CN1957456A - 中转站以及使用中转站的基片处理系统 - Google Patents

中转站以及使用中转站的基片处理系统 Download PDF

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Publication number
CN1957456A
CN1957456A CNA200680000266XA CN200680000266A CN1957456A CN 1957456 A CN1957456 A CN 1957456A CN A200680000266X A CNA200680000266X A CN A200680000266XA CN 200680000266 A CN200680000266 A CN 200680000266A CN 1957456 A CN1957456 A CN 1957456A
Authority
CN
China
Prior art keywords
substrate
substrate processing
side opening
terminal
described substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA200680000266XA
Other languages
English (en)
Chinese (zh)
Inventor
唐泽渉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1957456A publication Critical patent/CN1957456A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3408—Docking arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3411—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CNA200680000266XA 2005-03-01 2006-02-28 中转站以及使用中转站的基片处理系统 Pending CN1957456A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005056362A JP4563219B2 (ja) 2005-03-01 2005-03-01 中継ステーション及び中継ステーションを用いた基板処理システム
JP056362/2005 2005-03-01

Publications (1)

Publication Number Publication Date
CN1957456A true CN1957456A (zh) 2007-05-02

Family

ID=36941149

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA200680000266XA Pending CN1957456A (zh) 2005-03-01 2006-02-28 中转站以及使用中转站的基片处理系统

Country Status (6)

Country Link
US (1) US20080124192A1 (2)
JP (1) JP4563219B2 (2)
KR (1) KR100840959B1 (2)
CN (1) CN1957456A (2)
TW (1) TW200727382A (2)
WO (1) WO2006093120A1 (2)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5921371B2 (ja) * 2012-07-13 2016-05-24 信越ポリマー株式会社 基板収納容器
CN106462084B (zh) * 2014-05-07 2018-10-19 迈普尔平版印刷Ip有限公司 用于目标处理机械的封闭件
JP7090469B2 (ja) * 2018-05-15 2022-06-24 東京エレクトロン株式会社 基板処理装置
KR102849355B1 (ko) * 2021-03-10 2025-08-25 엔테그리스, 아이엔씨. 전방 및 후방 개구를 갖는 반도체 기판 운반 용기

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US513954A (en) * 1894-01-30 Metal-working tool
JPS6155930A (ja) 1984-08-27 1986-03-20 Mitsubishi Electric Corp 工程間リ−ドフレ−ム搬送装置
JP2502661B2 (ja) * 1988-03-04 1996-05-29 松下電器産業株式会社 気相成長装置
JP2525284B2 (ja) * 1990-10-22 1996-08-14 ティーディーケイ株式会社 クリ―ン搬送方法及び装置
US5277579A (en) * 1991-03-15 1994-01-11 Tokyo Electron Sagami Limited Wafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus provided with a wafers transferring system
US5256204A (en) * 1991-12-13 1993-10-26 United Microelectronics Corporation Single semiconductor water transfer method and manufacturing system
JPH05166917A (ja) * 1991-12-18 1993-07-02 Kawasaki Steel Corp バッファ・カセット
JP3632812B2 (ja) * 1997-10-24 2005-03-23 シャープ株式会社 基板搬送移載装置
JP2951628B2 (ja) * 1998-01-22 1999-09-20 アプライド マテリアルズ インコーポレイテッド ウェハ保管用カセット
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
US6641349B1 (en) * 1999-04-30 2003-11-04 Tdk Corporation Clean box, clean transfer method and system
KR100729986B1 (ko) * 1999-12-20 2007-06-20 아시스트 신꼬, 인코포레이티드 자동반송시스템
JP2003031641A (ja) * 2001-07-19 2003-01-31 Mitsubishi Electric Corp 製品保管方法および製品保管装置
JP4194262B2 (ja) * 2001-09-27 2008-12-10 東京エレクトロン株式会社 基板処理装置及び基板処理方法
JP2003188229A (ja) * 2001-12-18 2003-07-04 Hitachi Kasado Eng Co Ltd ウエハ製造システムおよびウエハ製造方法
JP2003321102A (ja) * 2002-05-02 2003-11-11 Tokyo Electron Ltd 無人搬送車システム
JP2004281474A (ja) * 2003-03-12 2004-10-07 Seiko Epson Corp 製造対象物の受け渡し装置および製造対象物の受け渡し装置を有する搬送システム
JP4065997B2 (ja) * 2003-05-23 2008-03-26 株式会社ダイフク 台車式搬送装置

Also Published As

Publication number Publication date
KR20070029172A (ko) 2007-03-13
KR100840959B1 (ko) 2008-06-24
JP4563219B2 (ja) 2010-10-13
WO2006093120A1 (ja) 2006-09-08
JP2006245130A (ja) 2006-09-14
TWI306641B (2) 2009-02-21
US20080124192A1 (en) 2008-05-29
TW200727382A (en) 2007-07-16

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PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication