 141, can effectively reduce the wind noise in the external sound that the second radio hole 141 gathered. Since the noise reduction effect of the open earphone 100 may be disturbed by the presence of wind noise, the active noise reduction effect may be achieved in the environment where wind noise exists by using the environmental noise picked up by the second microphone assembly 140.

In some embodiments, to avoid the second microphone assembly 140 from capturing sound generated by the open ended earphone 100 and thereby interfering with the ambient noise captured thereby, the second sound receiving aperture 141 may be disposed near the acoustic zero of the open ended earphone 100. For more details about the second microphone assembly 140 and/or the second sound receiving hole 141, refer to fig. 6-9 and fig. 11 and their descriptions, which are not repeated here.

In some embodiments, the second microphone assembly 140 may cooperate with another microphone or microphones to form a microphone array directed toward the user's mouth. For example, as shown in fig. 2, in the wearing state, the second sound receiving hole 141 connects with the first sound receiving hole 131 to form a vector L, and the vector L points to the mouth of the user, so that the microphone array formed by the first microphone assembly 130 and the second microphone assembly 140 can mainly collect the sound of the mouth of the user.

Some embodiments of the present disclosure may allow the open earphone 100 to effectively identify environmental noise to be reduced in different noise environments by providing the first microphone assembly 130 and the second microphone assembly 140 at different positions of the open earphone 100, and by using the difference in the effect of picking up environmental sounds between the two microphone assemblies, the noise reduction effect of the open earphone 100 is improved, and a better listening experience is provided for a user. In addition, the microphone array pointing to the mouth of the user can be constructed by setting the positions of the first sound receiving hole 131 and the second sound receiving hole 141 corresponding to the first microphone assembly 130 and the second microphone assembly 140, so that the microphone array can better collect the sound emitted by the mouth of the user when the user uses the open earphone 100 to talk, thereby improving the talk quality. Further description of noise reduction and/or collection of sound of the user's mouth with the first and second microphone assemblies 130, 140 may be found in fig. 6 and its description.

The processing circuitry 150 may process data and/or information obtained from one or more components of the open ended headset 100 (e.g., the first microphone assembly 130, the second microphone assembly 140, the speaker 160, etc.) or other devices to implement the desired functionality of the open ended headset 100. For example, the processing circuit 150 may obtain data and/or information from a user's terminal device and control the function of the speaker 160 based on the data and/or information. As another example, the processing circuit 150 may acquire external sounds collected by a microphone assembly (e.g., any one or more of the first microphone assembly 130, the second microphone assembly 140, the third microphone assembly 170, etc.) and generate a noise reduction signal based on the external sounds, thereby implementing active noise reduction.

In some embodiments, the open earphone 100 may include a first microphone assembly 130 and a second microphone assembly 140. The second microphone assembly 140 functions the same or similar to the first microphone assembly 130, with the difference that in a daily use scenario, the second sound receiving hole 141 may be disposed on the upper side US, so that the sound collected by the second microphone assembly 140 contains less wind noise than the first microphone assembly 130.

Based on the difference between the environmental noise collected by the first microphone assembly 130 and the second microphone assembly 140, some embodiments of the present disclosure may select at least one of the first microphone assembly 130 and the second microphone assembly 140 as a feedforward microphone to collect the environmental noise according to different scenes, so as to perform noise reduction processing, and ensure the active noise reduction effect of the open earphone 100 under different scenes. For example, the processing circuit 150 may determine a target noise reduction strategy from among a plurality of noise reduction strategies and generate a noise reduction signal (or referred to as a first noise reduction signal) according to the target noise reduction strategy. The speaker 160 may generate noise reduction sound under the driving of the noise reduction signal. The noise reduction sound can be the same in amplitude and opposite in phase to the noise at the user's ear canal, so that the noise at the user's ear canal can be eliminated. The plurality of noise reduction strategies includes at least two of taking the external sound collected by the first microphone assembly 130 as ambient noise, taking the external sound collected by the second microphone assembly 140 as ambient noise, and generating ambient noise in combination with the external sound collected by the first microphone assembly 130 and the second microphone assembly 140, respectively.

In some embodiments, the processing circuit 150 may determine a target noise reduction strategy from among a plurality of noise reduction strategies based on the trigger information, thereby determining a feed-forward microphone from the first microphone assembly 130 and the second microphone assembly 140. The triggering information may be used to designate the electrical signal generated by the first microphone assembly 130 and/or the second microphone assembly 140 as a basis for subsequent noise reduction, and accordingly, reflect the microphone corresponding thereto as a feedforward microphone. For example, the processing circuit 150 may determine, based on the trigger information, that each of the first microphone assembly 130 and the second microphone assembly 140 is a feedforward microphone, that is, each of the first microphone assembly 130 and the second microphone assembly 140 collects environmental noise, and the processing circuit 150 may generate environmental noise generation in combination with external sounds collected by the first microphone assembly 130 and the second microphone assembly 140, respectively, to generate the first noise reduction signal. For another example, the processing circuit 150 may also determine the first microphone assembly 130 as a feedforward microphone based on the trigger information, i.e., the processing circuit 150 may use external sound collected by the first microphone assembly 130 as ambient noise to generate the first noise reduction signal based on the ambient noise collected by the first microphone assembly 130. For another example, the processing circuit 150 may also determine the second microphone assembly 140 as a feedforward microphone based on the trigger information, i.e., the processing circuit 150 may take the external sound collected by the second microphone assembly 140 as ambient noise, thereby generating the first noise reduction signal based on the ambient noise collected by the second microphone assembly 140.

In some embodiments, the trigger information may be determined by a user (e.g., a user or other object that may manipulate the open earphone 100). For example, a trigger button may be provided on the housing 110, and the user may control the trigger button, and the processing circuit 150 may determine trigger information based on the trigger button, thereby determining a feed-forward microphone from the first microphone assembly 130 and the second microphone assembly 140. For another example, the user may also issue trigger information via a user terminal (e.g., cell phone, computer, etc.) communicatively coupled to the open earphone 100, which the processing circuit 150 may receive to determine a feed-forward microphone from the first microphone assembly 130 and the second microphone assembly 140.

In some embodiments, the processing circuit 150 may also acquire and analyze the external sounds collected by the first microphone assembly 130 and the external sounds collected by the second microphone assembly 140 to determine a target noise reduction strategy from among a plurality of noise reduction strategies.

In some embodiments, the processing circuit 150 may treat the external sound collected by the first microphone assembly 130 or the second microphone assembly 140 as ambient noise in response to the wind noise in the external sound collected by the first microphone assembly 130 or the second microphone assembly 140 meeting a first condition, or the processing circuit 150 may treat the external sound collected by the second microphone assembly 140 as ambient noise in response to the wind noise in the external sound collected by the first microphone assembly 130 or the second microphone assembly 140 meeting a second condition. The first condition may refer to a smaller wind noise in the external sound collected by the first microphone assembly 130, and the second condition may refer to a larger wind noise in the external sound collected by the first microphone assembly 130.

For example, when the first microphone assembly 130 and the second microphone assembly 140 collect external sounds, the difference between the sounds collected by the two is mainly due to wind noise, and is represented by the difference between the intensity and the duty ratio of the low-frequency components in the generated electric signals. Thus, the processing circuit 150 may analyze (e.g., compare the spectrogram differences of) the external sound collected by the first microphone assembly 130 and the external sound collected by the second microphone assembly 140 to determine the sound differences. When the difference between the sounds is less than or equal to the preset difference threshold (for example, the difference between the low frequency components in the sounds collected by the first microphone assembly 130 and the second microphone assembly 140 is less than the preset difference threshold), it indicates that the noise in the external sound collected by the first microphone assembly 130 is small, and the processing circuit 150 may use the external sound collected by the first microphone assembly 130 as the environmental noise. When the difference between the sounds is greater than the preset difference threshold, it is indicated that the noise in the external sound collected by the first microphone assembly 130 is greater, and the processing circuit 150 may use the external sound collected by the second microphone assembly 140 as the environmental noise, and perform the noise reduction process based on the environmental noise collected by the second microphone assembly 140.

In some embodiments, the processing circuit 150 may also input the external sounds collected by the first microphone assembly 130 and/or the external sounds collected by the second microphone assembly 140 into a machine learning model, thereby using the machine learning model to determine which microphone assembly collected the external sounds as ambient noise. The output of the machine learning model may be a target noise reduction strategy. The machine learning model may be a convolutional neural network model or any other machine learning model that can implement its function. The machine learning model may be obtained through training by training samples, which may include a first sample sound collected by the first microphone assembly 130 and a second sample sound collected by the second microphone assembly 140, and the training label may include a sample target noise reduction strategy. The training sample can be obtained manually, for example, when part of the first sample sound is collected, the airflow is manufactured so that part of the first sample sound has larger wind noise, and when the second sample sound is collected and part of the first sample sound is collected, the airflow speed is controlled, so that wind noise is avoided. Training tags may be obtained by manual labeling. For example, when the first sample sound has a large wind noise, the sample target noise reduction strategy may be to treat the external sound collected by the second microphone assembly 140 as ambient noise.

In some embodiments, the processing circuit 150 may also acquire and analyze the external sound captured by the first microphone assembly 130 to determine a target noise reduction strategy. For example, the processing circuit 150 may determine whether a sound pressure level of a preset frequency band range in the external sound collected by the first microphone assembly 130 is less than or equal to a preset sound pressure level threshold. The preset frequency range may be a frequency range in which wind noise occurs frequently. For example, the preset frequency range may be 20hz to 1000hz. When the sound pressure level of the preset frequency band range in the external sound is less than or equal to the preset sound pressure level threshold, the external sound collected by the first microphone assembly 130 is characterized as having smaller wind noise, and the first condition is satisfied, so that the processing circuit 150 can use the external sound collected by the first microphone assembly 130 as the environmental noise. When the sound pressure level of the preset frequency range in the external sound is greater than the preset sound pressure level threshold, the external sound collected by the first microphone assembly 130 is characterized as having greater wind noise, and the second condition is satisfied, so that the processing circuit 150 may use the external sound collected by the second microphone assembly 140 as the environmental noise.

According to the embodiments of the present disclosure, the feedforward microphone may be determined from the first microphone assembly 130 and the second microphone assembly 140 through the foregoing arrangement, when the collected environmental noise is smaller, the external sound collected by the first microphone assembly 130 may be selected as the environmental noise, so as to ensure that the environmental noise during the noise reduction process is closer to the environmental noise heard by the user, and improve the noise reduction effect of the open earphone 100, and when the collected environmental noise is larger, the external sound collected by the second microphone assembly 140 may be selected as the environmental noise, so as to reduce the adverse effect caused by the wind noise in the environmental noise during the noise reduction process, and improve the accuracy of the noise reduction process of the open earphone 100. Further, the processing circuit 150 may also automatically determine the target noise reduction strategy, so as to determine the feedforward microphone from the second microphone assembly 140 in the first microphone assembly 130, thereby improving the user experience.

Based on the variability of the environmental noise collected by the first microphone assembly 130 and the second microphone assembly 140, some embodiments of the present disclosure may also perform noise reduction processing in conjunction with the environmental noise collected by the first microphone assembly 130 and the second microphone assembly 140. For example, in response to wind noise in the external sounds collected by the first microphone assembly 130 or the second microphone assembly 140 meeting the second condition, the processing circuit 150 generates ambient noise in conjunction with the external sounds collected by the first microphone assembly 130 and the second microphone assembly 140, respectively.

As described above, wind noise is mainly concentrated at low frequencies, and thus low frequency components in the ambient noise collected by the first microphone assembly 130 are more susceptible to wind noise. Therefore, when the wind noise in the external sound collected by the first microphone assembly 130 or the second microphone assembly 140 satisfies the second condition (i.e., the wind noise is large), the processing circuit 150 may extract the corresponding frequency component from the external sound collected by the first microphone assembly 130 and the second microphone assembly 140 and generate the noise reduction signal according to the frequency component. As an example, a high frequency component of the external sound collected by the first microphone assembly 130, which is not susceptible to wind noise, and a low frequency component of the external sound collected by the second microphone assembly 140, which is not susceptible to wind noise, may be used for the subsequent noise reduction process. Specifically, the processing circuit 150 may acquire the environmental noise acquired by the first microphone assembly 130 (for convenience of description, the environmental noise acquired by the first microphone assembly 130 may also be referred to as a first environmental noise), acquire the environmental noise acquired by the second microphone assembly 140 (for convenience of description, the environmental noise acquired by the second microphone assembly 140 may also be referred to as a second environmental noise), and generate the target environmental noise based on the first environmental noise in the first frequency band and the second environmental noise in the second frequency band. The target environmental noise refers to environmental noise that is ultimately required to be noise-reduced. Wherein the second frequency band is higher than the first frequency band. The first frequency band and the second frequency band may be determined based on a preset. For example, the first frequency band may be 20-1000 Hz, and the second frequency band may be 1000-20000 Hz.

Because wind noise often occurs in low frequency, the processing circuit 150 generates the target environmental noise by selecting the first environmental noise in the first frequency band and the second environmental noise in the second frequency band, and further generates the first noise reduction signal based on the target environmental noise, so that the frequency band without wind noise in the first environmental noise can be reserved, the frequency band with wind noise in the first environmental noise is removed, and the frequency band removed in the first environmental noise is compensated based on the second environmental noise, thereby not only reducing wind noise in the environmental noise during noise reduction, but also enabling the environmental noise during noise reduction to be as close as possible to the environmental noise heard by the user, and improving the noise reduction effect of the open earphone 100.

In some embodiments, the processing circuit 150 may directly generate ambient noise in conjunction with the external sounds collected by the first microphone assembly 130 and the second microphone assembly 140, respectively, without determining whether the wind noise in the external sounds collected by the first microphone assembly 130 or the second microphone assembly 140 satisfies the second condition. For example, the processing circuit 150 may obtain external sounds collected by the first and second microphone assemblies 130 and 140, extract therefrom first ambient noise in the first frequency band and second ambient noise in the second frequency band, and thereby generate the target ambient noise.

In some embodiments, the open earphone 100 may include and only include the first microphone assembly 130 and the second microphone assembly 140, and perform noise reduction processing through ambient noise collected by at least one of the first microphone assembly 130 and the second microphone assembly 140, and by this arrangement, an inverted signal may be generated more quickly to perform noise reduction, reducing noise reduction delay, and improving real-time performance of noise reduction.

In some embodiments, the microphone assembly 200 may include a third microphone assembly 170. The third microphone assembly 170 may be used to collect external sounds. In some embodiments, at least a portion of the third microphone assembly 170 may be disposed inside the housing 110. For example, the third microphone assembly 170 may be disposed in the receiving cavity of the housing 110 and receive external sound through the third sound receiving hole 171. For another example, a portion of the third microphone assembly 170 may be disposed within the receiving cavity of the housing 110, and another portion may be disposed protruding from the housing surface. In some embodiments, the third microphone assembly 170 may be disposed outside the housing 110. For example, the third microphone assembly 170 may also be disposed on a surface of the housing 110. In some embodiments, when the open earphone 100 includes the first microphone assembly 130, the second microphone assembly 140, and the third microphone assembly 170 at the same time, the first microphone assembly 130, the second microphone assembly 140, and the third microphone assembly 170 may be disposed on the same structure in the open earphone 100 or may be disposed on different structures in the open earphone 100.

In some embodiments, the third microphone assembly 170 may be used to collect external ambient noise. The open earphone 100 (e.g., the processing circuit 150) may generate a noise reduction signal from the electrical signal generated by the third microphone assembly 170 and drive the speaker 160 accordingly to output a noise reduction sound capable of canceling the ambient noise. In some embodiments, the third microphone assembly 170 may be used to collect noise at the user's ear canal and the processing circuit 150 may generate a noise reduction signal based on the collected noise at the ear canal. The speaker 160 may generate noise-reducing sounds of the same magnitude and opposite phase as noise at the ear canal based on the noise-reducing signals to cancel noise at the ear canal of the user. In some embodiments, the third sound receiving aperture 171 may be located on the medial side IS and closer to the user's ear canal opening. Such an arrangement may allow the sound collected by the third microphone assembly 170 to more closely approximate the sound at the user's ear canal, thereby improving the accuracy of noise reduction using the third microphone assembly 170.

In some embodiments, the third microphone assembly 170 may be used to collect user speech during a conversation.

For more details regarding the third microphone assembly 170, reference is made to fig. 13 and the related description thereof, and the detailed description thereof is omitted.

In some embodiments, the open earphone 100 may include and only include one microphone assembly. The microphone assembly may be used to collect external sounds of the open earphone 100 for noise reduction processing, and may also be used to collect voices of a user during a call. For example, the open earphone 100 may include and only include the first microphone assembly 130. As another example, the open earphone 100 may include and only include the second microphone assembly 140. As another example, the open earphone 100 may include and only include the third microphone assembly 170.

In some embodiments, the open earphone 100 may include, and only include, two microphone assemblies.

For example, the open earphone 100 may include and only include the first microphone assembly 130 and the second microphone assembly 140. The first microphone assembly 130 and the second microphone assembly 140 may both collect ambient noise as feedforward microphones. In performing the noise reduction process, the processing circuit 150 may select at least one of the first microphone assembly 130 and the second microphone assembly 140 as a feed-forward microphone (i.e., determine a target noise reduction strategy from a plurality of noise reduction strategies) to generate the noise reduction signal. In addition, the microphone array pointing to the mouth of the user can be constructed by setting the positions of the first sound receiving hole 131 and the second sound receiving hole 141 corresponding to the first microphone assembly 130 and the second microphone assembly 140, so that the microphone array can better collect the sound emitted by the mouth of the user when the user uses the open earphone 100 to talk, thereby improving the talk quality.

As another example, the open earphone 100 may include and only include the first microphone assembly 130 (or the second microphone assembly 140) and the third microphone assembly 170. The first microphone assembly 130 (or the second microphone assembly 140) may function as a feed forward microphone and the third microphone assembly 170 may function as a feedback microphone for active noise reduction. For example, the processing circuit 150 may take the external sound collected by the first microphone assembly 130 (or the second microphone assembly 140) as ambient noise to generate a first noise reduction signal, and drive the speaker 160 to generate noise reduction sound (or referred to as first noise reduction sound) based on the first noise reduction signal. The third microphone assembly 170 may collect a second noise reduction sound. The second noise reduction sound refers to noise that remains after the noise reduction sound generated by the speaker 160 based on the first noise reduction signal and the environmental noise cancel at the ear canal. The processing circuit 150 may adjust the first noise reduction signal according to the second noise reduction sound. For example, the processing circuit 150 may adjust the magnitude and phase of the first noise reduction signal based on the electrical signal generated by the third microphone assembly 170. The speaker 160 may generate the adjusted noise reduction sound under the driving of the adjusted first noise reduction signal, so that the residual noise at the ear canal of the user may be further removed.

In some embodiments, the open earphone 100 may include three microphone assemblies. For example only, in some embodiments, the open earphone 100 may include a first microphone assembly 130, a second microphone assembly 140, and a third microphone assembly 170, and actively reduce noise through at least one of the aforementioned first microphone assembly 130, second microphone assembly 140, and third microphone assembly 170. For example, the open earphone 100 may collect ambient noise based on at least one of the first and second microphones 130, 140, and may also collect a second noise reduction sound (or referred to as residual noise) at the ear canal by the third microphone assembly 170, and the processing circuit 150 may perform an analysis process with the second noise reduction sound based on the ambient noise and generate the first noise reduction signal. For example, the processing circuit 150 may perform processing based on the following formula:

e(t)=p(t)+y(t), (1)

Where y (t) is the first noise reduction signal, p (t) is the ambient noise, and e (t) is the second noise reduction sound at the ear canal. The processing circuit 150 may continuously update the first noise reduction signal based on the environmental noise and the second noise reduction sound, so that the second noise reduction sound collected by the third microphone assembly 170 is as small as possible, so as to improve the noise reduction effect of the open earphone 100.

In some embodiments, when the third microphone assembly 170 is used as a feedback microphone, the third microphone assembly 170 as a feedback microphone may be closer to the user's ear canal than the first microphone assembly 130 and/or the second microphone assembly 140 as feedforward microphones in order to be able to more accurately reflect sound at the user's ear canal. To this end, in some embodiments, a corresponding third sound receiving aperture 171 of the third microphone assembly 170 may be located on an inner side of the housing 110 and closer to the ear canal opening of the user.

In some embodiments, when the open ended headset 100 may include three microphone assemblies, at least one of the three microphone assemblies may be used to collect user speech during a conversation. For example, during a conversation, the first microphone assembly 130, the second microphone assembly 140, and the third microphone assembly 170 may each be used to collect user speech during the conversation. In the event that the sounds picked up by the first microphone assembly 130 and/or the second microphone assembly 140 are loud, the processing circuit 150 may select one of the sounds picked up by the first microphone assembly 130, the second microphone assembly 140, and the third microphone assembly 170 as the user's speaking sound. For example only, the processing circuit 150 may compare the intensities, duty ratios, etc. of the low frequency components in the sounds picked up by the three microphone assemblies, thereby selecting the sound with the smallest wind noise from the sounds picked up by the three microphone assemblies as the speaking voice of the user. As another example, the processing circuit 150 may select one of the sounds picked up by the three microphone assemblies with the highest signal-to-noise ratio as the user's speaking voice. For another example, the processing circuit 150 may compare the voice quality of the sounds picked up by the three microphone assemblies based on a voice activity detection algorithm, thereby selecting the one with the highest voice quality as the speaking voice of the user.

The speaker 160 may be used to convert electrical signals into sound. In some embodiments, the speaker 160 may be located within the housing 110 and configured to generate a noise reduction sound driven by the first noise reduction signal. The noise reduction sound may perform noise reduction processing on the open earphone 100. In some embodiments, speaker 160 may also output other audio, such as alert sounds, audio played according to user needs, and the like.

The housing 110 may include one or more sound outlets thereon through which the speaker 160 may output the generated sound signals to the outside of the housing 110. As shown in fig. 3 and 4, a first sound outlet 1111 may be provided on the inner side IS of the housing 110, for guiding the sound generated at the front side of the speaker 160 out of the housing 110 and toward the ear canal. Other side walls of the housing 110 (e.g., on the outer side surface OS) may be provided with second sound outlet holes 1112 for balancing the air pressure inside the housing 110 when the speaker 160 vibrates. The second sound outlet 1112 may also be configured to cancel sound (e.g., far-field sound) generated by the rear side of the speaker 160 after being directed out of the housing 110 and directed out of the first sound outlet 1111, thereby reducing leakage of the open earphone 100 in the far field.

In some embodiments, speaker 160 may be a single diaphragm speaker. The first sound outlet 1111 may be in communication with the front side of the diaphragm (i.e., the front side of the speaker 160) and the second sound outlet 1112 may be in communication with the back side of the diaphragm. In some embodiments, speaker 160 may also be a dual diaphragm speaker. The double-diaphragm loudspeaker can comprise a magnetic circuit assembly, a voice coil and a first diaphragm and a second diaphragm which are arranged on two sides of the magnetic circuit assembly, and the first diaphragm and the second diaphragm can be driven to vibrate respectively through the action of the magnetic circuit assembly and the voice coil.

In some embodiments, the first diaphragm and the second diaphragm may be driven by different voice coils (e.g., the first diaphragm is driven by a first voice coil and the second diaphragm is driven by a second voice coil) to drive the first diaphragm and the second diaphragm to vibrate asynchronously or to drive the first diaphragm and the second diaphragm to vibrate synchronously. Further details regarding the dual-diaphragm speaker can be found in fig. 5 and the related description thereof, and are not repeated here.

Fig. 5 is a schematic cross-sectional view of an open earphone according to some embodiments of the present description.

For example only, the speaker 160 may be a dual diaphragm speaker with dual voice coils. As shown in fig. 5, the dual-diaphragm speaker 160 may include a first diaphragm 161, a second diaphragm 162, a magnetic circuit assembly 163, a first voice coil 164, and a second voice coil 165. The first diaphragm 161 and the second diaphragm 162 may be disposed at intervals on both sides of the magnetic circuit assembly 163 in the thickness direction Z of the housing 110 and symmetrical with respect to a center plane (e.g., center plane a shown in fig. 7 or 12). The magnetic circuit assembly 163 may include a magnet 1631, a first magnetic conductive plate 1632, and a second magnetic conductive plate 1633, one end of the first voice coil 164 is located in the magnetic gap of the magnetic circuit assembly 163, the other end of the first voice coil 164 is connected to the first diaphragm 161, one end of the second voice coil 165 is located in the magnetic gap of the magnetic circuit assembly 163, and the other end of the second voice coil 165 is connected to the second diaphragm 162. When the first voice coil 164 and/or the second voice coil 165 are energized, they vibrate under the action of the magnetic field and drive the corresponding first diaphragm 161 and/or the second diaphragm 162 to vibrate, thereby generating sound. The vibration direction of the first diaphragm 161 and/or the second diaphragm 162 may be parallel or substantially parallel to the thickness direction Z of the housing.

In some embodiments, as shown in fig. 5, the aforementioned dual-diaphragm speaker may further include a connector 166 (for ease of illustration, the connector 166 may also be referred to as a first connector 166). The first connector 166 may connect the first voice coil 164 and the second voice coil 165, thereby enabling the first diaphragm 161 and the second diaphragm 162 to perform synchronous vibration better.

In some embodiments, the dual-diaphragm speaker may not include the first connector 166, and the open earphone 100 may respectively power the first voice coil 164 and the second voice coil 165 to respectively drive the first diaphragm 161 and the second diaphragm 162 to vibrate, where the vibrations of the first diaphragm 161 and the second diaphragm 162 may be the same direction vibration or different direction vibration.

In some embodiments, the first diaphragm 161 and the second diaphragm 162 may also be driven by the same voice coil, so that the first diaphragm 161 and the second diaphragm 162 vibrate synchronously in the same direction. For example, the speaker 160 may be a single-voice-coil dual-diaphragm speaker, where the single-voice-coil dual-diaphragm speaker may include a magnetic circuit assembly, a voice coil, a second connector, a first diaphragm and a second diaphragm, where the magnetic circuit assembly may include a magnetic conductive plate and a magnet, the first diaphragm and the second diaphragm are respectively located at two opposite sides of the magnetic circuit assembly, one end of the voice coil is located in a magnetic gap of the magnetic circuit assembly, and the other end of the voice coil is connected with the first diaphragm. When the voice coil is electrified, the voice coil can vibrate under the action of the magnetic field and drive the corresponding first vibrating diaphragm to vibrate. In the vibration direction of first vibrating diaphragm and second vibrating diaphragm, magnetic circuit subassembly is equipped with the through-hole, and the second vibrating diaphragm can be connected with first vibrating diaphragm or voice coil loudspeaker voice coil through the second connecting piece to vibrate under the drive of first vibrating diaphragm or voice coil loudspeaker voice coil.

The housing 110 may include one or more sound outlets thereon through which the speaker 160 may output the generated sound signals to the outside of the housing 110. For example, referring to fig. 3 and 4, a first sound outlet 1111 may be disposed on the inner side IS of the housing 110, so as to guide sound generated on the front side of the speaker 160 (i.e., on the side of the first diaphragm 161 facing away from the second diaphragm 162) out of the housing 110 and toward the ear canal. Other side walls of the housing 110 (e.g., on the outer side surface OS) may be provided with second sound outlet holes 1112 for balancing the air pressure inside the housing 110 when the speaker 160 vibrates. The second sound outlet 1112 may also be configured to cancel sound (e.g., far-field sound) generated by the rear side of the speaker 160 (i.e., the side of the second diaphragm 162 facing away from the first diaphragm 161) after being directed out of the housing 110, and the sound (e.g., far-field sound) generated by the first sound outlet 1111. Illustratively, the speaker 160 may emit sounds having a phase difference (e.g., opposite phases) through the first sound emitting hole 1111 and the second sound emitting hole 1112, which may interfere with each other in the far field, to form an effect of reducing leakage sound. The first sound outlet 1111 and/or the second sound outlet 1112 may be a single hole or may include a plurality of small holes spaced apart. For example, the holes may be formed by directly punching the surface of the housing 110, or may be holes in an acoustic steel mesh or an acoustic gauze corresponding to the speaker 160.

According to the embodiment of the invention, the double-diaphragm loudspeaker is arranged, so that the magnetic field utilization rate of the magnetic circuit assembly and the space utilization rate of the shell 110 can be improved, and the effective contact area between the diaphragm and air can be remarkably increased due to the arrangement of the double diaphragms, so that the air quantity of the diaphragm which can be pushed in the vibration process is increased, and the open earphone 100 provides higher-strength output. In an open scenario, the ambient noise heard by the user may be significantly greater than when wearing an in-ear earphone. By improving the output performance of the open earphone 100, it is possible to allow the open earphone 100 to output noise reduction sound of higher volume, thereby ensuring the noise reduction effect of the open earphone 100. In some embodiments, the two diaphragms of the dual-diaphragm speaker can vibrate synchronously in the same direction, so that the open earphone 100 can provide higher-intensity output with lower distortion, and meanwhile, the amplitude frequency response and the phase frequency response of the sound wave generated by the open earphone 100 are more stable and have smaller fluctuation, so that the open earphone 100 has flatter output in a wider frequency range, and the active noise reduction effect in a wider frequency range is further enhanced.

In addition, under the configuration of two vibrating diaphragm speakers, the cavity that corresponds respectively to two vibrating diaphragms is designed more easily, for example, be convenient for get the cavity structure that corresponds first sound hole and second sound hole and tend to unanimous to make the frequency response of the sound of follow first sound hole and second sound hole output more unanimous, be favorable to improving in bigger frequency band scope and fall the leakage sound effect.

As described above, at least one of the first microphone assembly 130 and the second microphone assembly 140 may collect ambient noise as a feedforward microphone. In order to ensure that the environmental noise collected by the first microphone assembly 130 is closer to the noise of the surrounding environment of the user, the auricle and the shielding of the housing 110 to the first sound receiving hole 131 during wearing are reduced, and the first sound receiving hole 131 may be located on one of the front side, the outer side and the lower side of the housing 110. For example, the first sound receiving hole 131 shown in fig. 3 is located at the outer side surface OS of the housing 110.

In some embodiments, in the worn state, the projection of the first sound receiving aperture 131 may be closer to the ear canal opening of the user in the projection of the first sound receiving aperture 131 and the second sound receiving aperture 141 on the sagittal plane of the user. For example, the first sound receiving hole 131 may be located in a region right above the ear canal opening of the user, so as to ensure that the environmental noise collected by the first microphone 130 is closer to the environmental noise heard by the user, thereby improving the noise reduction effect when the noise reduction process is performed based on the environmental noise collected by the first microphone 130. As shown in fig. 2, the first sound receiving hole 131 is located in the outer side surface of the housing 110 and is located in the area right above the ear canal opening of the user, so that the noise of the surrounding environment is close to the noise actually heard by the user, and the position of the first sound receiving hole 131 is far away from the auricle and the supporting structure 120, and is not shielded by the auricle, the supporting structure 120 or the housing 110, so that the sound collected by the first microphone 130 is prevented from being reflected by the auricle, the supporting structure 120 or the housing 110, and the actual noise of the ear canal opening of the user cannot be reflected truly, and the environmental noise collected by the first microphone 130 is further ensured to be close to the noise actually heard by the user.

In order to partially block the second sound receiving hole 141 by the auricle and the case 110 in the wearing state, the second sound receiving hole 141 may be disposed on the upper side US to reduce the influence of the air flow from the front of the user's body to the rear of the user's body along the sagittal axis. On the one hand, wind noise in external sound collected by the second sound receiving hole 141 can be effectively reduced by enabling the second sound receiving hole 141 to be located on the upper side of the shell 110, on the other hand, a vector L formed by connecting the second sound receiving hole 141 with the first sound receiving hole 131 can be directed to the mouth of a user by adjusting the position of the second sound receiving hole 141 on the upper side of the shell 110, so that signals from the mouth of the user can be enhanced based on time difference or phase difference of sound waves reaching the first microphone assembly 130 and the second microphone assembly 140, and a microphone array formed by the first microphone assembly 130 and the second microphone assembly 140 can mainly collect the sound of the mouth of the user.

The vector formed between the connection of the second sound receiving holes 141 and the first sound receiving holes 131 may refer to a vector formed by connecting the centroid of the second sound receiving holes 141 with the centroid of the first sound receiving holes 131. Fig. 6 is a schematic illustration of the wearing of an open earphone according to some embodiments of the present description. As shown in fig. 6, in the worn state, the projection of the second sound receiving aperture 141 (e.g., the centroid of the second sound receiving aperture 141) on the sagittal plane has a line M (M may be understood as the projection of the vector L on the sagittal plane) with the projection of the first sound receiving aperture 131 (e.g., the centroid of the first sound receiving aperture 131) on the sagittal plane, and the projection of the second sound receiving aperture 141 on the sagittal plane has a line N with the projection of the user's mouth feature point P (e.g., the user's labial bead) on the sagittal plane. In some embodiments, in order to improve the effect of the microphone array formed by the first microphone assembly 130 and the second microphone assembly 140 on the user's mouth sound, the included angle between the connection line M and the connection line N may be within a predetermined range. For example, in a direction towards the top of the user's head, the connection M and the connection N may have a first angle α therebetween, which may be in the range of 0-70 °. As another example, the connection M may have a second angle β with the connection N in a direction away from the top of the user's head, which may be in the range of 0-60 °. Through setting up the scope of first contained angle and second contained angle, can make vector L point to user's mouth, construct the sound microphone array that mainly gathers user's mouth to guarantee clear conversation effect. In some embodiments, to further enhance the collection of user mouth sounds by the microphone array formed by the first microphone assembly 130 and the second microphone assembly 140, the first included angle α may be in the range of 0-50 ° and the second included angle β may be in the range of 0-40 °. In some embodiments, to further enhance the collection of user mouth sounds by the microphone array formed by the first microphone assembly 130 and the second microphone assembly 140, the first included angle α may be in the range of 0-30 ° and the second included angle β may be in the range of 0-20 °.

In some embodiments, to ensure that the sound waves reach the first microphone assembly 130 and the second microphone assembly 140 with a sufficient time difference or phase difference, the signal from the user's mouth may be enhanced based on the time difference or phase difference, so that the microphone array formed by the first microphone assembly 130 and the second microphone assembly 140 may mainly collect the sound of the user's mouth, and the distance between the first sound receiving hole 131 and the second sound receiving hole 141 may be greater than 15mm. For example, the distance between the first sound receiving hole 131 and the second sound receiving hole 141 may be greater than 20mm. As another example, the distance between the first sound receiving hole 131 and the second sound receiving hole 141 may be greater than 30mm. In the present specification, the distance between two holes refers to the shortest distance of the centroids of the two holes on the surface of the housing unless otherwise specified.

Referring to fig. 3 and 4, the inner side of the housing 110 is provided with a first sound outlet 1111, and the outer side of the housing 110 is provided with a second sound outlet 1112. By disposing the first sound outlet 1111 on the inner side surface facing the user's ear canal, the sound emitted from the first sound outlet 1111 can directly reach the user's ear canal opening, thereby improving the listening effect. The second sound outlet 1112 may be used to balance the air pressure inside the housing 110 when the speaker 160 vibrates. In addition, by making the first sound outlet 1111 and the second sound outlet 1112 emit sounds having a phase difference (for example, opposite phases), the sounds having the phase difference can interfere with each other in the far field, thereby providing an effect of reducing leakage sound. In some embodiments, to reduce or avoid interference cancellation of the sound emitted by the first sound outlet 1111 and the second sound outlet 1112 in the near field (e.g., the ear canal opening) to affect the listening effect of the user, the sound pressure of the sound emitted by the second sound outlet 1112 (or referred to as the second sound) may be less than the sound pressure of the sound emitted by the first sound outlet 1111 (or referred to as the first sound).

Since the sound pressure of the second sound emitted from the second sound emitting hole 1112 is smaller than the sound pressure of the first sound emitted from the first sound emitting hole 1111, the second sound and the first sound are offset to the greatest extent at a position on the housing 110 closer to the second sound emitting hole 1112, so that an acoustic zero point between the first sound emitting hole 1111 and the second sound emitting hole 1112 is formed at the position. Therefore, in the first sound outlet 1111 and the second sound outlet 1112, the first sound outlet 131 or the second sound outlet 141 may be closer to the second sound outlet 1112, so that the position of the first sound outlet 131 or the second sound outlet 141 may be closer to the acoustic zero point of the speaker, and thus the first microphone assembly 130 or the second microphone assembly 140 may be prevented from collecting the sound output by the first sound outlet 1111 and/or the second sound outlet 1112 as much as possible. For example, when the second sound outlet 1112 is provided on the outer side surface, the second sound and the first sound can be offset to a greater extent on the outer side surface closer to the second sound outlet 1112. At this time, the acoustic zero between the first sound outlet 1111 and the second sound outlet 1112 is located at or near the outer side surface, and accordingly, the first sound outlet 131 may be located on the outer side surface. For another example, when the second sound outlet 1112 is disposed on the outer side, the first sound outlet 131 may be located on the front side or the lower side, and located closer to the outer side. As another example, the second sound receiving hole 141 may be located on the upper side and located closer to the outer side.

In this way, the sound picked up by the first microphone assembly 130 is mainly environmental noise, which can be used as a basis for noise reduction, so that the signal processing process can be simplified, and the noise reduction effect can be improved. In addition, by disposing the first sound receiving hole 131 in the vicinity of the acoustic zero point of the sound field constructed by the first sound receiving hole 1111 and the second sound receiving hole 1112 together, it is also possible to avoid the user from collecting the sound of the call object output by the first sound receiving hole 1111 and the second sound receiving hole 1112 when talking through the open earphone 100, and thus it is possible to reduce the echo heard by the call object (i.e., the sound of the call object itself).

In some embodiments, the first sound receiving hole 131 may be closer to the second sound outlet 1112, and the difference between the distance from the first sound receiving hole 131 to the first sound outlet 1111 and the distance from the first sound receiving hole 131 to the second sound outlet 1112 is 1mm to 7mm. In some embodiments, the first sound receiving hole 131 may be closer to the second sound outlet 1112, and the difference between the distance from the first sound receiving hole 131 to the first sound outlet 1111 and the distance from the first sound receiving hole 131 to the second sound outlet 1112 is 2 mm-6 mm. In some embodiments, the first sound receiving hole 131 may be closer to the second sound outlet 1112, and the difference between the distance from the first sound receiving hole 131 to the first sound outlet 1111 and the distance from the first sound receiving hole 131 to the second sound outlet 1112 ranges from 3mm to 5.5mm. Since acoustic nulls of the sound field may be different at different frequencies, some embodiments of the present disclosure may ensure that the first sound receiving aperture 131 is at or near an acoustic null corresponding to the sound field over a wide frequency range by limiting the difference between the distance of the first sound receiving aperture 131 to the first sound outlet aperture 1111 and the distance of the first sound receiving aperture 131 to the second sound outlet aperture 1112 to the above-described range.

In some embodiments, the second sound receiving hole 141 may be closer to the second sound outlet 1112, and the difference between the distance from the second sound receiving hole 141 to the first sound outlet 1111 and the distance from the second sound receiving hole 141 to the second sound outlet 1112 ranges from 1mm to 5mm. In some embodiments, the second sound receiving hole 141 may be closer to the second sound outlet 1112, and the difference between the distance from the second sound receiving hole 141 to the first sound outlet 1111 and the distance from the second sound receiving hole 141 to the second sound outlet 1112 is 2 mm-4.5 mm. In some embodiments, the second sound receiving hole 141 may be closer to the second sound outlet 1112, and the difference between the distance from the second sound receiving hole 141 to the first sound outlet 1111 and the distance from the second sound receiving hole 141 to the second sound outlet 1112 ranges from 3mm to 4.25mm. Similar to the first sound receiving hole 131, by limiting the range of the difference between the distance from the second sound receiving hole 141 to the first sound receiving hole 1111 and the distance from the second sound receiving hole 141 to the second sound receiving hole 1112, the sound from the first sound receiving hole 1111 and the sound from the second sound receiving hole 1112 can be counteracted as much as possible at the position where the second sound receiving hole 141 is located, so that the sound output by the first sound receiving hole 1111 and the sound output by the second sound receiving hole 141 can be prevented from being collected by the second microphone 140 as much as possible, and the subsequent noise reduction effect is improved.

In the worn state, an end of the housing 110 remote from the support structure 120 (or referred to as the free end) extends at least partially into the concha cavity of the user (as in fig. 2), or is located at the antitragus of the user. In some embodiments, the first sound receiving hole 131 may be located at one of the front side, the outer side, or the lower side of the housing 110, and at a position close to the ear canal opening of the user. For example, the first sound receiving aperture 131 may be projected closer to the ear canal opening of the user in the projection of the first sound receiving aperture 131 and the second sound receiving aperture 141 on the sagittal plane of the user in the wearing state. By the arrangement, the environmental noise collected by the first microphone 130 is more close to the environmental noise heard by the user, so that the noise reduction effect when the noise reduction processing is performed based on the environmental noise collected by the first microphone 130 is improved. As shown in fig. 2, the first sound receiving hole 131 is located in the outer side surface of the housing 110 and is located in the area right above the ear canal opening of the user, so that the noise of the surrounding environment is close to the noise actually heard by the user, and the position of the first sound receiving hole 131 is far away from the auricle and the supporting structure 120, and is not shielded by the auricle, the supporting structure 120 or the housing 110, so that the sound collected by the first microphone 130 is prevented from being reflected by the auricle, the supporting structure 120 or the housing 110, and the actual noise of the ear canal opening of the user cannot be reflected truly, and the environmental noise collected by the first microphone 130 is further ensured to be close to the noise actually heard by the user.

Fig. 7 is a schematic diagram of an open earphone according to some embodiments of the present description. Fig. 7 shows a side view of the open earphone 100 in its width direction. As shown in fig. 7, the speaker 160 has a center plane a. The center plane is a plane passing through the center point O of the speaker 160 and perpendicular to the vibration direction of the diaphragm. Wherein the vibration direction of the diaphragm may be parallel or substantially parallel to the thickness direction Z of the housing 110. For example, the speaker 160 may be a single diaphragm speaker, and the center point O of the speaker 160 refers to the centroid of the single diaphragm. For another example, in connection with fig. 5 and the description thereof, the speaker 160 may include a dual-diaphragm speaker including a first diaphragm 161 and a second diaphragm 162, and the center point O of the speaker 160 refers to a midpoint of a distance between the first diaphragm 161 and the second diaphragm 162 in the vibration direction, wherein the first diaphragm 161 and the second diaphragm 162 are symmetrical with respect to the center plane a and the center point O, respectively.

In some embodiments, as shown in fig. 7, the first sound receiving hole 131 may be located at the outer side surface OS of the housing 110, so that the first sound receiving hole 131 may be located closer to the acoustic zero between the first sound emitting hole 1111 and the second sound emitting hole 1112. In addition, compared with the rear side BS of the housing 110, the position of the first sound receiving hole 131 may be closer to the front side FS of the housing 110, so as to reduce shielding of the first sound receiving hole 131 by the auricle and the housing 110 during wearing, and ensure that the environmental noise collected by the first microphone assembly 130 is closer to the noise of the surrounding environment of the user. In some embodiments, an angle θ1 between a line B between a zero acoustic point between the first sound outlet 1111 and the second sound outlet 1112 and a center point O of the speaker 160 and a center plane a of the speaker 160 is about 19 ° on a projection plane perpendicular to the width direction of the housing 110 (i.e., a plane defined by the length direction Y and the thickness direction Z). Thus, the angle θ2 between the line C between the first sound receiving hole 131 and the center point O of the speaker 160 and the center plane a of the speaker 160 may be in the range of 5 ° -50 ° on the projection plane. By this arrangement, the first sound receiving hole 131 may be located closer to the acoustic zero point of the speaker, so that the first microphone assembly 130 may be prevented from capturing the sound output by the first sound output hole 1111 and/or the second sound output hole 1112 as much as possible. In addition, by setting the included angle θ2 within the range of 5 ° -50 °, the vector L formed by connecting the second sound receiving hole 141 located on the upper side of the housing 110 with the first sound receiving hole 131 can be directed to the mouth of the user, so that the microphone array formed by the first microphone assembly 130 and the second microphone assembly 140 can better collect the sound emitted from the mouth of the user, and improve the conversation quality. In some embodiments, the included angle θ2 may be in the range of 10 ° -40 ° in order to position the first sound receiving aperture 131 further closer to the acoustic zero point of the speaker while ensuring that the vector L formed by the connection of the second sound receiving aperture 141 to the first sound receiving aperture 131 may be directed toward the user's mouth. In some embodiments, the included angle θ2 may be in the range of 15 ° -25 ° in order to position the first sound receiving aperture 131 further closer to the acoustic zero point of the speaker while ensuring that the vector L formed by the connection of the second sound receiving aperture 141 to the first sound receiving aperture 131 may be directed toward the user's mouth.

It should be appreciated that the arrangement of the first sound receiving holes 131 on the outer side OS shown in fig. 7 is merely illustrative, and that in some embodiments the first sound receiving holes 131 may also be located on the front or lower side. For example, the first sound receiving hole 131 may be located on the front side and located closer to the outer side such that the included angle θ2 is formed within the above range. As another example, the first sound receiving hole 131 may be located on the lower side surface and located closer to the outer side surface so that the formed angle θ2 is within the above range.

In some embodiments, the sound output by the first microphone 130 by collecting the first sound outlet 1111 and/or the second sound outlet 1112 may be reduced or avoided by setting the distance between the first sound outlet 131 and the first sound outlet 1111 and/or the second sound outlet 1112 such that the first sound outlet 131 is as far away from the first sound outlet 1111 and/or the second sound outlet 1112 as possible. In some embodiments, the distance between the first sound receiving hole 131 and the first sound emitting hole 1111 may be greater than a first preset threshold. For example, the first preset threshold may be 12mm. For another example, the first preset threshold may be 13mm. Also for example, the first preset threshold may be 14mm. In some embodiments, the distance between the first sound receiving hole 131 and the second sound emitting hole 1112 may be greater than a second preset threshold. For example, the second preset threshold may be 5mm. For another example, the second preset threshold may be 6mm. Also for example, the second preset threshold may be 7mm.

As described above, the second sound receiving hole 141 is located on the upper side of the housing 110, so that the auricle, the support structure 120 and the housing 110 are utilized to partially shield the second sound receiving hole 141 when the user wears the device, thereby reducing the influence of the air flow from the front to the rear of the body of the user along the sagittal axis on the second sound receiving hole 141, and effectively reducing the wind noise in the external sound collected by the second sound receiving hole 141. In addition, in order to make the second sound receiving hole 141 closer to the second sound outlet 1112, so that the position of the second sound receiving hole 141 is closer to the acoustic zero point of the speaker, it is possible to avoid the second microphone assembly 140 from collecting the sound output by the first sound outlet 1111 and/or the second sound outlet 1112 as much as possible, and the position of the second sound receiving hole 141 on the upper side is closer to the outer side. For example, in the thickness direction Z, the second sound receiving hole 141 has a first distance from the outer side surface and a second distance from the inner side surface, and in some embodiments, the ratio between the first distance and the second distance may be in the range of 0.1-0.9 in order to make the second sound receiving hole 141 closer to the second sound outlet hole 1112 and thus the second sound receiving hole 141 closer to the acoustic zero point of the speaker. In some embodiments, the ratio between the first distance and the second distance may be in the range of 0.1-0.7 in order to allow the second sound receiving aperture 141 to be further closer to the second sound outlet aperture 1112, and thus the second sound receiving aperture 141 to be further closer to the acoustic zero of the speaker. In some embodiments, the ratio between the first distance and the second distance may be in the range of 0.1-0.5 in order to allow the second sound receiving aperture 141 to be further closer to the second sound outlet aperture 1112, and thus to allow the second sound receiving aperture 141 to be further closer to the acoustic zero of the speaker.

FIG. 8 is a schematic illustration of a plurality of exemplary locations of a second sound receiving aperture according to some embodiments of the present description. As shown in fig. 8, the second sound receiving hole 141 may be located at the upper side surface US of the housing 110 and at any one of the positions 1 to 6. The positions 1,3, 5 are closer to the inner side IS of the housing 110 and are equally spaced in the longitudinal direction Y from the rear side BS toward the front side FS, and the positions 2,4, 6 are closer to the outer side of the housing 110 and are equally spaced in the longitudinal direction Y from the rear side BS toward the front side FS. Fig. 9 is a plot of the frequency response of sound collected by the second sound receiving aperture at each of the plurality of exemplary positions shown in fig. 8. As shown in fig. 9, the abscissa represents frequency (Hz), the ordinate represents sound pressure level (dB), the curve 900 represents the frequency response curve of the sound collected by the third microphone assembly 170, and the curves 901 to 906 represent the frequency response curves of the sound collected when the second sound receiving holes 141 are respectively disposed at positions 1 to 6.

As described elsewhere in this specification, in order to more accurately reflect the sound at the ear canal of the user, the third sound receiving hole 171 corresponding to the third microphone assembly 170 is located at the inner side surface of the housing 110, so that the third sound receiving hole 171 is closer to the first sound emitting hole 1111, and the sound collected by the third microphone assembly 170 may be closer to the sound emitted from the first sound emitting hole 1111. Thus, the proximity of the sound collected by the second sound receiving hole 141 and the sound collected by the third sound receiving hole 171 may be used to indicate the proximity of the sound collected by the second sound receiving hole 141 and the sound emitted by the first sound emitting hole 1111, wherein the closer the sound collected by the second sound receiving hole 141 and the sound emitted by the first sound emitting hole 1111 is, the more easily the second sound receiving hole 141 collects the sound emitted by the first sound emitting hole 1111, that is, the more easily the second sound receiving hole 141 is interfered by the first sound emitting hole 1111.

In comparing the sounds collected by the second sound receiving holes 141 at the positions 1-6, the present disclosure may make the speaker 160 emit the sounds through the first sound emitting hole 1111 and the second sound emitting hole 1112, and obtain the sounds collected by the third microphone assembly 170 and the sounds collected by the second microphone assembly 140 at the positions 1-6. Further, by comparing the curve 900 with the curves 901-906, the proximity of the sound collected by the second sound receiving hole 141 to the sound emitted by the first sound emitting hole 1111 can be determined. It should be noted that the sound collected by the second microphone assembly 140 and the third microphone assembly 170 shown in fig. 9 refers to the sound emitted from the speaker 160 collected by the two microphone assemblies. For example, the sound collection process may be performed in a test environment where the environmental noise is minimal and negligible. At this time, when the speaker 160 is made to emit sound through the first sound emitting hole 1111 and the second sound emitting hole 1112, it can be considered that the sound collected by the third microphone assembly 170 and the second microphone assembly 140 includes only the sound emitted from the speaker 160.

For example, if one of the curves 901-906 is closer to the curve 900, it means that the sound corresponding to the curve is closer to the sound emitted from the first sound emitting hole 1111, that is, the second sound emitting hole 141 located at the corresponding position is more likely to be disturbed by the first sound emitting hole 1111. As shown in fig. 9, curves 902, 904, and 906 are farther from curve 900 than curves 901, 903, and 905, indicating that less sound emanating from the first sound outlet 1111 can be collected when the second sound outlet 141 is disposed at any of positions 2, 4, and 6, i.e., closer to the acoustic zero. Accordingly, the second sound receiving hole 141 may be disposed on the upper side US at a position closer to the outer side OS.

Further, comparing curves 902, 904, and 906, it can be seen that when the second sound receiving hole 141 is disposed closer to the front side FS, the corresponding curve is farther from the curve 900, which means that the sound emitted from the first sound emitting hole 1111 can be collected less when the second sound receiving hole 141 is disposed closer to the front side FS, that is, closer to the acoustic zero point. Thus, either position 4 or position 6 may be selected as the second sound receiving aperture 141.

In some embodiments, the second microphone 140 may be configured to collect the sound output by the first sound outlet 1111 and/or the second sound outlet 1112 by setting the distance between the second sound outlet 141 and the first sound outlet 1111 and/or the second sound outlet 1112 such that the second sound outlet 141 is as far away from the first sound outlet 1111 and/or the second sound outlet 1112 as possible. In some embodiments, the distance between the second sound receiving hole 141 and the first sound emitting hole 1111 may be greater than a third preset threshold. For example, the third preset threshold may be 7mm. For another example, the third preset threshold may be 8mm. Also for example, the third preset threshold may be 9mm. In some embodiments, the distance between the second sound receiving hole 141 and the second sound outlet hole 1112 may be greater than a fourth preset threshold. For example, the fourth preset threshold may be 7mm. For another example, the fourth preset threshold may be 8mm. Also for example, the fourth preset threshold may be 9mm.

Fig. 10 is a schematic structural view of a first microphone assembly according to some embodiments of the present disclosure. As shown in fig. 10, the first microphone assembly 130 is disposed inside the housing 110. The housing 110 is provided with a first sound receiving hole 131 corresponding to the first microphone assembly 130, and the first sound receiving hole 131 through which the first microphone assembly 130 can receive external sound. The first microphone assembly 130 may include a first microphone 132, a structural member 133, and an acoustically resistive mesh 134.

In some embodiments, the first microphone 132 may be supported and secured on a bracket 180 inside the housing 110 (e.g., inside the connection 112). As shown in fig. 10, the bracket 180 is provided with a recess accommodating the first microphone 132, and the first microphone 132 is disposed in the recess. In some embodiments, the peripheral sidewall of the first microphone 132 may be fixedly connected with the inner sidewall of the groove by glue.

The structural member 133 may be located between the first microphone 132 and the first sound receiving aperture 131. As shown in fig. 10, an opening 1113 corresponding to the structural member 133 may be provided on the housing 110, and at least a portion of the structural member 133 may be provided in the opening 1113. The structural member 133 includes a main body 1331 and an extension 1332. The main body 1331 is disposed on the first microphone 132 in a covering manner, and is connected to the upper surface of the first microphone 132 facing the first sound receiving hole 131. For example, the first microphone 132 may include an access hole 1321, and the main body 1331 may be hermetically coupled to the upper surface of the first microphone 132 at an area around the access hole 1321 by double-sided tape, glue, or the like. The extension 1332 may extend toward the bracket 180 at the circumferential side of the first microphone 132 so as to be supported on the bracket 180, thereby achieving the support fixation of the structure 133.

The structural member 133 is provided with a first sound guiding channel 1333 for communicating the first sound receiving hole 131 with the first microphone 132. The position of the first sound introducing passage 1333 may correspond to the position of the sound introducing hole 1321 of the first microphone 132, thereby enabling communication between the first sound receiving hole 131 and the first microphone 132. In some embodiments, the length of the first sound guiding channel 1333 may be within a preset range, which may ensure that the first sound guiding channel 1333 has a sufficient length to attenuate wind noise of external sound, and may prevent the first sound guiding channel 1333 from being too long to increase the path of sound reaching the first microphone 132 and thus delay the signal. In some embodiments, the preset range may be 1mm-5mm. In some embodiments, the preset range may be 1mm-3mm in order to further attenuate wind noise of external sounds while reducing delay of signals.

In some embodiments, a gauze or air permeable membrane 1323 may be disposed between the first microphone 132 and the first sound introducing passage 1333. The gauze or air permeable membrane 1323 may function to prevent water and dust from entering the first microphone 132 while not affecting the collection of sound signals by the first microphone 132.

An acoustically resistive mesh 134 is disposed over a side of the structural member 133 remote from the first microphone 132. As shown in fig. 10, the acoustic resistive mesh 134 is disposed to cover a side of the structural member 133 remote from the first microphone 132, and an edge 1341 of the acoustic resistive mesh 134 may extend toward an inner sidewall of the opening 1113 to be fixedly supported on the inner sidewall of the opening 1113. For example, the inner side wall of the opening 1113 may be provided with a boss 11131, and the edge 1341 of the acoustic resistive mesh 134 may be supported on the boss 11131.

Through setting up the sound resistance net 134 in the one side of keeping away from first microphone 132 of structure 133, can scatter the air current that gets into first microphone 132, reduce the wind speed to can reduce the wind noise in the environmental noise sound that first microphone 132 gathered, improve the noise reduction effect when making an uproar based on the environmental noise that first microphone 130 gathered carries out the noise reduction processing. In addition, the setting of the acoustic resistance net 134 does not affect the amplitude and the phase of the environmental noise collected by the first microphone 130, so that the accuracy of the environmental noise collected by the first microphone 130 can be ensured, and the noise reduction effect can be ensured.

In some embodiments, to ensure that the acoustic resistive mesh 134 reduces wind noise while avoiding the acoustic resistive mesh 134 from affecting the acquisition of sound by the first microphone 132 due to an excessive acoustic impedance, the acoustic resistive mesh 134 may have an acoustic impedance in the range of 25MKS Rayls-200 MKS Rayls. In some embodiments, to further enhance the wind noise reduction effect of the acoustic resistive mesh 134 while avoiding the acoustic resistive mesh 134 from affecting the collection of sound by the first microphone 132 due to an excessive acoustic impedance, the acoustic resistive mesh 134 may have an acoustic impedance in the range of 90MKS Rayls-150 MKS Rayls.

In some embodiments, the acoustically resistive mesh 134 can have a sufficiently large effective area to ensure that the acoustically resistive mesh 134 reduces wind noise. The effective area refers to a surface area of the acoustic resistive network 134, which is not blocked toward the first microphone 132, wherein the surface area includes an area of a hollowed-out area where the pores in the acoustic resistive network 134 are located and an area of a non-hollowed-out area around the pores. For example, the effective area of the acoustically resistive mesh 134 can be greater than 5mm ². The larger effective area of the acoustic resistive mesh 134 may provide sufficient space to disperse airflow and reduce wind speed, and may provide a more porous path to extend the contact time of the airflow with the mesh surface and increase viscous dissipation, thereby ensuring the effect of the acoustic resistive mesh 134 in reducing wind noise. In some embodiments, the effective area of the acoustically resistive mesh 134 can be within a preset range, while taking into account structural size constraints. For example, the effective area of the acoustically resistive mesh 134 can be in the range of 5mm ²-30mm². For another example, to further enhance the effect of the acoustically resistive mesh 134 in reducing wind noise, the effective area of the acoustically resistive mesh 134 may be in the range of 10mm ²-25mm², while taking into account structural size limitations. For another example, to further enhance the effect of the acoustically resistive mesh 134 in reducing wind noise while further considering the limitations of structural size, the effective area of the acoustically resistive mesh 134 may be in the range of 15mm ²-20mm².

As described above, the edge 1341 of the acoustically resistive mesh 134 can extend toward the inner sidewall of the opening 1113, thereby achieving a support securement of the acoustically resistive mesh 134. In some embodiments, the extension length of the edge 1341 of the acoustically resistive mesh 134 can be in the range of 0.2mm-2mm, taking into account the constraints of the structural dimensions. In some embodiments, the extension of the edge 1341 of the acoustically resistive mesh 134 can be in the range of 0.4mm-1.5mm, further considering the limitations of structural dimensions. In some embodiments, the extension of the edge 1341 of the acoustically resistive mesh 134 can be in the range of 0.6mm-1mm, further considering the limitations of structural dimensions.

In some embodiments, the side of the structure 133 facing the first sound receiving hole 131 may have a recess 1335. The recess 1335 may cooperate with the acoustically resistive mesh 134 to form a cavity that is in acoustic communication with the first sound introducing channel 1333. By having the grooves 1335 cooperate with the acoustically resistive mesh 134 to form a cavity, the flow rate of the air flow through the acoustically resistive mesh 134 is further reduced in the cavity and the energy is further dissipated, thereby further reducing wind noise in the ambient noise sound captured by the first microphone 132.

Fig. 11 is a graph of the frequency response of wind noise collected by a first microphone when grooves or acoustic resistive mesh are provided and not provided on a structural member according to some embodiments of the present disclosure, wherein the acoustic resistive mesh is a steel mesh. As shown in fig. 11, the abscissa represents frequency (Hz), the ordinate represents sound pressure level (dB), curve 1101 represents the frequency response curve of wind noise collected by the first microphone assembly 130 when the groove and the steel mesh are not provided, curve 1102 represents the frequency response curve of wind noise collected by the first microphone assembly 130 when the groove is provided but the steel mesh is not provided, and curve 1103 represents the frequency response curve of wind noise collected by the first microphone assembly 130 when the groove and the steel mesh are simultaneously provided.

According to fig. 11, by providing the grooves, wind noise collected by the first microphone assembly 130 can be effectively reduced in a frequency range of 1000Hz or less. By providing both the grooves and the steel mesh, wind noise collected by the first microphone assembly 130 may be further reduced in a frequency range below 300 Hz. As described above, wind noise is mainly concentrated at low frequencies below 1000Hz, and thus wind noise collected by the first microphone assembly 130 can be effectively reduced by providing grooves and a steel mesh at the same time.

In some embodiments, the first microphone 132 may include a motherboard 1322 for implementing signal processing, functional control, interface communication, and other functions of the first microphone 132. In some embodiments, the acoustically resistive mesh 134 can be made of metallic or non-metallic materials. For example only, the acoustically resistive mesh 134 may include a steel mesh. In some embodiments, when the acoustically resistive mesh 134 is made of a metallic material, the first microphone assembly 130 can also include a metallic piece 135. The acoustically resistive mesh 134 can be electrically coupled to the main plate 1322 through the metallic member 135. For example, as shown in fig. 10, a motherboard 1322 may be disposed between the first microphone 132 and the structural member. One end of the metal member 135 may be connected to an inner side surface of the acoustic resistive mesh 134, the structural member 133 may include a structural channel 1334 isolated from the first acoustic guiding channel 1333, and the other end of the metal member 135 may pass through the structural channel 1334 and then be connected to the main board 1322, thereby electrically conducting the acoustic resistive mesh 134 and the main board 1322. Isolation of the structural channel 1334 from the first sound guiding channel 1333 means that the structural channel 1334 is not in acoustic communication with the first sound guiding channel 1333. For example, the structural passageway 1334 may be an internally hollow passageway prior to assembly of the metal piece 135, such that the other end of the metal piece 135 may be connected to the main plate 1322 through the structural passageway 1334. And after the metal member 135 is assembled, the structural channel 1334 may be hermetically filled with a filler (e.g., glue, etc.), so that the structural channel 1334 may be prevented from being in acoustic communication with the first sound guiding channel 1333 to affect the acoustic performance of the first sound guiding channel 1333 and/or the first microphone 132.

By providing the metal member 135 to electrically connect the acoustic resistive mesh 134 and the main board 1322 of the first microphone 132, static electricity generated by the acoustic resistive mesh 134 under the action of air flow friction or the like can be led into the main board 1322 through the metal member 135, and at this time, the static electricity can be considered to be grounded through the metal member 135, so that the static electricity can be prevented from interfering with the first microphone 132 (for example, the static electricity may interfere with sensitive electronic components (such as a preamplifier) in the first microphone 132, or even break down the first microphone 132, etc.).

Fig. 12 is a schematic structural view of a second microphone assembly according to some embodiments of the present disclosure. As shown in fig. 12, the second microphone assembly 140 is at least partially disposed within the housing 110. Specifically, the upper side US of the case 110 may be provided with an opening for receiving the second microphone assembly 140, through which a portion of the second microphone assembly 140 is received inside the case 110, and another portion of the second microphone assembly 140 is protruded outside the case 110. The upper side US of the case 110 may be provided with a protrusion 1114, a portion of the second microphone assembly 140 protruding outside the case 110 may be covered by the protrusion 1114, and the second sound receiving hole 141 of the second microphone assembly 140 may be opened on the protrusion 1114 to receive external sound. By arranging the second microphone assembly 140 at least partially inside the housing 110, the housing 110 can be used to position or fix the second microphone assembly 140, and at the same time, the occupation of the second microphone assembly 140 to the inner space of the housing 110 can be reduced, which is beneficial to miniaturization of the structure.

As shown in fig. 12, the second microphone assembly 140 may include a second microphone 142 and a second sound introducing channel 143. The second sound guiding channel 143 is used for communicating the second sound receiving hole 141 and the second microphone 142.

In some embodiments, the second microphone 142 may be carried on the speaker 160 of the open ended headset 100. For example, the speaker 160 may be provided with a recess 1671, and at least a portion of the second microphone 142 may be embedded within the recess 1671. Referring to fig. 5 and 12, the speaker 160 of the open earphone 100 may include a magnetic circuit assembly 163, and two diaphragms (i.e., a first diaphragm 161 and a second diaphragm 162) located at both sides of the magnetic circuit assembly 163 and symmetrical with respect to a center plane a. Specifically, the recess 1671 may be surrounded by the magnetic circuit assembly 163 (e.g., the magnet 1631, the first magnetically permeable plate 1632, the second magnetically permeable plate 1633, etc., shown in fig. 5). A recess 1671 may be provided at a side of the magnetic circuit assembly 163 facing the upper side US of the case, and the second microphone 142 is embedded in the recess 1671 so as to receive external sound through the second sound receiving hole 141 located at the upper side US. Illustratively, the magnetic circuit assembly 163 includes a magnet 1631, a first magnetic conductive plate 1632, and a second magnetic conductive plate 1633, and the recess 1671 may be surrounded by the magnet 1631, the first magnetic conductive plate 1632, and the second magnetic conductive plate 1633.

Further, in some embodiments, speaker 160 may also include a speaker housing 167, speaker housing 167 disposed around magnetic circuit assembly 163 and configured to carry various components in speaker 160. Specifically, speaker housing 167 may be provided with an opening corresponding to recess 1671, or speaker housing 167 may be countersunk in a region corresponding to recess 1671 to form a housing recess corresponding to recess 1671.

By providing the recess 1671 on the speaker housing 160 and embedding the second microphone 142 in the recess 1671, the second microphone 142 can be moved down, reducing the size of the housing 110 in the width direction, facilitating miniaturization of the structure. In addition, since the second sound receiving hole 141 is closer to the outer side surface OS of the housing, the distance between the second sound receiving hole 141 and the second microphone 142 can be increased by moving the second microphone 142 downward, so that the second sound guiding channel 143 between the second sound receiving hole 141 and the second microphone 142 is not too inclined to increase the processing difficulty.

As shown in fig. 12, the first diaphragm 161 and the second diaphragm 162 are located on both sides of the magnetic circuit assembly 163 and are symmetrical with respect to the center plane a, which passes through the center of the magnet 1631. To avoid altering the configuration of other components around the magnet 1631 (e.g., the first and second magnetically permeable plates 1632, 1633, the first and second voice coils 164, 165, etc. shown in fig. 5) to affect the acoustic characteristics of the speaker 160, the recess 1671 may be provided by simply reducing the size of the magnet 1631 without changing the configuration of other components around the magnet 1631. For example, the recess 1671 may be symmetrical about the center plane a such that the position of the recess 1671 corresponds to the position of the magnet 1631, where the size of the magnet 1631 in the length direction Y need only be reduced without affecting the acoustic properties of the speaker 160.

As described above, the inner side IS of the housing 110 IS provided with the first sound outlet 1111, and the outer side OS of the housing 110 IS provided with the second sound outlet 1112. In order to make the second sound receiving hole 141 closer to the second sound outlet 1112, so that the second sound receiving hole 141 may be located closer to the acoustic zero point of the speaker, the second microphone assembly 140 may be prevented from capturing the sound output by the first sound outlet 1111 and/or the second sound outlet 1112 as much as possible, and the second sound receiving hole 141 may be closer to the second sound outlet 1112. For example, the second sound receiving hole 141 may be closer to the outer side surface OS of the case 110. Accordingly, as shown in fig. 12, the second sound introducing passage 143 is inclined toward the outer side face OS in a direction along the second microphone 142 to the second sound receiving hole 141.

In some embodiments, in order to position the second sound receiving hole 141 closer to the acoustic zero of the speaker while compromising the difficulty of processing the second sound guiding channel 143, the inclination angle of the second sound guiding channel 143 is in the range of 0-60 °. In some embodiments, in order to position the second sound receiving hole 141 further near the acoustic zero of the speaker while compromising the difficulty of machining the second sound guiding channel 143, the inclination angle of the second sound guiding channel 143 is in the range of 20 ° -40 °.

In some embodiments, the length of the second sound guiding channel 143 may be within a preset range, which may ensure that the second sound guiding channel 143 has a sufficient length to attenuate wind noise of external sound, and may prevent the second sound guiding channel 143 from being too long to increase the path of sound reaching the second microphone 142 and thus delay the signal. In some embodiments, the preset range may be 1mm-5mm. In some embodiments, the preset range may be 1mm-3mm in order to further attenuate wind noise of external sounds while reducing delay of signals.

Fig. 13 is a schematic structural view of a third microphone assembly according to some embodiments of the present disclosure. As shown in fig. 13, the third microphone assembly 170 is at least partially disposed inside the housing 110 and receives external sound through the third sound receiving hole 171. The third microphone assembly 170 may include a third microphone 172 and a third sound introducing channel 173. The third sound introducing channel 173 is used for communicating the third sound receiving hole 171 and the third microphone 172.

The third microphone assembly 170 may be used to collect signals at the ear canal. For example, the third microphone assembly 170 may be used in conjunction with the first microphone assembly 130 and/or the second microphone assembly 140, wherein the first microphone assembly 130 and/or the second microphone assembly 140 may function as a feed-forward microphone for capturing ambient noise for generating the first noise reduction signal, and the third microphone assembly 170 may function as a feedback microphone for capturing the second noise reduction sound at the ear canal, such that the first noise reduction signal may be adjusted in accordance with the second noise reduction sound, further eliminating residual noise at the ear canal of the user. In order to be able to reflect sound at the user's ear canal more accurately, the third microphone assembly 170, which is a feedback microphone, may be closer to the user's ear canal than the first microphone assembly 130 and/or the second microphone assembly 140, which are feedforward microphones. Thus, the third sound receiving hole 171 may be located on the inner side of the housing 110 at a position closer to the ear canal opening of the user. For example, the third sound receiving hole 171 may be closer to the ear canal of the user than both the first sound receiving hole 131 and the second sound receiving hole 141. As another example, the third microphone assembly 170 may not be used with the first microphone assembly 130 or the second microphone assembly 140. The open earphone 100 may now include and only include the third microphone assembly 170. The third microphone assembly 170 may collect noise at the ear canal and the processing circuit 150 may generate the first noise reduction signal directly based on the collected noise at the ear canal. The speaker 160 may generate noise-reduced sound having the same amplitude and opposite phase as the noise at the ear canal based on the first noise-reduced signal to cancel the noise at the ear canal of the user.

As shown in fig. 13, the inner side IS of the case 110 may be provided with an opening for receiving the third microphone assembly 170, through which a portion of the third microphone assembly 170 IS received inside the case 110, and another portion of the third microphone assembly 170 IS protruded outside the case 110. The inner side IS of the case 110 may be provided with a protrusion 1115, a portion of the third microphone assembly 170 protruding outside the case 110 may be covered with the protrusion 1115, and the third sound receiving hole 171 may be provided on the protrusion 1115. By disposing the third sound receiving hole 171 on the boss 1115, the third sound receiving hole 171 can be brought closer to the user's ear canal, so that the signal collected by the third microphone 172 can more accurately reflect the sound at the user's ear canal. In addition, since the first sound outlet 1111 IS located on the inner side IS, by disposing the third sound outlet 171 on the protrusion 1115, the third sound outlet 171 IS further away from the first sound outlet 1111, so that the third microphone 172 can be reduced or avoided from collecting the sound emitted by the first sound outlet 1111, thereby improving the consistency of the signal collected by the third microphone 172 and the signal at the auditory canal. In some embodiments, in order to distance the third sound receiving hole 171 farther from the first sound outlet hole 1111, thereby reducing or avoiding the third microphone 172 from collecting sound emitted from the first sound outlet hole 1111, the consistency of the signal collected by the third microphone 172 with the signal at the ear canal IS improved, and the height of the protrusion 1115 with respect to the protrusion of the inner side IS may be greater than 0.5mm. In some embodiments, to avoid hole blocking or wearing comfort effects caused by contact with the user's ear when the protuberance 1115 IS too high, the height of the protuberance 1115 relative to the medial IS protuberance may be in the range of 0.5mm-3 mm. In some embodiments, to further improve the consistency of the signal acquired by the third microphone 172 with the signal at the ear canal while avoiding hole blockage or affecting wear comfort, the height of the protrusion 1115 relative to the medial IS protrusion may be in the range of 1.1mm-1.6 mm.

Fig. 14 is a schematic diagram of an open earphone according to some embodiments of the present description. In some embodiments, the support structure 120 may be symmetrical along a central plane D that is parallel to the direction of extension of the support structure 120. Because of the specificity of the ear structure, the center plane D of the support structure 120 and the center plane a of the speaker 160 (or the center plane of the housing 110) may not coincide in order to ensure that the housing 110 can fit the user's ear when in the worn state. For example, as shown in fig. 14, the center plane a of the speaker 160 (or the center plane of the housing 110) may be inclined toward the inner side IS with respect to the support structure 120 such that the housing 110 IS inclined toward the user's ear in the worn state, so that the housing 110 may more fit the user's ear in the worn state. The center plane D of the support structure 120 may have an angle θ3 with the center plane a of the speaker 160 on a projection plane perpendicular to the width direction X of the housing 110 (i.e., a plane defined by the length direction Y and the thickness direction Z). In some embodiments, the included angle θ3 may be in the range of 0-10 ° in order to ensure that the housing 110 fits around the user's ear when in the worn state, while ensuring comfort when worn. In some embodiments, the included angle θ3 may be in the range of 3 ° -6 ° in order to ensure that the housing 110 may further fit the user's ear when in a worn state, while ensuring comfort when worn.

In some embodiments, the protrusion height of protrusion 1115 relative to medial side IS IS related to angle θ3. For example, a greater included angle θ3 indicates that the housing 110 is tilted toward the user's ear and the protrusion 1115 is closer to the user's ear canal opening. Accordingly, the protrusion height of protrusion 1115 relative to medial surface IS may be inversely related to included angle θ3. For example, the included angle θ3 may be in the range of 0-3 °, and accordingly, the protrusion height of the protrusion 1115 with respect to the inner side IS may be in the range of 1.6mm-3 mm. For another example, the included angle θ3 may be in the range of 3 ° -6 °, and correspondingly, the protrusion height of the protrusion 1115 with respect to the inner side IS may be in the range of 1.1mm-1.6 mm. For another example, the angle θ3 may be in the range of 6 ° -10 °, and correspondingly, the protrusion height of the protrusion 1115 with respect to the inner side IS may be in the range of 0.5mm-1.6 mm.

In the worn state, an end of the housing 110 remote from the support structure 120 (or referred to as the free end) extends at least partially into the concha cavity of the user (as in fig. 2), or is located at the antitragus of the user. The free end, i.e. the end at which the rear side BS of the housing is located. Thus, in the worn state, the free end of the housing 110 is closer to the ear canal opening of the user.

In some embodiments, the protrusion 1115 may be disposed proximate to the free end of the housing 110 such that the third sound receiving aperture 171 is closer to the ear canal opening of the user, e.g., such that the distance between the protrusion 1115 and the free end of the housing 110 in the length direction Y of the housing 110 is less than 8mm in order to bring the third sound receiving aperture 171 closer to the ear canal opening of the user such that the second noise reduction collected is closer to the sound at the ear canal opening. For another example, in order to bring the third sound receiving hole 171 further closer to the ear canal opening of the user, so that the collected second noise reduction sound further approaches the sound at the ear canal opening, a distance between the protrusion 1115 and the free end of the housing 110 in the length direction Y of the housing 110 is less than 6mm. For another example, in order to bring the third sound receiving hole 171 further closer to the ear canal opening of the user, so that the collected second noise reduction sound further approaches the sound at the ear canal opening, a distance between the protrusion 1115 and the free end of the housing 110 in the length direction Y of the housing 110 is less than 4mm. The distance between the protrusion 1115 and the free end of the housing 110 refers to the distance between the edge of the protrusion 1115 near the free end and the free end. When the free end of the housing 110 is curved, the distance between the protrusion 1115 and the free end of the housing 110 refers to the distance between the tangent point of the free end at which the tangent line is parallel to the short axis direction X and the protrusion 1115.

In some embodiments, the free end of the housing 110 may be curved for improved comfort when worn. For example, as shown in fig. 13, the connection surface between the inner side IS and the rear side BS of the housing 110 IS a curved surface. The curved surface reduces the accommodation space of the free end, so that the third microphone 172 is located relatively far from the free end. Thus, in order to bring the third sound receiving hole 171 close to the ear canal opening of the user, so that the collected second noise-reducing sound is closer to the ear canal opening, the third sound guiding passage 173 may be inclined toward the free end of the housing in a direction along the third microphone 172 to the third sound receiving hole 171, so that the third sound receiving hole 171 can also be brought close to the ear canal opening of the user to collect sound close to the ear canal opening when the third microphone 172 is located away from the free end. In some embodiments, in order to bring the third sound receiving hole 171 closer to the ear canal opening of the user, so that the collected second noise reduction is closer to the sound at the ear canal opening, the distance between the center of the third sound receiving hole 171 and the edge of the protrusion 1115 in the length direction Y of the housing 110 may be less than 6mm, where the edge of the protrusion 1115 refers to the point on the protrusion 1115 closest to the free end in the length direction Y of the housing 110. In some embodiments, in order to bring the third sound receiving hole 171 closer to the ear canal opening of the user, thereby bringing the collected second noise reduction closer to the sound at the ear canal opening, the distance between the center of the third sound receiving hole 171 and the edge of the protrusion 1115 may be less than 4mm in the length direction Y of the housing 110. In some embodiments, in order to bring the third sound receiving hole 171 closer to the ear canal opening of the user, thereby bringing the collected second noise reduction closer to the sound at the ear canal opening, the distance between the center of the third sound receiving hole 171 and the edge of the protrusion 1115 may be less than 2.5mm in the length direction Y of the housing 110.

In some embodiments, in the wearing state, the distance between the third sound receiving hole 171 and the ear canal opening of the user may be in the range of 5mm-20mm, so that the collected second noise reduction is closer to the sound at the ear canal opening, and the noise reduction effect is improved. In some embodiments, in order to make the collected second noise reduction sound further approach to the sound at the ear canal opening, while avoiding that the sound field corresponding to the third sound receiving hole 171 is affected when the third sound receiving hole 171 is too close to the ear canal opening of the user, the distance between the third sound receiving hole 171 and the ear canal opening of the user may be in the range of 8mm-10mm in the wearing state. The distance between the third sound receiving hole 171 and the ear canal opening of the user refers to the distance between the third sound receiving hole 171 and the feature point on the ear canal opening. The feature point may be the point of the ear canal orifice closest to the rear side of the ear in projection on the sagittal plane of the user.

As shown in fig. 13, the surface of the protrusion 1115 is recessed inward to form a recessed plane 1116, and the opening of the third sound guide channel 173 (i.e., the third sound receiving hole 171) may be disposed on the recessed plane 1116. So set up, under wearing the state, when protruding 1115 and user's ear contact, because third radio hole 171 sets up on protruding 1115 inside sunken plane 1116 to can avoid because of the stifled hole that the direct ear contact of third radio hole 171 and user that the difference of people's ear or wearing mode were wrong led to causes, and then guarantee the collection effect of third microphone 172. In some embodiments, the open area of the recessed plane 1116 may be substantially larger than the open area of the third sound receiving aperture 171, such that a recessed plane 1116 having a larger open area may not be easily completely shielded by the ear structure, such that a gap allowing sound to pass is formed between the recessed plane 1116 and the ear structure. The opening area of the recess plane 1116 refers to the area of the opening of the recess plane 1116 at the outermost side (i.e., the side of the recess plane 1116 facing away from the third microphone 172). In some embodiments, to avoid the recess plane 1116 being completely obscured by the ear structure, such that a sufficient gap is formed between the recess plane 1116 and the ear structure to allow sound to pass through, the ratio between the open area of the recess plane 1116 and the open area of the third sound receiving aperture 171 is greater than 30. In some embodiments, to further avoid the recess plane 1116 being completely obscured by the ear structure, such that a sufficient gap is formed between the recess plane 1116 and the ear structure to allow sound to pass through, the ratio between the opening area of the recess plane 1116 and the opening area of the third sound receiving aperture 171 is greater than 20. In some embodiments, to further avoid the recess plane 1116 being completely obscured by the ear structure, such that a sufficient gap is formed between the recess plane 1116 and the ear structure to allow sound to pass through, the ratio between the opening area of the recess plane 1116 and the opening area of the third sound receiving aperture 171 is greater than 15.

In some embodiments, for ease of description, the first microphone assembly 130 may also be referred to as a front side microphone assembly, correspondingly, the first sound pickup aperture 131 may also be referred to as a front side sound pickup aperture, the first sound pickup channel 1333 may also be referred to as a front side sound pickup channel, the recess 1335 may also be referred to as a front side recess, the second microphone assembly 140 may also be referred to as an upper side microphone assembly, correspondingly, the second sound pickup aperture 143 may also be referred to as an upper side sound pickup aperture, the protrusion 1114 may also be referred to as an upper side protrusion, the recess 1671 may also be referred to as an upper side recess, the third microphone assembly 170 may also be referred to as a rear side microphone assembly, correspondingly, the third sound pickup channel 173 may also be referred to as a rear side sound pickup aperture, the third sound pickup aperture 171 may also be referred to as a rear side protrusion 1115.

While the basic concepts have been described above, it will be apparent to those skilled in the art that the foregoing disclosure is by way of example only and is not intended to be limiting. Although not explicitly described herein, various modifications, improvements, and adaptations to the present disclosure may occur to one skilled in the art. Such modifications, improvements, and modifications are intended to be suggested within this specification, and therefore, such modifications, improvements, and modifications are intended to be included within the spirit and scope of the exemplary embodiments of the present invention.

Meanwhile, the specification uses specific words to describe the embodiments of the specification. Reference to "one embodiment," "an embodiment," and/or "some embodiments" means that a particular feature, structure, or characteristic is associated with at least one embodiment of the present description. Thus, it should be emphasized and should be appreciated that two or more references to "an embodiment" or "one embodiment" or "an alternative embodiment" in various positions in this specification are not necessarily referring to the same embodiment. Furthermore, certain features, structures, or characteristics of one or more embodiments of the present description may be combined as suitable.

Furthermore, those skilled in the art will appreciate that the various aspects of the specification can be illustrated and described in terms of several patentable categories or circumstances, including any novel and useful procedures, machines, products, or materials, or any novel and useful modifications thereof. Accordingly, aspects of the present description may be performed entirely by hardware, entirely by software (including firmware, resident software, micro-code, etc.), or by a combination of hardware and software. The above hardware or software may be referred to as a "data block," module, "" engine, "" unit, "" component, "or" system. Furthermore, aspects of the specification may take the form of a computer product, comprising computer-readable program code, embodied in one or more computer-readable media.

Furthermore, the order in which the specification processes elements and sequences, the use of numerical letters, or other designations are used is not intended to limit the order in which the specification flows and methods are performed unless explicitly recited in the claims. While certain presently useful inventive embodiments have been discussed in the foregoing disclosure, by way of various examples, it is to be understood that such details are merely illustrative and that the appended claims are not limited to the disclosed embodiments, but, on the contrary, are intended to cover all modifications and equivalent arrangements included within the spirit and scope of the embodiments of the present disclosure. For example, while the system components described above may be implemented by hardware devices, they may also be implemented solely by software solutions, such as installing the described system on an existing server or mobile device.

Likewise, it should be noted that in order to simplify the presentation disclosed in this specification and thereby aid in understanding one or more inventive embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof. This method of disclosure does not imply that the subject matter of the present description requires more features than are set forth in the claims. Indeed, less than all of the features of a single embodiment disclosed above.

In some embodiments, numbers describing the components, number of attributes are used, it being understood that such numbers being used in the description of embodiments, in some examples, are modified with the modifier "about," "approximately," or "substantially," etc. Unless otherwise indicated, "about," "approximately," or "substantially" indicate that the number allows for a 20% variation. Accordingly, in some embodiments, numerical data used in the specification and claims is approximations that may vary depending upon the desired properties sought to be obtained by the individual embodiments. In some embodiments, the numerical data should take into account the specified significant digits and employ a method for preserving the general number of digits. Although the numerical ranges and data used in some embodiments of the present disclosure are approximations, in particular embodiments, the settings of such numerical values are as precise as possible.

Claims

1. An open-back headphone, comprising:

case;

The support structure is configured to place the housing near the user's ear without obstructing the ear canal when worn;

The microphone assembly is configured to receive external sound.

The processing circuitry is configured to generate a first noise-reduced signal based on the external sound acquired by the microphone assembly; and

A loudspeaker, located within the housing, is configured to generate noise-canceling sound under the drive of the first noise-canceling signal, wherein the loudspeaker includes a magnetic circuit assembly and two diaphragms located on both sides of the magnetic circuit assembly, the two diaphragms being configured to vibrate synchronously in the same direction.

2. The open-back headphone according to claim 1, wherein the microphone assembly includes a first microphone assembly configured to receive external sound through a first sound-receiving port, the housing includes mutually perpendicular length, width, and thickness directions, and the two diaphragms are symmetrical about a central plane and a central point, wherein...

On a projection plane perpendicular to the width direction of the housing, the first sound hole is located at an angle between the line connecting it to the center point and the center plane, the angle being in the range of 5°-50°.

3. The open-back headphone according to claim 2, wherein the microphone assembly includes a second microphone assembly configured to receive external sound through a second microphone hole, wherein the first microphone hole and the second microphone hole are located on different side walls of the housing, the first microphone hole is located on the front side, outer side or lower side of the housing, and the second microphone hole is located on the upper side of the housing.

4. The open-back headphone according to claim 3,

The first microphone assembly includes a first microphone and a structural member located between the first microphone and the first sound-receiving port.

The structural component is provided with a first sound-guiding channel for connecting the first sound-receiving hole and the first microphone, wherein the length of the first sound-guiding channel is in the range of 1mm-5mm.

5. The open-back headphone according to claim 4, wherein the first microphone assembly further comprises an acoustic barrier, the acoustic barrier being disposed on the side of the structure away from the first microphone, the acoustic impedance of the acoustic barrier being in the range of 25 MKS Rayls-200 MKS Rayls, and/or the effective area of the acoustic barrier being in the range of 5 ^mm² -30 ^mm² .

6. The open-back headphone according to claim 3,

The inner side of the housing is provided with a first sound outlet, and the outer side of the housing is provided with a second sound outlet.

The second microphone assembly includes a second microphone and a second sound-guiding channel disposed between the second microphone and the second sound-receiving hole, wherein the second sound-guiding channel is inclined toward the outer side in the direction along the second microphone to the second sound-receiving hole, the inclination angle of the second sound-guiding channel is in the range of 0-60°, and the length of the second sound-guiding channel is in the range of 1mm-5mm.

7. The open-back earphone according to claim 3, wherein the upper side of the housing is provided with an upper protrusion, and the second sound receiving hole is formed on the upper protrusion.

8. The open-back headphone according to claim 3, wherein the microphone assembly further comprises a third microphone assembly configured to receive external sound through a third sound-receiving hole, the third sound-receiving hole being located on the inner side of the housing and closer to the ear canal than both the first and second sound-receiving holes.

9. The open-back earphone according to claim 8, wherein the inner side of the housing is provided with a rear protrusion, and the third sound hole is disposed on the rear protrusion.

10. The open-back headphone of claim 8, wherein the third microphone assembly includes a third microphone and a third acoustic channel disposed between the third microphone and the third sound hole, wherein the third acoustic channel is inclined toward the free end of the housing in a direction along the third microphone to the third sound hole.

11. The open-back earphone according to claim 10, wherein the distance between the third sound receiving hole and the ear canal opening is in the range of 1mm-30mm.

12. The open-back headphone of claim 8, wherein the processing circuit is further configured to determine a target noise reduction strategy from a plurality of noise reduction strategies, and generate the first noise reduction signal according to the target noise reduction strategy, wherein the plurality of noise reduction strategies includes at least three of the following strategies:

The external sound collected by the first microphone assembly is taken as environmental noise;

The external sound collected by the second microphone assembly is taken as ambient noise;

The external sounds collected by the first microphone assembly and the second microphone assembly are combined to generate ambient noise;

And the external sound collected by the third microphone assembly is used as ambient noise.

13. The open-back headphones according to claim 12, wherein determining the target noise reduction strategy from a plurality of noise reduction strategies comprises:

In response to wind noise in the external sound collected by the first microphone assembly or the second microphone assembly satisfying a first condition, the external sound collected by the first microphone assembly is taken as the ambient noise; or

In response to the wind noise in the external sound collected by the first microphone assembly or the second microphone assembly satisfying the second condition, the external sound collected by the second microphone assembly is taken as the ambient noise; or

In response to the wind noise in the external sound collected by the first microphone assembly or the second microphone assembly satisfying the second condition, the environmental noise is generated by combining the external sound collected by the first microphone assembly and the second microphone assembly respectively.

14. The open-back headphones according to claim 13, wherein generating the ambient noise by combining the external sounds collected by the first microphone assembly and the second microphone assembly respectively comprises:

The ambient noise is determined based on the first frequency band of the ambient sound collected by the first microphone component and the second frequency band of the ambient sound collected by the second microphone component, wherein the frequency of the first frequency band is greater than the frequency of the second frequency band.

15. The open-back headphone according to claim 8, wherein the processing circuit is configured to: use the external sound collected by the third microphone assembly as a second noise-canceling tone, and adjust the first noise-canceling signal according to the second noise-canceling tone.